High-precision positioning mechanical platform of die bonder

Abstract

This invention relates to the field of die bonding machine technology and provides a high-precision positioning mechanical platform for a die bonding machine, including a worktable. The top of the worktable is connected to a positioning component and a die bonding device, and the bottom of the worktable is connected to a support platform. In this invention, a second motor drives a bidirectional threaded rod to rotate. Utilizing the opposite direction of the threads at both ends, the moving blocks on both sides can be moved in opposite directions simultaneously, achieving precise position adjustment of the baffle and the limiting box. This design can quickly adjust the positioning range according to chips or substrates of different sizes. The suction port on the side of the limiting box is connected to a bottom vacuum cleaner via a connecting hose. During the die bonding process, it can adsorb impurities such as metal scraps and chip fragments generated during the die taking and bonding stages in real time. The inclined side design of the limiting box helps impurities to gather towards the suction port. Combined with the mesh structure of the waste box and the bottom of the support platform, it greatly improves the adsorption efficiency.

Description

Technical Field

[0001] This utility model belongs to the field of die bonder technology, and in particular relates to a high-precision positioning mechanical platform for a die bonder. Background Technology

[0002] As semiconductor packaging technology continues to evolve, chip sizes are becoming increasingly miniaturized and integration levels are constantly rising, placing extremely stringent demands on the precision and stability of die bonders. As a key piece of equipment in the semiconductor packaging field, die bonders bear the heavy responsibility of accurately fixing chips to substrates, and their performance directly affects the quality and reliability of packaged products.

[0003] Existing die bonders often generate impurities such as metal shavings, dust, and chip fragments during operation. If these impurities remain on the wafer, they are very likely to cause electrical performance failures such as short circuits and open circuits in the chip, which seriously affects product quality and reliability. Therefore, a high-precision positioning mechanical platform for die bonders is needed to solve the above problems. Utility Model Content

[0004] The purpose of this utility model embodiment is to provide a high-precision positioning mechanical platform for a die bonder to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A high-precision positioning mechanical platform for a die bonder includes a worktable, a positioning component and a die bonder connected to the top of the worktable, a support platform connected to the bottom of the worktable, a waste box connected inside the support platform, and a vacuum cleaner connected to the bottom of the support platform.

[0007] The positioning component includes a second motor, the output end of which is connected to a bidirectional threaded rod. A movable block is threadedly connected to the outer side of the bidirectional threaded rod. A baffle is connected to one side of the movable block. A limit box is connected to one side of the baffle. Electric telescopic rods are connected to both ends of the bottom of the limit box. A fixed plate is connected to one end of the electric telescopic rods. An adsorption port is opened on one side of the limit box. A rubber plate is connected to one side of the bottom of the limit box.

[0008] In a further technical solution, a first motor is connected to the top of the support platform through a groove, and the output end of the first motor is connected to a wafer tray.

[0009] In a further technical solution, the interior of the support platform is connected to a second motor, and the two ends of the bidirectional threaded rod have opposite thread directions.

[0010] In a further technical solution, the number of baffles is four, the number of limiting boxes is two, each limiting box is located between two baffles, the top of the support platform is provided with a sliding groove, and both ends of the limiting box are slidably connected to the sliding groove.

[0011] A further technical solution is that each of the limiting boxes is connected to a connecting hose on one side, one end of the connecting hose is located above the waste box, the connecting hose is connected through the top of the workbench and the support platform, and one side of the limiting box is inclined.

[0012] In a further technical solution, the number of movable blocks is approximately four, with limit rods connected to the inner sides of two of the movable blocks, and the tops of the waste box and the support platform are both mesh structures.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] This invention uses a second motor to drive a bidirectional threaded rod to rotate. Utilizing the opposite direction of the threads at both ends, it can synchronously drive the movable blocks on both sides to move towards or away from each other, achieving precise position adjustment of the baffle and the limiting box. This design can quickly adjust the positioning range according to chips or substrates of different sizes. The suction port on the side of the limiting box is connected to the bottom vacuum cleaner through a connecting hose. During the die bonding process, it can adsorb impurities such as metal debris and chip fragments generated during the die taking and bonding stages in real time. The inclined side design of the limiting box helps impurities to gather towards the suction port. Combined with the mesh structure of the waste box and the bottom of the support platform, it greatly improves the adsorption efficiency and effectively reduces the risk of chip electrical failure caused by impurity residue.

[0015] In this invention, the electric telescopic rod at the bottom of the limiting box can adjust the height of the fixing plate in real time. By contacting the chip surface with the rubber plate, the chip can be fixed in multiple directions to prevent the chip from shifting during processing. During clamping, it can provide a stable fixing force and avoid chip damage caused by rigid contact. The first motor at the top of the support platform can drive the wafer tray to rotate, which makes it easy for users to adjust the angle of the chip and facilitates worker operation.

[0016] To more clearly illustrate the structural features and effects of this utility model, the following detailed description of this utility model is provided in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the three-dimensional structure of the main body of this utility model;

[0018] Figure 2 This is a partial side view cross-sectional three-dimensional structural diagram of the main body of this utility model;

[0019] Figure 3This is a three-dimensional structural diagram of the positioning component of this utility model;

[0020] Figure 4 This utility model Figure 3 A magnified three-dimensional structural diagram of A in the middle.

[0021] In the diagram: 1. Workbench; 2. Positioning assembly; 3. Die bonding device; 4. Support platform; 5. Waste box; 6. Vacuum cleaner; 7. Connecting hose; 8. First motor; 9. Wafer tray; 10. Slide groove; 11. Limiting rod; 201. Second motor; 202. Bidirectional threaded rod; 203. Movable block; 204. Baffle; 205. Limiting box; 206. Electric telescopic rod; 207. Fixing plate; 208. Suction port; 209. Rubber plate. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0023] The specific implementation of this utility model will be described in detail below with reference to specific embodiments.

[0024] like Figures 1-4 As shown, this utility model embodiment provides a high-precision positioning mechanical platform for a die bonder, including a worktable 1, a positioning component 2 and a die bonder 3 connected to the top of the worktable 1, a support platform 4 connected to the bottom of the worktable 1, a waste box 5 connected inside the support platform 4, and a vacuum cleaner 6 connected to the bottom of the support platform 4.

[0025] The positioning component 2 includes a second motor 201. The output end of the second motor 201 is connected to a bidirectional threaded rod 202. A movable block 203 is threadedly connected to the outer side of the bidirectional threaded rod 202. A baffle 204 is connected to one side of the movable block 203. A limit box 205 is connected to one side of the baffle 204. Electric telescopic rods 206 are connected to both ends of the bottom of the limit box 205. A fixed plate 207 is connected to one end of the electric telescopic rods 206. An adsorption port 208 is opened on one side of the limit box 205. A rubber plate 209 is connected to one side of the bottom of the limit box 205.

[0026] In this embodiment, the second motor 201 is started, which drives the bidirectional threaded rod 202 to rotate. Since the threads at both ends of the bidirectional threaded rod 202 are opposite, the movable blocks 203 on both sides can move synchronously towards or away from each other, thereby driving the baffle 204 and the limiting box 205 to precisely adjust their positions and achieve precise positioning of the chip. The movable blocks 203 move with the rotation of the bidirectional threaded rod 202, driving the baffle 204 to adjust its position. The four baffles 203 cooperate with the two limiting boxes 205 to flexibly adjust the clamping range according to the chip size and achieve positioning of workpieces of different specifications. The electric telescopic rod 206 at the bottom of the limiting box 205 can drive the fixing plate 207 to move up and down. Through the rubber plate 209, it contacts the chip surface to achieve flexible clamping, which can not only stably fix the chip in multiple directions, but also avoid damage caused by rigid contact.

[0027] like Figure 2 , Figure 3 and Figure 4 As shown, specifically, the top of the support platform 4 is connected to the first motor 8 through a groove, and the output end of the first motor 8 is connected to the wafer tray 9.

[0028] The interior of the support platform 4 is connected to the second motor 201, and the two ends of the bidirectional threaded rod 202 have opposite thread directions;

[0029] There are four baffles 204 and two limit boxes 205. Each limit box 205 is located between two baffles 204. The top of the support platform 4 is provided with a sliding groove 10. Both ends of the limit box 205 are slidably connected to the sliding groove 10.

[0030] Each limit box 205 is connected to a connecting hose 7 on one side. One end of the connecting hose 7 is located above the waste box 5. The connecting hose 7 is connected through the top of the workbench 1 and the support table 4. One side of the limit box 205 is inclined.

[0031] There are four movable blocks 203 in total, two of which are connected to limit rods 11 on their inner sides. The tops of the waste box 5 and the support platform 4 are both mesh structures.

[0032] In this embodiment, the suction port 208 on one side of the limiting box 205 is connected to the vacuum cleaner 6 at the bottom of the support platform 4 via a connecting hose 7. Impurities such as metal shavings and chip fragments generated during the die bonding process can be sucked into the waste box 5 by the vacuum cleaner through the suction port 208. One side of the limiting box 205 is inclined, which helps impurities to gather towards the suction port 208 and improves the suction efficiency. The waste box 5 inside the support platform 4 is used to collect impurities. Its top and the top of the support platform 1 are both mesh structures, which can ensure the negative pressure effect of the vacuum cleaner 6 and prevent large particles of impurities from clogging the pipes, thus achieving efficient impurity removal.

[0033] The working principle of this utility model is as follows: First, the chip is placed on the wafer tray 9. The second motor 201 is started, which drives the bidirectional threaded rod 202 to rotate. This causes the movable blocks 203 on both sides to move synchronously towards or away from each other, thereby driving the baffles 204 and the limiting boxes 205 to precisely adjust their positions, achieving precise positioning of the chip. The movable blocks 203 move with the rotation of the bidirectional threaded rod 202, driving the baffles 204 to adjust their positions. The four baffles 203 cooperate with the two limiting boxes 205 to flexibly adjust their positions according to the chip size. After adjusting the clamping range, the electric telescopic rod 206 at the bottom of the limiting box 205 drives the fixing plate 207 to move up and down. Through the rubber plate 209, it contacts the chip surface, achieving flexible clamping. This not only stably fixes the chip in multiple directions but also avoids damage caused by rigid contact. Finally, the suction port 208 on one side of the limiting box 205 is connected to the vacuum cleaner 6 at the bottom of the support platform 4 via a connecting hose 7. Metal scraps, chip fragments, and other impurities generated during the die bonding process can be sucked into the waste box 5 through the suction port 208. The waste box 5 inside the support platform 4 is used to collect impurities.

[0034] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A high-precision positioning mechanical platform for a die bonder, comprising a worktable (1), characterized in that: The top of the workbench (1) is connected to a positioning component (2) and a die bonding device (3), the bottom of the workbench (1) is connected to a support platform (4), the inside of the support platform (4) is connected to a waste box (5), and the bottom of the support platform (4) is connected to a vacuum cleaner (6). The positioning component (2) includes a second motor (201), the output end of which is connected to a bidirectional threaded rod (202). A movable block (203) is threadedly connected to the outer side of the bidirectional threaded rod (202). A baffle (204) is connected to one side of the movable block (203). A limit box (205) is connected to one side of the baffle (204). An electric telescopic rod (206) is connected to both ends of the bottom of the limit box (205). A fixed plate (207) is connected to one end of the electric telescopic rod (206). An adsorption port (208) is opened on one side of the limit box (205). A rubber plate (209) is connected to one side of the bottom of the limit box (205).

2. The high-precision positioning mechanical platform of the die bonder according to claim 1, characterized in that: The top of the support platform (4) is connected to a first motor (8) through a groove, and the output end of the first motor (8) is connected to a wafer tray (9).

3. The high-precision positioning mechanical platform of the die bonder according to claim 1, characterized in that: The interior of the support platform (4) is connected to the second motor (201), and the two ends of the bidirectional threaded rod (202) have opposite thread directions.

4. The high-precision positioning mechanical platform of the die bonder according to claim 1, characterized in that: There are four baffles (204) and two limiting boxes (205). Each limiting box (205) is located between two baffles (204). The top of the support platform (4) is provided with a sliding groove (10). Both ends of the limiting box (205) are slidably connected to the sliding groove (10).

5. The high-precision positioning mechanical platform of the die bonder according to claim 1, characterized in that: Each of the limiting boxes (205) is connected to a connecting hose (7) on one side. One end of the connecting hose (7) is located above the waste box (5). The connecting hose (7) is connected through the top of the workbench (1) and the support platform (4). One side of the limiting box (205) is inclined.

6. The high-precision positioning mechanical platform of the die bonder according to claim 1, characterized in that: The number of movable blocks (203) is approximately four, of which two movable blocks (203) are connected to limit rods (11) on their inner sides, and the bottom of the waste box (5) and the support platform (4) are both mesh structures.

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