Wafer chuck structure and wafer spin coating apparatus

By setting a back-blowing ring and a self-cleaning component on the outside of the wafer chuck, the problem of back-side accumulation caused by bonding adhesive back-sputtering during wafer spin coating is solved, thereby improving wafer fixation stability and equipment cleanliness.

CN224460543UActive Publication Date: 2026-07-03WUSHI MICROELECTRONICS (SUZHOU) CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
WUSHI MICROELECTRONICS (SUZHOU) CO LTD
Filing Date
2025-04-29
Publication Date
2026-07-03

AI Technical Summary

Technical Problem

During the spin coating process, due to centrifugal force, some bonding adhesive is thrown off and backsplashed onto the back side of the wafer, resulting in back-side accumulation, which affects subsequent processes and overall performance.

Method used

A back-blowing ring is installed on the outside of the chuck. The diameter of the back-blowing ring is smaller than that of the wafer. The air outlet faces the back of the wafer and blows out gas to form air pressure, which prevents bonding adhesive from accumulating. A self-cleaning component is installed on the chuck to clean the fluid channels.

Benefits of technology

It effectively prevents the accumulation of bonding adhesive on the back of the wafer, improves the stability of wafer adsorption and fixation, and keeps the inside of the equipment clean through self-cleaning components, thereby improving processing quality and efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a kind of wafer chuck structure and wafer spin coating equipment, wafer chuck structure includes: mounting table;Driving assembly, installation is in mounting table;Chuck, with driving assembly connection, for carrying fixed wafer, and chuck can be driven by driving assembly to drive wafer rotation;Back blow ring, surround in chuck outside, and wafer diameter is greater than back blow ring diameter, back blow ring has air inlet and with air inlet's airflow passage and with airflow passage's several gas outlets, several gas outlets are evenly spaced along back blow ring circumferential direction, when wafer is located on chuck, gas outlet blows out gas towards wafer back, to form wind pressure on wafer back, prevent wafer back exists bonding glue, long time causes the accumulation of wafer back bonding glue, or to chuck adsorption hole cause blockage, to improve the stability of wafer adsorption fixation.
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