Laser alignment and calibration device for wafer carrier

Abstract

This utility model relates to the field of laser calibration technology and discloses a laser alignment and calibration device for a wafer carrier. It includes a worktable, a grooved plate fixedly connected to the top of the worktable, and sliding grooves formed on the front and rear sides of the outer wall of the grooved plate. A slider is slidably connected to the inner wall of the sliding groove, and a sliding plate is fixedly connected to the top of the slider. A support column is fixedly connected to the bottom of the worktable, and a base plate is fixedly connected to the bottom of the support column. Push handles are fixedly connected to the left and right sides of the sliding plate, and a hollow column is fixedly connected to the top of the sliding plate. In this utility model, the sliding plate slides in the first sliding groove, the rotating handle causes the screw to rotate and rise in the hollow column, and the pulley slides in the second sliding groove. This improves laser alignment accuracy, reduces alignment errors, compensates for wafer deformation, reduces detection deviations caused by local tilting, improves laser detection clarity, reduces mark recognition errors, and reduces height errors.

Description

Technical Field

[0001] This utility model relates to the field of laser calibration technology, and in particular to a laser alignment and calibration device for wafer carriers. Background Technology

[0002] Wafer carriers are components used in semiconductor manufacturing to carry, transport, and store wafers. They affect wafer cleanliness, processing accuracy, and production efficiency. Their design must meet the requirements of high precision, high cleanliness, wear resistance, and corrosion resistance, and be compatible with wafers of different sizes and various process equipment. Wafer carriers are the foundation of clean transport and automated production in semiconductor manufacturing, and their performance is directly related to the yield of chips. With the development of wafer size, carriers are being upgraded towards lightweight and intelligent design, while also needing to adapt to more complex multi-wafer stacking storage and three-dimensional process requirements. They are an essential component in intelligent semiconductor manufacturing.

[0003] Laser alignment and calibration devices are typically used in semiconductor manufacturing to achieve high-precision wafer positioning. Traditional wafer laser alignment and calibration devices are mostly static alignment and calibration devices, which rely on support calibration for adjustment. They can only ensure the overall level of the carrier and cannot compensate for the warpage of the wafer itself or the microscopic unevenness of the carrier surface. The mainstream height adjustment relies on piezoelectric ceramics and servo motors for driving. Displacement may occur after power failure, and servo motors have backlash errors due to gear backlash. Utility Model Content

[0004] To overcome the above shortcomings, this utility model provides a laser alignment and calibration device for wafer carriers, aiming to improve the problems of insufficient calibration accuracy, easy to cause secondary errors during adjustment, poor adjustment coordination and easy to cause cross interference, and insufficient compatibility and poor adaptability in the prior art.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a laser alignment and calibration device for a wafer carrier, comprising a worktable, a groove plate fixedly connected to the top of the worktable, a sliding groove first formed on the front and rear sides of the outer wall of the groove plate, a slider slidably connected to the inner wall of the sliding groove first, a sliding plate fixedly connected to the top of the slider, a support column second fixedly connected to the bottom of the worktable, a base plate fixedly connected to the bottom of the support column second, push handles fixedly connected to the left and right sides of the sliding plate, a hollow column fixedly connected to the top of the sliding plate, a screw threadedly connected to the inner wall of the hollow column, a threaded groove formed on the inner wall of the hollow column, a rotating handle fixedly connected to the top of the screw, a support column first fixedly connected to the top of the rotating handle, a sliding groove second formed on the upper middle part of the outer wall of the support column first, a movable box slidably connected to the rear side of the upper middle part of the support column first, pulleys rotatably connected to the left and right sides of the inner wall of the movable box, and a calibration mechanism fixedly connected to the top of the worktable, the calibration mechanism being used for fine-tuning and calibrating the wafer carrier.

[0006] As a further description of the above technical solution:

[0007] The calibration mechanism includes a transmission rod base, a fixing block 1 fixedly connected to the top of the base, a rotary adjuster 1 rotatably connected to the top of the fixing block 1, an electric cylinder fixedly connected to the top of the rotary adjuster 1, a telescopic rod fixedly connected to the top of the electric cylinder, a rotary adjuster 2 fixedly connected to the top of the telescopic rod, a fixing block 2 rotatably connected to the top of the rotary adjuster 2, a platform fixedly connected to the top of the fixing block 2, and a suction cup provided on the top of the platform.

[0008] As a further description of the above technical solution:

[0009] The bottom of the base plate is rotatably connected to a bearing, and a snap ring caster is fixedly connected to the bottom of the bearing.

[0010] As a further description of the above technical solution:

[0011] A handle is fixedly connected to the top rear side of the base plate, and a control box is fixedly connected to the outer rear side of the support column.

[0012] As a further description of the above technical solution:

[0013] A laser is fixedly connected to the top of the mobile box, and a shell is fixedly connected to the right side of the outer wall of the mobile box.

[0014] As a further description of the above technical solution:

[0015] A return spring is fixedly connected to the right side of the outer casing, and sliding grooves are provided on both the front and rear sides of the outer wall of the outer casing.

[0016] As a further description of the above technical solution:

[0017] The left side of the return spring is fixedly connected to a connector, and the right side of the connector is fixedly connected to a connecting block.

[0018] As a further description of the above technical solution:

[0019] A locking block is fixedly connected to the top of the insert, and a locking slot is provided on the top right side of the outer casing.

[0020] This utility model has the following beneficial effects:

[0021] 1. In this utility model, the sliding plate slides in the first sliding groove, the rotating handle causes the screw to rotate and rise in the hollow column, and the pulley slides in the second sliding groove, which improves the laser alignment accuracy, reduces alignment error, compensates for the deformation of the wafer itself, reduces the detection deviation caused by local tilt, improves the clarity of laser detection, reduces mark recognition error, and reduces height error.

[0022] 2. In this utility model, by rotating the first and second rotary adjusters on the first and second fixed blocks, the electric cylinder drives the telescopic rod to extend and retract, and the suction cup is placed on the platform. This allows for multi-dimensional deviation correction, cross-specification compatibility, strong adaptability, improved stability, reduced debugging costs, and shortened debugging cycle. Attached Figure Description

[0023] Figure 1 This is a front perspective view of the laser alignment and calibration device for a wafer carrier proposed in this utility model.

[0024] Figure 2 This is a partial structural diagram of the slider of the laser alignment and calibration device for a wafer carrier proposed in this utility model.

[0025] Figure 3 This is a partial structural exploded view of the rotating handle of the laser alignment and calibration device for a wafer carrier proposed in this utility model.

[0026] Figure 4 This is a partial structural diagram of the hollow column of the laser alignment and calibration device for a wafer carrier proposed in this utility model.

[0027] Figure 5 This is a partial structural exploded view of the slide groove of the laser alignment and calibration device for the wafer carrier proposed in this utility model;

[0028] Figure 6 This is a partial structural diagram of the moving box of the laser alignment and calibration device for a wafer carrier proposed in this utility model.

[0029] Figure 7 This is a partial structural diagram of the insertion part of the laser alignment and calibration device for the wafer carrier proposed in this utility model;

[0030] Figure 8 This is a partial structural diagram of the telescopic rod of the laser alignment and calibration device for the wafer carrier proposed in this utility model.

[0031] Legend:

[0032] 1. Workbench; 2. Calibration Mechanism; 201. Base; 202. Fixing Block 1; 203. Rotary Adjuster 1; 204. Electric Cylinder; 205. Telescopic Rod; 206. Rotary Adjuster 2; 207. Fixing Block 2; 208. Platform; 209. Suction Cup; 3. Slot Plate; 4. Slide Rail 1; 5. Slider; 6. Sliding Plate; 7. Hollow Column; 8. Screw; 9. Rotating Handle; 10. Threaded Groove; 11. Support Column 1; 12. Slide Rail 2; 13. Moving Box; 14. Pulley; 15. Support Column 2; 16. Base Plate; 17. Bearing; 18. Snap Ring Caster; 19. Handle; 20. Push Handle; 21. Control Box; 22. Laser; 23. Housing; 24. Return Spring; 25. Slide Rail 3; 26. Insert; 27. Connecting Block; 28. Locking Block; 29. ​​Locking Slot. Detailed Implementation

[0033] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0034] Please see the appendix Figure 2 Appendix Figure 3 and attached Figure 4 This utility model provides an embodiment of a laser alignment and calibration device for a wafer carrier, comprising a worktable 1, characterized in that: a groove plate 3 is fixedly connected to the top of the worktable 1; a sliding groove 4 is formed on the front and rear sides of the outer wall of the groove plate 3; a slider 5 is slidably connected to the inner wall of the sliding groove 4; a sliding plate 6 is fixedly connected to the top of the slider 5; a support column 15 is fixedly connected to the bottom of the worktable 1; a base plate 16 is fixedly connected to the bottom of the support column 15; and push handles 20 are fixedly connected to the left and right sides of the sliding plate 6; the top of the sliding plate 6 is fixedly connected to... A hollow column 7 is fixedly connected, and a screw 8 is threadedly connected to the inner wall of the hollow column 7. A threaded groove 10 is opened on the inner wall of the hollow column 7. A rotating handle 9 is fixedly connected to the top of the screw 8. A support column 11 is fixedly connected to the top of the rotating handle 9. A sliding groove 12 is opened in the upper middle part of the outer wall of the support column 11. A movable box 13 is slidably connected to the rear side of the upper middle part of the support column 11. A pulley 14 is rotatably connected to the left and right sides of the inner wall of the movable box 13. A calibration mechanism 2 is fixedly connected to the top of the worktable 1. The calibration mechanism 2 is used for fine-tuning and calibrating the wafer carrier.

[0035] Specifically, the worktable 1, as the load-bearing component of the equipment, possesses wear-resistant and corrosion-resistant properties. Its bottom is connected to the base plate 16 via a second support column 15. The base plate 16 provides a stable reference for subsequent adjustment and calibration. The slotted plate 3, serving as the adjustment guide rail, is fixed to the top of the worktable 1. Symmetrical sliding grooves 4 are opened on its front and rear sides. The slider 5 is embedded in the first sliding groove 4 and connected to the bottom of the sliding plate 6. The push handles 20 on the left and right sides of the sliding plate 6 facilitate manual pushing and pulling adjustment by the operator. A hollow column 7 is fixed to the top of the sliding plate 6, and its inner wall threaded groove 10 is connected to the screw 8. The top of the screw 8 is connected to the rotating handle 9, which is fixed to the support column 11. The support column 11 provides stable support for adjustment. The support column 11 has a sliding groove 12, which serves as a guide rail for the moving box 13. The inner wall of the moving box 13 is rotatably connected to the pulleys 14. The moving box 13 has a reserved installation position to accommodate the alignment marks at different positions of the wafer. The operator adjusts the position of the sliding plate 6 by pushing the handle 20 and adjusts the height of the support column 11 by rotating the handle 9. The moving box 13 slides to adjust the laser so that the wafer is roughly within the detection field of view.

[0036] Please see the appendix Figure 1 and attached Figure 8 The calibration mechanism 2 includes a transmission rod base 201, a fixing block 202 fixedly connected to the top of the base 201, a rotary adjuster 203 rotatably connected to the top of the fixing block 202, an electric cylinder 204 fixedly connected to the top of the rotary adjuster 203, a telescopic rod 205 fixedly connected to the top of the electric cylinder 204, a rotary adjuster 206 fixedly connected to the top of the telescopic rod 205, a fixing block 207 rotatably connected to the top of the rotary adjuster 206, a platform 208 fixedly connected to the top of the fixing block 207, and a suction cup 209 provided on the top of the platform 208.

[0037] Specifically, calibration mechanism 2 is a device for alignment adjustment in the wafer carrier laser alignment system. It can perform wafer angle correction, height adjustment, and horizontal calibration, adapting to the wafer alignment adjustment requirements during laser alignment. Base 201 serves as the support for the entire calibration mechanism 2, with its bottom connected to the worktable 1 and its top abutting against fixed block 202 to prevent shaking from affecting the upper adjustment accuracy. Base 201 provides a stable reference for adjustment. Fixed block 202 is fixed to base 201 and cooperates with the rotating shaft of rotary adjuster 203. Rotary adjuster 203 is the component that realizes horizontal angle adjustment. (Electric cylinder...) 204 serves as a height adjustment component to meet the height adaptation requirements of wafers of different thicknesses. The telescopic rod 205 is connected to the electric cylinder 204, and its top is connected to the rotary adjuster 206. The rotary adjuster 206 is used to correct the angular deviation of the wafer. The bottom of the fixing block 207 is connected to the rotary adjuster 206, and its top is connected to the platform 208. It not only bears the weight of the platform 208 and the wafer, but also transmits the rotation angle adjustment to the platform 208. The platform 208 is the component that supports the suction cup 209 and the wafer. The suction cup 209 can hold the wafer. The suction cup 209 works with the wafer carrier to shorten the adjustment time of subsequent laser alignment.

[0038] Please see the appendix Figure 1 Appendix Figure 5 and attached Figure 6 The bottom of the base plate 16 is rotatably connected to a bearing 17, the bottom of the bearing 17 is fixedly connected to a snap ring caster 18, the top rear side of the base plate 16 is fixedly connected to a handle 19, the outer rear side of the support column 11 is fixedly connected to a control box 21, the top of the movable box 13 is fixedly connected to a laser 22, and the outer right side of the movable box 13 is fixedly connected to a shell 23.

[0039] Specifically, the base plate 16 serves as a load-bearing component. A bearing 17 and a snap-spring caster 18 are mounted on the bottom of the base plate 16. The top of the bearing 17 engages with a pivot at the bottom of the base plate 16, and the bottom connects to the snap-spring caster 18, ensuring rotation. When the brake pedal is depressed, the snap-spring locks the caster body and frame together through friction, ensuring no displacement during operation and meeting the needs of different workstations on the production line. Furthermore, it maintains stability comparable to a fixed installation even after braking. The handle 19 on the rear top of the base plate 16 is the operating component for moving the equipment. Pushing the equipment via the handle 19 coordinates with the rotation of the snap-spring caster 18. A single person can complete the turning and positioning of the equipment, reducing the labor cost of adjustment. The control box 21 on the rear side of the outer wall of the support column 11 controls the operation of the equipment. The components of the control box 21 are connected to provide stable control for adjustment. The laser 22 on the top of the moving box 13 and the outer shell 23 on the right side of the outer wall are responsible for emitting the laser beam. The outer shell 23 has impact resistance. After the laser beam emitted by the laser 22 is protected by the outer shell 23, it prevents the laser beam from shining directly on the operator. The braking function of the snap ring caster 18 is combined with the base plate 16, making the equipment flexible and controllable when moving, meeting the requirements of laser alignment and improving the efficiency of single wafer calibration.

[0040] Please see the appendix Figure 1 and attached Figure 7 A return spring 24 is fixedly connected to the right side of the outer casing 23. Slide grooves 25 are provided on both the front and rear sides of the outer wall of the outer casing 23. A plug 26 is fixedly connected to the left side of the return spring 24. A connecting block 27 is fixedly connected to the right side of the plug 26. A locking block 28 is fixedly connected to the top of the plug 26. A locking groove 29 is provided on the top right side of the outer casing 23.

[0041] Specifically, the outer shell 23 serves as a protective enclosure for the laser 22. Its right side and outer wall feature a return spring 24, a sliding groove 25, and a latch 26, which ensure the protective performance of the laser 22 during operation while facilitating daily maintenance and component replacement. This balances the safety and operability of the equipment. The return spring 24 and latch 26 on the right side of the outer shell 23 are components for locking the outer shell 23. The latch 26 is engaged by spring force, and the right end of the return spring 24 is fixed to the inner right wall of the outer shell 23. The left end connects to the insert 26, ensuring a stable restoring force during the movement of the insert 26. The right side of the insert 26 connects to the return spring 24, allowing it to slide without jamming within the slide groove 25. When the outer casing 23 is closed, the return spring 24 is in a compressed state, pushing the insert 26 to the left through its elastic force to lock it in place and prevent the outer casing 23 from loosening due to equipment vibration. The slide groove 25 on the front and rear sides of the outer wall of the outer casing 23 connects to the connecting block 27 on the right side of the insert 26, allowing the insert 26 to move... The sliding groove 25 cooperates with the insert 26, restricting the insert 26 to move only in the horizontal direction. The connecting block 27 is fixed to the right end of the insert 26, and both ends of the connecting block 27 are inside the sliding groove 25. When the operator pulls the operating handle to the right, it can overcome the elastic force of the return spring 24 and drive the insert 26 to the right to open the outer casing 23. The locking block 28 on the top of the insert 26 and the locking groove 29 on the top right side of the outer casing 23 prevent the outer casing 23 from opening during maintenance. 3. Accidental closure enhances operational safety. The locking block 28 is embedded in the insert 26 and has a certain degree of elasticity. The right side is a vertical surface, which facilitates sliding into the slot 29 and forming a lock. The slot 29 is a rectangular groove, opened at the top of the housing 23 corresponding to the position of the locking block 28. When the insert 26 moves to the right to the unlocked position, the locking block 28 moves synchronously with the insert 26 and slides into the slot 29. The elastic force of the return spring 24 makes the right side of the locking block 28 fit against the inner wall of the slot 29, and the insert 26 is in the unlocked state.

[0042] Working principle: When positioning the wafer carrier is required, the laser 22 is first activated via the control box 21. The laser 22 emits a laser beam. Hold the connecting block 27 and push the insert 26 towards the slot 29. When the locking block 28 contacts the outer casing 23, it will automatically descend, causing the insert 26 to move horizontally. When the locking block 28 reaches the slot 29, it will automatically rise and engage with the slot 29, thus releasing the lock on the slider 5. Then, hold the push handle 20 and slide the sliding plate 6. The cooperation of the sliding groove 4 and the slider 5 allows the components supported on the top of the sliding plate 6 to move left and right. The push handle 20 makes the movement simple and convenient, so it can drive the laser 22 to adjust left and right. After the adjustment is completed, press the locking block 28 so that it is below the outer casing 23. Then, the return spring 24 will automatically pop out the insert 26 and lock the slider 5. Similarly, when it is necessary to adjust the moving box 13 forward and backward... When the pulley 14 is locked, follow the previous steps to release it. Move the moving box 13 to make the pulley 14 slide in the slide groove 12 for adjustment. After the adjustment is completed, press the locking block 28 to make it under the outer shell 23. Then the return spring 24 will automatically pop out the insert 26 to lock the slider 5. When adjusting the height, hold the rotating handle 9 and rotate the screw 8. The hollow column 7 has a threaded groove 10. After rotation, the screw 8 and the parts on it will rise. When rotated in the opposite direction, the screw 8 and the parts on it will fall.

[0043] When fine-tuning is required, rotary adjuster 1 203 and rotary adjuster 206 rotate. Rotary adjuster 206 is connected to fixed block 207. By adjusting the rotational degrees of freedom, when the suction cup 209 experiences a slight angular shift due to temperature or collision factors, the rotation of rotary adjuster 1 203 and rotary adjuster 206 can drive the platform 208 and suction cup 209 to perform angle calibration. Simultaneously, electric cylinder 204 will push the telescopic rod 205 to extend and retract. When the suction cup 209 experiences a horizontal shift, it needs to be adjusted. When the suction cup 209 is calibrated in the horizontal direction, the extension and retraction of the telescopic rod 205 driven by the electric cylinder 204 can be used to conveniently and quickly adjust the suction cup 209 in the horizontal direction. The distance that the electric cylinder 204 pushes the telescopic rod 205 can be adjusted at any time, and all the adjustment shafts are in parallel structure. The movement of a single shaft does not affect the movement of other shafts, and multi-degree-of-freedom coordination can be performed. Through the rotation of the rotary adjuster 206 and the fixed block 207, and the extension and retraction of the electric cylinder 204 and the telescopic rod 205, the suction cup 209 is calibrated in all directions, which improves the calibration efficiency.

[0044] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A laser alignment calibration device for wafer carriers, comprising a worktable surface (1), characterized in that: A groove plate (3) is fixedly connected to the top of the workbench (1). A sliding groove (4) is provided on the front and back sides of the outer wall of the groove plate (3). A slider (5) is slidably connected to the inner wall of the sliding groove (4). A sliding plate (6) is fixedly connected to the top of the slider (5). A support column (15) is fixedly connected to the bottom of the workbench (1). A base plate (16) is fixedly connected to the bottom of the support column (15). Push handles (20) are fixedly connected to the left and right sides of the sliding plate (6). A hollow column (7) is fixedly connected to the top of the sliding plate (6). The inner wall of the hollow column (7) is threaded. There is a screw (8), and the inner wall of the hollow column (7) is provided with a threaded groove (10). The top of the screw (8) is fixedly connected to a rotating handle (9), and the top of the rotating handle (9) is fixedly connected to a support column (11). The upper middle part of the outer wall of the support column (11) is provided with a sliding groove (12). The rear side of the upper middle part of the support column (11) is slidably connected to a moving box (13). The inner wall of the moving box (13) is rotatably connected to pulleys (14). The top of the worktable (1) is fixedly connected to a calibration mechanism (2). The calibration mechanism (2) is used for fine-tuning and calibrating the wafer carrier.

2. The laser alignment calibration device for wafer carrier according to claim 1, wherein: The calibration mechanism (2) includes a transmission rod base (201), a fixing block (202) is fixedly connected to the top of the base (201), a rotary adjuster (203) is rotatably connected to the top of the fixing block (202), an electric cylinder (204) is fixedly connected to the top of the rotary adjuster (203), a telescopic rod (205) is fixedly connected to the top of the electric cylinder (204), a rotary adjuster (206) is fixedly connected to the top of the telescopic rod (205), a fixing block (207) is rotatably connected to the top of the rotary adjuster (206), a platform (208) is fixedly connected to the top of the fixing block (207), and a suction cup (209) is provided on the top of the platform (208).

3. The laser alignment calibration device for wafer carrier of claim 1, wherein: The bottom of the base plate (16) is rotatably connected to a bearing (17), and the bottom of the bearing (17) is fixedly connected to a snap ring caster (18).

4. The laser alignment calibration device for wafer carrier of claim 3, wherein: A handle (19) is fixedly connected to the top rear side of the base plate (16), and a control box (21) is fixedly connected to the outer rear side of the support column (11).

5. The laser alignment calibration device for wafer carrier of claim 1, wherein: A laser (22) is fixedly connected to the top of the mobile box (13), and a shell (23) is fixedly connected to the right side of the outer wall of the mobile box (13).

6. The laser alignment calibration device for wafer carrier of claim 5, wherein: A return spring (24) is fixedly connected to the right side of the outer shell (23), and a sliding groove (25) is provided on both the front and rear sides of the outer wall of the outer shell (23).

7. The laser alignment calibration device for wafer carrier of claim 6, wherein: The left side of the return spring (24) is fixedly connected to a plug (26), and the right side of the plug (26) is fixedly connected to a connecting block (27).

8. The laser alignment calibration device for wafer carrier of claim 7, wherein: The top of the insert (26) is fixedly connected to a locking block (28), and the top right side of the outer shell (23) is provided with a locking slot (29).

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