Photovoltaic silicon wafer cutting positioning device

Abstract

The utility model relates to photovoltaic silicon wafer processing equipment technical field especially relates to a kind of photovoltaic silicon wafer cutting positioning device, the utility model discloses photovoltaic silicon wafer cutting positioning device installs two mirror image settings clamping mechanism on the opposite sides of pedestal, two clamping mechanisms can be synchronously close or far away to adapt to different size models silicon wafer, expand the scope of application of this device, improve practicality;Clamping mechanism includes mounting plate, fixed clamp, movable clamp, first screw rod and knob, when clamping silicon wafer, silicon wafer two sides are placed on two fixed clamps respectively, then through knob rotation first screw rod to drive movable clamp to descend and cooperate with fixed clamp, realize the stable clamping to silicon wafer, effectively avoid the problem that silicon wafer deviates in cutting process, improve the cutting quality of silicon wafer.

Description

Technical Field

[0001] This utility model relates to the field of photovoltaic silicon wafer processing equipment technology, and in particular to a photovoltaic silicon wafer cutting and positioning device. Background Technology

[0002] In the photovoltaic industry, silicon wafer cutting is one of the key processes in the production of solar cells. Traditional silicon wafer cutting equipment often suffers from unstable fixing during the cutting process, leading to slight displacement of the silicon wafer and affecting the cutting quality. Therefore, there is an urgent need for a photovoltaic silicon wafer cutting and positioning device that can improve cutting accuracy, facilitate waste liquid treatment, and has a stable structure. Utility Model Content

[0003] To solve the above-mentioned technical problems, this utility model provides a photovoltaic silicon wafer cutting and positioning device, comprising:

[0004] A base is provided with a waste liquid collection hole and a collection box. Waste liquid on the upper surface of the base can flow into the collection box through the waste liquid collection hole.

[0005] Two clamping mechanisms are mirror-arranged on opposite sides of the base. Both clamping mechanisms are connected to a first driving mechanism, which can drive the two clamping mechanisms to move closer or further apart synchronously along the horizontal longitudinal direction.

[0006] A cutting mechanism is disposed on the base adjacent to the clamping mechanism. The cutting mechanism is connected to a second driving mechanism, which can drive the cutting mechanism to move linearly along the horizontal longitudinal direction.

[0007] The clamping mechanism includes a mounting plate, a fixed clamp, a movable clamp, a first lead screw, and a first guide rod. The fixed clamp is installed on the side of the mounting plate facing the base. A first through groove is provided on the mounting plate. The movable clamp, the first guide rod, and the first lead screw are all installed in the first through groove. The first lead screw is driven to the movable clamp. Rotating the first lead screw can drive the movable clamp to move vertically up and down. The upper end of the first lead screw protrudes from the mounting plate and is connected to a knob.

[0008] In some possible embodiments, flexible pads are provided on the opposite sides of both the fixed clip and the movable clip.

[0009] In some possible embodiments, the cutting mechanism includes a vertical plate, a horizontal plate, a laser cutter, and a third driving mechanism. The vertical plate is arranged vertically, and the horizontal plate extends horizontally from the top of the vertical plate to above the base. The laser cutter and the third driving mechanism are both disposed on the horizontal plate, and the third driving mechanism is capable of driving the laser cutter to move linearly on the horizontal plate.

[0010] In some possible embodiments, the first driving mechanism includes two movable seats, two first fixed plates, a bidirectional lead screw, and a slide bar. The two first fixed plates are respectively installed at the edges of opposite sides of the base. The bidirectional lead screw and the slide bar are both arranged horizontally between the two first fixed plates and both pass through the two movable seats. The clamping mechanism is installed on the movable seats. The movable seats are drivenly connected to the bidirectional lead screw and slidably connected to the slide bar. One end of the bidirectional lead screw passes through the first fixed plate and is connected to a first motor.

[0011] In some possible embodiments, the second drive mechanism includes two second fixed plates mounted on the side of the base and spaced apart. A second lead screw and a second guide rod are passed through the two second fixed plates along the horizontal longitudinal direction. Both the second lead screw and the second guide rod pass through the vertical plate. One end of the second lead screw passes out from the second fixed plate and is connected to a second motor. The second lead screw is drivenly connected to the vertical plate.

[0012] In some possible embodiments, the horizontal plate has a second through slot along the horizontal direction, the third drive mechanism includes a third lead screw, a slide block and a third motor, the third lead screw and the slide block are both disposed in the second through slot, and the slide block is drivenly connected to the third lead screw, the third motor is mounted on the horizontal plate and can drive the third lead screw to rotate, and the laser cutter is mounted vertically downward at the bottom of the slide block.

[0013] In some possible embodiments, sliding grooves are provided on both sides of the second through groove, and sliders adapted to the sliding grooves are provided on both sides of the slide block.

[0014] In some possible embodiments, a first pulley is provided at one end of the third lead screw near the third motor, a second pulley is connected to the output end of the third motor, and a transmission belt is sleeved between the first pulley and the second pulley.

[0015] In some possible embodiments, a slot is provided on the side of the base opposite to the cutting mechanism, and the collection box can be movably inserted into the slot.

[0016] In some possible embodiments, the upper end face of the base is formed with a flow guiding slope, the lowest point of which extends to the waste liquid collection hole.

[0017] Compared with the prior art, the beneficial effects of this utility model are as follows: The photovoltaic silicon wafer cutting and positioning device of this utility model has two mirror-shaped clamping mechanisms installed on opposite sides of the base. The two clamping mechanisms can move closer or further away synchronously to adapt to silicon wafers of different sizes and models, thus expanding the applicability of the device and improving its practicality. The clamping mechanism includes a mounting plate, a fixed clamp, a movable clamp, a first lead screw, and a knob. When clamping the silicon wafer, the two sides of the silicon wafer are first placed on the two fixed clamps respectively. Then, the first lead screw is rotated by the knob to drive the movable clamp to descend and cooperate with the fixed clamp, thereby achieving stable clamping of the silicon wafer and effectively avoiding the problem of silicon wafer displacement during the cutting process, thus improving the cutting quality of the silicon wafer. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 Three-dimensional structure of the photovoltaic silicon wafer cutting and positioning device provided in the embodiments of this utility model Figure 1 ;

[0020] Figure 2 Three-dimensional structure of the photovoltaic silicon wafer cutting and positioning device provided in the embodiments of this utility model Figure 2 ;

[0021] Figure 3 This is a front view of the structure of the photovoltaic silicon wafer cutting and positioning device provided in an embodiment of the present utility model;

[0022] Figure 4 This is a cross-sectional schematic diagram of the photovoltaic silicon wafer cutting and positioning device provided in an embodiment of the present utility model;

[0023] Figure 5 A three-dimensional structural diagram of the clamping mechanism portion provided in an embodiment of this utility model;

[0024] Figure 6 A three-dimensional structural diagram of the cutting mechanism provided in an embodiment of this utility model.

[0025] Reference numerals: Base 1, Guide slope 2, Slot 3, Collection box 4, Vertical plate 6, Horizontal plate 7, Mounting plate 10, Fixing clamp 11, First through groove 12, First lead screw 13, First guide rod 14, Knob 15, Movable clamp 16, Flexible pad 17, Laser cutter 18, Waste liquid collection hole 19, First fixing plate 901, Bidirectional lead screw 902, First motor 903, Slide rod 904, Moving seat 905, Second fixing plate 501, Second lead screw 502, Second motor 503, Second guide rod 504, Second through groove 801, Third lead screw 802, Third motor 803, First pulley 8031, Second pulley 8032, Transmission belt 8033, Slide seat 804, Slide groove 805, Slider 806. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model. Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of this disclosure, unless otherwise stated, "a plurality of" means two or more.

[0027] Reference Figures 1 to 4 The photovoltaic silicon wafer cutting and positioning device shown includes a base 1, two clamping mechanisms, a cutting mechanism, a first driving mechanism, and a second driving mechanism.

[0028] Reference Figure 1 and Figure 4 As shown, the upper surface of the base 1 has a guide slope 2, and a waste liquid collection hole 19 is opened in the middle of the slope. The lowest point of the guide slope 2 extends to the waste liquid collection hole 19. A slot 3 is provided on one side of the base 1, and a collection box 4 is movably inserted into it. The collection box 4 is located below the waste liquid collection hole 19. This design allows the waste liquid generated during the cutting process to flow smoothly into the waste liquid collection hole 19 through the guide slope 2 and finally be collected in the collection box 4, preventing the waste liquid from accumulating on the base 1, keeping the working environment clean, and protecting the equipment from corrosion by the waste liquid. It should be noted that when laser cutting silicon wafers, coolant needs to be sprayed at the cutting point. The coolant not only cools the cutting point on the silicon wafer to prevent local overheating, but also cleans the silicon wafer, washing away the cutting debris, which finally flows into the collection box 4 with the coolant.

[0029] Reference Figure 1 and Figure 5 As shown, the clamping mechanism includes a mounting plate 10, a fixed clamp 11, a movable clamp 16, a first guide rod 14, and a first lead screw 13. The fixed clamp 11 is located on the side of the mounting plate 10 facing the base 1. A first through groove 12 is formed on the mounting plate 10. The movable clamp 16, the first guide rod 14, and the first lead screw 13 are all located within the first through groove 12, and the first lead screw 13 can rotate within the first through groove 12. The first lead screw 13 is driven to the movable clamp 16. Rotating the first lead screw 13 drives the movable clamp 16 to move vertically up and down and cooperate with the fixed clamp 11 to clamp and fix the silicon wafer. The upper end of the first lead screw 13 protrudes from the mounting plate 10 and is connected to a knob 15, which facilitates the operator to rotate the first lead screw 13. Furthermore, flexible pads 17 are provided on the opposite sides of the fixed clamp 11 and the movable clamp 16. In use, the silicon wafer is placed between the fixed clamp 11 and the movable clamp 16. By rotating the knob 15, the first lead screw 13 rotates, thereby driving the movable clamp 16 downward to clamp the silicon wafer and prevent slight displacement of the silicon wafer during the cutting process. The flexible pad 17 effectively prevents damage to the silicon wafer during clamping and protects the integrity of the silicon wafer.

[0030] Reference Figure 1 As shown, the first driving mechanism includes two movable seats 905, two first fixed plates 901, a bidirectional lead screw 902, and a slide bar 904. The two first fixed plates 901 are correspondingly installed at the edges of opposite sides of the base 1. The bidirectional lead screw 902 and the slide bar 904 are both arranged horizontally between the two first fixed plates 901 and pass through the two movable seats 905. The slide bar 904 is fixedly installed, while the bidirectional lead screw 902 is rotatable. A clamping mechanism is installed on the movable seats 905. The movable seats 905 are drivenly connected to the bidirectional lead screw 902, and slidably connected to the slide bar 904. The slide bar 904 restricts the movable seats 905 from rotating with the bidirectional lead screw 902 and guides the movable seats 905 to move linearly along the horizontal longitudinal direction. One end of the bidirectional lead screw 902 passes through the first fixed plate 901 and is connected to the first motor 903. The rotation of the first motor 903 can drive the bidirectional lead screw 902 to rotate, thereby enabling the two clamping mechanisms to move closer or further apart synchronously along the horizontal longitudinal direction. This allows the spacing between the two clamping mechanisms to be adapted to silicon wafers of different sizes and models, expanding the applicability of the device and improving its practicality.

[0031] Reference Figure 1 and Figure 6As shown, the cutting mechanism includes a vertical plate 6, a horizontal plate 7, a laser cutter 18, and a third drive mechanism. The vertical plate 6 is vertically arranged and its lower end is fixedly connected to one side of the base 1. The horizontal plate 7 extends horizontally from the top of the vertical plate 6 to the top of the base 1. The laser cutter 18 and the third drive mechanism are both mounted on the horizontal plate 7. The vertical plate 6 and the horizontal plate 7 can be integrally formed. The third drive mechanism includes a third lead screw 802, a slide block 804, and a third motor 803. A second horizontal through groove 801 is formed on the horizontal plate 7. Sliding grooves 805 are formed on both sides of the second through groove 801. Sliding blocks 806 that are adapted to the sliding grooves 805 are provided on both sides of the slide block 804 so that the slide block 804 can move back and forth linearly in a horizontal direction. Both the third lead screw 802 and the slide block 804 are disposed within the second through slot 801, and the slide block 804 is drivenly connected to the third lead screw 802. The third motor 803 is mounted on the horizontal plate 7 and can drive the third lead screw 802 to rotate. The laser cutter 18 is mounted vertically downward at the bottom of the slide block 804. A first pulley 8031 ​​is disposed at the end of the third lead screw 802 near the third motor 803, and a second pulley 8032 is connected to the output end of the third motor 803. A transmission belt 8033 is sleeved between the first pulley 8031 ​​and the second pulley 8032. The rotation of the third motor 803 drives the second pulley 8032 to rotate, which in turn drives the first pulley 8031 ​​to rotate via the transmission belt 8033, thereby realizing the rotation of the third lead screw 802, driving the slide block 804 to move along the third lead screw 802, and thus driving the laser cutter 18 to move linearly on the horizontal plate 7, achieving a high-precision cutting operation. The cooperation between the slide 805 and the slider 806 ensures the stability of the laser cutter 18 during movement.

[0032] Reference Figure 2 As shown, the second drive mechanism includes two second fixed plates 501 mounted on the side of the base 1 and spaced apart. A second lead screw 502 and a second guide rod 504, running horizontally longitudinally, are inserted between the two second fixed plates 501. Both the second lead screw 502 and the second guide rod 504 pass through the vertical plate 6. One end of the second lead screw 502 extends out of the second fixed plate 501 and is connected to a second motor 503, thus driving the second lead screw 502 to rotate. The rotation of the second motor 503 drives the second lead screw 502 to rotate, thereby achieving linear movement of the cutting mechanism along the horizontal longitudinal direction and ensuring cutting accuracy.

[0033] When using the photovoltaic silicon wafer cutting and positioning device of this application, firstly, the first motor 903 drives the bidirectional lead screw 902 to rotate, thereby causing the two clamping mechanisms to move synchronously closer or further apart along the horizontal longitudinal direction. The distance between the two clamping mechanisms is adjusted to match the shape and size of the silicon wafer to be processed. Then, the silicon wafer to be processed is placed between the clamping mechanisms. By rotating the knob 15, the first lead screw 13 is driven to rotate, thereby causing the movable clamp 16 to move downward and clamp the silicon wafer. Next, the second motor 503 is started to drive the second lead screw 502 to rotate, causing the cutting mechanism to move along the horizontal longitudinal direction. The third motor 803 is started to drive the third lead screw 802 to rotate, causing the laser cutter 18 to move horizontally laterally on the horizontal plate 7. The second motor 503 and the third motor 803 can be started simultaneously to drive the laser cutter 18 to move to the initial cutting position. Finally, the third motor 803 is started again, and through the rotation of the third lead screw 802, the laser cutter 18 is driven to move linearly on the horizontal plate 7 to cut the silicon wafer. Waste liquid generated during the cutting process flows into waste liquid collection hole 19 through guide slope 2 and is eventually collected in collection box 4.

[0034] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any changes or substitutions within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. A photovoltaic silicon wafer cutting positioning device, characterized by, The utility model relates to a cutting device for waste liquid, including: a base is provided with waste liquid collection hole and collection box on the upper end face of waste liquid can flow to the collection box through the waste liquid collection hole on the base; Two clamping mechanisms are mirror imagedly arranged on the opposite sides of the base, and the two clamping mechanisms are connected with a first driving mechanism, and the first driving mechanism can drive the two clamping mechanisms to move towards or away from each other along the horizontal longitudinal direction simultaneously; A cutting mechanism is arranged on the side adjacent to the clamping mechanism on the base, and the cutting mechanism is connected with a second driving mechanism, and the second driving mechanism can drive the cutting mechanism to move linearly along the horizontal longitudinal direction; Wherein, the clamping mechanism includes a mounting plate, a fixed clamp, a movable clamp, a first lead screw and a first guide rod, the fixed clamp is installed on the side of the mounting plate towards the base, a first through slot is formed in the mounting plate, the movable clamp, the first guide rod and the first lead screw are all installed in the first through slot, the first lead screw is drivingly connected with the movable clamp, rotating the first lead screw can drive the movable clamp to move up and down along the vertical direction, the upper end of the first lead screw protrudes from the mounting plate and is connected with a knob.

2. The photovoltaic silicon wafer cutting positioning device according to claim 1, wherein, The opposite sides of the fixed clamp and the movable clamp are both provided with flexible pads.

3. The photovoltaic silicon wafer cutting positioning device according to claim 1, wherein, The cutting mechanism includes a vertical plate, a horizontal plate, a laser cutter and a third driving mechanism, the vertical plate is arranged vertically, the horizontal plate extends horizontally from the top of the vertical plate to above the base, the laser cutter and the third driving mechanism are both arranged on the horizontal plate, and the third driving mechanism can drive the laser cutter to move linearly on the horizontal plate.

4. The photovoltaic silicon wafer cutting positioning device of claim 1, wherein, The first driving mechanism includes two moving seats, two first fixed plates, a bidirectional lead screw and a sliding rod, the two first fixed plates are correspondingly installed on the edges of the opposite sides of the base, the bidirectional lead screw and the sliding rod are both arranged horizontally between the two first fixed plates and pass through the two moving seats, the clamping mechanism is installed on the moving seat, the moving seat is drivingly connected with the bidirectional lead screw, the moving seat is slidingly connected with the sliding rod, and one end of the bidirectional lead screw protrudes from the first fixed plate and is connected with a first motor.

5. The photovoltaic silicon wafer cutting positioning device according to claim 3, wherein, The second driving mechanism includes two second fixed plates installed on the side of the base and spaced apart, a second lead screw and a second guide rod are arranged horizontally between the two second fixed plates, the second lead screw and the second guide rod both pass through the vertical plate, one end of the second lead screw protrudes from the second fixed plate and is connected with a second motor, and the second lead screw is drivingly connected with the vertical plate.

6. A photovoltaic silicon wafer cutting positioning device according to claim 5, wherein, A second through slot is formed in the horizontal plate, the third driving mechanism includes a third lead screw, a sliding seat and a third motor, the third lead screw and the sliding seat are both arranged in the second through slot, the sliding seat is drivingly connected with the third lead screw, the third motor is installed on the horizontal plate and can drive the third lead screw to rotate, and the laser cutter is installed vertically on the bottom of the sliding seat.

7. A photovoltaic silicon wafer cutting positioning device according to claim 6, wherein, The opposite sides of the second through slot are both provided with sliding grooves, and the two sides of the sliding seat are provided with sliding blocks matched with the sliding grooves.

8. The photovoltaic silicon wafer cutting positioning device of claim 6, wherein, The first belt pulley is arranged on one end of the third screw rod close to the third motor, the output end of the third motor is connected with a second belt pulley, and a transmission belt is sleeved between the first belt pulley and the second belt pulley.

9. The photovoltaic silicon wafer cutting positioning device of claim 1, wherein, A slot is formed on the side of the base opposite to the cutting mechanism, and the collecting box is movably inserted into the slot.

10. The photovoltaic silicon wafer cutting positioning device of claim 1, wherein, The upper end surface of the base is formed with a flow guide slope, and the lowest point of the flow guide slope extends to the waste liquid collecting hole.

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