Power domain controllers, electronic devices and vehicles

Abstract

This application relates to a power domain controller, electronic device, and vehicle. The power domain controller includes a housing and a power integration module. The housing has an open heat dissipation channel, through which coolant is disposed and forms a heat dissipation cycle. The power integration module is fixed to the housing and has its opening closed, with at least a portion of the module in contact with the coolant, which carries away heat from the module. Based on this configuration, when the heat dissipation cycle is activated, the coolant directly contacts the power integration module, thereby directly carrying away its heat. In other words, the heat dissipation method of this application is direct liquid cooling, which provides better heat dissipation compared to previous heat conduction methods. Furthermore, this design reduces the amount of thermally conductive gel used for heat conduction, thereby reducing the overall cost and weight of the power domain controller.

Description

Technical Field

[0001] This application relates to the field of power control, and more particularly to a power domain controller, electronic equipment, and vehicle. Background Technology

[0002] With the rapid development of the new energy electric vehicle industry, the power requirements for DC-DC converters (DCDC converters) and on-board chargers (OBCs) are increasing. However, the power domain controller operates in a complex environment with high power density, making heat dissipation a key factor limiting its performance and lifespan. To ensure the stable and continuous operation of the power domain controller, the design of heat dissipation devices is crucial. These devices effectively remove the heat generated by the controller, keeping it within a suitable operating temperature range, thereby ensuring the reliable operation of the electric vehicle.

[0003] Currently, most manufacturers use a closed-loop water channel for power supply cooling in the design of integrated power control systems. This involves attaching the power devices to the bottom of the enclosure, with water channels laid at the bottom. Heat is first transferred to the bottom surface of the enclosure via thermally conductive gel, and then to the coolant; this results in low heat dissipation efficiency and high costs. Utility Model Content

[0004] The purpose of this application is to provide a power domain controller, electronic equipment, and vehicle.

[0005] According to a first aspect of the embodiments of this application, a power domain controller is provided, the power domain controller comprising:

[0006] The housing has an open heat dissipation channel inside, and the coolant is placed in the heat dissipation channel to form a heat dissipation cycle;

[0007] A power integrated module is fixed to the housing and the opening is closed, and at least a portion of the power integrated module is in contact with the coolant.

[0008] It should be noted that the aforementioned power integrated module may include both the DC-DC converter and the on-board charger. Of course, including only the DC-DC converter or only the on-board charger is also within the scope of this application. The aforementioned coolant generally consists of water and ethylene glycol. Water is typically deionized or distilled to reduce the risk of mineral precipitation and corrosion. Ethylene glycol has a low freezing point and a high boiling point, making it very suitable for preventing the liquid in the cooling system from freezing or boiling under various climatic conditions. Furthermore, ethylene glycol also has certain lubricating and anti-corrosion properties. In one embodiment, corrosion inhibitors, such as silicates, borates, nitrates, and molybdates, may be added to the above components to protect different metal components within the cooling system from corrosion.

[0009] Based on the above configuration, when the aforementioned heat dissipation cycle is activated, the coolant directly contacts the power integrated module, thereby directly carrying away the heat from the power integrated module. That is, the heat dissipation method of this application is direct liquid cooling, which provides better heat dissipation compared to previous heat conduction methods. Simultaneously, this design can reduce the amount of thermally conductive gel originally used for heat conduction, thereby reducing the overall cost and weight of the power domain controller.

[0010] That is, the above design can increase heat transfer efficiency while reducing the overall cost and weight of the power domain controller.

[0011] In one embodiment, the power integration module includes an integrated body and a protrusion connected to each other, the protrusion extending into the heat dissipation channel, the integrated body being fixed to the housing, and the integrated body being used to close the opening.

[0012] In one embodiment, the heat dissipation channel includes an integrated heat dissipation area, an inlet, and an outlet. The coolant flows into the integrated heat dissipation area from the inlet and flows out of the integrated heat dissipation area from the outlet. The power supply integrated module is disposed corresponding to the integrated heat dissipation area.

[0013] In one embodiment, the integrated heat dissipation area includes a flow guide plate disposed between the inlet and the outlet to extend the flow path of the coolant in the integrated heat dissipation area.

[0014] In one embodiment, the flow guide plate includes at least a first flow guide unit and a second flow guide unit, wherein the first flow guide unit is configured to cooperate with the flow inlet and the second flow guide unit is configured to cooperate with the flow outlet;

[0015] The first flow guiding unit forms an inflow channel with the side wall of the integrated heat dissipation area, the second flow guiding unit forms an outflow channel with the side wall of the integrated heat dissipation area, an intermediate channel is formed between the first flow guiding unit and the second flow guiding unit, and the inflow channel, the intermediate channel and the outflow channel are sequentially connected.

[0016] In one embodiment, the absolute value of the ratio of the difference between the cross-sectional areas of the inflow channel and the intermediate channel to the cross-sectional area of ​​the intermediate channel is greater than or equal to one-third.

[0017] Furthermore, the absolute value of the ratio of the difference in cross-sectional area between the outflow channel and the intermediate channel to the cross-sectional area of ​​the intermediate channel is greater than or equal to one-third.

[0018] In one embodiment, the integrated heat dissipation area further includes an annular protrusion disposed at the connection between the inflow channel, the intermediate channel and the outflow channel, for making the coolant flow smoothly.

[0019] In one embodiment, the first flow guiding unit and the second flow guiding unit extend along the length direction of the integrated heat dissipation area and are parallel to the side wall of the integrated heat dissipation area.

[0020] In one embodiment, the power domain controller includes a sealing ring, the housing has a sealing groove along the opening, the sealing ring is disposed in the sealing groove, the power integrated module is pressed onto the sealing ring, and the power integrated module is fixedly disposed with the housing.

[0021] According to a second aspect of the embodiments of this application, an electronic device is provided, the electronic device including a power domain controller as described in any of the above embodiments.

[0022] According to a third aspect of the embodiments of this application, a vehicle is provided, the vehicle including electronic equipment as described in the above embodiments.

[0023] The beneficial technical effects of the technical solutions provided in this application are:

[0024] The system comprises a housing and a power supply module. The housing contains open heat dissipation channels through which coolant is channeled, forming a heat dissipation cycle. The power supply module is fixed to the housing, with the openings closed, and at least a portion of the module is in contact with the coolant, which carries away heat from the module.

[0025] Based on the above configuration, when the aforementioned heat dissipation cycle is activated, the coolant directly contacts the power integrated module, thereby directly carrying away the heat from the power integrated module. That is, the heat dissipation method of this application is direct liquid cooling, which provides better heat dissipation compared to previous heat conduction methods. Simultaneously, this design can reduce the amount of thermally conductive gel originally used for heat conduction, thereby reducing the overall cost and weight of the power domain controller.

[0026] In summary, the above design can increase heat transfer efficiency while reducing the overall cost and weight of the power domain controller. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of the structure of a power domain controller according to an embodiment of this application.

[0029] Figure 2 This is an exploded view of a power domain controller according to an embodiment of this application.

[0030] Figure 3 This is a schematic diagram of the power domain controller from another perspective, according to an embodiment of this application.

[0031] Figure 4 for Figure 3 A cross-sectional view at point AA.

[0032] Figure 5 for Figure 3 A cross-sectional view of AA in another embodiment.

[0033] Figure 6 This is a schematic diagram of the structure of the housing according to an embodiment of this application.

[0034] Explanation of reference numerals in the attached figures

[0035] Dynamic Domain Controller 10

[0036] 100 shell

[0037] Heat dissipation channel 110

[0038] Opening 111

[0039] Integrated heat dissipation area 120

[0040] Inlet 130

[0041] Outlet 140

[0042] 150 deflector

[0043] First flow guiding unit 151

[0044] Second flow guiding unit 152

[0045] Inflow channel 161

[0046] Outflow channel 162

[0047] Intermediate flow channel 163

[0048] 170 ring protrusions

[0049] Sealing groove 180

[0050] Power Integrated Module 200

[0051] Integrated body 210

[0052] Protrusion 220

[0053] 300 sealing ring Detailed Implementation

[0054] The technical solutions in the embodiments (or "implementations") of this application will be clearly and completely described herein with reference to the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements.

[0055] If the embodiments of this application contain terms relating to directional indications or positional relationships (such as up, down, left, right, front, back, inside, outside, top, bottom, center, vertical, horizontal, longitudinal, transverse, length, width, counterclockwise, clockwise, axial, radial, circumferential, etc.), such terms are only used to explain the relative positional relationships and movements between components in a specific posture (as shown in the attached figures); if the specific posture changes, the directional indications or positional relationships will also change accordingly. Furthermore, the terms "first" and "second" used in the embodiments of this application are only for descriptive convenience and should not be construed as indicating or implying relative importance.

[0056] With the rapid development of the new energy electric vehicle industry, the power requirements for DC-DC converters and on-board chargers are increasing. However, the power domain controller operates in a complex environment with high power density, making heat dissipation a key factor limiting its performance and lifespan. Therefore, the design of heat dissipation devices is crucial to ensure the stable and continuous operation of the power domain controller. These devices effectively dissipate the heat generated by the controller, maintaining it within a suitable operating temperature range, thus ensuring the reliable operation of the electric vehicle.

[0057] Currently, most manufacturers use a closed-loop water channel for power supply cooling in the design of integrated power control systems. This involves attaching the power devices to the bottom of the enclosure, with water channels laid at the bottom. Heat is first transferred to the bottom surface of the enclosure via thermally conductive gel, and then to the coolant; this results in low heat dissipation efficiency and high costs.

[0058] This application proposes a dynamic domain controller 10, with reference to... Figure 1 , Figure 2 as well as Figure 3 As shown, the power domain controller 10 includes a housing 100 and a power integration module 200. The housing 100 has a heat dissipation channel 110 with an opening 111, through which coolant is disposed and forms a heat dissipation cycle. The power integration module 200 is fixed to the housing 100 and is positioned to close the opening 111, with at least a portion of the power integration module 200 in contact with the coolant. This contact between the power integration module 200 and the coolant allows the coolant to carry away the heat from the power integration module 200.

[0059] It should be noted that the aforementioned power integration module 200 may include both the DC-DC converter and the on-board charger. Of course, including only the DC-DC converter or only the on-board charger is also within the scope of this application. The aforementioned coolant generally consists of water and ethylene glycol. Water is typically deionized or distilled to reduce the risk of mineral precipitation and corrosion. Ethylene glycol has a low freezing point and a high boiling point, making it very suitable for preventing the liquid in the cooling system from freezing or boiling under various climatic conditions. Furthermore, ethylene glycol also has certain lubricating and anti-corrosion properties. In one embodiment, corrosion inhibitors, such as silicates, borates, nitrates, and molybdates, may be added to the above components to protect different metal components within the cooling system from corrosion.

[0060] Based on the above configuration, when the aforementioned heat dissipation cycle is activated, the coolant directly contacts the power integration module 200, thereby directly carrying away the heat from the power integration module 200. That is, the heat dissipation method of this application is direct liquid cooling, which provides better heat dissipation compared to previous heat conduction methods. Simultaneously, this design can reduce the amount of thermally conductive gel originally used for heat conduction, thereby reducing the overall cost and weight of the power domain controller 10.

[0061] That is, the above design can increase heat transfer efficiency while reducing the overall cost and weight of the power domain controller 10.

[0062] In one embodiment, reference Figure 3 and Figure 5As shown, the power supply integrated module 200 includes an integrated body 210 and a protrusion 220 connected to each other. The protrusion 220 extends into the heat dissipation channel 110. The integrated body 210 is fixed to the housing 100 and is used to close the opening 111.

[0063] In this embodiment, the protrusion 220 is inserted into the heat dissipation channel 110, which increases the contact area between the power integration module 200 and the coolant, thereby further increasing the heat dissipation efficiency of the power integration module 200.

[0064] refer to Figure 5 As shown, the protrusion 220 can be configured as multiple metal pins that extend directly into the coolant for heat exchange. Furthermore, the coolant can pass through the gaps between the metal pins, reducing obstruction to the coolant. In other embodiments, the protrusion 220 can also be other components, as long as they extend into the heat dissipation channel 110 to increase the heat dissipation area, all of which are within the scope of protection of this application.

[0065] In one embodiment, reference Figure 6 As shown, the heat dissipation channel 110 includes an integrated heat dissipation area 120, an inlet 130, and an outlet 140. Coolant flows into the integrated heat dissipation area 120 from the inlet 130 and flows out of the integrated heat dissipation area 120 from the outlet 140. The power supply integrated module 200 is correspondingly arranged with respect to the integrated heat dissipation area 120. It should be noted that the above-mentioned corresponding arrangement can be referenced... Figure 1 and Figure 2 For example, the integrated heat dissipation area 120 is positioned directly below the power integrated module 200 and is in direct contact with the power integrated module 200.

[0066] Based on the above configuration, the coolant in the integrated heat dissipation zone 120 can flow in from the inlet 130 and out from the outlet 140, thereby achieving heat circulation and thus heat dissipation for the power integrated module 200.

[0067] Furthermore, in this embodiment, the integrated heat dissipation area 120 directly corresponds to the power supply integrated module 200, thus allowing for better design to accommodate the shape of the power supply integrated module 200. In particular, the shape can be optimized based on the heat generation module within the power supply integrated module 200. For example, as shown in the reference view, the integrated heat dissipation area 120 is configured as a square to fit the power supply integrated module 200.

[0068] In one embodiment, reference Figure 6 As shown, the integrated heat dissipation zone 120 includes a guide plate 150, which is disposed between the inlet 130 and the outlet 140 to extend the flow path of the coolant in the integrated heat dissipation zone 120.

[0069] The aforementioned guide plate 150 is used to guide the flow of coolant to form a longer flow path, thereby allowing the liquid in the integrated heat dissipation area 120 to remain for a longer time, and thus allowing the coolant to fully exchange heat with the power integrated module 200, thereby improving cooling efficiency.

[0070] In this embodiment, reference Figure 6 As shown, the flow guide plate 150 includes at least a first flow guide unit 151 and a second flow guide unit 152. The first flow guide unit 151 is configured to cooperate with the inlet 130, and the second flow guide unit 152 is configured to cooperate with the outlet 140. The first flow guide unit 151 and the side wall of the integrated heat dissipation area 120 form an inflow channel 161, and the second flow guide unit 152 and the side wall of the integrated heat dissipation area 120 form an outflow channel 162. An intermediate channel 163 is formed between the first flow guide unit 151 and the second flow guide unit 152, and the inflow channel 161, the intermediate channel 163, and the outflow channel 162 are sequentially connected.

[0071] It should be noted that the above-described configuration of the first flow guiding unit 151 and the second flow guiding unit 152 is only one embodiment. Of course, multiple flow guiding units can also be configured, with the number being 3, 4, 5, or even more. The multiple flow guiding units can be arranged in parallel as shown in the figure, or they can be arranged in a ring. All of the above configurations are within the protection scope of this application.

[0072] Based on the above configuration, in this embodiment, the coolant needs to sequentially pass through the inlet channel 161, the intermediate channel 163, and the outlet channel 162 before finally flowing out from the outlet 140, and these channels completely cover the integrated heat dissipation area 120. That is, the coolant needs to completely pass through the entire integrated heat dissipation area 120 before flowing out from the outlet 140, allowing for better heat dissipation in areas outside the line connecting the inlet 130 and the outlet 140. This results in better cooling efficiency.

[0073] In this application, reference continues to be made to Figure 6 As shown, the first flow guiding unit 151 and the second flow guiding unit 152 extend along the length of the integrated heat dissipation area 120 and are parallel to the side wall of the integrated heat dissipation area 120.

[0074] With the above configuration, the lengths of the inflow channel 161, intermediate channel 163, and outflow channel 162 can be maximized to ensure that the coolant stays in the integrated heat dissipation area 120 for a sufficient amount of time, thereby increasing the heat dissipation efficiency.

[0075] In one embodiment, reference Figure 6As shown, the integrated heat dissipation area 120 also includes an annular protrusion 170, which is disposed at the connection between the inflow channel 161, the intermediate channel 163 and the outflow channel 162 to make the coolant flow smoothly.

[0076] When coolant flows, it can easily hit corners, thus reducing its flow speed. In this application, the aforementioned annular protrusion 170 is provided at the corner, which makes the coolant flow more smoothly when passing through the corner, thereby reducing the obstruction of the small flow channel to the coolant.

[0077] The applicant discovered through research that when the difference in cross-sectional area between the inflow channel 161, the intermediate channel 163, and the outflow channel 162 is too large, it will result in different pressure values ​​for each channel and different flow velocities for each channel, leading to low heat dissipation efficiency and hindering the flow of coolant to some extent.

[0078] In one embodiment, the absolute value of the ratio of the difference between the cross-sectional areas of the inflow channel 161 and the intermediate channel 163 to the cross-sectional area of ​​the intermediate channel 163 is greater than or equal to one-third, and the absolute value of the ratio of the difference between the cross-sectional areas of the outflow channel 162 and the intermediate channel 163 to the cross-sectional area of ​​the intermediate channel 163 is greater than or equal to one-third.

[0079] Within the aforementioned range, the difference in cross-sectional area between the inflow channel 161, the intermediate channel 163, and the outflow channel 162 can be relatively small. Within this range, the pressure values ​​borne by each channel tend to be similar, and the flow velocities are similar, thereby reducing the obstruction to the flow of coolant. For example, the aforementioned absolute values ​​can be one-third, one-quarter, one-fifth, or one-sixth.

[0080] In one embodiment, reference Figure 2 , Figure 4 and Figure 5 As shown, the power domain controller 10 includes a sealing ring 300, and the housing 100 is provided with a sealing groove 180 along the opening 111. The sealing ring 300 is disposed in the sealing groove 180, and the power integrated module 200 is pressed on the sealing ring 300. The power integrated module 200 is fixedly disposed with the housing 100.

[0081] The aforementioned sealing ring 300 fills the gap between the power domain controller 10 and the housing 100, thereby preventing coolant from leaking out from the gap between the power domain controller 10 and the housing 100. In other words, it reduces the risk of coolant leakage and improves the stability of the power domain controller 10.

[0082] This application also proposes an electronic device comprising a power domain controller 10 as described in any of the above embodiments. For example, it may be a body control module (BCM) responsible for controlling vehicle electronic devices such as doors, windows, and lights, but it can also work in conjunction with the power domain controller to achieve more efficient power management and load control. A battery management system (BMS) monitors the battery's status (such as voltage, current, and temperature) to ensure safe battery operation and optimize the charging and discharging process. The power domain controller can work closely with the BMS to manage power transmission between the high-voltage battery and other vehicle systems. Alternatively, a motor control unit (MCU) can be used to regulate the operating state of the electric motor to achieve drive control. The power domain controller can coordinate energy distribution under different power demands.

[0083] Furthermore, this application also proposes a vehicle that includes the electronic equipment described in any of the foregoing claims.

[0084] The vehicle can be a car, truck, van, SUV, or any other type of vehicle equipped with a battery. In one embodiment, the vehicle is a high-voltage traction battery-powered electric vehicle (e.g., a battery electric vehicle (BEV), a hybrid electric vehicle (HEV), a plug-in hybrid electric vehicle (PHEV), etc.). In another embodiment, the vehicle is an autonomous vehicle, wherein the vehicle's maneuverability is controlled without direct input from a human driver.

[0085] It should be noted that the technical solutions or features described in the above embodiments can be combined or supplemented with each other without conflict. The scope of protection of this application is not limited to the precise structures described in the above embodiments and shown in the accompanying drawings; all modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A power domain controller, characterized by, The dynamic domain controller includes: The housing has an open heat dissipation channel inside, and the coolant is placed in the heat dissipation channel to form a heat dissipation cycle; A power integrated module is fixed to the housing and the opening is closed, and at least a portion of the power integrated module is in contact with the coolant.

2. The power domain controller of claim 1, wherein, The power supply integrated module includes an integrated body and a protrusion that are interconnected. The protrusion extends into the heat dissipation channel. The integrated body is fixed to the housing and is used to close the opening.

3. The power domain controller of claim 1, wherein, The heat dissipation channel includes an integrated heat dissipation area, an inlet, and an outlet. The coolant flows into the integrated heat dissipation area from the inlet and flows out of the integrated heat dissipation area from the outlet. The power supply integrated module is configured correspondingly to the integrated heat dissipation area.

4. The power domain controller of claim 3, wherein, The integrated heat dissipation zone includes a flow guide plate, which is disposed between the inlet and the outlet to extend the flow path of the coolant in the integrated heat dissipation zone.

5. The power domain controller of claim 4, wherein, The flow guide plate includes at least a first flow guide unit and a second flow guide unit, wherein the first flow guide unit is configured in conjunction with the flow inlet and the second flow guide unit is configured in conjunction with the flow outlet; The first flow guiding unit forms an inflow channel with the side wall of the integrated heat dissipation area, the second flow guiding unit forms an outflow channel with the side wall of the integrated heat dissipation area, an intermediate channel is formed between the first flow guiding unit and the second flow guiding unit, and the inflow channel, the intermediate channel and the outflow channel are sequentially connected.

6. The power domain controller of claim 5, wherein, The absolute value of the ratio of the difference between the cross-sectional areas of the inflow channel and the intermediate channel to the cross-sectional area of ​​the intermediate channel is greater than or equal to one-third. Furthermore, the absolute value of the ratio of the difference in cross-sectional area between the outflow channel and the intermediate channel to the cross-sectional area of ​​the intermediate channel is greater than or equal to one-third.

7. The power domain controller of claim 5, wherein, The integrated heat dissipation area also includes an annular protrusion, which is disposed at the connection between the inflow channel, the intermediate channel and the outflow channel to make the coolant flow smoothly.

8. The power domain controller of claim 5, wherein, The first flow guiding unit and the second flow guiding unit extend along the length direction of the integrated heat dissipation area and are parallel to the side wall of the integrated heat dissipation area.

9. The power domain controller of claim 1, wherein, The power domain controller includes a sealing ring, and the housing has a sealing groove along the opening. The sealing ring is disposed in the sealing groove, and the power integrated module is pressed onto the sealing ring and fixedly disposed with the housing.

10. An electronic device, comprising: The electronic device includes the power domain controller as described in any one of claims 1-9.

11. A vehicle characterized by comprising: The vehicle includes the electronic equipment as described in claim 10.

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