Lead-free soldering bar cooling forming device

Abstract

This utility model discloses a lead-free solder bar cooling and forming device, belonging to the field of solder bar production technology. The key technical points include a base, with a placement component fixedly connected to the top of the base. A cooling component is installed inside the placement component, and the cooling component includes a liquid storage tank. A storage tank is fixedly connected to the top of the liquid storage tank, and a phase change heat storage device is fixedly connected inside the storage tank. This solves the problem that existing cooling and forming devices are inconvenient for mold replacement. In actual production, due to the lack of a connecting structure, the fixing method between the mold and the cooling device is complex and not secure. When different specifications of lead-free solder bars need to be produced and the mold needs to be changed, operators often need to spend a lot of time disassembling and installing. Frequent disassembly can easily lead to wear at the connection points between the mold and the device, affecting the stability and service life of the equipment and reducing the practicality of the device.

Description

Technical Field

[0001] This utility model relates to the field of solder bar production technology, and in particular to a lead-free solder bar cooling and forming device. Background Technology

[0002] With the development of the electronics industry, the requirements for environmental protection are increasing. Lead-free solder bars are widely used in the field of electronic soldering due to their environmental protection characteristics. Lead-free solder bars are usually produced using high-purity metal raw materials. After melting, they have good fluidity and wettability, bright solder joints, and very little oxide residue. They are suitable for high-quality wave soldering and manual soldering processes. In the production process of lead-free solder bars, cooling and shaping is a key step.

[0003] Most existing cooling devices can only cool one side of the solder bar, resulting in a low contact area between the solder bar and the cooling medium, which leads to low solder bar forming efficiency.

[0004] An existing patent (publication number: CN221538065U) discloses a cooling device for solder bar forming. Liquid is sprayed into the corresponding cooling tank through multiple water spray pipes. The high-speed flow of liquid cools the tin material. The liquid flows through the connecting tank, which performs comprehensive heat exchange on the tin material. This allows multiple sides of the tin material in each forming tank to be cooled, resulting in a better cooling effect.

[0005] Existing patents offer solutions to the above problems, but they are not convenient for mold replacement. In actual production, due to the lack of a connecting structure, the fixing method between the mold and the cooling device is complicated and not secure. When it is necessary to change the mold to produce lead-free solder bars of different specifications, operators often need to spend a lot of time disassembling and installing. At the same time, frequent disassembly can easily lead to wear on the connection between the mold and the device, affecting the stability and service life of the equipment and reducing the practicality of the device.

[0006] To address this, a lead-free solder bar cooling and forming device is proposed. Utility Model Content

[0007] The purpose of this invention is to provide a lead-free solder bar cooling and forming device that solves the problems of existing cooling and forming devices being inconvenient for mold replacement. In actual production, due to the lack of a connecting structure, the fixing method between the mold and the cooling device is complicated and not firm. When it is necessary to change the mold to produce lead-free solder bars of different specifications, the operator often needs to spend a lot of time disassembling and installing. At the same time, frequent disassembly can easily lead to wear on the connection between the mold and the device, affecting the stability and service life of the equipment and reducing the practicality of the device.

[0008] To achieve the above objectives, the present invention provides the following technical solution: a lead-free solder bar cooling and forming device, comprising a base, a placement component fixedly connected to the top of the base, and a cooling component disposed inside the placement component, the cooling component comprising a liquid storage tank, a storage tank fixedly connected to the top of the liquid storage tank, and a phase change heat storage device fixedly connected inside the storage tank.

[0009] The placement component includes a U-shaped storage block. Both sides of the top of the U-shaped storage block are provided with connection holes, and a mold is movably connected inside the connection holes. A square fixing frame is provided at the top of each of the two connection holes, and a sliding groove is provided at the top of each side of the inner wall of the square fixing frame. Positioning plates are fixedly connected to the front and rear sides inside the two sliding grooves, and a buckle block is rotatably connected to the top of the positioning plate. A slider is slidably connected to the surface of each of the two positioning plates, and the two sliders are fixedly connected to both sides of the mold respectively.

[0010] Preferably, the bottom of the phase change thermal storage device is fixedly connected with several heat-conducting plates, and the side of the heat-conducting plates away from the phase change thermal storage device extends into the interior of the liquid storage tank.

[0011] Preferably, an infusion pump is fixedly connected to the bottom left side of the storage tank, and an infusion tube is fixedly connected to the output end of the infusion pump, with the other end of the infusion tube extending into the interior of the U-shaped storage block. A return pipe is fixedly connected to the bottom right side of the storage tank, with the other end of the return pipe extending into the interior of the U-shaped storage block.

[0012] Preferably, the front of the storage box is movably connected to a movable door, and a rubber sealing block is fixedly connected to the side of the movable door closest to the storage box.

[0013] Preferably, the front and rear sides of the two sliders are provided with positioning holes for use with positioning plates, and the surface of the positioning plate is in contact with the inner wall of the positioning hole.

[0014] Preferably, handles are fixedly connected to both the front and rear sides of the top of the mold, and the surface of the handles is provided with anti-slip texture.

[0015] Preferably, a controller is fixedly connected to the front side of the movable door, and the controller is electrically connected to the cooling assembly.

[0016] Preferably, a detector is fixedly connected to the front side of the liquid storage tank, the probe of the detector extends into the interior of the liquid storage tank, and the detector is electrically connected to the controller.

[0017] Compared with the prior art, the beneficial effects of this utility model are:

[0018] 1. By setting up a cooling component, this application can replace the coolant in the U-shaped storage block through the infusion pump and return pipe, and at the same time realize the conversion and storage of heat with the help of heat conduction plate and phase change heat storage device. This can not only continuously reduce the temperature of the coolant in the storage tank, but also reduce energy consumption and improve the practicality of the device.

[0019] 2. This application, by setting up a placement component, can restrict the mold with the help of a positioning plate, ensuring its stable and precise installation. With the help of the snap-fit ​​block, it can lock the slider to form a mechanical lock, complete the quick change of the mold, prevent the mold from shaking or shifting due to the flow of coolant, ensure the cooling effect of lead-free solder bars, and improve the ease of use of the device. Attached Figure Description

[0020] Figure 1 This is an overall structural diagram of the lead-free solder bar cooling and forming device of this utility model;

[0021] Figure 2 This is a front view of the lead-free solder bar cooling and forming device of this utility model;

[0022] Figure 3 This is a schematic diagram showing the connection between the placement component and the cooling component of this utility model;

[0023] Figure 4 This is a schematic diagram of the structure of the placement component of this utility model;

[0024] Figure 5 This is a schematic diagram of the cooling component of this utility model.

[0025] In the diagram, 1. Base; 2. Placement component; 201. U-shaped storage block; 202. Connection hole; 203. Mold; 204. Square fixing frame; 205. Slide groove; 206. Positioning plate; 207. Buckle block; 208. Slider; 3. Cooling component; 301. Liquid storage tank; 302. Storage tank; 303. Phase change heat storage device; 304. Heat conduction plate; 305. Infusion pump; 306. Infusion tube; 307. Return tube; 4. Movable door; 5. Rubber sealing block; 6. Positioning hole; 7. Handle; 8. Controller; 9. Detector. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] Please see Figure 1-5The present invention provides the following technical solution:

[0028] A lead-free solder bar cooling and forming device includes a base 1, a placement component 2 is fixedly connected to the top of the base 1, and a cooling component 3 is disposed inside the placement component 2. The cooling component 3 includes a liquid storage tank 301, a storage tank 302 is fixedly connected to the top of the liquid storage tank 301, and a phase change heat storage device 303 is fixedly connected inside the storage tank 302.

[0029] The placement component 2 includes a U-shaped storage block 201. Both sides of the top of the U-shaped storage block 201 are provided with connection holes 202, and a mold 203 is movably connected inside the connection holes 202. A square fixing frame 204 is provided on the top of each of the two connection holes 202, and a sliding groove 205 is provided on the top of each side of the inner wall of the square fixing frame 204. Positioning plates 206 are fixedly connected to the front and rear sides inside the two sliding grooves 205, and a buckle block 207 is rotatably connected to the top of the positioning plate 206. A slider 208 is slidably connected to the surface of each of the two positioning plates 206, and the two sliders 208 are fixedly connected to both sides of the mold 203 respectively.

[0030] In this embodiment: by rotating the latching block 207, the lock on the slider 208 is released, allowing the slider 208 and the mold 203 to move smoothly under the constraint of the positioning plate 206. This ensures that the mold 203 is accurately embedded into the U-shaped storage block 201 through the connecting hole 202. Then, rotating the latching block 207 again completes the quick locking, enabling rapid replacement of the mold 203 and preventing displacement of the mold 203 due to coolant flow. This ensures the normal operation of the cooling process, improves the convenience of using the placement component 2, and, under the action of the U-shaped storage block 201, ensures that the mold 203 is completely immersed in the coolant, significantly increasing heat exchange. The change in area improves the forming effect of the solder bar. Then, under the action of the return pipe 307, the U-shaped storage block 201 is connected to the liquid storage tank 301, so that the coolant in the U-shaped storage block 201 can flow into the liquid storage tank 301 in real time. With the help of the heat conduction plate 304, the heat in the coolant can be transferred to the phase change heat storage device 303 in real time for storage, thus completing the continuous reduction of the coolant temperature. At the same time, under the action of the liquid pump 305, the coolant in the liquid storage tank 301 flows smoothly into the U-shaped storage block 201, realizing the circulation of coolant and ensuring the continuous and stable cooling of the mold 203, thus improving the ease of use of the cooling component 3.

[0031] Specifically, such as Figure 5 As shown, a number of heat-conducting plates 304 are fixedly connected to the bottom of the phase change heat storage device 303, and the side of the heat-conducting plates 304 away from the phase change heat storage device 303 extends into the interior of the liquid storage tank 301.

[0032] Specifically, such as Figure 5As shown, an infusion pump 305 is fixedly connected to the bottom left side of the storage tank 301, and an infusion tube 306 is fixedly connected to the output end of the infusion pump 305. The other end of the infusion tube 306 extends into the interior of the U-shaped storage block 201. A return pipe 307 is fixedly connected to the bottom right side of the storage tank 301, and the other end of the return pipe 307 extends into the interior of the U-shaped storage block 201.

[0033] Specifically, such as Figure 3 , Figure 5 As shown, a movable door 4 is movably connected to the front side of the storage box 302, and a rubber sealing block 5 is fixedly connected to the side of the movable door 4 near the storage box 302.

[0034] In this embodiment: the movable door 4 facilitates the opening and closing of the storage tank 302, making it convenient to inspect and replace the phase change heat storage device 303. When the movable door 4 is closed, the rubber sealing block 5 is deformed under pressure to fill the gap between the movable door 4 and the storage tank 302, forming an airtight space, which can reduce heat leakage, ensure the stable operation of the phase change heat storage device 303, control the coolant temperature fluctuation within a suitable range, and improve the ease of use of the cooling component 3.

[0035] Specifically, such as Figure 4 As shown, both the front and rear sides of the two sliders 208 are provided with positioning holes 6 for use with the positioning plate 206, and the surface of the positioning plate 206 is in contact with the inner wall of the positioning hole 6.

[0036] Specifically, such as Figure 4 As shown, handles 7 are fixedly connected to the front and rear sides of the top of the mold 203, and the surface of the handles 7 is provided with anti-slip texture.

[0037] In this embodiment: the handle 7 provides a support structure for the operator, enabling the device to be moved smoothly and facilitating the replacement of the mold 203. At the same time, the positioning plate 206 and the positioning hole 6 work together to form a guiding structure, allowing the slider 208 to drive the mold 203 to move smoothly under the constraint of the positioning plate 206. The locking block 207 completes the mechanical locking, preventing the mold 203 from shaking or shifting due to the flow of coolant, ensuring the cooling effect of the lead-free solder bar, and improving the convenience of using the placement component 2.

[0038] Specifically, such as Figure 1 , Figure 2 , Figure 3 , Figure 5 As shown, a controller 8 is fixedly connected to the front side of the movable door 4, and the controller 8 is electrically connected to the cooling assembly 3.

[0039] Specifically, such as Figure 1 , Figure 2 , Figure 3 , Figure 5 As shown, a detector 9 is fixedly connected to the front side of the liquid storage tank 301. The probe of the detector 9 extends into the interior of the liquid storage tank 301, and the detector 9 is electrically connected to the controller 8.

[0040] In this embodiment: the detector 9 can detect the temperature of the coolant in the storage tank 301 in real time and transmit the data to the controller 8. Under the control of the controller 8, the cooling component 3 is precisely adjusted according to the data. When the coolant temperature rises, the flow rate of the coolant can be adjusted by the infusion pump 305 to ensure that the heat conduction plate 304 can quickly transfer heat to the phase change heat storage device 303. At the same time, the phase change material can quickly absorb a large amount of latent heat to undergo phase change, thereby controlling the temperature fluctuation of the coolant in the storage tank 301 within a suitable range, ensuring the cooling effect of the lead-free solder bar, and improving the ease of use of the device.

[0041] Working Principle: During the cooling and shaping operation of lead-free solder bars, firstly, manually rotate the locking block 207 to release the lock on the slider 208, allowing the slider 208 and mold 203 to move smoothly under the constraint of the positioning plate 206. This ensures that the mold 203 is accurately embedded into the U-shaped storage block 201 through the connecting hole 202. Then, rotate the locking block 207 again to complete the quick locking, enabling rapid replacement of the mold 203. This locking structure can resist the impact force generated by the flow of coolant, ensuring a stable cooling process. Simultaneously, the U-shaped storage block 201 adopts a fully submerged design, ensuring that the mold 203 is completely immersed in the coolant, significantly increasing the heat exchange area and accelerating heat exchange efficiency. After the mold 203 is installed, the solder material is poured into the mold 203. Simultaneously, detector 9 is activated to monitor the temperature of the coolant in the storage tank 301 in real time and transmit the data to controller 8. Based on the data, the operator sets the operating parameters of the cooling component 3 through controller 8. The return pipe 307 and the delivery pump 305 form a closed-loop cooling system, allowing the coolant in the U-shaped storage block 201 to flow into the storage tank 301 in real time. With the help of the heat conduction plate 304, the heat in the coolant can be transferred to the phase change heat storage device 303 in real time for storage, thus completing the continuous reduction of the coolant temperature. At the same time, the delivery pump 305 is activated to smoothly flow the coolant in the storage tank 301 into the U-shaped storage block 201, realizing the recycling of the coolant and ensuring that the mold 203 can be continuously cooled, thereby improving the forming quality and production efficiency of lead-free solder bars.

[0042] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A lead-free solder bar cooling and forming device, comprising a base (1), characterized in that: The top of the base (1) is fixedly connected to a placement component (2), and a cooling component (3) is provided inside the placement component (2). The cooling component (3) includes a liquid storage tank (301), the top of the liquid storage tank (301) is fixedly connected to a storage tank (302), and a phase change heat storage device (303) is fixedly connected inside the storage tank (302). The placement component (2) includes a U-shaped storage block (201). Both sides of the top of the U-shaped storage block (201) are provided with connection holes (202), and a mold (203) is movably connected inside the connection holes (202). A square fixing frame (204) is provided on the top of each of the two connection holes (202), and a sliding groove (205) is provided on the top of both sides of the inner wall of the square fixing frame (204). A positioning plate (206) is fixedly connected to the front and rear sides inside the two sliding grooves (205), and a buckle block (207) is rotatably connected to the top of the positioning plate (206). A slider (208) is slidably connected to the surface of each of the two positioning plates (206), and the two sliders (208) are fixedly connected to both sides of the mold (203).

2. The lead-free solder bar cooling and forming device according to claim 1, characterized in that: The bottom of the phase change heat storage device (303) is fixedly connected with several heat conduction plates (304), and the side of the heat conduction plates (304) away from the phase change heat storage device (303) extends into the interior of the liquid storage tank (301).

3. The lead-free solder bar cooling and forming device according to claim 1, characterized in that: An infusion pump (305) is fixedly connected to the bottom left side of the liquid storage tank (301). An infusion tube (306) is fixedly connected to the output end of the infusion pump (305), and the other end of the infusion tube (306) extends into the interior of the U-shaped storage block (201). A return pipe (307) is fixedly connected to the bottom right side of the liquid storage tank (301), and the other end of the return pipe (307) extends into the interior of the U-shaped storage block (201).

4. The lead-free solder bar cooling and forming device according to claim 1, characterized in that: The front side of the storage box (302) is movably connected to a movable door (4), and a rubber sealing block (5) is fixedly connected to the side of the movable door (4) near the storage box (302).

5. The lead-free solder bar cooling and forming device according to claim 1, characterized in that: The front and rear sides of the two sliders (208) are provided with positioning holes (6) for use with positioning plates (206), and the surface of the positioning plate (206) is in contact with the inner wall of the positioning hole (6).

6. The lead-free solder bar cooling and forming device according to claim 1, characterized in that: The mold (203) has handles (7) fixedly connected to the front and rear sides of the top, and the surface of the handles (7) is provided with anti-slip texture.

7. The lead-free solder bar cooling and forming device according to claim 4, characterized in that: A controller (8) is fixedly connected to the front side of the movable door (4), and the controller (8) is electrically connected to the cooling assembly (3).

8. The lead-free solder bar cooling and forming device according to claim 7, characterized in that: A detector (9) is fixedly connected to the front side of the liquid storage tank (301). The probe of the detector (9) extends into the interior of the liquid storage tank (301), and the detector (9) is electrically connected to the controller (8).

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