High-temperature-resistant mobile phone mainboard cover assembly

Abstract

The utility model discloses a kind of high-temperature-resistant mobile phone mainboard upper cover assembly, including metal substrate layer and composite heat dissipation layer, metal substrate layer, made of aluminium alloy or magnesium alloy, its outer surface is equipped with micro-arc oxidation insulating layer;Composite heat dissipation layer is inlaid in the inner side of metal substrate layer by hot-pressing process, and is composed of ceramic fiber cloth layer, nano alumina coating and heat-conducting silicone layer sequentially arranged from inside to outside;The thickness of the nano alumina coating is 10-50 μm, and porosity is ≤5%.The high-temperature-resistant mobile phone mainboard upper cover assembly described in the utility model, through the synergistic effect of triple composite heat dissipation structure, significantly improve the heat dissipation efficiency, micro-arc oxidation insulating layer provides stable insulation protection, withstand high-temperature environment, air vent and through type heat dissipation channel enhance air convection, reduce core area temperature.

Description

Technical Field

[0001] This utility model relates to the field of mobile phone accessories technology, specifically a high-temperature resistant mobile phone motherboard cover assembly. Background Technology

[0002] As smartphone performance continues to improve, the heat generated by the internal motherboard under high load increases dramatically. Traditional motherboard cover components are prone to overheating due to insufficient heat dissipation, which in turn affects the stability and lifespan of the device.

[0003] In existing technologies, motherboard top covers are mostly made of a single metal material or ordinary plastic, which has the following problems:

[0004] 1. Low heat dissipation efficiency: Metal substrates lack composite heat dissipation structures, so heat cannot be conducted quickly; Plastic materials have poor thermal conductivity and are prone to heat accumulation.

[0005] 2. Insufficient insulation performance: Direct contact between the metal substrate and the motherboard may cause a short circuit risk, while the surface insulation layer (such as ordinary oxide layer) is easy to peel off or has poor high temperature resistance.

[0006] To address this, we propose a high-temperature resistant mobile phone motherboard cover assembly. Utility Model Content

[0007] (a) Technical problems to be solved

[0008] To address the shortcomings of existing technologies, this utility model provides a high-temperature resistant mobile phone motherboard cover assembly. Through the synergistic effect of a triple composite heat dissipation structure, it significantly improves heat dissipation efficiency. The micro-arc oxidation insulation layer provides stable insulation protection and withstands high-temperature environments. The ventilation holes and through-type heat dissipation channels enhance air convection and reduce the temperature of the core area, effectively solving the problems in the background technology.

[0009] (II) Technical Solution

[0010] To achieve the above objectives, the technical solution adopted by this utility model is as follows: a high-temperature resistant mobile phone motherboard top cover assembly, comprising a metal substrate layer and a composite heat dissipation layer. The metal substrate layer is made of aluminum alloy or magnesium alloy, and its outer surface is provided with a micro-arc oxidation insulating layer. The composite heat dissipation layer is attached to the inner side of the metal substrate layer by a hot pressing process, and is composed of a ceramic fiber cloth layer, a nano-alumina coating, and a thermally conductive silicone layer arranged sequentially from the inside to the outside. The thickness of the nano-alumina coating is 10-50μm, and the porosity is ≤5%.

[0011] Preferably, the thickness of the micro-arc oxidation insulating layer is 20-100μm, the surface roughness Ra≤1.6μm, the fiber diameter of the ceramic fiber cloth layer is 3-8μm, and the weaving density is 60-80 mesh.

[0012] Preferably, the thermally conductive silicone layer has an array of protrusions on the contact surface with the motherboard, with a protrusion height of 0.1-0.3mm.

[0013] Preferably, the edge of the metal substrate layer is provided with an upwardly extending folded edge, and the outer wall of the folded edge is provided with ventilation holes at equal intervals.

[0014] Preferably, the total thickness of the composite heat dissipation layer is 0.2-0.8 mm.

[0015] Preferably, the ventilation hole penetrates the folded edge of the metal substrate layer and extends to the composite heat dissipation layer, forming a through-type heat dissipation channel.

[0016] (III) Beneficial Effects

[0017] Compared with the prior art, this utility model provides a high-temperature resistant mobile phone motherboard cover assembly, which has the following beneficial effects:

[0018] 1. This high-temperature resistant mobile phone motherboard cover assembly achieves rapid heat conduction and dispersion through the synergistic effect of a triple structure consisting of a ceramic fiber cloth layer, a nano-alumina coating, and a thermally conductive silicone layer. The nano-alumina coating has a porosity of ≤5%, ensuring high thermal conductivity, while the array-type protrusion structure of the thermally conductive silicone layer increases the effective contact area with the motherboard, further improving heat dissipation efficiency.

[0019] 2. The high-temperature resistant mobile phone motherboard cover assembly has a micro-arc oxidation insulating layer (thickness 20-100μm, Ra≤1.6μm) on the surface of the metal substrate layer, which provides stable insulation protection, avoids short circuits, and is resistant to high-temperature environments.

[0020] 3. This high-temperature resistant mobile phone motherboard cover assembly features ventilation holes on the folded edge that form air convection with the through-type heat dissipation channel, accelerating heat dissipation and reducing the temperature of the core area.

[0021] 4. This high-temperature resistant mobile phone motherboard top cover assembly combines an aluminum alloy / magnesium alloy substrate with a composite heat dissipation layer (total thickness 0.2-0.8mm), which reduces weight while ensuring mechanical strength. The hot pressing process ensures that each layer is tightly bonded, preventing delamination and extending service life. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the overall structure of a high-temperature resistant mobile phone motherboard cover assembly according to this utility model.

[0023] Figure 2 This is a partial cross-sectional view of a high-temperature resistant mobile phone motherboard cover assembly according to this utility model.

[0024] Figure 3 This is a structural layer diagram of the metal substrate layer in a high-temperature resistant mobile phone motherboard top cover assembly according to this utility model.

[0025] Figure 4 This is a structural layer diagram of the composite heat dissipation layer in a high-temperature resistant mobile phone motherboard top cover assembly according to this utility model.

[0026] In the figure: 1. Metal substrate layer; 2. Folded edge; 3. Ventilation hole; 4. Composite heat dissipation layer; 5. Micro-arc oxidation insulation layer; 6. Ceramic fiber cloth layer; 7. Nano-alumina coating; 8. Thermally conductive silicone layer; 9. Array-type protrusion structure. Detailed Implementation

[0027] To make the technical solution, structural features and advantages of this utility model clearer, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0028] This embodiment provides a high-temperature resistant mobile phone motherboard cover assembly, which aims to solve problems such as low heat dissipation efficiency and insufficient insulation performance in the prior art.

[0029] 1. Overall Structure

[0030] The high-temperature resistant mobile phone motherboard cover assembly includes a metal substrate layer 1 and a composite heat dissipation layer 4. The edge of the metal substrate layer 1 is provided with an upwardly extending folded edge 2. Ventilation holes 3 are equally spaced on the outer wall of the folded edge 2. The ventilation holes 3 penetrate the folded edge 2 of the metal substrate layer 1 and extend to the composite heat dissipation layer 4 to form a through heat dissipation channel to enhance air convection and accelerate heat dissipation.

[0031] 2. Metal substrate layer

[0032] The metal substrate layer 1 is made of aluminum alloy or magnesium alloy, featuring lightweight and high strength. Its outer surface is formed with a micro-arc oxidation insulating layer 5 through a micro-arc oxidation process, such as... Figure 3 As shown, the thickness of the micro-arc oxidation insulation layer 5 is 20-100μm, and the surface roughness Ra≤1.6μm, which can provide stable insulation protection and withstand high temperature environment.

[0033] 3. Composite heat dissipation layer

[0034] The composite heat dissipation layer 4 is bonded to the inner side of the metal substrate layer 1 via a hot-pressing process, with a total thickness of 0.2-0.8 mm. Figure 4 As shown, the composite heat dissipation layer 4 is composed of a ceramic fiber cloth layer 6, a nano-alumina coating 7, and a thermally conductive silicone layer 8 arranged sequentially from the inside to the outside.

[0035] Ceramic fiber cloth layer 6: The fiber diameter is 3-8μm, the weaving density is 60-80 mesh, it is resistant to high temperature, and has both flexibility and strength.

[0036] Nano-alumina coating 7: Thickness is 10-50μm, porosity ≤5%, ensuring high thermal conductivity.

[0037] Thermal conductive silicone layer 8: The contact surface between the thermal conductive silicone layer 8 and the motherboard has an array of raised structures 9 with a height of 0.1-0.3mm, in order to increase the effective contact area with the motherboard and further improve heat dissipation efficiency.

[0038] 4. Working principle

[0039] When the mobile phone motherboard generates heat during operation, the heat is first quickly conducted to the composite heat dissipation layer 4 through the array of raised structures 9 of the thermally conductive silicone layer 8. Subsequently, the heat is dispersed to the metal substrate layer 1 through the nano-alumina coating 7 and the ceramic fiber cloth layer 6. The metal substrate layer 1 isolates the current through the micro-arc oxidation insulation layer 5 to avoid the risk of short circuit. At the same time, the ventilation holes 3 and the through-type heat dissipation channel form air convection, which accelerates the heat from the core area and achieves efficient heat dissipation.

[0040] It should be noted that, in this document, relational terms such as first and second (number one, number two), etc., are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0041] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.

Claims

1. A high-temperature resistant mobile phone motherboard top cover assembly, comprising a metal substrate layer (1) and a composite heat dissipation layer (4), characterized in that: The metal substrate layer (1) is made of aluminum alloy or magnesium alloy, and its outer surface is provided with a micro-arc oxidation insulating layer (5). The composite heat dissipation layer (4) is bonded to the inside of the metal substrate layer (1) by hot pressing process. It is composed of a ceramic fiber cloth layer (6), a nano alumina coating (7) and a thermally conductive silicone layer (8) arranged sequentially from the inside to the outside. The thickness of the nano-alumina coating (7) is 10-50 μm, and the porosity is ≤5%.

2. The high-temperature-resistant mobile phone mainboard cover assembly according to claim 1, characterized in that: The thickness of the micro-arc oxidation insulating layer (5) is 20-100μm, the surface roughness Ra≤1.6μm, and the fiber diameter of the ceramic fiber cloth layer (6) is 3-8μm, and the weaving density is 60-80 mesh.

3. The high-temperature-resistant mobile phone mainboard cover assembly according to claim 1, characterized in that: The thermally conductive silicone layer (8) has an array of raised structures (9) on the contact surface with the motherboard, with a raised height of 0.1-0.3mm.

4. The high-temperature-resistant mobile phone mainboard cover assembly according to claim 1, characterized in that: The edge of the metal substrate layer (1) is provided with an upwardly extending folded edge (2), and the outer wall of the folded edge (2) is provided with ventilation holes (3) at equal intervals.

5. The high-temperature-resistant mobile phone mainboard cover assembly according to claim 1, characterized in that: The total thickness of the composite heat dissipation layer (4) is 0.2-0.8 mm.

6. The high-temperature-resistant mobile phone mainboard cover assembly according to claim 4, characterized in that: The ventilation hole (3) penetrates the folded edge (2) of the metal substrate layer (1) and extends to the composite heat dissipation layer (4) to form a through heat dissipation channel.

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