An electronic component mounting device

Abstract

This application discloses an electronic component fixing and mounting device, belonging to the field of electronic component fixing and mounting. The device includes a PCB board and an electronic component body. The electronic component body is externally fitted with a protective mechanism soldered to the PCB board. The protective mechanism includes an opening and closing slide located above the electronic component body, at least three L-shaped clamping fingers telescopically connected to the side of the slide and arranged in a circular array for encircling the side of the electronic component body, and a drive disk rotatably connected to the center of the slide via a bushing nut for driving the opening and closing of the three L-shaped clamping fingers. This electronic component fixing and mounting device, through three-dimensional encircling fixing, uses the L-shaped clamping fingers to laterally constrain the inertial displacement of the component. The bottom end is fused to the PCB board, and with the vertical adhesion of the bottom thermal conductive gel, it effectively suppresses pin breakage or component tilting caused by vibration, making it particularly suitable for heavy components such as large electrolytic capacitors.

Description

Technical Field

[0001] This application relates to the field of electronic component mounting technology, specifically an electronic component mounting device. Background Technology

[0002] Fixed installation of electronic components refers to the process of physically positioning and electrically connecting electronic components to printed circuit boards (PCBs) or other carriers. Its core purpose is to ensure that the components work stably in multiple dimensions such as mechanical, electrical, thermal management, and environmental adaptability, and ultimately realize the function and reliability of the circuit.

[0003] Most common electronic components on PCBs are mounted using methods such as soldering, clipping, and gluing to securely fix them to the PCB and prevent displacement, detachment, or solder joint breakage due to vibration, impact, gravity, or long-term use. For large and heavy components, such as high-capacity electrolytic capacitors, through-hole mounting is usually used. The leads are inserted into the PCB through-holes and then soldered. However, relying solely on soldering the leads makes them prone to tilting or even breaking due to inertia when subjected to vibration, especially in long-term vibration environments, which shortens their lifespan.

[0004] Therefore, this application provides an electronic component mounting device to solve the above-mentioned problems. Utility Model Content

[0005] This application provides an electronic component fixing and mounting device, which aims to solve the problem mentioned in the background art that existing large and heavy components are prone to tilting or even breaking their pins due to large inertia during fixing and mounting.

[0006] To achieve the above objectives, this application provides the following technical solution: an electronic component fixing and mounting device, including a PCB board and an electronic component body, wherein the electronic component body is externally fitted with a protective mechanism soldered to the PCB board, the protective mechanism including an opening and closing slide located above the electronic component body, at least three L-shaped clamping fingers telescopically connected to the side of the opening and closing slide and arranged in a circular array for wrapping around the side of the electronic component body, a drive disk rotatably connected to the center of the opening and closing slide via a bushing nut for driving the opening and closing of the three L-shaped clamping fingers, and a locking bolt screwed to the bushing nut for locking the opening and closing slide and the drive disk, wherein each L-shaped clamping finger has a buffer pad fixedly connected to its inner side, which contacts the side wall of the electronic component body, and thermally conductive gel is filled between the bottom end of the electronic component body and the PCB board, and the bottom end of the L-shaped clamping finger is fused to the PCB board. In this way, through three-dimensional wrap-around fixation, the L-shaped clamps constrain the inertial displacement of the components from the side, and the bottom end is fused to the PCB board. Combined with the vertical bonding of the bottom thermal conductive gel, it effectively suppresses pin breakage or component tilting caused by vibration, and is especially suitable for heavy components such as large electrolytic capacitors.

[0007] Preferably, the L-shaped clamping finger includes a crossbar telescopically connected to the side of the opening and closing slide, a vertical bar fixedly connected to the other end of the crossbar for clamping the electronic component body, and a limiting slider fixedly connected to the bottom of the end of the crossbar away from the vertical bar. The side of the opening and closing slide is provided with a telescopic groove that is slidably connected to the crossbar.

[0008] Preferably, the drive disk has arc-shaped grooves arranged in a circular array and extending from the center to the edge, and the limiting slider passes through the arc-shaped grooves and is slidably connected to the arc-shaped grooves.

[0009] Preferably, the bottom of the drive disk is fixedly connected to at least three pads arranged in a circular array that contact the top of the electronic component body.

[0010] Preferably, both the foot pad and the cushioning pad are thermally conductive silicone pads.

[0011] This electronic component mounting device uses a three-dimensional wrap-around fixing method. The L-shaped clamps constrain the inertial displacement of the component from the side, and the bottom end is fused to the PCB board. Combined with the vertical bonding of the bottom thermal conductive gel, it effectively suppresses pin breakage or component tilting caused by vibration. It is especially suitable for heavy components such as large electrolytic capacitors.

[0012] This electronic component mounting device has a protective mechanism that can be pre-assembled on the outside of the component. It achieves quick positioning and locking through an opening and closing structure, adapts to components of different sizes, and is compatible with existing surface mount technology processes.

[0013] This electronic component mounting device uses thermally conductive silicone pads and thermally conductive gel to form a dual-channel heat dissipation system on the side walls and bottom, reducing the operating temperature of the components and extending their service life. The combination of mechanical self-locking and flexible contact, along with the cushioning material, absorbs the stress of thermal expansion and contraction, avoiding structural loosening caused by temperature changes in traditional rigid fixing methods. Attached Figure Description

[0014] Figure 1 A schematic diagram of a device for fixing and mounting electronic components;

[0015] Figure 2 A schematic diagram of the protective mechanism of an electronic component fixing and mounting device;

[0016] Figure 3 This is an exploded structural diagram of the protective mechanism of an electronic component fixing and mounting device.

[0017] In the picture:

[0018] 1. PCB board;

[0019] 2. Electronic component body;

[0020] 3. Protective mechanism; 31. Opening and closing slide; 311. Telescopic groove; 32. L-shaped gripper finger; 321. Crossbar; 322. Vertical bar; 323. Limiting slider; 33. Drive disc; 331. Arc-shaped groove; 34. Bushing nut; 341. Locking bolt; 35. Foot pad; 36. Buffer pad;

[0021] 4. Thermal conductive gel. Detailed Implementation

[0022] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0023] This embodiment provides an electronic component fixing and mounting device, such as... Figures 1-3 As shown, the electronic component mounting device includes a PCB board 1 and an electronic component body 2. The electronic component body 2 is fitted with a protective mechanism 3 that is soldered to the PCB board 1. The protective mechanism 3 includes an opening and closing slide 31 located above the electronic component body 2, at least three L-shaped grippers 32 that are telescopically connected to the side of the opening and closing slide 31 and arranged in a ring array to hug the side of the electronic component body 2, a drive disk 33 that is rotatably connected to the center of the opening and closing slide 31 through a bushing nut 34 to drive the opening and closing of the three L-shaped grippers 32, and a locking bolt 341 that is screwed to the bushing nut 34 to lock the opening and closing slide 31 and the drive disk 33. The inner side of each L-shaped gripper 32 is fixedly connected with a buffer pad 36 that contacts the side wall of the electronic component body 2. Thermal conductive gel 4 is filled between the bottom end of the electronic component body 2 and the PCB board 1. The bottom end of the L-shaped gripper 32 is fused to the PCB board 1.

[0024] In use, invert the protective mechanism 3 and place the electronic component body 2 upside down between the three L-shaped clamping fingers 32 of the protective mechanism 3. Under the action of gravity, the top of the electronic component body 2 contacts the bottom surface of the drive disk 33. Rotate the drive disk 33 to close the three L-shaped clamping fingers 32 until they clamp the side of the electronic component body 2, completing the pre-assembly. Cut off the bottom of the excess length of the L-shaped clamping fingers 32 so that it only extends one section beyond the bottom of the electronic component body 2. Pass the pins of the electronic component body 2 through the through holes of the PCB board 1 until the bottom of the L-shaped clamping fingers 32 presses against the surface of the PCB board 1. At this time, weld the bottom of the L-shaped clamping fingers 32 to the PCB board 1 to complete the initial fixation. Then, solder the pins of the electronic component body 2. Finally, fill the space between the bottom of the electronic component body 2 and the PCB board 1 with thermally conductive gel 4 until it solidifies. This not only enhances the vertical fixation strength through high adhesion, but also assists in heat dissipation of the component through its thermal conductivity. At the same time, the flexible properties of the gel can buffer lateral impacts.

[0025] Specifically, the L-shaped gripper 32 includes a crossbar 321 telescopically connected to the side of the opening and closing slide 31, a vertical bar 322 fixedly connected to the other end of the crossbar 321 for clamping the electronic component body 2, and a limiting slider 323 fixedly connected to the bottom of the end of the crossbar 321 away from the vertical bar 322. The side of the opening and closing slide 31 is provided with a telescopic groove 311 that is slidably connected to the crossbar 321. The drive disk 33 is provided with an arc-shaped groove 331 distributed in a ring array and extending from the center to the edge. The limiting slider 323 passes through the arc-shaped groove 331 and is slidably connected to the arc-shaped groove 331. The crossbar 321 is embedded in the telescopic groove 311 on the side of the opening and closing slide 31 to form a linear sliding pair. When the drive disk 33 rotates, the path change of the arc-shaped groove 331 will push the limiting slider 323 to move radially, thereby driving the crossbar 321 to slide in the telescopic groove 311, realizing the synchronous opening and closing of the three L-shaped gripper 32.

[0026] Furthermore, the bottom of the drive disk 33 is fixedly connected to at least three pads 35 arranged in a ring array that contact the top of the electronic component body 2; when the drive disk 33 is pressed down and locked, the pads 35 deform and fit against the top surface of the component to form a flexible contact layer.

[0027] Specifically, both the foot 35 and the buffer pad 36 are thermally conductive silicone pads; the buffer pad 36 is attached to the inner side of the longitudinal rod 322 and contacts the side wall of the electronic component; the foot 35 is attached to the bottom of the drive disk 33 and contacts the top surface of the component. The flexible properties of the thermally conductive silicone allow it to deform under pressure, filling the tiny gaps in the contact surface, while transferring heat through the vibration of the silicone molecular chains.

[0028] The above description is merely a preferred embodiment of this application, but the scope of protection of this application is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in this application, based on the technical solution and concept of this application, should be included within the scope of protection of this application.

Claims

1. An electronic component fixing and mounting device comprising a PCB board (1) and an electronic component body (2), characterized in that: The electronic component body (2) is externally fitted with a protective mechanism (3) that is soldered to the PCB board (1). The protective mechanism (3) includes an opening and closing slide (31) located above the electronic component body (2), at least three L-shaped grippers (32) that are telescopically connected to the side of the opening and closing slide (31) and arranged in a circular array to hug the side of the electronic component body (2), and a bushing nut (34) that is rotatably connected to the center of the opening and closing slide (31) to drive the three L-shaped grippers. (32) The opening and closing drive disk (33) and the locking bolt (341) screwed to the bushing nut (34) for locking the opening and closing slide (31) and the drive disk (33), wherein the inner side of the L-shaped clip (32) is fixedly connected with a buffer pad (36) that contacts the side wall of the electronic component body (2), the bottom end of the electronic component body (2) and the PCB board (1) are filled with thermal conductive gel (4), and the bottom end of the L-shaped clip (32) is fused to the PCB board (1).

2. The electronic component mounting apparatus according to claim 1, characterized by: The L-shaped clamp (32) includes a crossbar (321) that is telescopically connected to the side of the opening and closing slide (31), a vertical bar (322) that is fixedly connected to the other end of the crossbar (321) for clamping the electronic component body (2), and a limiting slider (323) that is fixedly connected to the bottom of the end of the crossbar (321) away from the vertical bar (322). The side of the opening and closing slide (311) is provided with a telescopic groove (311) that is slidably connected to the crossbar (321).

3. The electronic component mounting fixture of claim 2, wherein: The drive disk (33) has an arc-shaped groove (331) arranged in a ring array and extending from the center to the edge. The limiting slider (323) passes through the arc-shaped groove (331) and is slidably connected to the arc-shaped groove (331).

4. The electronic component mounting fixture of claim 3, wherein: The bottom of the drive disk (33) is fixedly connected to at least three pads (35) arranged in a ring array that contact the top of the electronic component body (2).

5. The electronic component mounting fixture of claim 4, wherein: Both the foot pad (35) and the buffer pad (36) are thermally conductive silicone pads.

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