Vacuum chuck for semiconductor wafer production

Abstract

This utility model relates to the technical field of semiconductor wafer manufacturing, and in particular to a vacuum chuck for semiconductor wafer manufacturing. The chuck includes a chuck, a connecting plate slidably connected to the lower surface of a positioning block, an air groove formed on the inner surface of the connecting plate, a fixing block fixedly connected to the lower surface of the connecting plate, and a fixing mechanism provided on the inner surface of the chuck. This vacuum chuck for semiconductor wafer manufacturing, through its design, uses a breathable porous ceramic instead of the original chuck center portion, and grinds it to form a planar structure. This eliminates the influence of the uneven portion of the support ring on the wafer's front-side pattern, helping to improve the accuracy and integrity of the wafer pattern, thereby improving product quality. Because it avoids wafer pattern defects caused by the support ring, it improves process stability and increases production efficiency in production processes involving special processes.

Images