A wafer washing device

Abstract

This utility model discloses a wafer cleaning device, which includes a body and a cleaning mechanism and a receiving mechanism installed in the body. The cleaning mechanism includes a cleaning section, a spraying section, and a multi-axis drive section. The cleaning section and the spraying section are both installed on the multi-axis drive section. Under the drive of the multi-axis drive section, the cleaning section and the spraying section move above the wafer and close to the upper surface of the wafer to perform cleaning and spraying operations. The receiving mechanism includes a fixing section and a rotating section. The fixing section is connected to the rotating section and is used to receive and fix the wafer. The rotating section drives the fixing section and the wafer to rotate, realizing the integrated cleaning and spraying of the wafer, effectively cleaning impurity particles on the wafer surface, and ensuring the cleanliness of the wafer.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment, and in particular to a wafer brushing device. Background Technology

[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits; its raw material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon crystal seeds, and then slowly pulled out to form a cylindrical single-crystal silicon ingot. After grinding, polishing, and slicing, the silicon ingot forms a silicon wafer. As semiconductor feature sizes shrink and processing and measurement equipment becomes more advanced, new data characteristics have emerged in wafer processing. Simultaneously, the reduction in feature size increases the impact of airborne particles on the quality and reliability of the processed wafer, and with improved cleanliness, the particle count also exhibits new data characteristics.

[0003] If the wafer surface contains impurities, it will affect the subsequent mounting effect. If cleaning is not performed before mounting, the wafer surface is prone to unevenness during mounting. Utility Model Content

[0004] The purpose of this invention is to address the technical problems existing in the background art by proposing a wafer brushing device.

[0005] To achieve the above-mentioned technical objectives, the technical solution adopted by this utility model is as follows:

[0006] A wafer cleaning apparatus is provided for cleaning the surface of a wafer. The wafer cleaning apparatus includes a body and a cleaning mechanism and a receiving mechanism installed in the body. The cleaning mechanism includes a cleaning section, a spraying section, and a multi-axis drive section. The cleaning section and the spraying section are both mounted on the multi-axis drive section. Driven by the multi-axis drive section, the cleaning section and the spraying section move above the wafer and close to the upper surface of the wafer to perform cleaning and spraying operations. The receiving mechanism includes a fixing section and a rotating section. The fixing section is connected to the rotating section and is used to receive and fix the wafer. The rotating section drives the fixing section and the wafer to rotate.

[0007] Preferably, the machine body includes a cover and a mounting platform. The cover covers the mounting platform, and the brushing mechanism and the receiving mechanism are both mounted on the mounting platform and placed inside the cover.

[0008] Preferably, the wafer washing device further includes at least one set of door assemblies, with at least one transport window on the housing. Each door assembly is mounted on the mounting platform and used to open and close the corresponding transport window. The door assembly includes a first lifting member and a baffle. The first lifting member is connected to the baffle and drives the baffle to cover or open the transport window.

[0009] Preferably, the fixing part includes a bracket, at least one clamping member, a first driving member, and a linkage member. Each clamping member is mounted on the bracket, the first driving member is mounted on the mounting platform, and the first part of the linkage member is connected to the output end of the first driving member. Under the drive of the first driving member, the second part of the linkage member is connected to each clamping member to activate the clamping and fixing of the wafer by each clamping member.

[0010] Preferably, the rotating part includes a main shaft, a second driving member, and a first tube. The main shaft is hollowed out and mounted on a mounting table. The second driving member is mounted on the mounting table. The first tube is rotatably mounted inside the main shaft. The first end of the first tube is drivenly connected to the second driving member. The second end of the first tube extends out of the main shaft and extends away from the mounting table. The second end of the first tube is fixedly connected to a bracket.

[0011] Preferably, the rotating part further includes a second tube built into the first tube, the first end of the second tube extending out of the first end of the first tube and fixed on the mounting platform, the second end of the second tube extending out of the second end of the first tube and provided with a first nozzle structure, the spraying direction of the first nozzle structure facing the lower surface of the wafer.

[0012] Preferably, the multi-axis drive unit includes a second lifting member, a lifting platform, a third drive member, a rotating shaft, and an arm. The second lifting member is mounted on the mounting platform, the lifting platform is mounted on the second lifting member and driven by the second lifting member, and the lifting platform moves up and down along the height direction of the cover under the drive of the second lifting member. The third drive member is mounted on the lifting platform, the first end of the rotating shaft is mounted on the output end of the third drive member, and the arm is fixedly connected to the second end of the rotating shaft.

[0013] Preferably, the scrubbing unit includes a mounting frame, a rotating drum, a fourth drive member, a scrubbing rod, and a third lifting member. The mounting frame is mounted on the end of the arm away from the rotating shaft. The rotating drum is rotatably mounted on the mounting frame. The fourth drive member is mounted on the mounting frame and driven to rotate the rotating drum. The scrubbing rod is slidably mounted on the mounting frame. A scrubbing head is provided on the first end of the scrubbing rod. When the rotating drum rotates, the scrubbing rod rotates together. The third lifting member is mounted on the mounting frame and connected to the second end of the scrubbing rod to drive the scrubbing rod to slide within the rotating drum.

[0014] Preferably, the spray washing unit includes a fourth lifting member, an extension arm, and a second nozzle structure. The fourth lifting member is installed on the end of the arm away from the rotating shaft. The first end of the extension arm is driven to be connected to the fourth lifting member. The second end of the extension arm extends to be close to the brush head. The second nozzle structure is installed on the second end of the extension arm. The spray direction of the second nozzle structure is towards the upper surface of the wafer.

[0015] Preferably, a drain outlet is provided on the mounting platform.

[0016] Compared with the prior art, the utility model has the following beneficial technical effects: it includes a body and a brushing mechanism and a receiving mechanism installed in the body; the brushing mechanism includes a brushing part, a spraying part and a multi-axis drive part, the brushing part and the spraying part are both installed on the multi-axis drive part, under the drive of the multi-axis drive part, the brushing part and the spraying part move to the top of the wafer and close to the upper surface of the wafer to perform brushing and spraying work; the receiving mechanism includes a fixing part and a rotating part, the fixing part is connected to the rotating part and is used to receive and fix the wafer, the rotating part drives the fixing part and the wafer to rotate, realizing the integrated brushing and spraying of the wafer, effectively cleaning the impurity particles on the wafer surface and ensuring the cleanliness of the wafer. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of an embodiment of the present utility model;

[0018] Figure 2 The internal structure of this utility model embodiment Figure 1 ;

[0019] Figure 3 The internal structure of this utility model embodiment Figure 2 ;

[0020] Figure 4 This is a schematic diagram of the receiving mechanism in an embodiment of the present utility model;

[0021] Figure 5 This is a top view of the rotating part in an embodiment of this utility model;

[0022] Figure 6 for Figure 5 Sectional view of section AA;

[0023] Figure 7 This is a schematic diagram of the fixing part in an embodiment of the present utility model;

[0024] Figure 8 This is a schematic diagram of the brushing mechanism in an embodiment of the present invention;

[0025] Figure 9 This is an exploded view of the scrubbing mechanism in an embodiment of this utility model;

[0026] Figure 10 This is an exploded view of the brushing section and the spraying section in an embodiment of this utility model;

[0027] Figure 11 This is a schematic diagram of the brushing section in an embodiment of the present invention;

[0028] Figure 12 This is a top view of the clamping component in an embodiment of the present invention;

[0029] Figure 13 for Figure 12 Schematic diagram of the structure of the middle BB section;

[0030] Figure 14 This is an exploded view of the clamping component in an embodiment of the present invention.

[0031] Icon labels:

[0032] 100 Body, 101 Shell, 1011 Transport Window, 102 Mounting Platform, 1021 Drainage Outlet;

[0033] 200 Brushing mechanism, 201 Brushing section, 2011 Mounting bracket, 2012 Rotary drum, 2013 Fourth drive component, 2014 Brushing rod, 2015 Third lifting component, 2016 Third spring, 202 Spraying section, 2021 Fourth lifting component, 2022 Extension arm, 2023 Second nozzle structure, 203 Multi-axis drive unit, 2031 Second lifting component, 2032 Lifting platform, 2033 Third drive component, 2034 Rotary shaft, 2035 Arm;

[0034] 300 Receiving mechanism, 301 Fixing part, 3011 Bracket, 3012 Clamping component, 30121 Main trunk, 30122 Flange, 30123 First spring, 30124 Vertical rod, 30125 Second spring, 30126 Fastener, 30127 Lateral limiting groove, 30128 Longitudinal limiting groove, 30129 Hook, 3013 First driving component, 3014 Linkage component, 302 Rotating part, 3021 Main shaft, 3022 Second driving component, 3023 First tube, 3024 Second tube, 3025 First nozzle structure;

[0035] 400 door assembly, 401 first lifting component, 402 baffle. Detailed Implementation

[0036] It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0037] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or assembly referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more features. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0038] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a link, or a specific connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the connection within two groups. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0039] The specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0040] like Figures 1-14 As shown, this utility model proposes a wafer cleaning device for cleaning the surface of wafers. The wafer cleaning device includes a body 100 and a cleaning mechanism 200 and a receiving mechanism 300 installed in the body 100. The cleaning mechanism 200 includes a cleaning section 201, a spraying section 202 and a multi-axis drive section 203. The cleaning section 201 and the spraying section 202 are both installed on the multi-axis drive section 203. Under the drive of the multi-axis drive section 203, the cleaning section 201 and the spraying section 202 move above the wafer and close to the upper surface of the wafer to perform cleaning and spraying operations. The receiving mechanism 300 includes a fixing section 301 and a rotating section 302. The fixing section 301 is connected to the rotating section 302 and is used to receive and fix the wafer. The rotating section 302 drives the fixing section 301 and the wafer to rotate.

[0041] It should be noted that, in the specific implementation of this wafer washing device, the wafer is transported into the machine body 100 by an external robotic arm or automated transport equipment, and then received and secured by the receiving mechanism 300. It is important to note that the machine body 100 is equipped with multiple sensors to detect whether the wafer has entered the machine body 100 and whether it has been received by the receiving mechanism 300. After confirming that the wafer has been received and secured by the receiving mechanism 300, the washing mechanism 200 is activated, and the multi-axis drive unit 203 drives the washing unit 201 and the spray unit. When part 202 moves above the wafer, rotating part 302 drives fixed part 301 and the wafer thereon to rotate. Spraying part 202 sprays cleaning fluid and other cleaning substances onto the upper surface of the wafer. Brushing part 201 approaches and adheres to the upper surface of the wafer to perform brushing operation. Since multi-axis drive part 203 can drive brushing part 201 to move within the machine body 100, the movement of brushing part 201 can gradually move from the center of the wafer to the edge of the wafer. Since the wafer is rotating, the entire upper surface of the wafer can be brushed by brushing part 201.

[0042] In one embodiment of this application, the body 100 includes a cover 101 and a mounting platform 102. The cover 101 covers the mounting platform 102. The brushing mechanism 200 and the receiving mechanism 300 are both mounted on the mounting platform 102 and placed inside the cover 101.

[0043] In one embodiment of this application, the wafer brushing device further includes at least one set of door assemblies 400. The housing 101 is provided with at least one transport window 1011. Each door assembly 400 is mounted on the mounting platform 102 and is used to open and close the corresponding transport window 1011. The door assembly 400 includes a first lifting member 401 and a baffle 402. The first lifting member 401 is connected to the baffle 402 and drives the baffle 402 to cover or open the transport window 1011.

[0044] It should be noted that in the implementation of this embodiment, the housing 101 is provided with a transport window 1011, and the door assembly 400 is also provided accordingly. The wafer enters and exits the housing 101 through the transport window 1011. Only after a complete process of cleaning and removal can the next wafer be processed to ensure the cleanliness of the wafer.

[0045] In another implementation, the housing 101 is provided with two transport windows 1011. These two transport windows 1011 are respectively located on two adjacent side walls of the housing 101. These two transport windows 1011 serve as windows for receiving wafers and windows for outputting wafers, respectively. In actual application, the wafer is input into the housing 101 through one transport window 1011. After the wafer has completed the cleaning process, the wafer is output out of the housing 101 through the other transport window 1011. It should be noted that the wafer transport operation is carried out by a robotic arm or automated equipment with wafer transport function outside the equipment. Moreover, the input and output of the wafer do not interfere with each other. By adjusting the transport speed, it can be ensured that the next wafer is input at the same time as the wafer is output, thereby improving the wafer transport efficiency and thus improving the wafer cleaning efficiency.

[0046] In one embodiment of this application, the fixing part 301 includes a bracket 3011, at least one clamping member 3012, a first driving member 3013, and a linkage member 3014; each clamping member 3012 is mounted on the bracket 3011; the first driving member 3013 is mounted on the mounting platform 102; the first part of the linkage member 3014 is connected to the output end of the first driving member 3013; wherein, under the drive of the first driving member 3013, the second part of the linkage member 3014 is connected to each clamping member 3012 to activate the clamping and fixing of the wafer by each clamping member 3012.

[0047] See appendix Figure 12 - Appendix Figure 14 It should be noted that the clamping component 3012 includes a main frame 30121, a flange 30122, a first spring 30123, a vertical rod 30124, a second spring 30125, a fastener 30126, and screws. The flange 30122 is fitted onto the main frame 30121 and fixed to the bracket 3011. The main frame 30121 is hollow inside, and bosses are provided at both the top and bottom ends of the main frame 30121 (here, the top and bottom ends are attached to the bracket). Figure 13The spatial position is directly displayed to the human eye (i.e., the bottom end). The first spring 30123 is sleeved on the main stem 30121, with one end abutting against the flange 30122 and the other end abutting against the boss at the bottom end of the main stem 30121. The vertical rod 30124 is built into the main stem 30121, and a cavity is provided inside the main stem 30121. The second spring 30125 is built into the cavity and sleeved on the bottom end of the vertical rod 30124. A transverse limiting groove 30127 is provided on the top end of the vertical rod 30124. The fastener 30126 is rotatably installed on the top end of the main stem 30121 and connected to the transverse limiting groove 30127. A longitudinal limiting groove 30128 is provided on one side of the top end of the vertical rod 30124. The screw extends into the longitudinal limiting groove 30128 and is fixed to the top end of the vertical rod 30124. The connection is fixed, wherein the screw can move within the longitudinal limiting groove 30128, and the fastener 30126 is provided with a hook 30129. When the fastener 30126 deflects, its deflection trajectory is affected by the restriction of the transverse limiting groove 30127 and the longitudinal limiting groove 30128, and the hook 30129 will deflect to a designated position. Each clamping component 3012 surrounds the edge of the wafer, and the deflection of the hook 30129 will just lock the edge of the wafer, thereby fixing the wafer without applying excessive force to the wafer and avoiding damage to the wafer. The second spring 30125 is provided to provide a certain buffer function for the hook 30129, which also further avoids damage to the wafer. In this embodiment, the bottom ends of the main stem 30121 of each clamping component 3012 are connected together by a ring frame.

[0048] The connection between the linkage 3014 and the clamping member 3012 is through abutment, as shown in the appendix. Figure 7 Driven by the first driving component 3013, the linkage component 3014 abuts against the ring frame. During the upward movement of the linkage component 3014, the ring frame drives each main component 30121 to rise, causing the hook 30129 to shift and lock onto the edge of the wafer. After the linkage component 3014 descends, the main component 30121 descends and returns to its initial position under the release compression of the first spring 30123. At this time, the hook 30129 disengages from the wafer, and the wafer is unlocked and fixed. It should be noted that the linkage component 3014 is a combination of a lifting structure and a transmission structure. The transmission structure is directly connected to the first driving component 3013 to provide a power source. The lifting structure is rotatably connected to the transmission structure. However, the lifting rod in the lifting structure passes through the mounting platform 102, where there is a hole. This hole restricts the degree of freedom of the lifting rod, allowing it to move only in the vertical direction. The linkage between the transmission structure and the lifting structure is to raise or lower the lifting structure, thereby realizing the lifting operation of the lifting structure.

[0049] In one embodiment of this application, the rotating part 302 includes a main shaft 3021, a second driving member 3022, and a first tube 3023. The main shaft 3021 is hollowed out and mounted on the mounting platform 102. The second driving member 3022 is mounted on the mounting platform 102. The first tube 3023 is rotatably mounted inside the main shaft 3021. The first end of the first tube 3023 is drivenly connected to the second driving member 3022. The second end of the first tube 3023 extends out of the main shaft 3021 and extends away from the mounting platform 102. The second end of the first tube 3023 is fixedly connected to the bracket 3011.

[0050] In one embodiment of this application, the rotating part 302 further includes a second tube 3024 built into the first tube 3023. The first end of the second tube 3024 extends out of the first end of the first tube 3023 and is fixed on the mounting platform 102. The second end of the second tube 3024 extends out of the second end of the first tube 3023 and is provided with a first nozzle structure 3025. The spraying direction of the first nozzle structure 3025 faces the lower surface of the wafer.

[0051] It should be noted that the support 3011 is provided with a flow guide plate and a cover plate. The flow guide plate has an umbrella-shaped structure. A first hole is opened in the middle of the flow guide plate, which is directly opposite the first nozzle structure 3025. The cover plate is set at the edge of the flow guide plate to enclose the flow guide plate. Multiple second holes are provided at the edge of the flow guide plate.

[0052] After the water stains on the wafer are flung off, they will drip onto the guide plate and splash onto the cover plate. The bracket 3011 is fixedly connected to the first tube 3021, so the entire bracket 3011 will rotate under the drive of the second drive 3022. The water stains dripping onto the guide plate and splashing onto the cover plate will approach the junction of the guide plate and the cover plate due to centrifugal force. Multiple second holes at the edge of the guide plate, that is, at the junction of the guide plate and the cover plate, will allow the water stains to flow along the inner wall of the cover plate and through each second hole 30224 onto the mounting stage 102. The first nozzle structure 3025 may include a single-hole spray structure or a multi-hole spray structure. The second tube 3024 may be arranged with an air pipe connected to the first nozzle structure 3025 to deliver gas for cleaning the lower surface of the wafer.

[0053] In one embodiment of this application, the multi-axis drive unit 203 includes a second lifting member 2031, a lifting platform 2032, a third drive member 2033, a rotating shaft 2034, and an arm 2035. The second lifting member 2031 is mounted on the mounting platform 102; the lifting platform 2032 is mounted on the second lifting member 2031 and drivenly connected to the second lifting member 2031, and under the drive of the second lifting member 2031, the lifting platform 2032 moves up and down along the height direction of the cover 101; the third drive member 2033 is mounted on the lifting platform 2032; the first end of the rotating shaft 2034 is mounted on the output end of the third drive member 2033; and the arm 2035 is fixedly connected to the second end of the rotating shaft 2034.

[0054] In one embodiment of this application, the scrubbing unit 201 includes a mounting frame 2011, a rotating drum 2012, a fourth driving member 2013, a scrubbing rod 2014, and a third lifting member 2015. The mounting frame 2011 is mounted on the end of the arm 2035 away from the rotating shaft 2034; the rotating drum 2012 is rotatably mounted on the mounting frame 2011; the fourth driving member 2013 is mounted on the mounting frame 2011 and is drivenly connected to the rotating drum 2012 to drive the rotating drum 2012 to rotate; the scrubbing rod 2014 is slidably mounted on the mounting frame 2011. A brush head is provided on the first end of 4, wherein the brush rod 2014 rotates together when the drum 2012 rotates; the third lifting member 2015 is installed on the mounting bracket 2011 and connected to the second end of the brush rod 2014 to drive the brush rod 2014 to slide within the drum 2012. It should also be noted that the brushing part 2035 also includes a third spring 2016, which is sleeved on the brush rod 2014. When the third lifting member 2015 performs corresponding extension and retraction, the third spring 2016 is correspondingly compressed and returns to its initial state.

[0055] In one embodiment of this application, the spray washing unit 202 includes a fourth lifting member 2021, an extension arm 2022, and a second nozzle structure 2023. The fourth lifting member 2021 is mounted on the end of the arm 2035 away from the rotating shaft 2034. The first end of the extension arm 2022 is drivenly connected to the fourth lifting member 2021, and the second end of the extension arm 2022 extends to a position close to the brush head. The second nozzle structure 2023 is mounted on the second end of the extension arm 2022, and the spray direction of the second nozzle structure 2023 is toward the upper surface of the wafer.

[0056] In one embodiment of this application, a drain outlet 1021 is provided on the mounting platform 102 to drain any remaining water stains that fall onto the mounting platform 102.

[0057] The above description provides one or more embodiments in conjunction with specific content, but it is not intended that the specific implementation of this utility model is limited to these descriptions. Any methods or structures that are similar to or identical to those of this utility model, or any technical deductions or substitutions made based on the concept of this utility model, should be considered within the scope of protection of this utility model.

Claims

1. A wafer cleaning device for cleaning the surface of wafers, characterized in that, It includes a body (100) and a brushing mechanism (200) and a receiving mechanism (300) installed in the body (100); The brushing mechanism (200) includes a brushing section (201), a spraying section (202), and a multi-axis drive section (203). The brushing section (201) and the spraying section (202) are both mounted on the multi-axis drive section (203). Driven by the multi-axis drive section (203), the brushing section (201) and the spraying section (202) move to the top of the wafer and close to the upper surface of the wafer to perform brushing and spraying operations. The receiving mechanism (300) includes a fixing part (301) and a rotating part (302). The fixing part (301) is connected to the rotating part (302) and is used to receive and fix the wafer. The rotating part (302) drives the fixing part (301) and the wafer to rotate.

2. The wafer brushing device according to claim 1, characterized in that, The body (100) includes a cover (101) and a mounting platform (102). The cover (101) covers the mounting platform (102). The brushing mechanism (200) and the receiving mechanism (300) are both mounted on the mounting platform (102) and placed inside the cover (101).

3. A wafer scrubbing apparatus as claimed in claim 2, wherein It also includes at least one set of door assemblies (400), the housing (101) is provided with at least one transport window (1011), each of the door assemblies (400) is mounted on the mounting platform (102) and is used to open and close the corresponding transport window (1011). The door assembly (400) includes a first lifting member (401) and a baffle (402). The first lifting member (401) is connected to the baffle (402) and drives the baffle (402) to cover or open the transport window (1011).

4. The wafer scrubbing apparatus of claim 2, wherein The fixing part (301) includes: Stent (3011); At least one clamping member (3012) is mounted on the bracket (3011); The first driving component (3013) is mounted on the mounting platform (102); Linkage component (3014), the first part of which is connected to the output end of the first drive component (3013); Under the drive of the first driving member (3013), the second part of the linkage member (3014) is connected to each of the clamping members (3012) to activate the clamping and fixing of the wafer by each of the clamping members (3012).

5. A wafer scrubbing apparatus as claimed in claim 4, wherein The rotating part (302) includes: The main spindle (3021) has an internal hollow design and is mounted on the mounting platform (102); The second drive unit (3022) is mounted on the mounting platform (102); The first tube (3023) is rotatably mounted inside the main shaft (3021). The first end of the first tube (3023) is driven to be connected to the second drive member (3022). The second end of the first tube (3023) extends out of the main shaft (3021) and extends away from the mounting platform (102). The second end of the first tube (3023) is fixedly connected to the bracket (3011).

6. A wafer scrubbing apparatus as claimed in claim 5, wherein The rotating part (302) further includes a second tube (3024) built into the first tube (3023). The first end of the second tube (3024) extends out of the first end of the first tube (3023) and is fixed on the mounting platform (102). The second end of the second tube (3024) extends out of the second end of the first tube (3023) and is provided with a first nozzle structure (3025). The spraying direction of the first nozzle structure (3025) faces the lower surface of the wafer.

7. The wafer scrubbing apparatus of claim 2, wherein The multi-axis drive unit (203) includes a second lifting member (2031), a lifting platform (2032), a third drive member (2033), a rotating shaft (2034), and an arm (2035). The second lifting member (2031) is mounted on the mounting platform (102). The lifting platform (2032) is mounted on the second lifting member (2031) and drivenly connected to the second lifting member (2031). Under the drive of the second lifting member (2031), the lifting platform (2032) moves up and down along the height direction of the cover (101). The third drive member (2033) is mounted on the lifting platform (2032). The first end of the rotating shaft (2034) is mounted on the output end of the third drive member (2033). The arm (2035) is fixedly connected to the second end of the rotating shaft (2034).

8. A wafer scrubbing apparatus as claimed in claim 7, wherein The scrubbing unit (201) includes a mounting frame (2011), a rotating drum (2012), a fourth driving member (2013), a scrubbing rod (2014), and a third lifting member (2015). The mounting frame (2011) is mounted on the end of the arm (2035) away from the rotating shaft (2034). The rotating drum (2012) is rotatably mounted on the mounting frame (2011). The fourth driving member (2013) is mounted on the mounting frame (2011) and is drivenly connected to the rotating drum (2012) to drive the rotating drum (2012) to rotate. The scrubbing rod (2014) is slidably mounted on the mounting frame (2011). A scrubbing head is provided on the first end of the scrubbing rod (2014). When the rotating drum (2012) rotates, the scrubbing rod (2014) rotates together. The third lifting component (2015) is mounted on the mounting bracket (2011) and connected to the second end of the brush rod (2014) to drive the brush rod (2014) to slide within the rotating drum (2012).

9. A wafer scrubbing apparatus as claimed in claim 8, wherein The spray washing unit (202) includes a fourth lifting member (2021), an extension arm (2022), and a second nozzle structure (2023). The fourth lifting member (2021) is mounted on the end of the arm (2035) away from the rotating shaft (2034). The first end of the extension arm (2022) is drivenly connected to the fourth lifting member (2021). The second end of the extension arm (2022) extends to a position close to the brush head. The second nozzle structure (2023) is mounted on the second end of the extension arm (2022). The spray direction of the second nozzle structure (2023) is towards the upper surface of the wafer.

10. The wafer scrubbing apparatus of claim 2, wherein, The mounting platform (102) is provided with a drain outlet (1021).

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