A wafer carrier device

Abstract

This utility model relates to the field of testing technology, and more particularly to a wafer carrier device, comprising: a rotating mechanism and a carrier mechanism, wherein the carrier mechanism is disposed on the rotating mechanism and is used to carry a wafer; the rotating mechanism is used to drive the carrier mechanism to rotate in multiple dimensions; the carrier mechanism includes a support ring, an adsorption component, and a clamping component, wherein the adsorption component and the clamping component are both disposed on the support ring; the adsorption component has an adsorption end, and the clamping component has a clamping end; when the carrier mechanism carries the wafer, the adsorption end adsorbs the wafer, and the wafer is located between the clamping end and the adsorption end. This utility model at least helps to reduce damage to the wafer.

Description

Technical Field

[0001] This utility model belongs to the field of testing technology, and in particular relates to a wafer carrier device. Background Technology

[0002] When performing defect inspection on wafers, the wafers need to be adjusted to multiple different angles to enable multi-angle and all-round inspection. If the wafer angle is rotated manually, it requires high labor costs, and the precision of the angle adjustment cannot be controlled, which affects the effectiveness and efficiency of wafer defect inspection.

[0003] When using mechanical means to achieve multi-dimensional rotation, if the wafer is fixed by clamping, the grippers are prone to damaging or crushing the wafer; if the wafer is fixed by adsorption, since the wafer needs to be flipped during the testing process, if the vacuum of the adsorption is abnormal, the wafer is prone to falling off, which will cause greater damage to the wafer or even make it unusable. Utility Model Content

[0004] In view of this, the present invention aims to provide a wafer carrier device that at least helps to reduce damage to the wafer.

[0005] To achieve the above objectives, the technical solution of this utility model is implemented as follows:

[0006] This utility model provides a wafer carrier device, including: a rotating mechanism and a carrier mechanism. The carrier mechanism is disposed on the rotating mechanism and is used to carry the wafer. The rotating mechanism is used to drive the carrier mechanism to rotate in multiple dimensions. The carrier mechanism includes a support ring, an adsorption component, and a clamping component. The adsorption component and the clamping component are both disposed on the support ring. The adsorption component has an adsorption end, and the clamping component has a clamping end. When the carrier mechanism carries the wafer, the adsorption end adsorbs the wafer, and the wafer is located between the clamping end and the adsorption end.

[0007] Furthermore, when the carrier mechanism carries the wafer, there is a gap between the clamping end and the wafer; the clamping end is movable relative to the adsorption end along the thickness direction of the support ring; when loading or unloading the wafer, the clamping end moves away from the adsorption end so that the clamping end and the adsorption end have a first gap in the thickness direction of the support ring; when the carrier mechanism carries the wafer, the clamping end moves towards the adsorption end so that the clamping end and the adsorption end have a second gap in the thickness direction of the support ring, wherein the first gap is greater than the second gap.

[0008] Furthermore, the supporting mechanism includes multiple adsorption components and multiple clamping components. The multiple adsorption components are arranged at intervals in the circumferential direction of the support ring, and the multiple clamping components are arranged at intervals in the circumferential direction of the support ring.

[0009] Furthermore, at least one clamping component and one adsorption component are disposed at the same position in the circumferential direction of the support ring; at least one clamping component and one adsorption component are offset from each other in the circumferential direction of the support ring.

[0010] Furthermore, the support mechanism also includes: a first limiting block, the first end of which is fixed to the inner ring sidewall of the support ring, and the second end of which is connected to the adsorption component; and a second limiting block, which is fixed to the inner ring sidewall of the support ring, and the first limiting block and the second limiting block cooperate to achieve wafer positioning.

[0011] Furthermore, the supporting mechanism includes 3 adsorption components and 4 clamping components. Two clamping components correspond to two adsorption components, and the corresponding clamping components and adsorption components are set at the same position in the circumferential direction of the support ring. The remaining two clamping components are located on both sides of the remaining adsorption component.

[0012] Furthermore, the clamping assembly includes a drive unit, a connector, and a pressure block. The drive unit is disposed on the outer side wall of the support ring. One end of the connector is connected to the free end of the drive unit, and the other end of the connector is connected to the pressure block, which serves as the clamping end. The drive unit drives the pressure block to move along the thickness direction of the support ring through the connector.

[0013] Furthermore, the clamping assembly also includes a mounting base plate, a slider, and a slide rail. The drive unit and the slide rail are both mounted on the mounting base plate. The mounting base plate is detachably connected to the support ring. The slider is mounted on the connector and is slidably connected to the slide rail. When the drive unit moves the connector, the connector moves the slider along the slide rail.

[0014] Furthermore, the connector includes a first extension, a second extension, and a third extension. The first end of the first extension is connected to the free end of the drive unit. The slider is disposed at the first end of the second extension, and the pressure block is disposed at the first end of the third extension. The second ends of the first extension, the second end of the second extension, and the second end of the third extension are connected to each other.

[0015] Furthermore, the adsorption assembly includes a suction cup holder and a suction cup, with the suction cup serving as the adsorption end. The suction cup holder is mounted on the support ring, and the suction cup is mounted on the suction cup holder, with the suction cup facing the side of the carrier mechanism that carries the wafer.

[0016] Compared with the prior art, the present invention can achieve the following beneficial effects: In the wafer carrier device provided by the present invention, the rotating mechanism is used to drive the carrier mechanism to rotate in multiple dimensions, and the carrier mechanism is used to carry the wafer, thereby realizing the rotation of the wafer in multiple dimensions. The carrier mechanism includes a support ring, a clamping component, and an adsorption component. The support ring is used to fix the clamping component and the adsorption component. The adsorption end of the adsorption component is used to adsorb and fix the wafer. The clamping end of the clamping component is located on the side of the wafer away from the adsorption end. In this way, the wafer is fixed by an adsorption method that causes less damage to the wafer. Moreover, if the adsorption at the adsorption end is abnormal when the wafer is flipped, the clamping end can prevent the wafer from falling, which helps to reduce the damage to the wafer. Attached Figure Description

[0017] The accompanying drawings, which form part of this utility model, are used to provide a further understanding of the utility model. The illustrative embodiments of the utility model and their descriptions are used to explain the utility model and do not constitute an undue limitation of the utility model. In the drawings:

[0018] Figure 1 This is a schematic diagram of the structure of the wafer carrier device described in an embodiment of the present invention;

[0019] Figure 2 This is a schematic diagram of the structure of the bearing mechanism described in an embodiment of the present utility model;

[0020] Figure 3 This is a schematic diagram of the clamping assembly described in an embodiment of the present utility model;

[0021] Figure 4 This is a schematic diagram of the rotating mechanism described in an embodiment of the present utility model;

[0022] Figure 5 This is a schematic diagram of the structure of the second drive mechanism of the wafer carrier device according to an embodiment of the present invention.

[0023] Explanation of reference numerals in the attached drawings: 2. Rotating mechanism; 1. Bearing mechanism; 10. Support ring; 11. Adsorption assembly; 12. Clamping assembly; 112. First limiting block; 113. Second limiting block; 120. Drive unit; 121. Connector; 122. Pressure block; 123. Mounting base plate; 125. Slider; 124. Slide rail; 101. First extension; 102. Second extension; 103. Third extension; X, First direction; Y, Second direction; Z, Third direction; 110. Suction cup holder; 111. Suction cup; 114. Notch; 210. Substrate; 211. First turntable; 212. Rotating plate; 213. Second turntable; 214. First support part; 224. Second support part; 1041. Guide rail mounting plate; 1043. Curved guide rail; 2105. Second drive mechanism; 1051. Second driver; 1052. Linear guide rail; 1053. First slider; 1054. First connecting block; 1055. Connecting rod; 1056. Second connecting block; 1057. Second slider. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and do not constitute a limitation thereof.

[0025] It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0026] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0027] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0028] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0029] refer to Figures 1 to 3 This utility model provides a wafer carrier device, including: a rotating mechanism 2 and a carrier mechanism 1. The carrier mechanism 1 is disposed on the rotating mechanism 2 and is used to carry the wafer. The rotating mechanism 2 is used to drive the carrier mechanism 1 to rotate in multiple dimensions. The carrier mechanism 1 includes a support ring 10, an adsorption component 11 and a clamping component 12. The adsorption component 11 and the clamping component 12 are both disposed on the support ring 10. The adsorption component 11 has an adsorption end and the clamping component 12 has a clamping end. When the carrier mechanism 1 carries the wafer, the adsorption end adsorbs the wafer and the wafer is located between the clamping end and the adsorption end.

[0030] Furthermore, when the supporting mechanism 1 supports the wafer, there is a gap between the clamping end and the wafer. That is to say, this utility model mainly uses the adsorption component 11 to adsorb and fix the wafer. When the adsorption is normal, the clamping end of the clamping component 12 does not come into contact with the wafer, which can reduce the phenomenon of pinching or crushing the wafer. When the adsorption is abnormal, the clamping end comes into contact with the wafer to support the wafer and prevent the wafer from falling.

[0031] In some embodiments, the clamping end is movable relative to the adsorption end along the thickness direction of the support ring 10. When loading or unloading the wafer, the clamping end moves away from the adsorption end to create a first gap between the clamping end and the adsorption end in the thickness direction of the support ring 10. When the carrier mechanism 1 carries the wafer, the clamping end moves towards the adsorption end to create a second gap between the clamping end and the adsorption end in the thickness direction of the support ring 10, wherein the first gap is greater than the second gap. The reason for this arrangement is that when loading or unloading the wafer, the clamping end moves away from the adsorption end to make room for the operation required for loading or unloading the wafer, allowing the wafer to be unloaded or loaded onto the carrier mechanism 1 from the outside. After the wafer is loaded onto the carrier mechanism 1, the clamping end moves towards the adsorption end to reduce the gap between the clamping end and the wafer. In this way, the clamping end can catch the wafer in case of abnormal drop and prevent the wafer from falling.

[0032] Furthermore, the support mechanism 1 includes multiple adsorption components 11 and multiple clamping components 12. The multiple adsorption components 11 are arranged at intervals in the circumferential direction of the support ring 10, and the multiple clamping components 12 are arranged at intervals in the circumferential direction of the support ring 10. The multiple adsorption components 11 work together to adsorb the wafer, and the multiple clamping components 12 work together to catch the wafer in the event of an abnormal drop.

[0033] In some examples, multiple adsorption components 11 are evenly arranged along the circumference of the support ring 10, and multiple clamping components 12 are evenly arranged along the circumference of the support ring 10.

[0034] Furthermore, at least one clamping component 12 and an adsorption component 11 are disposed at the same position in the circumferential direction of the support ring 10, thereby reducing the space occupied by the components and making the structural layout of the bearing mechanism 1 simpler.

[0035] In some embodiments, at least one clamping component 12 and an adsorption component 11 are offset from each other in the circumferential direction of the support ring 10.

[0036] Furthermore, the supporting mechanism 1 also includes: a first limiting block 112, the first end of which is fixed to the inner ring sidewall of the support ring 10, and the second end of which is connected to the adsorption component 11; and a second limiting block 113, which is fixed to the inner ring sidewall of the support ring 10, and the first limiting block 112 and the second limiting block 113 cooperate to achieve wafer positioning. In some examples, the second limiting block 113 and the clamping component 12, which is not provided with the adsorption component 11 at the same position, are aligned in the circumferential direction of the support ring 10. This helps to reduce the space occupied by the components and makes the structural layout of the supporting mechanism 1 simpler.

[0037] In some embodiments, the second end of the first limiting block 112 facing the top surface of the wafer and the second end of the second limiting block 113 facing the top surface of the wafer are both higher than the top surface of the adsorption component 11 facing the wafer. When loading the wafer, the first limiting block 112 and the second limiting block 113 work together to limit the wafer, so that the wafer is adsorbed and fixed in a designated position to prevent the wafer from moving around.

[0038] Furthermore, the support mechanism 1 includes three adsorption components 11 and four clamping components 12. Two clamping components 12 correspond to two adsorption components 11, and the corresponding clamping components 12 and adsorption components 11 are positioned at the same location on the circumference of the support ring 10. The remaining two clamping components 12 are located on both sides of the remaining adsorption component 11. The three adsorption components 11 are evenly arranged along the circumference of the support ring 10, and the four clamping components 12 are evenly arranged along the circumference of the support ring 10. In this way, the wafer can fully contact each adsorption end, which is conducive to achieving more stable adsorption. The two clamping components 12 are positioned at the same location on the circumference of the support ring 10, which is conducive to further reducing the space occupied by the components. The arrangement of the clamping components 12 can produce a better support effect, so that the wafer will not fall off the support mechanism 1 when it shakes at any angle.

[0039] In some embodiments, the support mechanism 1 may also include three adsorption components 11 and three clamping components 12. The three adsorption components 11 are evenly arranged along the circumference of the support ring 10, and the three clamping components 12 are evenly arranged along the circumference of the support ring 10. The three adsorption components 11 and the three clamping components 12 correspond one-to-one. The corresponding clamping components 12 and adsorption components 11 are set at the same position in the circumference of the support ring 10. In this way, the space occupied by the components can be reduced, and the structural layout of the support mechanism 1 can be made simpler.

[0040] Furthermore, the clamping assembly 12 includes a drive unit 120, a connector 121, and a pressure block 122. The drive unit 120 is disposed on the outer ring sidewall of the support ring 10. One end of the connector 121 is connected to the free end of the drive unit 120, and the other end of the connector 121 is connected to the pressure block 122, which serves as the clamping end. The drive unit 120 drives the pressure block 122 to move along the thickness direction of the support ring 10 through the connector 121.

[0041] Furthermore, the clamping assembly 12 also includes a mounting base plate 123, a slider 125, and a slide rail 124. The drive unit 120 and the slide rail 124 are both mounted on the mounting base plate 123. The mounting base plate 123 is detachably connected to the support ring 10. The slider 125 is mounted on the connector 121, and the slider 125 is slidably connected to the slide rail 124. When the drive unit 120 moves the connector 121, the connector 121 moves the slider 125 along the slide rail 124. The detachable connection between the mounting base plate 123 and the support ring 10 enhances the detachability of the entire clamping assembly 12, facilitating component replacement and maintenance. The slider 125 and the slide rail 124 ensure that the movement of the connector 121 is more stable and directional when the drive unit 120 moves it.

[0042] In some embodiments, the drive unit 120 may be a cylinder.

[0043] Furthermore, the connector 121 includes a first extension 101, a second extension 102, and a third extension 103. The first end of the first extension 101 is connected to the free end of the drive unit 120. The slider 125 is disposed at the first end of the second extension 102. The pressure block 122 is disposed at the first end of the third extension 103. The second ends of the first extension 101, the second end of the second extension 102, and the second end of the third extension 103 are connected to each other.

[0044] In some embodiments, the first extension 101 extends along a first direction X, the second extension 102 extends along a second direction Y, and the third extension 103 extends along a third direction Z, with the first direction X, the second direction Y, and the third direction Z being perpendicular to each other. In some examples, the first direction X is tangent to the outer ring of the support ring 10, the second direction Y is the corresponding radial direction of the support ring 10, and the third direction Z is parallel to the thickness direction of the support ring 10.

[0045] Furthermore, the adsorption assembly 11 includes a suction cup holder 110 and a suction cup 111. The suction cup 111 serves as the adsorption end. The suction cup holder 110 is disposed on the support ring 10, and the suction cup 111 is disposed on the suction cup holder 110, with the suction cup 111 facing the side of the carrier mechanism 1 that carries the wafer. Specifically, the suction cup holder 110 can be disposed on the support ring 10 via a first limiting block 112.

[0046] In some embodiments, the support ring 10 has a notch 114 for the movement of a robotic arm that picks up and places wafers, which can prevent the robotic arm from scraping the support ring 10 during the wafer picking and placing process.

[0047] The working process of the wafer carrier device provided by this utility model can be as follows: In the initial state, the carrier mechanism 1 is in a horizontal state, that is, the thickness direction of the support ring 10 is parallel to the vertical direction, each clamping end is in a raised state, and there is no vacuum at each adsorption end; after the wafer is placed on the adsorption end, the vacuum adsorbs and fixes the wafer, the clamping end descends, and the clamping end does not contact the wafer; the wafer is flipped for detection, and after the detection is completed, the carrier mechanism 1 returns to a horizontal state, the clamping end is raised, the vacuum at the adsorption end is closed, and the wafer is removed.

[0048] In some embodiments, reference Figures 1 to 5The rotating mechanism 2 includes a base plate 210, a first turntable 211, a rotating plate 212, and a second turntable 213 connected in sequence. The first turntable 211 is rotatable relative to the base plate 210, the rotating plate 212 is rotatable relative to the first turntable 211, and the second turntable 213 is rotatable relative to the rotating plate 212 along a first axis. The bearing mechanism 1 is disposed on the side of the second turntable 213 away from the rotating plate 212 via a support arm. The bearing mechanism 1 is rotatable relative to the second turntable 213 and the support arm along a second axis. The first axis and the second axis are different.

[0049] In some embodiments, the support arm includes a first support portion 214 and a second support portion 224, a bearing mechanism 1 is disposed between the first support portion 214 and the second support portion 224, and a second turntable 213 is disposed between the first support portion 214 and the second support portion 224.

[0050] In some embodiments, the rotating mechanism 2 further includes a first driving mechanism, a second driving mechanism, a third driving mechanism, and a fourth driving mechanism. The first driving mechanism is connected to the first turntable 211 and is used to drive the first turntable 211 to rotate relative to the substrate 210. The second driving mechanism is connected to the rotating plate 212 and is used to drive the rotating plate 212 to rotate relative to the first turntable 211. The third driving mechanism is connected to the second turntable 213 and is used to drive the second turntable 213 to rotate relative to the rotating plate 212. The fourth driving mechanism is connected to the bearing mechanism 1 and is used to drive the bearing mechanism 1 to rotate relative to the support arm.

[0051] In some embodiments, the first turntable 211 is rotatable relative to the substrate 210 along a third axis, and the rotating plate 212 is rotatable relative to the first turntable 211 along a fourth axis. The first, second, third, and fourth axes are all different. Through the first, second, third, and fourth driving mechanisms, multi-dimensional rotation of the wafer on the carrier mechanism 1 can be realized. Since the first, second, third, and fourth axes are all different, multi-dimensional and omnidirectional rotation of the wafer on the carrier mechanism 1 can be achieved in a more flexible manner. This mechanical method replaces manual rotation angles, which not only reduces labor costs but also improves the detection accuracy and efficiency of the test object.

[0052] In some embodiments, the third axis is a direction orthogonal to the plane where the substrate 210 is located, the fourth axis may coincide with the yaw axis of the rotating plate 212, the first axis may be orthogonal to the plane where the second turntable 213 is located, and the second axis may be parallel to the plane where the second turntable 213 is located.

[0053] refer to Figure 1 and Figure 4In the definition diagram, the wafer carrier device is located in its initial position, meaning that the surfaces of the first turntable 211, rotating plate 212, second turntable 213, and carrier mechanism 1 are all parallel. At this time, the third axis and the first axis may coincide, but in actual use, the angle of the wafer on the carrier mechanism 1 will be adjusted by adjusting the first drive mechanism, second drive mechanism, third drive mechanism, and fourth drive mechanism to facilitate wafer detection. Therefore, the aforementioned first axis, second axis, third axis, and fourth axis are all different means that in actual use, the first axis, second axis, third axis, and fourth axis are all different.

[0054] In some embodiments, the rotating mechanism 2 further includes a pair of guide rail mounting plates 1041, on which curved guide rails 1043 are provided on one side close to each other, and the rotating plate 212 is located between the pair of guide rail mounting plates 1041. The second driving mechanism 2105 is configured to drive the rotating plate 212 to move along the curved guide rails 1043 to change the angle of the rotating plate 212.

[0055] Specifically, in some examples, the second drive mechanism 2105 converts linear motion into curved movement or oscillation via linear moving parts and linkage mechanisms. The second drive mechanism includes a second driver 1051, a linear guide rail 1052, a first slider 1053, a first connecting block 1054, a connecting rod 1055, a second connecting block 1056, and a second slider 1057. One side of the first slider 1053 is movably connected to the linear guide rail 1052, and the other side is fixedly connected to the first connecting block 1054. One end of the connecting rod 1055 is rotatably connected to the first connecting block 1054, and the other end is rotatably connected to the second connecting block 1056. The second connecting block 1056 is fixedly connected to the second slider 1057, and the second slider 1057 is movably connected to the curved guide rail 1043. The second driver 1051 is configured to drive the first slider 1053 to move linearly along the linear guide rail 1052; the fixed connection may be detachable or non-detachable.

[0056] In some embodiments, the second drive mechanism 2105 is located on one side near either of the pair of guide rail mounting plates 1041. The other guide rail mounting plate 1041 is also provided with a second connecting block 1056 and a second slider 1057. That is, both sides of the rotating plate 212 are provided with a second connecting block 1056 and a second slider 1057, and both sides of the rotating plate 212 are fixedly connected to the second connecting blocks 1056 on both sides. When it is necessary to change the angle of the rotating plate through the operation of the second drive mechanism 2105, the second driver 1051 drives the first slider 1053 to move linearly on the linear guide rail 1052. The first slider 1053 drives one end of the connecting rod 1055 to rotate relative to the first connecting block 1054, and the other end of the connecting rod 1055 to rotate relative to the second connecting block 1056. Simultaneously, the connecting rod 1055 exerts a force on the second slider 1057, causing the second slider 1057 to move along the curved guide rail 1043 to change the angle of the rotating plate 212. When the second driver 1051 moves the second slider 1057 that is relatively close to the side, it also moves the second slider 1057 that is relatively far away from the side. Furthermore, corresponding curved guide rails 1043, second connecting blocks 1056, and second sliders 1057 are provided on both sides of the rotating plate 212, so that the rotating plate 212 can obtain more sufficient support and also helps the rotating plate 212 to rotate more stably.

[0057] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this utility model disclosure can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution disclosed in this utility model can be achieved, and this is not limited herein.

[0058] The specific embodiments described above do not constitute a limitation on the scope of protection of this utility model. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.

Claims

1. A wafer carrier device, characterized in that, include: A rotating mechanism (2) and a carrying mechanism (1), wherein the carrying mechanism (1) is disposed on the rotating mechanism (2), the carrying mechanism (1) is used to carry the wafer, and the rotating mechanism (2) is used to drive the carrying mechanism (1) to rotate in multiple dimensions; The carrier mechanism (1) includes a support ring (10), an adsorption component (11), and a clamping component (12). The adsorption component (11) and the clamping component (12) are both disposed on the support ring (10). The adsorption component (11) has an adsorption end, and the clamping component (12) has a clamping end. When the carrier mechanism (1) carries the wafer, the adsorption end adsorbs the wafer, and the wafer is located between the clamping end and the adsorption end.

2. The wafer carrier apparatus of claim 1, wherein, When the supporting mechanism (1) supports the wafer, there is a gap between the clamping end and the wafer; The clamping end is movable relative to the adsorption end along the thickness direction of the support ring (10). When loading or unloading the wafer, the clamping end moves away from the adsorption end so that the clamping end and the adsorption end have a first distance in the thickness direction of the support ring (10). When the bearing mechanism (1) carries the wafer, the clamping end moves towards the adsorption end so that the clamping end and the adsorption end have a second distance in the thickness direction of the support ring (10), wherein the first distance is greater than the second distance.

3. The wafer carrier apparatus of claim 1, wherein, The supporting mechanism (1) includes multiple adsorption components (11) and multiple clamping components (12). The multiple adsorption components (11) are arranged at intervals in the circumferential direction of the support ring (10), and the multiple clamping components (12) are arranged at intervals in the circumferential direction of the support ring (10).

4. The wafer carrier device according to claim 3, characterized in that, At least one clamping component (12) and an adsorption component (11) are disposed at the same position in the circumferential direction of the support ring (10); At least one clamping component (12) and an adsorption component (11) are offset from each other in the circumferential direction of the support ring (10).

5. The wafer carrier device according to claim 3, characterized in that, The supporting mechanism (1) further includes: The first limiting block (112) has its first end fixed on the inner side wall of the support ring (10), and its second end connected to the adsorption assembly (11). The second limiting block (113) is fixed on the inner side wall of the support ring (10), and the first limiting block (112) and the second limiting block (113) cooperate to achieve wafer positioning.

6. The wafer carrier device according to claim 3, characterized in that, The supporting mechanism (1) includes three adsorption components (11) and four clamping components (12). Two clamping components (12) correspond to two adsorption components (11) respectively, and the corresponding clamping components (12) and adsorption components (11) are located at the same position in the circumferential direction of the support ring (10). The remaining two clamping components (12) are located on both sides of the remaining adsorption component (11).

7. The wafer carrier device according to claim 2, characterized in that, The clamping assembly (12) includes a drive unit (120), a connector (121), and a pressure block (122). The drive unit (120) is disposed on the outer ring sidewall of the support ring (10). One end of the connector (121) is connected to the free end of the drive unit (120), and the other end of the connector (121) is connected to the pressure block (122). The pressure block (122) serves as the clamping end. The drive unit (120) drives the pressure block (122) to move along the thickness direction of the support ring (10) through the connector (121).

8. The wafer carrier device according to claim 7, characterized in that, The clamping assembly (12) further includes a mounting base plate (123), a slider (125), and a slide rail (124). The drive unit (120) and the slide rail (124) are both mounted on the mounting base plate (123). The mounting base plate (123) is detachably connected to the support ring (10). The slider (125) is mounted on the connector (121), and the slider (125) is slidably connected to the slide rail (124). When the drive unit (120) moves the connector (121), the connector (121) causes the slider (125) to slide along the slide rail (124).

9. The wafer carrier device according to claim 8, characterized in that, The connector (121) includes a first extension (101), a second extension (102), and a third extension (103). The first end of the first extension (101) is connected to the free end of the drive unit (120). The slider (125) is disposed at the first end of the second extension (102). The pressure block (122) is disposed at the first end of the third extension (103). The second ends of the first extension (101), the second end of the second extension (102), and the second end of the third extension (103) are connected.

10. The wafer carrier device according to claim 1, characterized in that, The adsorption assembly (11) includes a suction cup holder (110) and a suction cup (111). The suction cup (111) serves as the adsorption end. The suction cup holder (110) is disposed on the support ring (10), and the suction cup (111) is disposed on the suction cup holder (110). The suction cup (111) faces the side of the carrier mechanism (1) that carries the wafer.

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