Wafer pick-up and flip mechanism for a horizontal plating apparatus

Abstract

The utility model discloses a wafer piece taking turnover mechanism for horizontal electroplating equipment, this wafer piece taking turnover mechanism installs on wafer handling manipulator of horizontal electroplating equipment, and it is used for carrying out turnover operation to wafer to realize two -sided electroplating of wafer, not only can realize wafer efficient transportation, and through with the both ends of motor connecting shaft set in fixed bearing and guide bearing respectively, formed stable transmission structure, can effectively reduce the vibration and impact in wafer transportation process, improve the stability of whole device.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment technology, and in particular to a wafer flipping mechanism for horizontal electroplating equipment. Background Technology

[0002] In the horizontal electroplating process of semiconductor manufacturing, wafer handling and flipping operations are crucial. Existing wafer handling and flipping mechanisms often suffer from significant vibration and impact during operation, which can easily lead to wafer surface damage, affecting electroplating quality and yield. Furthermore, some mechanisms have inadequate structural designs, lacking sufficient capacity for multi-wafer handling and high-precision positioning, failing to meet the ever-increasing production demands. Summary of the Invention

[0003] In view of this, the present invention provides a wafer pick-and-turn mechanism for horizontal electroplating equipment to solve the problems existing in the background art.

[0004] A wafer flipping mechanism for a horizontal electroplating equipment includes a housing, a flipping motor and fiber optic amplifier fixed inside the housing, a wafer end effector disposed outside the housing, and a vacuum tube disposed inside the housing.

[0005] The rotating shaft of the flip motor is connected to a motor connecting shaft. One end of the motor connecting shaft extends out of the housing and is connected to the wafer end effector via an actuator connecting assembly. A wiring groove is provided at the bottom of the shaft section inside the housing. An optical fiber sensor is embedded inside the actuator connecting assembly.

[0006] The motor connecting shaft has a first wiring hole in its center. The actuator connecting assembly has a second wiring hole that connects and communicates with the first wiring hole. The vacuum tube extends from the wiring groove into the motor connecting shaft and is laid along the first and second wiring holes to connect with the wafer end actuator. The signal line of the fiber optic sensor is laid along the second and first wiring holes and extends out from the wiring groove to connect with the fiber optic amplifier.

[0007] Preferably, the actuator connection assembly includes a connecting shaft mounting base plate, a connecting shaft housing, and a connecting shaft mounting cover plate. The connecting shaft mounting base plate has a recess for placing an optical fiber sensor. The connecting shaft housing is closed and fixed on the surface of the connecting shaft mounting base plate. The connecting shaft mounting cover plate is connected to the connecting shaft mounting base plate and the wafer end effector to lock and fix the wafer end effector.

[0008] Preferably, the fiber optic amplifier and the flip motor are arranged opposite to each other. The fiber optic amplifier is fixed to the housing by a fiber optic amplifier fixing plate, and the flip motor is fixed to the housing by a motor mounting plate.

[0009] Preferably, a bearing mounting plate is fixed on the motor mounting plate, a fixed bearing is installed in the center of the bearing mounting plate, a guide bearing is installed on the front side of the outer shell opposite to the bearing mounting plate, one end of the motor connecting shaft passes through the guide bearing and is connected to the actuator connecting assembly, and the other end is fixed in the fixed bearing, and the rotating shaft of the flip motor passes through the motor mounting plate and is fixed to the motor connecting shaft.

[0010] Preferably, the inner wall of the motor connecting shaft is coated with a friction-reducing coating.

[0011] Preferably, the friction-reducing coating is a polymer coating.

[0012] Preferably, the housing includes a bottom plate, a top plate, a left side plate, a right side plate, a front side plate, and a rear side plate. The fiber optic amplifier mounting plate is fixed to the rear side plate of the housing. The motor mounting plate is an L-shaped plate with its horizontal section fixed to the bottom plate and its vertical section parallel to the fiber optic amplifier mounting plate.

[0013] Preferably, sealing strips are provided at the joints between the bottom plate, top plate, left side plate, right side plate, front side plate, and rear side plate.

[0014] Preferably, the wiring groove is a semi-circular annular groove.

[0015] The beneficial effects of this utility model are:

[0016] 1. The wafer flipping mechanism of this utility model is installed on the wafer handling robot arm of a horizontal electroplating equipment. It is used to flip the wafer to achieve double-sided electroplating. It can not only achieve efficient wafer transportation, but also form a stable transmission structure by setting the two ends of the motor connecting shaft in the fixed bearing and the guide bearing respectively. This can effectively reduce vibration and impact during wafer transportation and improve the stability of the entire device.

[0017] 2. The bottom of the motor connecting shaft of this application is provided with a wiring groove. By setting the wiring groove as a semi-circular annular groove, the vacuum tube and fiber optic sensor signal line passing through the motor connecting shaft and the connecting shaft mounting base plate can be prevented from getting tangled, thereby affecting the gripping effect of the wafer end effector or the signal transmission effect of the fiber optic sensor.

[0018] 3. The inner wall of the motor connecting shaft of this application is coated with a friction-reducing coating. The friction-reducing coating can effectively reduce the friction of the vacuum tube, protect the vacuum tube, improve the service life of the vacuum tube, and improve the stability of the entire device.

[0019] 4. All the joints of the plates that make up the outer shell of this application are provided with sealing strips. The sealing strips can not only effectively prevent dust and moisture from entering the interior of the outer shell, protect the internal components such as the flip motor and bearings, and extend the service life of the flip motor and bearings, but also play a certain role in shock absorption. At the same time, the surface of the sealing strip is hard anodized, which can improve the wear resistance and corrosion resistance of the plates. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of a wafer pick-and-turn mechanism mounted on a wafer handling robot.

[0022] Figure 2 This is a schematic diagram of the removal of the right side plate and top plate of the wafer pick-and-turn mechanism.

[0023] Figure 3 yes Figure 2 A half-section diagram.

[0024] Figure 4 This is a three-dimensional schematic diagram of a wafer flipping mechanism.

[0025] Figure 5 This is a schematic diagram of the motor connecting shaft.

[0026] The labels in the diagram mean:

[0027] 1 represents the outer shell.

[0028] 2 is a flip motor.

[0029] 3 is an optical fiber amplifier.

[0030] 4 represents the wafer end effector.

[0031] 5 is the motor connecting shaft, 51 is the wiring groove, and 52 is the first wiring hole.

[0032] 6 represents a vacuum tube.

[0033] 7 is the mounting base plate for the connecting shaft.

[0034] 8 is the connecting shaft cover.

[0035] 9 is the connecting shaft mounting cover, and 91 is the second wiring hole.

[0036] 10 is the fiber optic amplifier mounting plate.

[0037] 11 is the motor mounting plate.

[0038] 12 is the bearing mounting plate.

[0039] 13 is a fixed bearing.

[0040] 14 is a guide bearing. Detailed Implementation

[0041] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model is described below with reference to specific embodiments shown in the accompanying drawings. However, it should be understood that these descriptions are merely exemplary and not intended to limit the scope of the present utility model. Furthermore, descriptions of well-known structures and technologies are omitted in the following description to avoid unnecessarily obscuring the concept of the present utility model.

[0042] The terminology used in this disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. The singular forms “a,” “the,” and “the” as used in this disclosure and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any and all possible combinations of one or more of the associated listed items.

[0043] It should be understood that although the terms first, second, etc., may be used in this disclosure to describe various information, such information should not be limited to these terms and should not be construed as indicating or implying relative importance. These terms are used only to distinguish information of the same type from one another. For example, without departing from the scope of this disclosure, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "when," "when," or "in response to determination."

[0044] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0045] In the description of this utility model, unless otherwise specified and limited, it should be noted that the terms "installation", "connection" and "linking" should be interpreted broadly. For example, they can refer to mechanical or electrical connections, or internal connections between two components. They can be direct connections or indirect connections through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms according to the specific circumstances.

[0046] To better understand the technical solution of this utility model, the following detailed description of this utility model is provided in conjunction with the accompanying drawings.

[0047] This utility model provides a wafer pick-and-turn mechanism for a horizontal electroplating equipment, including a housing 1, a flipping motor 2 and an optical fiber amplifier 3 fixed inside the housing 1, a wafer end effector 4 disposed outside the housing 1, and a vacuum tube 6 disposed inside the housing 1.

[0048] The outer shell 1 includes a bottom plate, a top plate, a left side plate, a right side plate, a front side plate, and a rear side plate. The overall shape of the outer shell 1 can be designed as a cubic shell or an L-shaped three-dimensional shell.

[0049] The base plate is used to mount the left side plate, right side plate, front side plate, rear side plate, and motor mounting plate. Multiple mounting holes for mounting the left side plate, right side plate, front side plate, rear side plate, and motor mounting plate are correspondingly opened at different positions on the base plate. In this embodiment, the base plate is an L-shaped flat plate made of aluminum alloy.

[0050] The left side plate is connected to the bottom plate, front side plate, rear side plate, and top plate by fasteners such as bolts or screws, and serves as the left side cover plate of the outer casing 1. In this embodiment, the left side plate is made of stainless steel sheet metal, and its surface is electrolytically polished to improve the corrosion resistance and aesthetics of the device.

[0051] The right side plate is the same as the left side plate, and is also connected to the bottom plate, front side plate, rear side plate, and top plate by fasteners such as bolts or screws. The right side plate serves as the right side cover plate of the outer casing 1. In this embodiment, the right side plate is made of stainless steel sheet metal, and its surface is electrolytically polished to improve the corrosion resistance and aesthetics of the device.

[0052] The front side plate is connected to the bottom plate, top plate, left side plate, and right side plate by fasteners such as bolts or screws, and the front side plate serves as the front cover plate of the outer shell 1. Bearing mounting holes are provided on the front side plate, and guide bearings are installed in these holes. In this embodiment, the front side plate is made of aluminum alloy.

[0053] The rear side plate is connected to the bottom plate, top plate, left side plate, and right side plate by fasteners such as bolts or screws, and serves as the rear cover plate of the outer shell 1. In this embodiment, the rear side plate is made of aluminum alloy.

[0054] The top plate is connected to the left, right, front, and rear plates via bolts or screws, serving a sealing and locking function to ensure that the internal components of the outer casing 1 are not affected by external dust and moisture. In this embodiment, the top plate is also an L-shaped flat plate made of aluminum alloy.

[0055] The flip motor 2 is disposed inside the housing 1 and is fixed to the bottom plate of the housing 1 by a motor mounting plate 11. In this embodiment, the motor mounting plate 11 is an L-shaped plate with its horizontal section fixed to the bottom plate and its vertical section parallel to the fiber optic amplifier fixing plate 10. The horizontal section of the motor mounting plate 11 has bolt holes for fixing it to the bottom plate, and the vertical section has side holes for mounting the flip motor and the bearing mounting plate.

[0056] The rotating shaft of the flip motor 2 is connected to a motor connecting shaft 5. One end of the motor connecting shaft 5 extends out of the housing 1 and is connected to the wafer end actuator 4 through the actuator connecting assembly.

[0057] Specifically, a bearing mounting plate 12 is fixed to the front side of the motor mounting plate 11, and a fixed bearing 13 is installed in the center of the bearing mounting plate 12. A guide bearing 14 is installed on the front side of the outer casing 1 opposite to the bearing mounting plate 12. One end of the motor connecting shaft 5 passes through the guide bearing 14 and is connected to the actuator connecting assembly, while the other end is fixed inside the fixed bearing 13. The motor connecting shaft has a stainless steel hollow structure. The rotating shaft of the flip motor 2 passes through the motor mounting plate 11 and is fixed to the motor connecting shaft 5. That is, the rotating shaft of the flip motor 2 passes through the motor mounting plate 11 and is inserted into the motor connecting shaft 5. The motor connecting shaft has a set screw locking thread hole, and the rotating shaft of the flip motor 2 is tightened and fixed by the set screw inserted in the set screw locking thread hole.

[0058] In this embodiment, the bearing mounting plate is made of aluminum alloy. Both the fixed bearing 13 and the guide bearing 14 are double-cap deep groove ball bearings. The double-cap deep groove ball bearings have the characteristics of high precision and low noise. The fixed bearing 13 is installed on the bearing mounting plate 12 and can play the role of guidance and shock absorption. The guide bearing 14 can ensure the stability of the motor connecting shaft when rotating and flipping. The flipping motor 2 is a high-precision five-phase stepper motor.

[0059] The bottom of the shaft section of the motor connecting shaft 5 located inside the housing 1 is provided with a wiring groove 51. The center of the inside of the motor connecting shaft 5 is provided with a first wiring hole 52. The inside of the actuator connecting assembly is provided with a second wiring hole 91 that connects and communicates with the first wiring hole 52. The vacuum tube 6 extends from the wiring groove 51 into the inside of the motor connecting shaft 5 and is laid along the first wiring hole 52 and the second wiring hole 91 to connect with the wafer end actuator 4. The signal line of the fiber optic sensor is laid along the second wiring hole 91 and the first wiring hole 52 and extends out from the wiring groove 51 to connect with the fiber optic amplifier 3.

[0060] Specifically, the actuator connection assembly includes a connecting shaft mounting base plate 7, a connecting shaft cover 8, and a connecting shaft mounting cover plate 9.

[0061] The connecting shaft mounting base plate 7 is made of aluminum alloy and serves to transmit the rotational motion of the motor connecting shaft 5, thereby achieving synchronous rotation of the motor connecting shaft 5, the wafer end effector 4, and the wafer. A recessed platform is provided on the connecting shaft mounting base plate 7 to house a fiber optic sensor, which is used to detect the wafer position and determine whether the wafer has been successfully gripped. A second wiring hole 91 is provided along the length of the connecting shaft mounting base plate 7. The diameter of the second wiring hole 91 is equal to that of the second wiring hole 52. The two wiring holes are connected to form a wiring channel, through which the signal lines of the vacuum tube 6 and the fiber optic sensor can pass.

[0062] The connecting shaft cover 8 is fixed to the surface of the connecting shaft mounting base plate 7 to seal the fiber optic sensor and vacuum tube 6 to prevent external interference. The connecting shaft cover 8 is made of stainless steel sheet metal with electrolytic polishing.

[0063] The connecting shaft mounting cover 9 is connected to the connecting shaft mounting base plate 7 and the wafer end effector 4 to lock and fix the wafer end effector 4. The connecting shaft mounting cover 9 is made of aluminum alloy.

[0064] In this embodiment, the vacuum tube 6 is laid along the bottom plate of the outer casing 1 and extends into the interior of the motor connecting shaft 5 from the wiring groove 51. It connects to the air inlet of the wafer end effector 4 via the first wiring hole 52 inside the motor connecting shaft 5 and the second wiring hole 91 inside the connecting shaft mounting base plate 7. When the motor shaft rotates, the motor shaft can synchronously rotate with the motor connecting shaft, which in turn drives the wafer end effector 4 to rotate synchronously in the circumferential direction. To prevent the vacuum tube 6 from tangling during the rotation of the motor connecting shaft, in this embodiment, the wiring groove 51 is designed as a semi-circular annular groove.

[0065] In a preferred embodiment, to effectively reduce friction in the vacuum tube, a friction-reducing coating is applied to the inner wall of the motor connecting shaft 5. The friction-reducing coating is a polymer coating, preferably a polytetrafluoroethylene (PTFE) coating.

[0066] The wafer end effector 4 is made of ceramic or carbon fiber material, possessing good rigidity and shock absorption performance. The wafer end effector 4 grips the wafer using either vacuum adsorption or Bernoulli gripping. Vacuum adsorption gripping allows for precise control of the adsorption force by adjusting the vacuum level, while Bernoulli gripping utilizes Bernoulli's principle, generating a stable adsorption force through airflow with minimal damage to the wafer surface. The end of the wafer end effector 4 is provided with threaded holes for fixed connection with the connecting shaft mounting base plate 7 and the connecting shaft mounting cover plate 9.

[0067] The fiber optic amplifier is used to amplify the signal from the fiber optic sensor and transmit the amplified signal to the controller. The fiber optic amplifier 3 is positioned opposite to the flip motor 2, and is fixed to the rear panel of the housing 1 by the fiber optic amplifier fixing plate 10.

[0068] In a preferred embodiment, sealing strips are provided at the joints between all plates of this application, such as the bottom plate, top plate, left side plate, right side plate, front side plate, and rear side plate. The sealing strips have a Shore A hardness, which effectively prevents dust and moisture from entering the module and also provides a certain degree of shock absorption. Fluororubber sealing strips are preferably used. The surface of the sealing strips undergoes hard anodizing treatment, which improves the wear resistance and corrosion resistance of the plates.

[0069] When assembling the outer casing 1, first apply an appropriate amount of sealant to the four connecting surfaces of the left and right side panels. Then, align the mounting holes of the left and right side panels with the mounting holes on the base plate, and use M6 self-tapping screws to fix the left and right side panels to the base plate. When tightening the self-tapping screws, apply a torque of 3-5 N·m with a screwdriver. Then, install the front and rear side panels in the same way. Next, fix the motor mounting plate to the base plate. When installing the motor mounting plate, ensure that the bearing mounting holes on the motor mounting plate are aligned with the bearing mounting holes on the front side panel to ensure that the motor connecting shaft can pass through smoothly and with uniform gaps. Then, install the top plate. The tightening torque of the front and rear side panels should be controlled at about 6-8 N·m, and the tightening torque of the top plate should be controlled at about 8-10 N·m. Finally, use a right-angle ruler to check the perpendicularity of each plate. The perpendicularity error should be controlled within ±0.1°.

[0070] The wafer pick-and-turn mechanism of this application is installed on the wafer handling robot arm in a horizontal electroplating equipment, such as Figure 1 As shown.

[0071] In practical use, the control process of the wafer flipping mechanism for horizontal electroplating equipment of this utility model is as follows:

[0072] S1, Initialization: After the horizontal electroplating equipment is started, the rotary motor 2, fiber optic sensor, fiber optic amplifier, etc. are initialized to ensure that each component is working properly and whether there are any faults such as short circuits or open circuits; at the same time, the wafer handling robot is moved to the initial position according to the preset parameters.

[0073] The stepper motor is zeroed out by rotating the motor shaft to its initial position. The encoder feeds back the motor's position information to ensure that the position error is within ±0.01°.

[0074] Initialize the parameters of the fiber optic sensor and fiber optic amplifier, set the detection threshold and amplification factor to enable them to accurately detect the position and minute vibrations of the wafer.

[0075] S2, wafer gripping: The fiber optic sensor on the wafer handling robot (not the fiber optic sensor set in the connecting shaft mounting base plate of this application) detects the position and status of the wafer in the loading section. When the wafer position is detected to be accurate and meets the gripping conditions, the wafer handling robot moves to move the wafer end effector 4 of the wafer pick-up and flipping mechanism to a suitable position above the wafer.

[0076] Then, the vacuum generator or Bernoulli gripper is activated, and the wafer end effector 4 grips the wafer. If it is a vacuum adsorption type wafer gripper, the controller activates the vacuum generator to make the wafer end effector 4 generate an adsorption force. The magnitude of the adsorption force is adjusted according to the size and weight of the wafer, and is generally controlled between 5-10N. If it is a Bernoulli type wafer gripper, the controller adjusts the airflow parameters to make the actuator generate a stable adsorption force.

[0077] During the gripping process, the fiber optic sensors on the wafer handling robot monitor the gripping situation in real time. If the adsorption force is insufficient or the wafer is not gripped within a specified time (e.g., 2 seconds), the controller issues an alarm signal, stops the relevant operations, and performs troubleshooting.

[0078] S3, Handling and Flipping: The flipping motor 2 drives the motor connecting shaft 5 to rotate in the circumferential direction according to the preset program. The motor connecting shaft 5 drives the wafer end effector 4 and the wafer to perform flipping operations at preset angles and speeds. For example, when the wafer needs to be flipped 180°, the flipping motor rotates at a speed of 100° / s. The encoder provides real-time feedback on the rotation angle of the flipping motor. When the angle error exceeds ±0.01°, the controller adjusts the rotation parameters of the flipping motor in a timely manner to ensure flipping accuracy. During the handling process, the PLC controller adjusts the movement speed and acceleration of the wafer handling robot in real time. Combined with the shock absorption effect of the fixed bearing and guide bearing, as well as the buffering effect of the fluororubber sealing strip, vibration and impact are reduced. The controller also monitors the motor current and speed in real time to ensure stable motor operation.

[0079] The aforementioned flipping action is performed during the process of transporting the wafer from the pre-wetting chamber of the horizontal electroplating equipment to the electroplating chamber. That is, after the wafer handling robot clamps the wafer and performs a wet spraying operation in the pre-wetting chamber of the horizontal electroplating equipment, the wafer pick-up and flipping mechanism in this application operates to flip the wafer 180° and turn it over (that is, assuming that the upper surface of the wafer is wetted in the pre-wetting chamber, after the wafer pick-up and flipping mechanism flips 180°, the wetted side of the wafer is flipped to face down). Then the wafer handling robot transports the wafer to the electroplating chamber for electroplating processing.

[0080] S5, Wafer Return: After wafer electroplating is completed, the wafer handling robot grabs the wafer again and transports it back to the wafer cassette. Once the wafer is accurately placed back into the cassette, the vacuum suction or Bernoulli gripping is released. If it is vacuum suction, the controller shuts off the vacuum generator, separating the wafer from the actuator. If it is Bernoulli gripping, the controller adjusts the airflow parameters to cancel the suction force, completing one operation cycle.

[0081] It should be understood that the described embodiments are merely some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.

Claims

1. A wafer flipping mechanism for a horizontal electroplating equipment, characterized in that, It includes a housing (1), a flip motor (2) and an optical fiber amplifier (3) fixed inside the housing (1), a wafer end effector (4) disposed outside the housing (1), and a vacuum tube (6) disposed inside the housing (1). The rotating shaft of the flip motor (2) is connected to a motor connecting shaft (5). One end of the motor connecting shaft (5) extends out of the housing (1) and is connected to the wafer end actuator (4) through the actuator connecting assembly. A wiring groove (51) is provided at the bottom of the shaft section of the motor connecting shaft (5) located inside the housing (1). An optical fiber sensor is embedded inside the actuator connecting assembly. The motor connecting shaft (5) has a first wiring hole (52) in the center. The actuator connecting assembly has a second wiring hole (91) that connects and communicates with the first wiring hole (52). The vacuum tube (6) extends from the wiring groove (51) into the motor connecting shaft (5) and is laid along the first wiring hole (52) and the second wiring hole (91) to connect with the wafer end actuator (4). The signal line of the fiber optic sensor is laid along the second wiring hole (91) and the first wiring hole (52) and extends out from the wiring groove (51) to connect with the fiber optic amplifier (3).

2. The wafer flipping mechanism for horizontal electroplating equipment according to claim 1, characterized in that, The actuator connection assembly includes a connecting shaft mounting base plate (7), a connecting shaft cover (8), and a connecting shaft mounting cover plate (9). The connecting shaft mounting base plate (7) has a recess for placing an optical fiber sensor. The connecting shaft cover (8) is closed and fixed on the surface of the connecting shaft mounting base plate (7). The connecting shaft mounting cover plate (9) is connected to the connecting shaft mounting base plate (7) and the wafer end effector (4) to lock and fix the wafer end effector (4).

3. The wafer flipping mechanism for horizontal electroplating equipment according to claim 1, characterized in that, The fiber optic amplifier (3) is positioned opposite to the flip motor (2). The fiber optic amplifier (3) is fixed to the outer shell (1) by the fiber optic amplifier fixing plate (10), and the flip motor (2) is fixed to the outer shell (1) by the motor mounting plate (11).

4. The wafer flipping mechanism for horizontal electroplating equipment according to claim 3, characterized in that, A bearing mounting plate (12) is fixed on the motor mounting plate (11). A fixed bearing (13) is installed in the center of the bearing mounting plate (12). A guide bearing (14) is installed on the front side of the outer shell (1) opposite to the bearing mounting plate (12). One end of the motor connecting shaft (5) passes through the guide bearing (14) and is connected to the actuator connecting assembly, while the other end is fixed in the fixed bearing (13). The rotating shaft of the flip motor (2) passes through the motor mounting plate (11) and is fixed to the motor connecting shaft (5).

5. The wafer flipping mechanism for a horizontal electroplating equipment according to claim 1 or 4, characterized in that, The inner wall of the motor connecting shaft (5) is coated with a friction-reducing coating.

6. The wafer flipping mechanism for a horizontal electroplating equipment according to claim 5, characterized in that, The friction-reducing coating is a polymer coating.

7. The wafer flipping mechanism for horizontal electroplating equipment according to claim 3, characterized in that, The outer casing (1) includes a bottom plate, a top plate, a left side plate, a right side plate, a front side plate, and a rear side plate. The fiber optic amplifier fixing plate (10) is fixed on the rear side plate of the outer casing (1). The motor mounting plate (11) is an L-shaped plate with its horizontal section fixed on the bottom plate and its vertical section parallel to the fiber optic amplifier fixing plate (10).

8. The wafer flipping mechanism for a horizontal electroplating equipment according to claim 7, characterized in that, Sealing strips are provided at the joints between the bottom plate, top plate, left side plate, right side plate, front side plate, and rear side plate.

9. The wafer flipping mechanism for a horizontal electroplating equipment according to claim 1, characterized in that, The wiring groove (51) is a semi-circular annular groove.

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