Two-phase flow cooling enclosure for airborne electronic equipment

By employing a two-phase flow cooling chassis design in airborne electronic equipment and utilizing microchannels and heat pipes for heat dissipation, the problems of coolant leakage and low heat dissipation efficiency are solved, achieving efficient cooling and improved safety. This design is suitable for the miniaturization and integration of airborne equipment.

CN224460343UActive Publication Date: 2026-07-03JIANGSU HUACHUANG MICROSYSTEM CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
JIANGSU HUACHUANG MICROSYSTEM CO LTD
Filing Date
2025-07-14
Publication Date
2026-07-03

AI Technical Summary

Technical Problem

Existing airborne electronic equipment cooling methods suffer from problems such as large coolant flow rate, high flow resistance, high pressure, high risk of coolant leakage, and limited heat dissipation capacity. In particular, single-phase liquid-cooled chassis have low heat conversion efficiency in conductive design, which cannot meet the heat dissipation requirements of high-power electronic equipment.

Method used

The chassis adopts a two-phase flow cooling design, including the chassis, front insertion processing module, lower chassis cooling plate, upper chassis cooling plate, left side panel and rear insertion interface module. By adding microchannels and disturbances in the cooling flow channel, combined with heat pipe conduction heat dissipation, the heat transfer effect is enhanced. R134fa and other refrigerants are used for cooling to avoid the risk of leakage caused by liquid cooling connector failure or corrosion.

Benefits of technology

It improves the heat dissipation performance and safety of airborne electronic equipment, reduces the risk of electrical short circuits and equipment damage, enables the miniaturization and integration of airborne equipment, and enhances the phase change efficiency and heat transfer capacity of coolant.

✦ Generated by Eureka AI based on patent content.

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    Figure CN224460343U_ABST
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Abstract

This utility model discloses a two-phase flow cooling chassis for airborne electronic equipment, including a chassis body. The chassis body includes a front insertion processing module, a lower cooling plate, a right side cooling plate, an upper cooling plate, a left side cooling plate, and a rear insertion interface module. The front insertion processing module and the rear insertion interface module are located on the front and back of the chassis, respectively. The upper and lower cooling plates are located at the top and bottom of the chassis, respectively. The left and right side cooling plates are located on both sides of the chassis. Microchannels are added to the cooling channels corresponding to electronic modules with high and concentrated heat generation to increase the effective contact area between the refrigerant and the heat dissipation surface within the cooling channels, and to increase the turbulence during the refrigerant flow process to enhance heat dissipation. The refrigerant absorbs a large amount of heat during the transition from liquid to gas phase and flows out of the chassis, thereby significantly improving the heat dissipation performance of the chassis and reducing the risk of electrical short circuits and damage to electrical equipment.
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