A compressor control board
By introducing busbar components and high-voltage capacitors into the compressor control board, the electromagnetic compatibility problem caused by the sharing of high and low voltage lines was solved, and the hierarchical isolation of current and miniaturization design were achieved, which improved safety and control accuracy and reduced costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- FUZHOU XICHENG TECHNOLOGY CO LTD
- Filing Date
- 2025-08-06
- Publication Date
- 2026-07-03
AI Technical Summary
In traditional compressor control board designs, high-voltage, high-current and low-voltage, low-current circuits share a single PCB board, leading to serious electromagnetic compatibility issues and limiting PCB board design, making miniaturization difficult.
Busbar assemblies are used to separate high-voltage current from low-voltage current. The high-voltage power input interface and compressor drive interface are installed on the input and output terminals of the busbar metal terminals through the busbar assembly. The low-voltage power communication interface and IGBT chip are installed on the PCB board, forming a layered isolation in physical space. High-voltage capacitors and limit baffles are added for fixation, and an aluminum shell frame is used to protect the core components.
It effectively avoids electromagnetic compatibility interference, improves the safety and control accuracy of the control board, and reduces material costs, thus achieving miniaturization of the control board.
Smart Images
Figure CN224460103U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of compressor technology, and in particular to a compressor control board. Background Technology
[0002] In traditional compressor control board design, high-voltage, high-current transmission lines and low-voltage, low-current control lines usually share a PCB board, with both high-current copper traces and low-current signal traces existing on the PCB board.
[0003] However, this design has the following important problems:
[0004] (1) Significant electromagnetic compatibility issues: Due to the close proximity of high-voltage, high-current and low-voltage, low-current lines, the strong electromagnetic interference generated by the high current will seriously affect the stability of the low-voltage signal, leading to a decrease in control accuracy;
[0005] (2) PCB board design limitations: In order to accommodate the two types of circuits, the number of PCB boards needs to be increased or the area needs to be expanded, which not only increases the cost, but also hinders the miniaturization of the control board. Utility Model Content
[0006] The technical problem to be solved by this utility model is to provide a compressor control board that can effectively avoid interference and being interfered with by electromagnetic compatibility in hardware, while also reducing costs.
[0007] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows:
[0008] A compressor control board includes a PCB board, a low-voltage power communication interface, a high-voltage power input interface, a compressor drive interface, and an IGBT chip. It also includes a bus assembly mounted on the PCB board. The high-voltage power input interface is mounted on the input end of the bus assembly, the compressor drive interface is mounted on the output end of the bus assembly, and the low-voltage power communication interface and the IGBT chip are respectively mounted on the PCB board.
[0009] Furthermore, the bus assembly includes a bus injection molded part and a bus metal terminal. The bus injection molded part is mounted on a PCB board, and the bus metal terminal is embedded in the bus injection molded part and electrically connected to the PCB board. The high-voltage power input interface is installed at the input end of the bus metal terminal, and the compressor drive interface is installed at the output end of the bus metal terminal.
[0010] Furthermore, the bus metal terminals include an input metal terminal and an output metal terminal that are electrically connected to the PCB board respectively. The high-voltage power input interface is installed on the input metal terminal, and the compressor drive interface is installed on the output metal terminal.
[0011] Furthermore, the IGBT chip, input metal terminal, and output metal terminal are respectively soldered onto the PCB board, and the soldering pins of the IGBT chip are positioned close to the soldering pins of the input metal terminal.
[0012] Furthermore, the busbar metal terminal is a copper busbar, which is embedded in the busbar injection molded part through a sandwich layer.
[0013] Furthermore, it also includes a high-voltage capacitor, which is mounted on the bus assembly and positioned near the input terminal of the bus assembly.
[0014] Furthermore, a limiting baffle is provided on the side of the bus assembly away from the PCB board. The limiting baffle is positioned corresponding to the position of the high-voltage capacitor and abuts against the high-voltage capacitor.
[0015] Furthermore, a limiting block is provided on the side of the bus assembly away from the PCB board. The limiting block is located at the opposite end of the limiting baffle. Each high-voltage capacitor is equipped with two limiting blocks. The high-voltage capacitor is located between the two limiting blocks and abuts against the two limiting blocks respectively.
[0016] Furthermore, the low-voltage power communication interface is mounted on the side of the PCB board away from the bus assembly.
[0017] Furthermore, it also includes an aluminum housing frame, with the bus assembly, compressor drive interface and IGBT chip all located inside the aluminum housing frame, and the low-voltage power communication interface and high-voltage power input interface located outside the aluminum housing frame.
[0018] The beneficial effects of this utility model are as follows:
[0019] This solution involves mounting a bus assembly on the PCB board. High-voltage current is input to the bus assembly through the high-voltage power input interface. The high-voltage current input to the bus assembly is then fed into the IGBT chip through the PCB board. Low-voltage current is input to the PCB board through the low-voltage power communication interface. The low-voltage current in the PCB board controls the switching of the IGBT chip, converting the input high-voltage current into the high-voltage current required for compressor operation. The converted high-voltage current is then transmitted through the PCB board to the bus assembly and then to the compressor drive interface, ultimately connecting to the compressor body through the compressor drive interface. This design achieves physical spatial isolation between the high-voltage and low-voltage currents. This design fundamentally solves the electromagnetic compatibility (EMC) problem caused by sharing a PCB board for high and low voltage lines in traditional designs, effectively avoiding EMC interference and being interfered with in the hardware. Simultaneously, the addition of a bus assembly significantly increases the creepage distance between components, reducing safety risks caused by insufficient creepage distance and improving the safety of the control board. Furthermore, placing high-voltage current in the bus assembly greatly reduces the line load on the PCB board, eliminating the need to increase the number of PCB layers or expand the area to accommodate both high and low voltage lines. This significantly saves PCB space and layers, reduces material costs, and enables the miniaturization of the control board, meeting the compact structure requirements of the compressor control field. Attached Figure Description
[0020] Figure 1 This is a partial structural diagram of the compressor control board of this utility model;
[0021] Figure 2 This is a partial structural diagram of the compressor control board of this utility model;
[0022] Figure 3 This is a partial cross-sectional view of the compressor control board of this utility model;
[0023] Figure 4 This is an exploded view of the busbar assembly of the compressor control board of this utility model;
[0024] Figure 5 This is a partial structural diagram of the compressor control board of this utility model;
[0025] Figure 6 This is a schematic diagram of the manifold injection molded part of the compressor control board of this utility model;
[0026] Figure 7 This is a schematic diagram showing the structure of the compressor control board of this utility model with all components assembled together.
[0027] Figure 8 The compressor control board of this utility model Figure 7 Exploded view;
[0028] Label Explanation:
[0029] 1. Busbar assembly; 101. Busbar injection molded part; 1011. First through slot; 1012. Second through slot; 1013. Limiting baffle; 1014. Limiting block; 102. Busbar metal terminal; 1021. Input metal terminal; 1022. Output metal terminal; 2. PCB board; 3. IGBT chip; 4. High voltage power input interface; 5. Compressor drive interface; 6. Low voltage power communication interface; 7. Aluminum housing frame; 8. High voltage capacitor. Detailed Implementation
[0030] To explain in detail the technical content, objectives, and effects of this utility model, the following description is provided in conjunction with the embodiments and accompanying drawings.
[0031] Please refer to Figure 1 A compressor control board includes a PCB board 2, a low-voltage power communication interface 6, a high-voltage power input interface 4, a compressor drive interface 5, and an IGBT chip 3. It also includes a bus assembly 1 mounted on the PCB board 2. The high-voltage power input interface 4 is mounted on the input end of the bus assembly 1, the compressor drive interface 5 is mounted on the output end of the bus assembly 1, and the low-voltage power communication interface 6 and the IGBT chip 3 are respectively mounted on the PCB board 2.
[0032] As can be seen from the above description, the beneficial effects of this utility model are as follows:
[0033] This solution involves installing a bus assembly 1 on PCB board 2. High-voltage current is input to bus assembly 1 through high-voltage power input interface 4. The high-voltage current input to bus assembly 1 is then fed into IGBT chip 3 through PCB board 2. Low-voltage current is input to PCB board 2 through low-voltage power communication interface 6. The low-voltage current in PCB board 2 controls the switching of IGBT chip 3, converting the input high-voltage current into the high-voltage current required for compressor operation. The converted high-voltage current is then transmitted through PCB board 2 to bus assembly 1 and then to compressor drive interface 5, ultimately connecting to the compressor body through compressor drive interface 5. This achieves a physical spatial layering and isolation between high-voltage and low-voltage currents. The structural design fundamentally solves the electromagnetic compatibility problem caused by the sharing of PCB board 2 for high and low voltage lines in traditional designs, effectively avoiding electromagnetic compatibility interference and being interfered with in the hardware. At the same time, the addition of a bus assembly 1 significantly increases the creepage distance between components, reduces the safety risks caused by insufficient creepage distance, and improves the safety of the control board. In addition, placing the high voltage current in the bus assembly 1 can significantly reduce the line load on PCB board 2, eliminating the need to increase the number of layers or expand the area of PCB board 2 to accommodate both high and low voltage lines, significantly saving space and layers of PCB board 2, reducing material costs, and realizing the miniaturization of the control board, which meets the needs of the compressor control field for a compact structure.
[0034] Furthermore, the bus assembly 1 includes a bus injection molded part 101 and a bus metal terminal 102. The bus injection molded part 101 is mounted on the PCB board 2. The bus metal terminal 102 is embedded in the bus injection molded part 101 and electrically connected to the PCB board 2. The high-voltage power input interface 4 is installed at the input end of the bus metal terminal 102, and the compressor drive interface 5 is installed at the output end of the bus metal terminal 102.
[0035] As described above, the bus assembly 1 is configured as a combination of a bus injection molded part 101 and a bus metal terminal 102. The bus metal terminal 102 is embedded in the bus injection molded part 101 and electrically connected to the PCB board 2. The high-voltage power input interface 4 and the compressor drive interface 5 are respectively installed at the input and output ends of the bus metal terminal 102. In this way, the bus injection molded part 101 can effectively insulate and fix the bus metal terminal 102, further strengthening the physical isolation between the high-voltage current transmission path and the low-voltage lines on the PCB board 2, reducing electromagnetic interference, and enhancing electromagnetic compatibility. At the same time, this structure makes the installation of the bus assembly 1 more stable, the electrical connection between the metal terminal and the PCB board 2 more reliable, and ensures the stability of high-voltage current transmission. In addition, the modular component design also facilitates production assembly and improves production efficiency.
[0036] Furthermore, the bus metal terminal 102 includes an input metal terminal 1021 and an output metal terminal 1022 that are electrically connected to the PCB board 2 respectively. The high-voltage power input interface 4 is installed on the input metal terminal 1021, and the compressor drive interface 5 is installed on the output metal terminal 1022.
[0037] As described above, the bus metal terminal 102 is divided into an input metal terminal 1021 and an output metal terminal 1022, which are respectively connected to the high-voltage power input interface 4 and the compressor drive interface 5. This split design makes the input and output paths of the high-voltage current clearer and easier to shunt and control the current. The input metal terminal 1021 and the output metal terminal 1022 are each electrically connected to the PCB board 2, which can reduce mutual interference and improve the stability of current transmission. Moreover, when a problem occurs with a terminal, it is easy to repair or replace it individually, reducing maintenance costs.
[0038] Furthermore, the IGBT chip 3, the input metal terminal 1021, and the output metal terminal 1022 are respectively soldered onto the PCB board 2, and the soldering pins of the IGBT chip 3 are positioned close to the soldering pins of the input metal terminal 1021.
[0039] As described above, the IGBT chip 3, input metal terminal 1021, and output metal terminal 1022 are all soldered onto the PCB board 2, and the soldering pins of the IGBT chip 3 are close to the soldering pins of the input metal terminal 1021. This soldering connection method can ensure the firmness of the connection between each component and the PCB board 2 and the reliability of the electrical connection, reduce contact resistance, and reduce energy loss. The close proximity of the soldering pins of the IGBT chip 3 to the soldering pins of the input metal terminal 1021 shortens the path of high-voltage current into the IGBT chip 3, reduces energy loss and electromagnetic radiation on the line, improves the conversion efficiency of the IGBT chip 3 for high-voltage current, and also helps to reduce electromagnetic interference to surrounding low-voltage lines.
[0040] Furthermore, the bus metal terminal 102 is a copper bus, which is embedded in the bus injection molded part 101 through a sandwich structure.
[0041] As described above, the busbar metal terminal 102 is made of copper and is embedded in the busbar injection molded part 101 through a sandwich structure. Copper has excellent conductivity, and using copper busbar as a metal terminal can reduce the resistance during high-voltage current transmission, reduce energy loss, and improve current transmission efficiency. The sandwich embedding method makes the copper busbar and the busbar injection molded part 101 more tightly bonded and more firmly fixed, preventing the copper busbar from shifting due to vibration or other reasons when transmitting large current. At the same time, the busbar injection molded part 101 can provide effective insulation protection for the copper busbar, preventing short circuits between the copper busbar and other components and improving the safety of the control board.
[0042] Furthermore, it also includes a high-voltage capacitor 8, which is mounted on the bus assembly 1 and positioned near the input terminal of the bus assembly 1.
[0043] As described above, a high-voltage capacitor 8 is placed on the bus assembly 1 near its input terminal. The high-voltage capacitor 8 can filter the input high-voltage current, reduce ripple in the high-voltage current, and make the high-voltage current input to the IGBT chip 3 more stable, thereby improving the current conversion effect of the IGBT chip 3 and ensuring the stability of the compressor operation. The high-voltage capacitor 8 is placed near the input terminal of the bus assembly 1, which can quickly respond to changes in the input current and perform timely filtering, thereby improving the filtering efficiency. At the same time, installing the high-voltage capacitor 8 on the bus assembly 1 does not occupy too much space on the PCB board 2, which is conducive to the miniaturization of the control board.
[0044] Furthermore, a limiting baffle 1013 is provided on the side of the bus assembly 1 away from the PCB board 2. The limiting baffle 1013 is positioned corresponding to the position of the high voltage capacitor 8 and abuts against the high voltage capacitor 8.
[0045] As can be seen from the above description, the side of the bus assembly 1 away from the PCB board 2 is provided with a limiting baffle 1013, which abuts against the high voltage capacitor 8. The limiting baffle 1013 can limit and fix the high voltage capacitor 8, preventing the high voltage capacitor 8 from shifting or loosening due to vibration or other reasons during the operation of the control board, ensuring the installation stability of the high voltage capacitor 8, and ensuring the normal functioning of its filtering function. The design of abutting against the high voltage capacitor 8 can further enhance the fixing effect of the high voltage capacitor 8 and avoid its shaking from affecting the surrounding components.
[0046] Furthermore, a limiting block 1014 is provided on the side of the bus assembly 1 away from the PCB board 2. The limiting block 1014 is located at the opposite end of the limiting baffle 1013. One high-voltage capacitor 8 is configured with two limiting blocks 1014. The high-voltage capacitor 8 is located between the two limiting blocks 1014 and abuts against the two limiting blocks 1014 respectively.
[0047] As described above, the busbar assembly 1 is equipped with a limiting block 1014, which works in conjunction with the limiting baffle 1013 to fix the high-voltage capacitor 8. Each high-voltage capacitor 8 is equipped with two limiting blocks 1014 located between the two. This combination of the limiting block 1014 and the limiting baffle 1013 forms a multi-directional limiting of the high-voltage capacitor 8, which can more comprehensively restrict the displacement of the high-voltage capacitor 8 and make the fixing effect more reliable. Even in a strong vibration environment, the position of the high-voltage capacitor 8 can be kept stable, ensuring its good connection with the busbar assembly 1, ensuring the stable performance of the filtering function, and improving the overall reliability of the control board.
[0048] Furthermore, the low-voltage power communication interface 6 is mounted on the side of the PCB board 2 away from the bus assembly 1.
[0049] As can be seen from the above description, the low-voltage power communication interface 6 is installed on the side of the PCB board 2 away from the bus assembly 1, which makes the input path of the low-voltage current and the transmission path of the high-voltage current on the bus assembly 1 physically farther apart, further increasing the isolation distance between the high and low voltage lines, reducing the impact of electromagnetic interference generated by the high-voltage current on the low-voltage signal, improving the stability of the low-voltage signal transmission, and thus improving the control accuracy of the control board; at the same time, this layout also makes the interface distribution on the control board more reasonable, which facilitates the connection and maintenance of external lines.
[0050] Furthermore, it also includes an aluminum outer frame 7, in which the bus assembly 1, the compressor drive interface 5 and the IGBT chip 3 are all located inside the aluminum outer frame 7, while the low-voltage power communication interface 6 and the high-voltage power input interface 4 are located outside the aluminum outer frame 7.
[0051] As described above, the aluminum outer frame 7 encapsulates the bus assembly 1, compressor drive interface 5, and IGBT chip 3 internally, while the low-voltage power communication interface 6 and high-voltage power input interface 4 are located externally. The aluminum outer frame 7 provides effective physical protection for the internal high-voltage components, preventing external dust, moisture, etc., from affecting these components, thus improving the service life and reliability of the control board. Aluminum has good heat dissipation properties, which can help dissipate heat from internal heat-generating components such as the IGBT chip 3, reducing their operating temperature and improving operational stability. At the same time, by encapsulating the high-voltage-related core components internally and placing the low-voltage and some high-voltage interfaces externally, the structure of the control board becomes more compact, facilitating the connection of external lines and reducing interference from external factors to the internal core components.
[0052] Please refer to Figures 1 to 8 As shown, Embodiment 1 of this utility model is as follows:
[0053] Please refer to Figure 1 A compressor control board includes a PCB board 2, a low-voltage power communication interface 6, a high-voltage power input interface 4, a compressor drive interface 5, and an IGBT chip 3. It also includes a bus assembly 1 mounted on the PCB board 2. The high-voltage power input interface 4 is mounted on the input end of the bus assembly 1, the compressor drive interface 5 is mounted on the output end of the bus assembly 1, and the low-voltage power communication interface 6 and the IGBT chip 3 are respectively mounted on the PCB board 2.
[0054] The compressor control board in this embodiment is suitable for scenarios such as household air conditioner compressors and commercial cold chain compressors that require precise driving and have high requirements for electromagnetic compatibility and structural compactness.
[0055] Please refer to Figure 1, Figure 2 and Figure 3 The bus assembly 1 includes a bus injection molded part 101 and a bus metal terminal 102. The bus injection molded part 101 is mounted on the PCB board 2. The bus metal terminal 102 is embedded in the bus injection molded part 101 and electrically connected to the PCB board 2. The high-voltage power input interface 4 is installed at the input end of the bus metal terminal 102. The compressor drive interface 5 is installed at the output end of the bus metal terminal 102.
[0056] The busbar injection molding part 101 is fastened and fixed to the PCB board 2 by screws.
[0057] Please refer to Figure 2 and Figure 4 The bus metal terminal 102 includes an input metal terminal 1021 and an output metal terminal 1022 that are electrically connected to the PCB board 2 respectively. The high-voltage power input interface 4 is installed on the input metal terminal 1021, and the compressor drive interface 5 is installed on the output metal terminal 1022.
[0058] Please refer to Figure 5 The IGBT chip 3, the input metal terminal 1021 and the output metal terminal 1022 are respectively soldered on the PCB board 2, and the soldering pins of the IGBT chip 3 are arranged close to the soldering pins of the input metal terminal 1021.
[0059] The busbar metal terminal 102 is a copper busbar, which is embedded in the busbar injection molded part 101 through a sandwich structure. The busbar metal terminal 102 can also be replaced with an aluminum busbar (silver-plated to improve conductivity), which is suitable for scenarios that are cost-sensitive but have slightly lower current carrying capacity requirements; or a copper-aluminum composite busbar can be used to balance conductivity and weight reduction.
[0060] The busbar injection molding part 101 can be made of high-temperature resistant insulating material or high-temperature resistant flame retardant material, which can improve the aging resistance and safety of the control board in high-temperature environments (such as compressor compartments).
[0061] Please refer to Figures 1 to 3 It also includes a high-voltage capacitor 8, which is mounted on the bus assembly 1 and positioned near the input terminal of the bus assembly 1.
[0062] Please refer to Figure 6 The bus assembly 1 is provided with a limiting baffle 1013 on the side away from the PCB board 2. The limiting baffle 1013 is set at the position of the high voltage capacitor 8 and abuts against the high voltage capacitor 8.
[0063] Please refer to Figure 1 , Figure 4 and Figure 6The bus assembly 1 is provided with a limiting block 1014 on the side away from the PCB board 2. The limiting block 1014 is located at the opposite end of the limiting baffle 1013. Each high voltage capacitor 8 is configured with two limiting blocks 1014. The high voltage capacitor 8 is located between the two limiting blocks 1014 and abuts against the two limiting blocks 1014 respectively.
[0064] Please refer to Figure 4 and Figure 6 The busbar injection molding part 101 has a first through groove 1011 through which the welding feet of the IGBT chip 3 (six in this embodiment) pass and a second through groove 1012 through which the welding feet of the high voltage capacitor 8 (four in this embodiment, the shape of the limiting baffle 1013 is adapted to the arrangement of the four high voltage capacitors 8, and the shape of the side of the limiting block 1014 near the high voltage capacitor 8 is adapted to the shape of the side wall of the high voltage capacitor 8) pass.
[0065] Please refer to Figure 1 and Figure 2 The low-voltage power communication interface 6 is installed on the side of the PCB board 2 away from the bus assembly 1.
[0066] Please refer to Figure 7 and Figure 8 It also includes an aluminum outer frame 7, the bus assembly 1, the compressor drive interface 5 and the IGBT chip 3 are all located inside the aluminum outer frame 7, and the low-voltage power communication interface 6 and the high-voltage power input interface 4 are located outside the aluminum outer frame 7.
[0067] The working process of the compressor control board described above is as follows:
[0068] An external high-voltage power supply is connected to the busbar metal terminal 102 through the high-voltage power input port. The high-voltage current is transmitted through the busbar metal terminal 102 and first flows through the high-voltage capacitor 8 soldered on the busbar metal terminal 102. The high-voltage capacitor 8 is directly electrically connected to the busbar metal terminal 102. It uses its energy storage characteristics to filter the input current, filter out high-frequency ripple and transient interference in the current, and keep the high-voltage and high-current output stable.
[0069] The filtered high-voltage current continues to be transmitted through the bus metal terminal 102. Since the bus metal terminal 102 is electrically connected to the PCB board 2, the high-voltage current is transmitted to the input terminal of the IGBT chip 3 soldered on the PCB board 2 through this connection path. At this time, the IGBT chip 3, as a key component on the PCB board 2, receives a low-voltage drive signal from the PCB board 2 (this signal is input through the low-voltage power supply communication interface 6).
[0070] According to the low-voltage current signal transmitted from the PCB board 2, the IGBT chip 3 precisely controls its own on and off states, converting the input high-voltage current into three-phase AC power (i.e., U-phase, V-phase, and W-phase) required for compressor operation. The converted three-phase high-voltage current is transmitted in reverse to the output terminal of the busbar metal terminal 102 through the connection between the IGBT chip 3 and the PCB board 2, and then transmitted to the compressor drive interface 5 through the busbar metal terminal 102. Finally, it is connected to the compressor body through the compressor drive interface 5 to drive the compressor to run according to preset parameters.
[0071] In summary, the compressor control board provided by this utility model, by mounting a bus assembly on a PCB board, allows high-voltage current to be input into the bus assembly through a high-voltage power input interface. The high-voltage current input to the bus assembly is then fed into the IGBT chip via the PCB board. Low-voltage current is input into the PCB board through a low-voltage power communication interface. The low-voltage current in the PCB board controls the switching of the IGBT chip, converting the input high-voltage current into the high-voltage current required for compressor operation. The converted high-voltage current is then transmitted through the PCB board to the bus assembly and then to the compressor drive interface, ultimately connecting to the compressor body via the compressor drive interface. This arrangement creates a physical separation between the high-voltage and low-voltage currents. This isolation design fundamentally solves the electromagnetic compatibility (EMC) problem caused by the sharing of PCB boards for high and low voltage lines in traditional designs, effectively avoiding EMC interference and being interfered with in the hardware. Simultaneously, the addition of a bus assembly significantly increases the creepage distance between components, reducing safety risks caused by insufficient creepage distance and improving the safety of the control board. Furthermore, placing high-voltage current in the bus assembly greatly reduces the line load on the PCB board, eliminating the need to increase the number of PCB layers or expand the area to accommodate both high and low voltage lines. This significantly saves PCB space and layers, reduces material costs, and enables the miniaturization of the control board, meeting the compact structure requirements of the compressor control field.
[0072] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent modifications made based on the content of this utility model specification and drawings, or direct or indirect applications in related technical fields, are similarly included within the patent protection scope of this utility model.
Claims
1. A compressor control board comprising a PCB board, a low-voltage power supply communication interface, a high-voltage power supply input interface, a compressor drive interface, and an IGBT chip, characterized in that, It also includes a bus assembly mounted on the PCB board, with the high-voltage power input interface mounted on the input end of the bus assembly, the compressor drive interface mounted on the output end of the bus assembly, and the low-voltage power communication interface and the IGBT chip mounted on the PCB board respectively.
2. The compressor control board of claim 1, wherein, The bus assembly includes a bus injection molded part and a bus metal terminal. The bus injection molded part is mounted on a PCB board, and the bus metal terminal is embedded in the bus injection molded part and electrically connected to the PCB board. The high-voltage power input interface is installed at the input end of the bus metal terminal, and the compressor drive interface is installed at the output end of the bus metal terminal.
3. The compressor control board of claim 2, wherein, The bus metal terminals include an input metal terminal and an output metal terminal that are electrically connected to the PCB board respectively. The high-voltage power input interface is installed on the input metal terminal, and the compressor drive interface is installed on the output metal terminal.
4. The compressor control board of claim 3, wherein, The IGBT chip, input metal terminal, and output metal terminal are respectively soldered on the PCB board, and the soldering pins of the IGBT chip are positioned close to the soldering pins of the input metal terminal.
5. The compressor control board of claim 2, wherein, The busbar metal terminal is a copper busbar, which is embedded in the busbar injection molded part through a sandwich layer.
6. The compressor control board of claim 1, wherein, It also includes a high-voltage capacitor, which is mounted on the bus assembly and positioned near the input terminal of the bus assembly.
7. The compressor control board of claim 6, wherein, A limiting baffle is provided on the side of the bus assembly away from the PCB board. The limiting baffle is positioned corresponding to the position of the high voltage capacitor and abuts against the high voltage capacitor.
8. The compressor control board of claim 7, wherein, The bus assembly is provided with a limiting block on the side away from the PCB board. The limiting block is located at the opposite end of the limiting baffle. Each high voltage capacitor is equipped with two limiting blocks. The high voltage capacitor is located between the two limiting blocks and abuts against the two limiting blocks respectively.
9. The compressor control board of claim 1, wherein, The low-voltage power communication interface is installed on the side of the PCB board away from the bus assembly.
10. The compressor control board of claim 1, wherein, It also includes an aluminum housing frame, with the bus assembly, compressor drive interface and IGBT chip all located inside the aluminum housing frame, and the low-voltage power communication interface and high-voltage power input interface located outside the aluminum housing frame.