Circuit board structure that improves heat dissipation by optimizing the spacing of pin-type electrolytic capacitors.

Abstract

This utility model relates to the field of circuit board technology and discloses a circuit board structure that improves heat dissipation performance by optimizing the spacing of pin-type electrolytic capacitors. The circuit board includes a circuit board body with several mounting holes, each containing an electrolytic capacitor assembly. Each electrolytic capacitor assembly includes an electrolytic capacitor body disposed within a mounting hole and pin assemblies disposed at the bottom of the electrolytic capacitor body. The bottom of the circuit board body has several pads. By setting the center-to-center distance between adjacent electrolytic capacitor body pads to 8mm-10mm, reasonable space is reserved between the electrolytic capacitors, effectively reducing heat transfer interference between capacitors and improving airflow between capacitors, thereby enhancing overall heat dissipation performance. The standardized mounting holes and pads ensure the stability and reliability of the electrolytic capacitor assembly installation, providing a fundamental guarantee for the normal operation of the circuit board.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a circuit board structure that improves heat dissipation performance by optimizing the spacing of pin-type electrolytic capacitors. Background Technology

[0002] In electronic device circuit board design, through-hole electrolytic capacitors are commonly used electronic components, and their performance and stability are crucial to the entire circuit system. As electronic devices become increasingly miniaturized and high-performance, component layouts on circuit boards are becoming more compact. However, in traditional circuit board designs, the spacing between through-hole electrolytic capacitors is often small, which brings several problems. On the one hand, the small spacing makes it difficult for the heat generated during operation to dissipate, leading to increased capacitor temperature. According to the characteristics of electrolytic capacitors, their lifespan is reduced by half for every 10-degree Celsius increase in ambient temperature. Excessively high temperatures accelerate the drying of the electrolyte inside the capacitor, thus reducing its lifespan and affecting the stability and reliability of the entire circuit system. On the other hand, the tightly packed electrolytic capacitors restrict operating space during circuit board repair and debugging, increasing repair difficulty and easily causing short circuits between adjacent solder joints, thus reducing production and maintenance efficiency.

[0003] Currently, although there are some technical solutions for capacitor heat dissipation, such as adding heat sinks and using thermally conductive materials, these solutions often do not fully consider the impact of capacitor spacing on heat dissipation, nor do they fundamentally solve the problems of inconvenience in maintenance caused by excessively small spacing. Utility Model Content

[0004] The purpose of this invention is to solve the problems existing in the prior art by proposing a circuit board structure that improves heat dissipation performance by optimizing the spacing of the pin-type electrolytic capacitors.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A circuit board structure that improves heat dissipation performance by optimizing the spacing of the plug-in electrolytic capacitors includes a circuit board body, wherein the circuit board body is provided with a plurality of mounting holes, and an electrolytic capacitor assembly is provided in each of the plurality of mounting holes.

[0007] The electrolytic capacitor assembly includes an electrolytic capacitor body disposed in a mounting hole and a pin assembly disposed at the bottom of the electrolytic capacitor body. The bottom of the circuit board body is provided with several pads. The positive and negative pins are fixed to the circuit board body by the pads, and the center distance between adjacent pads is 8mm-10mm.

[0008] Preferably, the circuit board body is made of metal-based copper-clad laminate.

[0009] Preferably, all of the pads are arranged asymmetrically.

[0010] Preferably, the top of the electrolytic capacitor body is also provided with a positive electrode mark.

[0011] Preferably, the surface of the circuit board body is provided with heat dissipation pads, and the circuit board body is also provided with a blower assembly for dissipating heat from the electrolytic capacitor assembly mounted on the circuit board body.

[0012] Preferably, the heat dissipation patch is integrally formed from copper foil.

[0013] Preferably, the air blowing assembly includes a miniature cooling fan disposed on the circuit board body.

[0014] Preferably, the positive electrode pin is slightly longer than the negative electrode pin.

[0015] Compared with the prior art, the beneficial effects of this utility model are:

[0016] This invention, by setting the center distance between the pads of adjacent electrolytic capacitor bodies to 8mm-10mm, provides reasonable space between electrolytic capacitors, effectively reducing heat transfer interference between capacitors, improving airflow between capacitors, and thus enhancing overall heat dissipation performance. The standardized mounting holes and pad settings ensure the stability and reliability of the electrolytic capacitor assembly installation, providing a basic guarantee for the normal operation of the circuit board. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the electrolytic capacitor body, which improves heat dissipation performance by optimizing the spacing between the pin-type electrolytic capacitors, as proposed in this utility model.

[0018] Figure 2 This is a schematic diagram of the solder pads for the circuit board structure proposed in this utility model, which improves heat dissipation performance by optimizing the spacing between pin-type electrolytic capacitors.

[0019] Figure 3 This is a top view of the circuit board structure proposed in this utility model, which improves heat dissipation performance by optimizing the spacing of the pin-type electrolytic capacitors.

[0020] Figure 4 This is a schematic diagram of a blower assembly that improves heat dissipation performance by optimizing the spacing of the pin-type electrolytic capacitors, as proposed in this utility model.

[0021] In the diagram: 1. Circuit board body; 2. Mounting holes; 3. Heat sink; 4. Air blower assembly; 5. Electrolytic capacitor body; 6. Positive pin; 7. Negative pin; 8. Solder pad; 9. Positive mark. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0023] Reference Figures 1 to 4 A circuit board structure that improves heat dissipation performance by optimizing the spacing of plug-in electrolytic capacitors includes a circuit board body 1, wherein a plurality of mounting holes 2 are provided on the circuit board body 1, and an electrolytic capacitor assembly is provided in each of the plurality of mounting holes 2.

[0024] The electrolytic capacitor assembly includes an electrolytic capacitor body 5 disposed in the mounting hole 2 and a pin assembly disposed at the bottom of the electrolytic capacitor body 5. The bottom of the circuit board body 1 is provided with a plurality of pads 8. The positive pin 6 and the negative pin 7 are both fixed to the circuit board body 1 by the pads 8. The center distance between adjacent pads 8 is 8mm-10mm.

[0025] When in use, this device sets the center distance of adjacent electrolytic capacitor bodies 5 and pads 8 to 8mm-10mm, leaving reasonable space between the electrolytic capacitors. This effectively reduces heat transfer interference between capacitors, improves airflow between capacitors, and enhances overall heat dissipation performance. The standardized mounting holes 2 and pads 8 ensure the stability and reliability of the electrolytic capacitor assembly installation, providing a basic guarantee for the normal operation of the circuit board.

[0026] Furthermore, the circuit board body 1 is made of metal-based copper-clad laminate. The metal substrate has excellent thermal conductivity, which can quickly conduct away the heat generated when the electrolytic capacitor is working, further improving the heat dissipation efficiency of the circuit board. The metal-based copper-clad laminate also has better mechanical strength and high temperature resistance, which improves the overall performance and service life of the circuit board, enabling it to adapt to harsher working environments.

[0027] Furthermore, the pads 8 are all asymmetrically arranged. This design can effectively avoid the situation where the positive and negative terminals of the electrolytic capacitors are reversed during installation, thus improving the accuracy and efficiency of installation. The asymmetrical layout of the pads 8 can also optimize the wiring space of the circuit board to a certain extent, reduce interference between signal lines, improve the electrical performance of the circuit board, and ensure the stability of circuit operation.

[0028] Furthermore, the top of the electrolytic capacitor body 5 is also provided with a positive terminal mark 9. The positive terminal mark 9 on the top of the electrolytic capacitor body 5 provides installers with a clear and intuitive basis for identifying the positive and negative terminals, further reducing the probability of installation errors. Especially in the process of mass production and rapid installation, the positive terminal mark 9 can significantly improve work efficiency, reduce rework and cost waste caused by installation errors, and ensure the production quality of the circuit board. The top of the electrolytic capacitor body 5 is also provided with a negative terminal mark, which is a clearly raised mark.

[0029] Furthermore, the surface of the circuit board body 1 is provided with heat dissipation pads 3, and the circuit board body 1 is also provided with a blower assembly 4 for dissipating heat from the electrolytic capacitor assembly mounted on the circuit board. The heat dissipation pads 3 on the surface of the circuit board body 1 increase the heat dissipation area and accelerate heat dissipation. The blower assembly 4 enhances the airflow speed around the electrolytic capacitors through active airflow, effectively carrying away heat in a timely manner. This forms a heat dissipation system that combines passive and active heat dissipation, significantly improving the heat dissipation effect. For high-power circuit boards that operate for extended periods, this effectively reduces the operating temperature of the electrolytic capacitors, preventing performance degradation or damage due to overheating, and improving the reliability and stability of the circuit board.

[0030] Furthermore, the heat dissipation patch 3 is integrally formed from copper foil. Copper foil has excellent thermal conductivity, and the integral forming design ensures the structural integrity and thermal continuity of the heat dissipation patch 3, reducing heat loss during the heat transfer process and improving heat dissipation efficiency. Simultaneously, the copper foil material has good electrical conductivity and oxidation resistance, enabling it to bond tightly with the circuit board body 1, ensuring the long-term effective operation of the heat dissipation patch 3 and enhancing the stability and durability of the heat dissipation system.

[0031] Furthermore, the air blowing assembly 4 includes a miniature cooling fan mounted on the circuit board body 1. The miniature cooling fan mounted on the circuit board body 1 is small in size and has low power consumption, and can provide sufficient airflow in a limited space to specifically dissipate heat from the electrolytic capacitor assembly. Its mounting on the circuit board body 1 makes heat dissipation more direct and efficient, and can quickly respond to the heating status of the electrolytic capacitor, adjust the heat dissipation intensity in a timely manner, ensure the timeliness and effectiveness of heat dissipation, and further optimize the performance of the heat dissipation system.

[0032] Furthermore, the positive pin 6 is slightly longer than the negative pin 7. When the electrolytic capacitor is installed and soldered, the longer positive pin 7 can contact and position itself with the solder pad 8 first, which helps to improve the accuracy and firmness of the soldering. This design allows the positive pin 6 to be better wetted with solder during the soldering process, ensuring the soldering quality, reducing the occurrence of problems such as cold solder joints and false solder joints, improving the reliability of the connection between the electrolytic capacitor and the circuit board, and ensuring stable current transmission.

[0033] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A circuit board structure for improving heat dissipation performance by optimizing the pin pitch of electrolytic capacitors, comprising a circuit board body (1), characterized in that: The circuit board body (1) is provided with a plurality of mounting holes (2), and an electrolytic capacitor assembly is provided in each of the plurality of mounting holes (2). The electrolytic capacitor assembly includes an electrolytic capacitor body (5) disposed in the mounting hole (2) and a pin assembly disposed at the bottom of the electrolytic capacitor body (5). The bottom of the circuit board body (1) is provided with several pads (8). The positive pin (6) and the negative pin (7) are both fixed to the circuit board body (1) through the pads (8). The center distance between adjacent pads (8) is 8mm-10mm.

2. The circuit board structure for improving heat dissipation performance by optimizing the pin electrolytic capacitor pitch according to claim 1, characterized in that: The circuit board body (1) is made of metal-based copper-clad laminate.

3. The circuit board structure for improving heat dissipation performance by optimizing the pin electrolytic capacitor pitch according to claim 2, characterized in that: Several of the pads (8) are asymmetrically arranged.

4. The circuit board structure for improving heat dissipation performance by optimizing the pin electrolytic capacitor pitch according to claim 3, characterized in that: The top of the electrolytic capacitor body (5) is also provided with a positive electrode mark (9).

5. The circuit board structure for improving heat dissipation performance by optimizing the pin electrolytic capacitor pitch according to claim 4, characterized in that: The surface of the circuit board body (1) is provided with heat dissipation pads (3), and the circuit board body (1) is also provided with a blower assembly (4) for dissipating heat from the electrolytic capacitor assembly mounted on the circuit board body.

6. The circuit board structure for improving heat dissipation performance by optimizing the pin electrolytic capacitor pitch according to claim 5, characterized in that: The heat dissipation patch (3) is formed by integral copper foil molding.

7. The circuit board structure for improving heat dissipation performance by optimizing the spacing of pin-type electrolytic capacitors according to claim 6, characterized in that: The blowing assembly (4) includes a miniature cooling fan mounted on the circuit board body (1).

8. The circuit board structure for improving heat dissipation performance by optimizing the pin electrolytic capacitor pitch according to claim 7, characterized in that: The positive electrode pin (6) is slightly longer than the negative electrode pin (7).

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