A semiconductor brittle material double-sided punching device

Abstract

The utility model relates to the technical field of semiconductor punching technology discloses a kind of semiconductor brittle material double-sided punching equipment, including base, the top rear side of base is fixedly connected with bed body, the top of base is provided with punching mechanism, the punching mechanism is used to carry out double-sided punching to workpiece, the punching mechanism includes Y-axis moving plate, the bottom of Y-axis moving plate is arranged in the top of base, the top front and rear side of Y-axis moving plate is fixedly connected with ZW transverse guide rail, the top left and right ends of two ZW transverse guide rails are slidably connected with support, the adjacent side top of two supports is fixedly connected with punching head. In the utility model, the position of punching head is adjusted by ZW transverse guide rail and support, the product is moved up and down by moving seat, the both sides support slides to make both sides punching head synchronous to the product and carry out punching, so that the long diameter of drill bit is effectively reduced, the vibration when processing is reduced, and the yield of product is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor drilling technology, and in particular to a double-sided drilling device for brittle semiconductor materials. Background Technology

[0002] Semiconductor brittle materials are a class of inorganic non-metallic materials that possess semiconductor properties but exhibit brittle mechanical properties. Typical examples include single-crystal silicon, sapphire, and silicon carbide. These materials are core foundational materials for the microelectronics, optoelectronics, and new energy industries, and are used in integrated circuit chips, power devices, sensors, and photovoltaic cells. Their unique physicochemical properties, such as excellent controllable conductivity, high temperature resistance, and chemical stability, provide important support for the miniaturization, high integration, and high efficiency of devices, driving the rapid iteration and upgrading of information technology, new energy technology, and other fields.

[0003] Semiconductor brittle material drilling equipment is a specialized device for processing holes in semiconductor brittle materials. It can process holes of different sizes and shapes on the surface or inside of the material according to processing needs, so as to meet the requirements of semiconductor devices in terms of electrical connection, heat dissipation and structural installation. It is one of the key equipment for achieving precision material processing in semiconductor manufacturing process.

[0004] Existing drilling equipment for brittle semiconductor materials uses laser drilling. However, laser energy distribution is uneven due to reflection and refraction, resulting in rough hole walls and inconsistent hole diameters. The focusing precision of the laser beam is extremely high, and even a slight deviation in the optical path can cause hole distortion. At the same time, the molten material and vaporized residue generated during processing are difficult to remove, easily clogging the micropores and affecting the permeability of the holes. To solve this problem, existing technologies use mechanical drilling. However, in actual use, mechanical drilling is single-sided drilling. For micro-hole processing, the processing time is long. When the length-to-diameter ratio of the drill bit is large, the rigidity is poor during processing, making it prone to vibration and drill bit breakage. The energy generated by the breakage will cause damage around the hole, leading to product scrap. Summary of the Invention

[0005] To overcome the above shortcomings, this utility model provides a double-sided drilling device for brittle semiconductor materials, aiming to improve the existing technology where the processing time is long, the drill bit has poor rigidity during processing when the length-to-diameter ratio is large, it is prone to vibration, the drill bit is prone to breakage, and the energy generated by the breakage will cause damage to the periphery of the hole, resulting in product scrap.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a double-sided drilling device for semiconductor brittle materials, including a base, a bed fixedly connected to the top rear side of the base, and a drilling mechanism provided on the top of the base, the drilling mechanism being used to perform double-sided drilling on the workpiece to be processed;

[0007] The drilling mechanism includes a Y-axis moving plate, the bottom of which is located on the top of the base. ZW transverse guide rails are fixedly connected to the front and rear sides of the top of the Y-axis moving plate. Brackets are slidably connected to the top left and right ends of the two ZW transverse guide rails. Drilling heads are fixedly connected to the top of adjacent sides of the two brackets. A moving seat is slidably connected to the front of the bed. A mounting plate is provided on the front of the moving seat. A clamping plate is fixedly connected to the front of the mounting plate. A clamping groove is provided on the right side of the clamping plate. A product is slidably connected to the inner side of the clamping groove. An installation component is provided on the front of the mounting plate. Moving components are provided on the top left and right sides of the base.

[0008] As a further description of the above technical solution:

[0009] The mounting assembly includes multiple mounting bolts, the rear sides of which are rotatably connected to the front side of the mounting plate, and the front side of the movable base has multiple mounting holes.

[0010] As a further description of the above technical solution:

[0011] The moving component includes two Y-axis guide rails, the bottoms of which are fixedly connected to the top left and right sides of the base, respectively. The tops of both Y-axis guide rails are slidably connected to the bottom of the Y-axis moving plate. X-axis guide rails are fixedly connected to the left and right ends of the front side of the bed. The front sides of both X-axis guide rails are slidably connected to the rear side of the moving seat. A grating ruler is fixedly connected to one end of each of the two ZW transverse guide rails, the Y-axis guide rails, and the X-axis guide rails.

[0012] As a further description of the above technical solution:

[0013] Multiple reinforcing plates are fixedly connected to the left and right rear sides of the clamping plate, and the rear sides of the multiple reinforcing plates are fixedly connected to the front side of the mounting plate.

[0014] As a further description of the above technical solution:

[0015] The rear ends of the plurality of mounting bolts all penetrate the front side of the mounting plate and are connected to the internal threads of the corresponding mounting holes, and the size of the mounting bolts matches that of the mounting holes.

[0016] This utility model has the following beneficial effects:

[0017] In this invention, the Y-axis moving plate moves along the Y-axis guide rail, driving the ZW transverse guide rail and bracket to adjust the position of the drilling head. The moving seat slides along the X-axis guide rail to move the product. The brackets on both sides slide on the ZW transverse guide rail so that the drilling heads on both sides can drill holes in the product simultaneously. The grating ruler monitors and provides feedback to realize position adjustment and drilling operation, which can adapt to different products. The double-sided drilling effectively reduces the length and diameter of the drill bit, reduces vibration during processing, makes the drill bit less prone to breakage, and improves the product yield. Attached Figure Description

[0018] Figure 1 This is a perspective view of a device for double-sided drilling of brittle semiconductor materials according to the present invention;

[0019] Figure 2 This is a front view of a double-sided drilling device for brittle semiconductor materials proposed in this utility model;

[0020] Figure 3 This is a schematic diagram of the support structure for a double-sided drilling device for semiconductor brittle materials proposed in this utility model;

[0021] Figure 4 This is an exploded view of the structure of a double-sided drilling device for brittle semiconductor materials proposed in this utility model.

[0022] Legend:

[0023] 1. Base; 2. Drilling mechanism; 201. Y-axis moving plate; 202. ZW transverse guide rail; 203. Bracket; 204. Drilling head; 205. Moving seat; 206. Mounting plate; 207. Clamping plate; 208. Clamping slot; 209. Product; 210. Mounting assembly; 2101. Mounting bolt; 2102. Mounting hole; 211. Moving assembly; 2111. Y-axis guide rail; 2112. X-axis guide rail; 2113. Grating ruler; 3. Bed; 4. Reinforcing plate. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] Reference Figure 2 , Figure 3 and Figure 4The present invention provides an embodiment of a device for double-sided drilling of brittle semiconductor materials, comprising a base 1, which provides a stable support foundation for the entire device. A bed 3 is fixedly connected to the top rear side of the base 1, which provides an installation and sliding carrier for components such as the movable seat 205. A drilling mechanism 2 is provided on the top of the base 1. The drilling mechanism 2 is the core device for realizing double-sided drilling of the workpiece to be processed. The drilling mechanism 2 is used to perform double-sided drilling on the workpiece to be processed, and can simultaneously perform drilling operations on both sides of the brittle material.

[0026] The drilling mechanism 2 includes a Y-axis moving plate 201, which supports the ZW transverse guide rail 202 and enables longitudinal position adjustment. The bottom of the Y-axis moving plate 201 is located on the top of the base 1, allowing it to slide stably against the base 1. ZW transverse guide rails 202 are fixedly connected to the front and rear sides of the top of the Y-axis moving plate 201, providing a transverse sliding guide path for the bracket 203. Brackets 203 are slidably connected to the left and right ends of the top of the two ZW transverse guide rails 202, allowing the drilling head 204 to adjust its left and right position along the ZW transverse guide rails 202. Drilling heads 204 are fixedly connected to the top of adjacent sides of the two brackets 203, enabling drilling of the product 209. A movable seat 205 is slidably connected to the front of the bed 3, allowing the movable seat 205 to drive... Components such as mounting plate 206 slide longitudinally along the bed 3. Mounting plate 206 is provided on the front side of movable seat 205. Mounting plate 206 provides a fixed mounting base for clamping plate 207. Clamping plate 207 is fixedly connected to the front side of mounting plate 206. Clamping plate 207 is used to support and position product 209. Clamping groove 208 is provided on the right side of clamping plate 207. Clamping groove 208 can initially limit the product 209 to prevent displacement. Product 209 is slidably connected to the inner side of clamping groove 208. Product 209 can be placed stably in clamping groove 208 as a processing object. Mounting component 210 is provided on the front side of mounting plate 206. Mounting component 210 is used to realize the detachable connection between mounting plate 206 and movable seat 205. Moving component 211 is provided on the top left and right sides of base 1. Moving component 211 provides precise moving guidance for each component.

[0027] Mounting assembly 210 includes multiple mounting bolts 2101, which can fasten mounting plate 206 to movable base 205. The rear sides of multiple mounting bolts 2101 are rotatably connected to the front side of mounting plate 206. The tightness of the connection between mounting plate 206 and movable base 205 can be adjusted by rotation. Multiple mounting holes 2102 are provided on the front side of movable base 205, which provide mating installation positions for mounting bolts 2101.

[0028] The moving assembly 211 includes two Y-axis guide rails 2111, which provide longitudinal sliding tracks for the Y-axis moving plate 201. The bottoms of the two Y-axis guide rails 2111 are respectively fixedly connected to the top left and right sides of the base 1, ensuring stable movement of the Y-axis moving plate 201 along the Y-axis direction. The tops of the two Y-axis guide rails 2111 are slidably connected to the bottom of the Y-axis moving plate 201, allowing the Y-axis moving plate 201 to adjust its front and rear positions along the Y-axis guide rails 2111. The front left and right ends of the bed 3 are fixed. The X-axis guide rail 2112 is connected to provide longitudinal sliding support for the movable seat 205. The front sides of the two X-axis guide rails 2112 are slidably connected to the rear side of the movable seat 205, so that the movable seat 205 can be adjusted up and down along the X-axis guide rail 2112. One end of the two ZW transverse guide rails 202, the Y-axis guide rail 2111 and the X-axis guide rail 2112 are all fixedly connected to a grating ruler 2113. The grating ruler 2113 can monitor the displacement data of the components on each guide rail in real time to ensure machining accuracy.

[0029] Specifically, the base 1 serves as the equipment foundation, and the bed 3, fixedly connected to its top rear side, provides the installation and sliding reference for the movable seat 205 component. The drilling mechanism 2 is the core for achieving double-sided drilling. The Y-axis moving plate 201 carries components such as the ZW transverse guide rails 202. The two ZW transverse guide rails 202 provide a transverse sliding path for the bracket 203, allowing the bracket 203 to move the top-fixed drilling head 204 left and right, thereby adjusting the drilling position to meet the drilling requirements of different products 209. The two drilling heads 204 are located on the front and rear sides of the product 209 respectively, and can work together to complete synchronous double-sided drilling. The movable seat 205, slidably connected to the front side of the bed 3, can move the mounting plate 206 and related components up and down. The clamping plate 207 fixed to the front side of the mounting plate 206 provides initial positioning and sliding support for the product 209 through the clamping groove 208, preventing large displacement of the product 209 during drilling. Multiple mounting bolts 2101 in the mounting assembly 210 are connected to multiple mounting bolts on the front side of the movable seat 205. Hole 2102 mates to achieve a detachable and fixed connection between the mounting plate 206 and the movable seat 205, facilitating the replacement or adjustment of the mounting plate 206 and clamping structure as needed. Two Y-axis guide rails 2111 in the moving assembly 211 are fixed to the top left and right sides of the base 1, providing front-to-back sliding guidance for the Y-axis moving plate 201, enabling the Y-axis moving plate 201 to drive the drilling-related components to move back and forth. X-axis guide rails 2112 fixed to the left and right ends of the front side of the bed 3 provide a longitudinal sliding path for the movable seat 205, enabling it to carry... The product 209 moves up and down, thereby adjusting the relative longitudinal position of the product 209 and the drilling head 204. In addition, the grating ruler 2113, which is fixedly connected to one end of the two ZW transverse guide rails 202, the Y-axis guide rail 2111 and the X-axis guide rail 2112, can monitor the displacement data of each component in real time, ensuring the movement accuracy of the bracket 203, the Y-axis moving plate 201 and the moving seat 205, thereby ensuring the positional accuracy and consistency of the double-sided drilling of the product 209 and effectively improving the processing quality of brittle semiconductor materials.

[0030] Reference Figure 1 and Figure 4 Multiple reinforcing plates 4 are fixedly connected to the left and right rear sides of the clamping plate 207. The reinforcing plates 4 can enhance the stability of the connection between the clamping plate 207 and the mounting plate 206. The rear sides of the multiple reinforcing plates 4 are fixedly connected to the front side of the mounting plate 206, so that the clamping plate 207 will not deform under force. The rear ends of the multiple mounting bolts 2101 pass through the front side of the mounting plate 206 and are connected to the internal threads of the corresponding mounting holes 2102, so as to achieve tight fixation between the mounting plate 206 and the moving seat 205. The size of the mounting bolts 2101 and the mounting holes 2102 are matched to ensure the accuracy and stability of the connection.

[0031] Specifically, the reinforcing plate 4 is fixed between the left and right rear sides of the clamping plate 207 and the front side of the mounting plate 206, which can enhance the stability of the connection between the clamping plate 207 and the mounting plate 206, prevent the clamping plate 207 from deforming or shaking due to force when drilling, and ensure stable clamping of the product 209. The rear end of the mounting bolt 2101 passes through the mounting plate 206 and is threadedly connected to the mounting hole 2102 and is sized to match, which can achieve tight fixation between the mounting plate 206 and the moving seat 205, prevent relative displacement between the two, and at the same time, the threaded connection is easy to disassemble, which is conducive to the replacement and adjustment of the mounting plate 206 and related components.

[0032] Working principle: First, the product 209 to be processed is placed in the clamping groove 208 of the clamping plate 207. The size of the clamping groove 208 is adapted to the product 209, fixing the product 209. The clamping plate 207 is fixed to the front side of the mounting plate 206. Multiple mounting bolts 2101 pass through the mounting plate 206 and are screwed into the mounting holes 2102 on the front side of the movable seat 205. The mounting plate 206 and the movable seat 205 are connected by the bolt tightening force. Therefore, different clamping plates 207 can be replaced according to different products 209. When it is necessary to adjust the drilling position, the Y-axis guide rails 2111 on the left and right sides of the top of the base 1 support the Y-axis movable plate 201. The Y-axis movable plate 201 can slide back and forth along the Y-axis guide rails 2111, driving the ZW transverse guide rails 202 and the bracket 203 at its top to move back and forth synchronously to adjust the position of the drilling head 204. The X-axis guide rail 2112 on the front side of the bed 3 supports the movable seat 205. The movable seat 205 can slide up and down along the X-axis guide rail 2112, driving the clamped product 209 to move, realizing the relative position adjustment between the product 209 and the drilling head 204. When drilling is required, the two supports 203 move towards the middle product 209 on the ZW transverse guide rail 202, so that the drilling head 204 drills the left and right sides of the product 209 at the same time. Because semiconductor materials are brittle, synchronous drilling can reduce the breakage of the product 209 caused by excessive force on one side, and improve the processing stability. The grating ruler 2113 can monitor the displacement data of the support 203, the Y-axis moving plate 201 and the movable seat 205 in real time, and feed the information back to the control system to ensure that the motion error of each component is controlled within the allowable range and to ensure the positional accuracy of double-sided drilling.

[0033] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A device for drilling holes on both sides of a semiconductor brittle material, comprising a base (1), characterized in that: The bed (3) is fixedly connected to the top rear side of the base (1), and a drilling mechanism (2) is provided on the top of the base (1). The drilling mechanism (2) is used to drill holes on both sides of the workpiece to be processed. The drilling mechanism (2) includes a Y-axis moving plate (201), the bottom of which is located on the top of the base (1). ZW transverse guide rails (202) are fixedly connected to the front and rear sides of the top of the Y-axis moving plate (201). Brackets (203) are slidably connected to the left and right ends of the top of the two ZW transverse guide rails (202). Drilling heads (204) are fixedly connected to the top of the adjacent side of the two brackets (203). The front side of the bed (3) is slidably connected to... A movable base (205) is provided, and an installation plate (206) is provided on the front side of the movable base (205). A clamping plate (207) is fixedly connected to the front side of the installation plate (206). A clamping groove (208) is provided on the right side of the clamping plate (207). A product (209) is slidably connected to the inner side of the clamping groove (208). An installation component (210) is provided on the front side of the installation plate (206). A movable component (211) is provided on the top left and right sides of the base (1).

2. The double-sided drilling equipment for brittle semiconductor materials according to claim 1, characterized in that: The mounting assembly (210) includes a plurality of mounting bolts (2101), the rear sides of which are rotatably connected to the front side of the mounting plate (206), and the front side of the movable seat (205) is provided with a plurality of mounting holes (2102).

3. The double-sided drilling equipment for brittle semiconductor materials according to claim 1, characterized in that: The moving component (211) includes two Y-axis guide rails (2111). The bottoms of the two Y-axis guide rails (2111) are fixedly connected to the top left and right sides of the base (1), respectively. The tops of the two Y-axis guide rails (2111) are slidably connected to the bottom of the Y-axis moving plate (201). The front left and right ends of the bed (3) are fixedly connected to X-axis guide rails (2112). The front sides of the two X-axis guide rails (2112) are slidably connected to the rear side of the moving seat (205). One end of the two ZW transverse guide rails (202), the Y-axis guide rails (2111), and the X-axis guide rails (2112) are fixedly connected to a grating ruler (2113).

4. The double-sided drilling equipment for brittle semiconductor materials according to claim 1, characterized in that: Multiple reinforcing plates (4) are fixedly connected to the left and right rear sides of the clamping plate (207), and the rear sides of the multiple reinforcing plates (4) are fixedly connected to the front side of the mounting plate (206).

5. The double-sided drilling equipment for brittle semiconductor materials according to claim 2, characterized in that: The rear ends of the plurality of mounting bolts (2101) all penetrate the front side of the mounting plate (206) and are connected to the internal threads of the corresponding mounting holes (2102), wherein the size of the mounting bolts (2101) matches that of the mounting holes (2102).

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