A bone-voiceprint sensor and electronic device

Abstract

This application discloses a bone conduction sensor and an electronic device. The bone conduction sensor includes: a first carrier plate with an electrical connector disposed on its lower surface, the electrical connector being configured to connect to an external device; a second carrier plate disposed above the first carrier plate, forming a vibration cavity together with the first carrier plate; a housing disposed above the second carrier plate, forming a microphone cavity together with the second carrier plate; a vibration system disposed within the vibration cavity; and a microphone assembly disposed within the microphone cavity. The bone conduction sensor of this application has a vibration system closer to the vibration source, enabling better sensing of vibration signals and higher sensitivity. Furthermore, the vibration system is disposed within the vibration cavity formed by the first and second carrier plates, allowing these components to be integrated into a subsystem, thereby simplifying the manufacturing process and improving reliability.

Description

Technical Field

[0001] This application belongs to the field of semiconductor technology and relates to a bone conduction sensor and electronic device. Background Technology

[0002] A bone conduction sensor is a sensor that detects sound waves transmitted by vibrations in the human skeleton and converts the resulting vibration signals into electrical signals. A bone conduction sensor typically includes a vibration system and a MEMS microphone assembly. The vibration system senses external vibrations, and the MEMS microphone assembly converts the resulting airflow changes into electrical signals to represent the vibration information. Both the vibration system and the MEMS microphone assembly are the core components of a bone conduction sensor.

[0003] Compared to traditional MEMS microphones, bone conduction signals are unaffected by airborne noise, significantly improving speech recognition rates in noisy environments. Because bone conduction sensors have no sound inlet, they are dustproof and waterproof, allowing them to be used in harsher environments.

[0004] However, the sensitivity and reliability of current bone conduction sensors still need to be improved. Utility Model Content

[0005] The main technical problem addressed by this application is to provide a bone voiceprint sensor and electronic device for improving the sensitivity and reliability of the bone voiceprint sensor.

[0006] In a first aspect, this application proposes a bone conduction sensor, comprising: a first carrier plate having an electrical connector disposed on its lower surface, the electrical connector being configured to connect to an external device; a second carrier plate disposed above the first carrier plate, forming a vibration cavity together with the first carrier plate; a housing disposed above the second carrier plate, forming a microphone cavity together with the second carrier plate; a vibration system disposed within the vibration cavity; and a microphone assembly disposed within the microphone cavity.

[0007] In some alternative embodiments, the second carrier plate has a sound hole that connects the vibration cavity and the microphone cavity.

[0008] In some alternative embodiments, the vibration system includes: a support portion disposed on the first carrier plate, an elastic membrane disposed on the support portion, and a mass block disposed on the elastic membrane.

[0009] In some alternative embodiments, the microphone assembly includes: a microphone MEMS chip disposed on the second carrier board corresponding to the sound hole, and a microphone ASIC chip disposed on the second carrier board.

[0010] In some alternative implementations, the microphone MEMS chip is electrically connected to the microphone ASIC chip via bonding wires, and the microphone ASIC chip is electrically connected to the second carrier board via bonding wires.

[0011] In some alternative embodiments, the microphone MEMS chip and the microphone ASIC chip are respectively fixed to the second carrier board by adhesive.

[0012] In some alternative embodiments, the first carrier plate and the second carrier plate are joined by solder, and the second carrier plate and the housing are joined by solder.

[0013] In some alternative embodiments, the first carrier plate and the second carrier plate, as well as the second carrier plate and the housing, are sealed together.

[0014] In some alternative implementations, the volume of the vibration cavity is smaller than that of the microphone cavity.

[0015] Secondly, this application proposes an electronic device including a motherboard, on which the bone voiceprint sensor is disposed, and a first carrier plate of the bone voiceprint sensor is electrically interconnected with the motherboard through an electrical connector on its lower surface.

[0016] As described above, this application proposes a multi-functional microphone and electronic device, which has the following advantages by adopting the above technical solution:

[0017] 1. The bone conduction sensor of this application has a vibration system located in the vibration cavity, which is closer to the first carrier plate than the microphone assembly. The first carrier plate is used to connect to an external device through its electrical connector. Thus, the vibration system is closer to the vibration source than the microphone assembly, which can better sense the vibration signal and achieve higher sensitivity (e.g., -20dB to -25dB).

[0018] 2. The vibration system is set in the vibration cavity formed by the first and second carrier plates. These components can be integrated together through the carrier plate manufacturing process to form a subsystem, thereby simplifying the process and improving reliability.

[0019] 3. The shell can be a common structure shell, such as a shell made of metals like copper or aluminum, which is less expensive. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments and the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a cross-sectional structural schematic diagram of a bone voiceprint sensor according to an embodiment of this application;

[0022] Figure 2 This is a cross-sectional structural schematic diagram of a bone voiceprint sensor proposed in another embodiment of this application. Detailed Implementation

[0023] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present application.

[0024] The terms "first," "second," "third," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0025] The following detailed descriptions will be provided through specific embodiments.

[0026] Example 1

[0027] refer to Figure 1 One embodiment of this application discloses a bone voiceprint sensor, which includes:

[0028] The first carrier plate 2 has an electrical connector on its lower surface, which is configured to connect to an external device.

[0029] The second carrier plate 1 is positioned above the first carrier plate 2, and together with the first carrier plate 2, they form a vibration cavity;

[0030] The housing 11 is positioned above the second carrier plate 1 and together with the second carrier plate 1 forms a microphone cavity 53;

[0031] The vibration system is installed inside the vibration chamber;

[0032] The microphone assembly is located inside the microphone cavity 53.

[0033] Here, the vibration system may include: a support 6 disposed on the first carrier plate 2, an elastic membrane 7 disposed on the support 6, and a mass block 3 disposed on the elastic membrane 7.

[0034] Here, the elastic membrane 7 can divide the vibration cavity into two cavities: a first cavity 51 formed by the first carrier plate 2, the support part 6 and the elastic membrane 7, and a second cavity 52 formed by the second carrier plate 2, the support part 6 and the elastic membrane 7.

[0035] Here, a sound hole 4 is provided on the second carrier plate 1, which connects the vibration cavity and the microphone cavity 53. Specifically, the sound hole 4 connects the second cavity 52 and the microphone cavity 53.

[0036] Here, the microphone assembly may include: a microphone MEMS (microelectromechanical system) chip 10 disposed on the second carrier board 1 corresponding to the sound hole 53, and a microphone ASIC (Application Specific Integrated Circuit) chip 8 disposed on the second carrier board 1.

[0037] In some alternative implementations, the microphone MEMS chip 10 is electrically connected to the microphone ASIC chip 8 via bonding wire 9, and the microphone ASIC chip 8 is electrically connected to the second carrier board 1 via bonding wire 9.

[0038] In some alternative embodiments, the microphone MEMS chip 10 and the microphone ASIC chip 8 are respectively fixed to the second carrier board by adhesives. The adhesives used include, but are not limited to, silicone and epoxy.

[0039] In some alternative embodiments, the first carrier plate 2 and the second carrier plate 1 are joined by solder, and the second carrier plate 1 and the housing 11 are joined by solder.

[0040] In some alternative embodiments, the first carrier plate 2 and the second carrier plate 1, as well as the second carrier plate 2 and the housing 11, are sealed together.

[0041] In some alternative implementations, the volume of the vibration cavity is smaller than that of the microphone cavity 53. Within the vibration cavity, the volume of the first cavity 51 is smaller than that of the second cavity 52.

[0042]

Example 2

[0043] refer to Figure 2 This illustrates another embodiment of a bone voiceprint sensor proposed in this application. Figure 2 The bone voiceprint sensor shown is similar to Figure 1 The bone voiceprint sensor shown differs in that:

[0044] exist Figure 1In the bone voiceprint sensor shown, the mass block 3 is disposed on the upper surface of the elastic membrane 7;

[0045] exist Figure 2 In the bone voiceprint sensor shown, the mass block 3 is disposed on the lower surface of the elastic membrane 7.

[0046]

Example 3

[0047] This application provides an electronic device, including a motherboard, on which are disposed such as Figure 1 or Figure 2 The bone voiceprint sensor shown has a first carrier plate 2 electrically interconnected with the motherboard via an electrical connector on its lower surface.

[0048] The technical solution of this application has been described in detail above through specific embodiments. In the above embodiments, the descriptions of each embodiment have their own emphasis, and for parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0049] It should be understood that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Those skilled in the art can modify the technical solutions described in the above embodiments, or make equivalent substitutions for some of the technical features; however, these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and protection scope of the technical solutions of the embodiments of this application.

Claims

1. A bone-voiceprint sensor, characterized by, include: A first carrier plate, the lower surface of which is provided with an electrical connector configured to connect to an external device; The second carrier plate is disposed above the first carrier plate, and together with the first carrier plate, they form a vibration cavity; The housing is positioned above the second carrier plate, forming a microphone cavity with the second carrier plate; The vibration system is installed inside the vibration cavity; A microphone assembly is disposed within the microphone cavity; The first carrier plate, the second carrier plate, and the vibration system are integrated together through a carrier plate manufacturing process.

2. The bone-voiceprint sensor of claim 1, wherein, The second carrier plate has a sound hole, which connects the vibration cavity and the microphone cavity.

3. The bone-sonic-print sensor of claim 2, wherein, The vibration system includes: a support portion disposed on the first carrier plate, an elastic membrane disposed on the support portion, and a mass block disposed on the elastic membrane.

4. The bone-sonic-print sensor of claim 2, wherein, The microphone assembly includes: a microphone MEMS chip disposed on the second carrier board corresponding to the sound hole, and a microphone ASIC chip disposed on the second carrier board.

5. The bone conduction sensor according to claim 4, characterized in that, The microphone MEMS chip is electrically connected to the microphone ASIC chip via bonding wires, and the microphone ASIC chip is electrically connected to the second carrier board via bonding wires.

6. The bone-sonic-print sensor of claim 4, wherein, The microphone MEMS chip and the microphone ASIC chip are respectively fixed to the second carrier board with adhesive.

7. The bone-sonic-print sensor of claim 1, wherein, The first carrier plate and the second carrier plate are joined by solder, and the second carrier plate and the housing are joined by solder.

8. The bone-sonic-print sensor of claim 1, wherein, The first carrier plate and the second carrier plate, as well as the second carrier plate and the housing, are sealed together.

9. The bone conduction sensor according to claim 1, characterized in that, The volume of the vibration cavity is smaller than that of the microphone cavity.

10. An electronic device comprising a main board, characterized by The motherboard is provided with a bone conduction sensor as described in claim 1, and the first carrier plate of the bone conduction sensor is electrically interconnected with the motherboard through an electrical connector on its lower surface.

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