Anti-collision radar package housing structure

Abstract

This utility model provides a collision avoidance radar encapsulation housing structure, relating to the field of encapsulation housing technology. It includes an encapsulation housing body, a cold air guiding layer, exhaust vents, a multi-stage finned heat dissipation assembly, heat-conducting bosses, and a heat pipe heat dissipation assembly. The cold air guiding layer design utilizes cold air inside the encapsulation housing body to remove some heat, which is then discharged through the exhaust vents. A sealed space is formed between the cold air guiding layer and the bottom surface of the inner cavity of the encapsulation housing body for installing electronic components, avoiding the airtightness issues caused by forced air cooling. The heat pipe heat dissipation assembly transfers some of the heat generated by the electronic components on the heat-conducting bosses to the multi-stage finned heat dissipation assembly on the outer wall of the encapsulation housing body for dissipation. The exhaust vents blow air onto the multi-stage finned heat dissipation assembly, improving heat dissipation efficiency and achieving a linkage between air cooling and finned heat dissipation. This multi-level heat dissipation meets the heat dissipation requirements of the collision avoidance radar.

Description

Technical Field

[0001] This utility model relates to the field of packaging shell technology, and in particular to an anti-collision radar packaging shell structure. Background Technology

[0002] The descriptions in this section provide background information relating to this disclosure and do not constitute prior art.

[0003] Collision avoidance radar consists of several sensors and a set of microcomputer controllers and buzzers. With the miniaturization of radar, the integration density of its internal components is increasing, and the requirements for heat dissipation performance are also increasing. Traditional finned heat sinks are not effective enough, while forced air cooling solutions pose airtightness risks. Summary of the Invention

[0004] The purpose of this utility model is to provide an anti-collision radar packaging shell structure, which has the advantages of forced air cooling without affecting the airtightness of the device packaging, and multiple heat dissipation through the linkage of air cooling and finned heat dissipation. It solves the technical problems of insufficient heat dissipation effect of traditional finned heat sinks and the airtightness risk of forced air cooling scheme.

[0005] This utility model provides an anti-collision radar packaging housing structure, including:

[0006] The main body of the encapsulated shell has a cold air guiding layer on its inner wall;

[0007] The cold air guiding interlayer is provided with exhaust holes, which are evenly distributed along the length of the upper surface of the encapsulation shell body.

[0008] A multi-stage finned heat dissipation assembly is symmetrically fixedly assembled on the left and right sides of the upper surface of the main body of the encapsulation shell;

[0009] The exhaust vent is located directly below the multi-stage finned heat dissipation assembly;

[0010] A thermally conductive boss is fixedly mounted on the bottom surface of the inner cavity of the main body of the encapsulation shell.

[0011] A heat pipe heat conduction assembly, the heated end of which is embedded in a heat conduction boss;

[0012] The heat pipe heat conduction component passes through a pre-reserved through hole in the main body of the encapsulation shell, and the condensation end of the heat pipe heat conduction component is embedded in the fin unit of the multi-level fin heat dissipation component.

[0013] As a further optimization, in order to remove the heat transferred to the inner cover by the airflow within the air guide channel, and to improve the heat dissipation efficiency of the multi-stage finned heat dissipation assembly by the airflow from the exhaust vents blowing onto it, the cold air guide layer includes:

[0014] The inner cover is coaxially fixedly assembled inside the main body of the encapsulation shell;

[0015] An air guide channel is formed between the outer wall of the inner layer cover and the inner wall of the main body of the encapsulation shell;

[0016] The lower end of the exhaust hole is connected to the air guide channel;

[0017] A miniature fan is fixedly connected to the outer wall of the main body of the encapsulation shell, and its airflow direction is towards the air guide channel.

[0018] As a further optimization, in order to better turbulent the airflow discharged from the exhaust vents by creating a height difference between the first-stage and second-stage fins, and to more quickly remove heat from the first-stage and second-stage fins by means of wind power, thereby improving heat dissipation efficiency, the multi-stage fin heat dissipation assembly includes:

[0019] The primary fins are arranged at a lateral inclination, with the higher end of the primary fins facing towards the side closer to the middle of the main body of the encapsulation shell;

[0020] The secondary fins are arranged at a lateral inclination, with the higher end of the secondary fins facing towards the side closer to the middle of the main body of the encapsulation shell;

[0021] The lower end of the primary fin is located below the higher end of the secondary fin;

[0022] The bottom surfaces of the primary and secondary fins are fixedly connected to the top surface of the main body of the encapsulation shell by support blocks.

[0023] The primary and secondary fins are fin units of the multi-level finned heat dissipation assembly.

[0024] As a further optimization, in order to increase the heat dissipation area of ​​the primary and secondary fins and improve the heat dissipation effect, the primary and secondary fins have the same structure.

[0025] The upper surfaces of the primary and secondary fins are wavy.

[0026] As a further optimization, in order to utilize the heat pipe's own thermal conductivity to transfer heat from the heat-conducting protrusion to the multi-stage finned heat dissipation assembly for heat dissipation, the heat pipe thermal conductivity assembly includes:

[0027] Heat pipes, with their bent design;

[0028] The heated end of the heat pipe is embedded in the heat-conducting boss.

[0029] The condenser end of the heat pipe is embedded in the fin unit of the multi-stage finned heat dissipation assembly.

[0030] As a further optimization, in order to absorb heat more quickly by setting a uniformly distributed first heat-conducting rod at the heated end of the heat pipe and to dissipate heat more quickly by setting a uniformly distributed second heat-conducting rod at the condensing end of the heat pipe, thereby increasing the heat absorption and heat dissipation area of ​​the heated end and the condensing end of the heat pipe, the outer wall of the heated end of the heat pipe is uniformly and fixedly connected with the first heat-conducting rod, and the first heat-conducting rod is embedded in the heat-conducting boss.

[0031] The outer wall of the condenser end of the heat pipe is uniformly and fixedly connected with a second heat-conducting rod, and the second heat-conducting rod is embedded in the fin unit of the multi-stage fin heat dissipation assembly.

[0032] As a further optimization, in order to make the thermally conductive bump a device mounting platform, heat is quickly transferred to the thermally conductive bump by attaching the graphene film to the device. The thermally conductive bump conducts heat to the multi-level fin heat dissipation assembly through the heat pipe heat dissipation component for heat dissipation. The upper surface of the thermally conductive bump is covered with a graphene film, and a silicone grease layer is provided between the graphene film and the upper surface of the thermally conductive bump.

[0033] As a further optimization, in order to conduct heat quickly through the carbon fiber layer, the heat is conducted outward through the gradient heat conduction layer, and the heat is carried away by the wind force in the air guide channel and discharged from the exhaust hole to achieve heat dissipation. The inner wall of the inner layer cover is provided with a gradient heat conduction layer.

[0034] The inner wall of the gradient thermal conductive layer is provided with a carbon fiber layer, and a silicone grease layer is provided between the carbon fiber layer and the inner wall of the gradient thermal conductive layer.

[0035] The gradient thermal conductive layer conducts heat in a gradient manner from the inside to the outside, from high to low.

[0036] As a further optimization, in order to form a thermal conductivity gradient from high to low through the density difference of the metal foam layer, and to form a thermal conductivity path from the inside to the outside, thereby enhancing the diffusion of heat to the shell, the gradient thermal conductivity layer is specifically a metal foam layer.

[0037] A low-density layer is welded to the side of the metal foam layer near the inner cover.

[0038] A high-density layer is welded to the inner wall of the low-density layer.

[0039] As a further optimization, to facilitate the installation and use of the device, and to allow for the disassembly of the upper shell and the bottom plate, facilitating the inspection and maintenance of the internal components of the encapsulation shell body, the encapsulation shell body includes:

[0040] The upper shell has a bottom plate at its lower end;

[0041] Upper side ear plates are fixedly connected to the left and right sides of the lower edge of the outer wall of the upper shell;

[0042] The outer wall of the base plate is fixedly connected to the lower ear plate corresponding to the upper ear plate;

[0043] The upper ear plate and the corresponding lower ear plate are screwed together with fixing bolts.

[0044] This utility model provides an improved anti-collision radar packaging housing structure, which has the following improvements and advantages compared with the prior art:

[0045] The design employs a cold air guiding jacket, utilizing cold air inside the main body of the packaging shell to remove some heat, which is then discharged through the exhaust vents. The cold air guiding jacket is positioned between the main body of the packaging shell and the electronic components inside, forming a sealed space between the cold air guiding jacket and the bottom surface of the inner cavity of the main body of the packaging shell for installing electronic components, thus avoiding the airtightness issues caused by forced air cooling. Through heat pipe heat conduction components, some of the heat generated by the electronic components on the heat-conducting protrusions is transferred to the multi-level finned heat dissipation components on the outer wall of the main body of the packaging shell for dissipation. The exhaust vents blow air onto the multi-level finned heat dissipation components, accelerating the heat dissipation efficiency and achieving the linkage between air cooling and finned heat dissipation. This multi-level heat dissipation meets the heat dissipation requirements of the collision avoidance radar. Attached Figure Description

[0046] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0047] Figure 1 is a schematic diagram of the structure of this utility model;

[0048] Figure 2 is a schematic cross-sectional view of the structure at point A-A' of this utility model;

[0049] Figure 3 shows the present invention. Figure 2 Schematic diagram of a partial structure;

[0050] Figure 4 is a schematic diagram of the heat pipe heat conduction component of this utility model;

[0051] Figure 5 is a schematic cross-sectional view of a partial structure of the gradient heat-conducting layer of this utility model.

[0052] Explanation of reference numerals in the attached figures:

[0053] 1-Encapsulated outer shell main body, 11-Upper shell, 12-Base plate, 13-Upper side ear plate, 14-Fixing bolt, 2-Cold air guiding jacket, 21-Inner layer cover, 22-Air guiding channel, 23-Exhaust hole, 24-Miniature fan, 3-Heat-conducting boss, 4-Multi-stage fin heat dissipation assembly, 41-First-stage fin, 42-Second-stage fin, 43-Support block, 5-Heat pipe heat conduction assembly, 51-Heat pipe, 52-First heat conduction rod, 53-Second heat conduction rod, 6-Gradient heat conduction layer, 61-High-density layer, 62-Low-density layer, 7-Carbon fiber layer. Detailed Implementation

[0054] The technical solution of this utility model will be clearly and completely described below with reference to the embodiments. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0055] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0056] In the description of this utility model, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified. Furthermore, the terms "installed," "connected," and "linked" should be interpreted broadly; for example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0057] Please refer to Figures 1-5. This utility model provides a technical solution: a collision avoidance radar encapsulation housing structure, comprising:

[0058] The main body of the encapsulation shell 1 has a cold air guiding layer 2 on its inner wall;

[0059] The cold air guiding interlayer 2 is provided with exhaust holes 23, which are evenly distributed along the length direction on the upper surface of the encapsulation shell body 1;

[0060] The multi-level finned heat dissipation assembly 4 is symmetrically fixedly assembled on the left and right sides of the upper surface of the encapsulation shell body 1;

[0061] Vent 23 is located directly below the multi-stage finned heat dissipation assembly 4;

[0062] Thermally conductive boss 3 is fixedly assembled to the bottom surface of the inner cavity of the main body 1 of the encapsulation shell;

[0063] The heat pipe heat conduction component 5 has its heated end embedded in the heat conduction boss 3;

[0064] The heat pipe heat conduction component 5 passes through a pre-reserved through hole in the main body 1 of the encapsulation shell, and the condensation end of the heat pipe heat conduction component 5 is embedded in the fin unit of the multi-level fin heat dissipation component 4.

[0065] Specifically, in this embodiment, the main body 1 of the packaging shell is made of aluminum alloy, which is lightweight and has good heat dissipation; the cold air guiding interlayer 2 is a structure set inside the main body 1 of the packaging shell, which forms an interlayer with the inner wall of the main body 1 of the packaging shell, and uses this interlayer for air cooling heat dissipation. This interlayer shields the outside of the electronic device at the bottom of the inner cavity of the main body 1 of the packaging shell, thus playing a role in sealing and encapsulation; the heat-conducting boss 3 is made of tungsten copper alloy, which has good thermal conductivity.

[0066] Furthermore, the cold air guiding layer 2 is disposed between the main body of the packaging shell 1 and the electronic components inside the main body of the packaging shell 1, forming a sealed space between the cold air guiding layer 2 and the bottom surface of the inner cavity of the main body of the packaging shell 1 for installing electronic components, thus avoiding the problem of forced air cooling affecting air tightness;

[0067] More specifically, the heat generated by the electronic devices on the heat-conducting boss 3 is transferred to the multi-level finned heat dissipation assembly 4 on the outer wall of the main body 1 of the packaged shell through the heat pipe heat conduction component 5. The exhaust vent 23 blows air onto the multi-level finned heat dissipation assembly 4 to accelerate the heat dissipation efficiency, thereby realizing the linkage between air cooling and finned heat dissipation.

[0068] It is understandable that the above-mentioned air-cooling and finned heat dissipation linkage design can be used for heat dissipation in other electronic packaging products.

[0069] In some embodiments, the cold air guiding interlayer 2 includes:

[0070] The inner cover 21 is coaxially fixedly assembled inside the encapsulation shell body 1;

[0071] An air guide channel 22 is formed between the outer wall of the inner cover 21 and the inner wall of the encapsulation shell body 1;

[0072] The lower end of the exhaust vent 23 is connected to the air guide channel 22;

[0073] The outer wall of the main body 1 of the encapsulation shell is fixedly connected to a miniature fan 24, which directs the airflow towards the air guide channel 22. Specifically, in this embodiment, the inner cover 21 is made of aluminum alloy, which has good thermal conductivity;

[0074] The lower end of the inner cover 21 is welded and fixed to the bottom surface of the inner cavity of the main body 1 of the encapsulation shell. During the welding operation, it is necessary to ensure the airtightness of the weld.

[0075] Furthermore, the miniature fan 24 is connected to the power supply of the device where the anti-collision radar is located, such as a car or a drone. The miniature fan 24 continuously blows air into the air guide channel 22. The airflow along the air guide channel 22 carries away the heat transferred to the inner cover 21. The airflow carrying the heat is discharged from the exhaust hole 23 to complete the forced air cooling.

[0076] More specifically, the inner cover 21 and the bottom surface of the inner cavity of the encapsulation shell body 1 form a sealed space, the heat-conducting boss 3 is located in this space, and the electronic devices are mounted on the heat-conducting boss 3; the heat pipe heat-conducting assembly 5 passes through the reserved hole on the inner cover 21 and the encapsulation shell body 1 in the middle, and a sealing ring is provided on the inner wall of the reserved hole to ensure airtightness.

[0077] In some embodiments, the multi-stage finned heat dissipation assembly 4 includes:

[0078] The first-stage fin 41 is arranged at a lateral angle, with the higher end of the first-stage fin 41 facing towards the side closer to the middle of the main body 1 of the encapsulation shell;

[0079] The secondary fin 42 is arranged at a lateral angle, with the higher end of the secondary fin 42 facing towards the side closer to the middle of the main body 1 of the encapsulation shell;

[0080] The lower end of the primary fin 41 is located below the higher end of the secondary fin 42;

[0081] The bottom surfaces of the primary fin 41 and the secondary fin 42 are fixedly connected to the top surface of the encapsulation shell body 1 by a support block 43;

[0082] The primary fin 41 and the secondary fin 42 are fin units of the multi-stage finned heat dissipation assembly 4.

[0083] Specifically, in this embodiment, both the primary fin 41 and the secondary fin 42 are made of aluminum alloy, which has excellent thermal conductivity, and the primary fin 41 and the secondary fin 42 are in sheet form;

[0084] Furthermore, both the primary fin 41 and the secondary fin 42 are inclined, forming a height difference between the head and tail of the primary fin and the secondary fin. The lower end of the primary fin 41 is located below the higher end of the secondary fin 42, which better turbulences the airflow discharged from the exhaust hole 23, and the heat on the primary fin 41 and the secondary fin 42 is carried away more quickly by the wind force, thereby improving the heat dissipation efficiency.

[0085] More specifically, the upper surface of the main body 1 of the encapsulation shell is symmetrically arranged with multi-level fin heat dissipation components 4 on the left and right sides. The fins on both sides are inclined to guide the airflow from the exhaust hole 23 to the middle, forming a convection effect in the middle. Convection can carry away heat more quickly and accelerate heat dissipation efficiency.

[0086] In some embodiments, the primary fin 41 and the secondary fin 42 have the same structure;

[0087] The upper surfaces of the primary fin 41 and the secondary fin 42 are wavy, which increases the heat dissipation area of ​​the primary fin 41 and the secondary fin 42 and improves the heat dissipation effect.

[0088] In some embodiments, the heat pipe thermal conductive assembly 5 includes:

[0089] Heat pipe 51, with its bent design;

[0090] The heated end of the heat pipe 51 is embedded in the heat-conducting boss 3;

[0091] The condenser end of heat pipe 51 is embedded in the fin unit of multi-stage finned heat dissipation assembly 4.

[0092] Specifically in this embodiment, the heat pipe 51 is an application of the prior art. When one end of the heat pipe 51 is heated, the liquid in the wick evaporates rapidly. The vapor flows to the other end under a small pressure difference and releases heat, then condenses back into liquid. The liquid then flows back to the evaporation section along the porous material by capillary force. In this cycle, heat is continuously transferred from one end to the other.

[0093] Furthermore, multiple heat pipes 51 are used to conduct heat from the heat-conducting boss 3 to the multi-level finned heat dissipation assembly 4 for heat dissipation;

[0094] It is understandable that the heat-conducting boss 3 is composed of two tungsten copper alloy plates, one above the other. The two tungsten copper alloy plates face each other and have insertion half-grooves at the ends of the heat pipe 51. Before the two tungsten copper alloy plates are spliced ​​together, the bent end of the pipe 51 is placed in the two insertion half-grooves. The two insertion half-grooves are spliced ​​together to form a slot. The slot and the outer wall of the heat pipe 51 are filled with heat-conducting paste. After the tungsten copper alloy plates are spliced ​​together, they are welded together along the outside of the gap to form a whole.

[0095] In some embodiments, a first heat-conducting rod 52 is uniformly and fixedly connected to the outer wall of the heated end of the heat pipe 51, and the first heat-conducting rod 52 is embedded in the heat-conducting boss 3.

[0096] A second heat-conducting rod 53 is uniformly fixedly connected to the outer wall of the condensing end of the heat pipe 51, and the second heat-conducting rod 53 is embedded in the fin unit of the multi-stage fin heat dissipation assembly 4. The first heat-conducting rod 52 is uniformly distributed at the heated end of the heat pipe 51 to absorb heat more quickly, and the second heat-conducting rod 53 is uniformly distributed at the condensing end of the heat pipe 51 to dissipate heat more quickly, thereby increasing the heat absorption and heat dissipation area of ​​the heated end and the condensing end of the heat pipe 51.

[0097] In some embodiments, a graphene film is laid on the upper surface of the thermally conductive protrusion 3, and a silicone grease layer is provided between the graphene film and the upper surface of the thermally conductive protrusion 3. Heat is quickly transferred to the thermally conductive protrusion 3 by bonding the graphene film with the device, and the thermally conductive protrusion 3 conducts the heat to the multi-level fin heat dissipation assembly 4 for heat dissipation through the heat pipe heat dissipation assembly 5.

[0098] In some embodiments, the inner wall of the inner cover 21 is provided with a gradient thermal conductive layer 6;

[0099] The inner wall of the gradient thermal conductive layer 6 is provided with a carbon fiber layer 7, and a silicone grease layer is provided between the carbon fiber layer 7 and the inner wall of the gradient thermal conductive layer 6.

[0100] The gradient heat conduction layer 6 conducts heat in a gradient manner from the inside to the outside and from high to low. The carbon fiber layer 7 conducts heat quickly, and the heat is conducted outward through the gradient heat conduction layer 6. The heat is then carried away by the airflow in the air guide channel 22 and discharged through the exhaust hole 23 to achieve heat dissipation.

[0101] In some embodiments, the gradient thermal conductive layer 6 is specifically a metal foam layer;

[0102] A low-density layer 62 is welded to the side of the metal foam layer near the inner cover 21;

[0103] The inner wall of the low-density layer 62 is welded with a high-density layer 61.

[0104] Specifically, in this embodiment, the high-density layer 61 is a high-density copper foam with an open porosity of 70% and a pore size of 2mm; the low-density layer 62 is a low-density copper foam with an open porosity of 85% and a pore size of 2mm.

[0105] Furthermore, the density difference of the metal foam layers creates a thermal conductivity gradient from high to low, forming a thermal conductivity path from the inside to the outside, thus enhancing the diffusion of heat to the shell.

[0106] In some embodiments, the encapsulation housing body 1 includes:

[0107] The upper shell 11 has a bottom plate 12 at its lower end;

[0108] Upper ear plates 13 are fixedly connected to both sides of the lower edge of the outer wall of the upper shell 11;

[0109] The lower ear plate is fixedly connected to the outer wall of the base plate 12 corresponding to the upper ear plate 13;

[0110] A fixing bolt 14 is screwed between the upper ear plate 13 and the corresponding lower ear plate.

[0111] Specifically in this embodiment, the lower end of the fixing bolt 14 connecting the upper ear plate 13 and the lower ear plate extends out of the lower ear plate and is fixed at the installation position;

[0112] After the device is disassembled by removing the fixing bolts 14, the upper shell 11 and the bottom plate 12 can be separated at the same time, which facilitates the inspection and maintenance of the internal components of the encapsulated shell body 1.

[0113] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A crash avoidance radar package housing structure, characterized by, include: The main body of the encapsulated shell (1) has a cold air guiding layer (2) on its inner wall. The cold air guiding interlayer (2) is provided with exhaust holes (23), which are evenly distributed along the length direction on the upper surface of the encapsulation shell body (1); A multi-level finned heat dissipation assembly (4) is symmetrically fixedly assembled on the left and right sides of the upper surface of the encapsulation shell body (1); The exhaust vent (23) is located directly below the multi-stage finned heat dissipation assembly (4); A heat-conducting boss (3) is fixedly assembled to the bottom surface of the inner cavity of the main body (1) of the encapsulation shell; The heat pipe heat conduction assembly (5) has its heated end embedded in the heat conduction boss (3); The heat pipe heat conduction component (5) passes through a pre-reserved through hole in the main body (1) of the encapsulation shell, and the condensation end of the heat pipe heat conduction component (5) is embedded in the fin unit of the multi-level fin heat dissipation component (4).

2. The crash avoidance radar package housing structure of claim 1, wherein The cold air guiding interlayer (2) includes: The inner cover (21) is coaxially fixedly assembled inside the main body (1) of the encapsulation shell; An air duct (22) is formed between the outer wall of the inner cover (21) and the inner wall of the encapsulation shell body (1). The lower end of the exhaust hole (23) is connected to the air guide channel (22); The outer wall of the encapsulation shell body (1) is fixedly connected to a miniature fan (24), and its airflow direction is towards the airflow channel (22).

3. The crash avoidance radar package housing structure of claim 1, wherein The multi-stage finned heat dissipation assembly (4) includes: The first-stage fin (41) is arranged laterally at an angle, and the higher end of the first-stage fin (41) faces the side closer to the middle of the main body (1) of the encapsulation shell; Secondary fins (42) are arranged laterally at an angle, with the higher end of the secondary fins (42) facing towards the middle of the main body (1) of the encapsulation shell; The lower end of the primary fin (41) is located below the higher end of the secondary fin (42); The bottom surfaces of the primary fins (41) and secondary fins (42) are fixedly connected to the top surface of the encapsulation shell body (1) by support blocks (43). The primary fin (41) and the secondary fin (42) are fin units of the multi-level fin heat dissipation assembly (4).

4. The crash-avoidance radar package housing structure of claim 1, wherein The primary fin (41) and the secondary fin (42) have the same structure; The upper surfaces of the primary fin (41) and the secondary fin (42) are wavy.

5. The crash-avoidance radar package housing structure of claim 1, wherein The heat pipe heat conduction assembly (5) includes: Heat pipe (51), with its bent design; The heated end of the heat pipe (51) is embedded in the heat-conducting boss (3); The condenser end of the heat pipe (51) is embedded in the fin unit of the multi-level finned heat dissipation assembly (4).

6. A collision avoidance radar package housing structure according to claim 5, wherein The outer wall of the heated end of the heat pipe (51) is uniformly and fixedly connected with a first heat-conducting rod (52), and the first heat-conducting rod (52) is embedded in the heat-conducting boss (3); The outer wall of the condenser end of the heat pipe (51) is uniformly and fixedly connected with a second heat-conducting rod (53), and the second heat-conducting rod (53) is embedded in the fin unit of the multi-level fin heat dissipation assembly (4).

7. The crash-avoidance radar package housing structure of claim 6, wherein The upper surface of the heat-conducting boss (3) is covered with a graphene film, and a silicone grease layer is provided between the graphene film and the upper surface of the heat-conducting boss (3).

8. The crash-avoidance radar package housing structure of claim 2, wherein, The inner wall of the inner cover (21) is provided with a gradient heat-conducting layer (6); The inner wall of the gradient heat-conducting layer (6) is provided with a carbon fiber layer (7), and a silicone grease layer is provided between the carbon fiber layer (7) and the inner wall of the gradient heat-conducting layer (6); The gradient heat-conducting layer (6) conducts heat in a gradient manner from the inside to the outside, from high to low.

9. The crash-avoidance radar package housing structure of claim 8, wherein, The gradient thermal conductive layer (6) is specifically a metal foam layer; A low-density layer (62) is welded to the side of the metal foam layer near the inner cover (21). The inner wall of the low-density layer (62) is welded with a high-density layer (61).

10. The crash-avoidance radar package housing structure of claim 1, wherein, The main body (1) of the encapsulation shell includes: The upper shell (11) has a bottom plate (12) at its lower end. Upper ear plates (13) are fixedly connected to the lower edge of the outer wall of the upper shell (11) on both the left and right sides. The outer wall of the base plate (12) is fixedly connected to the lower ear plate (13) corresponding to the upper ear plate; A fixing bolt (14) is screwed between the upper ear plate (13) and the corresponding lower ear plate.

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