A refrigerant leakage detection sensor and detection device
By employing a gas chamber heating module and a heat insulation encapsulation module in the NDIR infrared gas sensor, combined with temperature feedback control, the condensation problem of the NDIR infrared gas sensor in humid environments is solved, achieving low power consumption and high accuracy refrigerant leakage detection.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HUAGONG TECHNOLOGY CO LTD
- Filing Date
- 2025-06-30
- Publication Date
- 2026-07-07
AI Technical Summary
Existing NDIR infrared gas sensors are prone to condensation in humid environments, which leads to a decrease in detection accuracy and reliability. Furthermore, heating solutions increase power consumption and cause temperature drift issues.
The air chamber heating module heats the air inside the air chamber, the PCBA module is isolated by the heat insulation encapsulation module, and the temperature feedback module controls the air chamber temperature to avoid condensation and reduce the impact of heat sources on the PCBA module. The detection accuracy is improved by dual-channel detection and condensation pre-judgment.
It achieves anti-condensation at low heating power, reduces power consumption, minimizes the impact of heat sources on PCBA modules, and improves detection accuracy and reliability.
Smart Images
Figure CN224471530U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of gas detection technology, specifically to a refrigerant leak detection sensor and detection device. Background Technology
[0002] Refrigerants, as essential products for controlling thermal comfort, are used in many scenarios such as refrigerators, industrial refrigeration, air conditioners, and automobiles. Currently, commonly used refrigerant types include R32, R290, and R454B. Although these refrigerants each have their own application scenarios, they are all flammable and explosive refrigerants, and leaks could cause major safety accidents.
[0003] To address refrigerant leaks, NDIR infrared gas sensors are commonly used in related technologies to detect leaks. NDIR infrared gas sensors are sensors that detect gas concentrations using the principle of infrared absorption, offering high selectivity. By selecting different filters, they can detect a variety of gases, thus meeting diverse application requirements. They also boast high sensitivity, capable of detecting extremely low concentrations of gases.
[0004] However, the related technologies have the following drawbacks when applying NDIR infrared gas sensors:
[0005] Firstly, condensation easily forms on the surface of the metal chamber in the NDIR infrared gas sensor in humid environments, causing changes in the refractive index of the detection optical path and affecting detection accuracy.
[0006] Secondly, to address the condensation problem, some NDIR infrared gas sensors employ a heating solution for the metal gas chamber. However, this heating solution not only increases the power consumption of the NDIR infrared gas sensor, but also causes the printed circuit board assembly (PCBA) to experience temperature drift, resulting in an excessively large rate of change of the amplifier offset voltage, which further affects the detection accuracy and reliability of the NDIR infrared gas sensor. Utility Model Content
[0007] The purpose of this invention is to overcome the above-mentioned technical deficiencies and propose a refrigerant leakage detection sensor and detection device to solve the technical problems of high power consumption and insufficient detection accuracy and reliability of existing NDIR infrared gas sensors.
[0008] To achieve the above-mentioned technical objectives, the present invention adopts the following technical solution:
[0009] In a first aspect, this utility model provides a refrigerant leak detection sensor, comprising:
[0010] PCBA module;
[0011] A gas chamber, located on the PCBA module, is used to contain the gas to be tested;
[0012] An air chamber heating module is disposed inside the air chamber and electrically connected to the PCBA module for heating the air inside the air chamber;
[0013] A thermal insulation encapsulation module isolates the PCBA module from the air chamber; and
[0014] An infrared optical detection module is installed inside the gas chamber and electrically connected to the PCBA module for detecting refrigerant concentration.
[0015] In some embodiments, the thermal insulation encapsulation module includes a first thermal insulation layer, which is fixedly disposed between the air chamber and the PCBA module, and the first thermal insulation layer is an aerogel thermal insulation layer or a ceramic substrate.
[0016] In some embodiments, the air chamber heating module is a metal heating film, which is fixedly disposed between the first heat insulation layer and the air chamber and electrically connected to the PCBA module.
[0017] In some embodiments, when the first heat insulation layer is a ceramic substrate, the gas chamber heating module is a metallized thin film heating layer, which is etched and formed on the side of the ceramic substrate near the gas chamber and electrically connected to the PCBA module.
[0018] In some embodiments, the metallized thin-film heating layer has a continuous curved structure.
[0019] In some embodiments, the heat insulation encapsulation module includes a second heat insulation layer, which covers and is disposed on the outside of the air chamber to isolate the air chamber from the outside air.
[0020] In some embodiments, the air chamber has multiple air holes, each of which is provided with a waterproof and breathable membrane, and the outside of the air chamber is also covered with a heat insulation cover.
[0021] In some embodiments, a temperature feedback module is further included, the temperature feedback module comprising:
[0022] A first temperature sensor, disposed inside the air chamber and electrically connected to the PCBA module, is used to detect the internal temperature of the air chamber; and
[0023] A second temperature sensor is disposed outside the air chamber and electrically connected to the PCBA module for detecting the external temperature of the air chamber.
[0024] The PCBA module controls the heating power of the air chamber heating module to make the internal temperature higher than the external temperature.
[0025] Secondly, this utility model also provides a refrigerant leak detection device, including the aforementioned refrigerant leak detection sensor.
[0026] Compared with existing technologies, the refrigerant leak detection sensor and detection device provided by this utility model can heat the internal temperature of the gas chamber to above the ambient dew point temperature through the gas chamber heating module. The gas chamber is isolated from the PCBA module by the heat insulation encapsulation module, which avoids temperature drift of the PCBA module due to heat and reduces the heating of the outside air. The heat source is concentrated in the gas chamber, thereby achieving anti-condensation with lower heating power, reducing power consumption, and reducing the impact of the heat source on the PCBA module. Furthermore, through dual-channel detection, condensation pre-judgment and pre-removal, the negative impact of condensation on gas detection accuracy is shielded, thereby improving detection accuracy and reliability. Attached Figure Description
[0027] Figure 1 This is a schematic diagram of the first structure of the refrigerant leak detection sensor in Example 1;
[0028] Figure 2 This is a schematic diagram of the second structure of the refrigerant leak detection sensor in Example 1;
[0029] Figure 3 This is an exploded schematic diagram of the refrigerant leak detection sensor in Example 1;
[0030] Figure 4 This is a partial schematic diagram of the refrigerant leak detection sensor in Example 2;
[0031] Figure 5 This is a partial explosion diagram of the refrigerant leak detection sensor in Example 2;
[0032] Figure 6 This is a schematic diagram of the refrigerant leakage detection device in Example 3.
[0033] Explanation of reference numerals in the attached drawings: 1. PCBA module; 2. Air chamber; 21. Waterproof and breathable membrane; 22. Air vent; 3. Heat insulation cover; 4. Structural fastener; 5. Heat insulation encapsulation module; 51. First heat insulation layer; 511. Through hole; 52. Second heat insulation layer; 6. Infrared optical detection module; 61. Infrared light source; 62. Thermopile; 7. Air chamber heating module; 71. Metal heating film; 72. Metallized thin film heating layer; 8. Housing; 81. Air inlet; 9. Display screen; 10. Operation panel. Detailed Implementation
[0034] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.
[0035] To address the aforementioned technical problems, this invention provides a refrigerant leak detection sensor and detection device that can achieve anti-condensation with lower heating power, reduce power consumption, minimize the impact of heat sources on PCBA modules, and improve detection accuracy and reliability.
[0036] Example 1:
[0037] Please see Figure 1-2 A refrigerant leak detection sensor includes a PCBA module 1, a gas chamber 2, and an infrared optical detection module 6; wherein the PCBA module 1 is further provided with a gas chamber heating module 7 and a heat insulation encapsulation module 5.
[0038] During operation, the gas chamber 2 can contain the gas to be tested; the gas chamber heating module 7 can heat the air inside the gas chamber 2 to prevent condensation inside the gas chamber 2; the heat insulation encapsulation module 5 can isolate the gas chamber 2 from the PCBA module 1 to prevent temperature drift of the PCBA module 1; the infrared optical detection module 6 can detect the concentration of refrigerant in the gas to determine whether refrigerant leakage has occurred.
[0039] Specifically, the aforementioned PCBA module 1 is a printed circuit board assembly, which includes a PCB substrate and components such as chips, resistors, and capacitors. In this refrigerant leak detection sensor, the main function of the PCBA module 1 is to form a complete circuit system, providing a feasible circuit environment for the normal operation of each component.
[0040] It is understood that in this embodiment, the various components on PCBA module 1 and their arrangement are not the focus of this utility model. They can be set with reference to the relevant components and their arrangement in the prior art. This embodiment will focus on the arrangement of the air chamber 2, infrared optical detection module 6, air chamber heating module 7 and heat insulation packaging module 5 on PCBA module 1.
[0041] However, considering the problem of excessive amplifier offset voltage change rate when PCBA module 1 experiences temperature drift in related technologies, the amplifier on PCBA module 1 in this embodiment is preferably a zero-temperature-drift operational amplifier.
[0042] Please see Figure 3In this embodiment, the gas chamber 2 can be a metallized gas chamber 2. The gas chamber 2 can have an opening on the side near the PCBA module 1, and it can be fixed to the PCBA module 1 with screws. When the gas chamber 2 is fixed to the PCBA module 1, the gas chamber 2 and the PCBA module 1 will form a space that can accommodate the gas to be detected.
[0043] To facilitate the entry of the gas to be tested into the gas chamber 2, multiple air holes 22 (not shown in the figure) can be provided on the side of the gas chamber 2 away from the PCBA module 1. A groove can be provided at the location of the multiple air holes 22 in the gas chamber 2, and a waterproof and breathable membrane 21 can be fixedly installed within the groove. The waterproof and breathable membrane 21 ensures that the gas to be tested can enter the gas chamber 2 while preventing water droplets from entering the gas chamber 2, and also directionally dissipates heat from inside the gas chamber 2, preventing overheating.
[0044] The aforementioned air chamber heating module 7 can be a metal heating film 71, which can be a nickel-chromium alloy heating film or a metal film of other materials; the material is not specifically limited as long as the heating requirements are met. The metal heating film 71 can be fixedly installed on the side of the air chamber 2 near the PCBA module 1, and can be electrically connected to the corresponding power supply terminal on the PCBA module 1 through wires or contacts, so that the PCBA module 1 can supply power to the metal heating film 71 and control the heating power of the metal heating film 71.
[0045] It is understood that the metal heating film 71 is directly connected to the air chamber 2. After being powered on, the metal heating film 71 can heat the air inside the air chamber 2, thereby increasing the internal temperature of the air chamber 2. As for how to power and control the metal heating film 71 through the PCBA module 1, this is existing technology and is not the focus of this utility model, so it will not be described in detail.
[0046] To prevent the metal heating film 71 from heating the air chamber 2 and causing temperature drift in the PCBA module 1, the aforementioned heat-insulating encapsulation module 5 can isolate the metal heating film 71 from the PCBA module 1. Specifically, the heat-insulating encapsulation module 5 includes a first heat-insulating layer 51, which can be an aerogel heat-insulating layer. In this case, the first heat-insulating layer 51 can be fixedly disposed between the metal heating film 71 and the PCBA module 1, thereby isolating the metal heating film 71 from the PCBA module 1 and reducing the heat received by the PCBA module 1.
[0047] To facilitate the assembly of the air chamber 2, the metal heating film 71 and the first heat insulation layer 51 onto the PCBA module 1, grooves can be pre-set at corresponding positions on the PCBA module 1 so that the first heat insulation layer 51 can be accurately embedded into the grooves, achieving precise assembly.
[0048] Please see Figure 3In this embodiment, the infrared optical detection module 6 may include an infrared light source 61 and a thermopile 62. The infrared light source 61 and the thermopile 62 can be fixedly mounted on the PCBA module 1 by welding and form an electrical connection with the PCBA module 1. During operation, the PCBA module 1 can supply power to the infrared light source 61 and the thermopile 62. The infrared light source 61 and the thermopile 62 can form an NDIR detection signal source.
[0049] Since the gas to be detected is located inside the gas chamber 2, in order to facilitate the detection of the refrigerant concentration in the gas to be detected, a through hole 511 can be opened on the first heat insulation layer 51 corresponding to the position of the infrared optical detection module 6, and a corresponding notch can be set on the metal heating film 71, so that the infrared light source 61 and the thermopile 62 can extend into the gas chamber 2 and detect the gas in the gas chamber 2.
[0050] It is understood that the infrared light source 61, together with the thermopile 62, can form an NDIR detection signal source. Combined with the corresponding detection circuit on the PCBA module 1, it can achieve NDIR gas detection of the refrigerant (such as R32, R290, etc.) inside the gas chamber 2. As for the specific detection circuit, it belongs to existing technology and is not the focus of this utility model; therefore, it will not be elaborated upon here.
[0051] In this embodiment, the PCBA module 1 is also provided with a temperature feedback module (not shown in the figure). The temperature feedback module may include a first temperature sensor and a second temperature sensor. The first temperature sensor may be located inside the air chamber 2, while the second temperature sensor is located outside the air chamber 2.
[0052] Thus, the first temperature sensor, in conjunction with the detection circuit on PCBA module 1, can acquire the temperature value of the metal heating film 71 in real time, which can reflect the internal temperature of the air chamber 2; while the second temperature sensor, in conjunction with the detection circuit on PCBA module 1, can also acquire the external temperature of the air chamber 2 in real time.
[0053] It is understandable that, through the temperature feedback module mentioned above, PCBA module 1 can perform real-time temperature PID control on the metal heating film 71, and adjust the internal temperature of the air chamber 2 by controlling the heating power of the metal heating film 71.
[0054] Based on this, the specific models of the first and second temperature sensors mentioned above can be selected as needed, but they are preferably distributed PT1000 thin-film temperature sensors. Thus, in conjunction with the aforementioned PCBA module 1, the first temperature sensor can monitor the axial temperature gradient of the gas chamber 2 in real time with a resolution of 0.1℃.
[0055] Based on the internal and external temperatures of chamber 2, this refrigerant leak detection sensor can also control the risk of condensation in chamber 2. Specifically, since condensation inside chamber 2 occurs when the internal temperature of chamber 2 is lower than the external temperature, by acquiring the internal and external temperatures of chamber 2 in real time, the PCBA module 1 can control the internal temperature of chamber 2 to always be higher than the external temperature. Preferably, the internal temperature of chamber 2 is controlled to always be 10-15°C higher than the external temperature, thereby effectively preventing condensation inside chamber 2 and improving detection accuracy.
[0056] In other embodiments, to reduce the power consumption of the refrigerant leak detection sensor, a humidity sensor (not shown in the figure) may also be provided on the PCBA module 1.
[0057] The humidity sensor, in conjunction with the relevant detection circuit on PCBA module 1, can acquire the ambient humidity value in real time. When the ambient humidity is high, the internal temperature of the air chamber 2 can be appropriately increased; when the ambient humidity is low, the internal temperature of the air chamber 2 can be appropriately decreased.
[0058] Understandably, provided that the internal temperature of chamber 2 remains higher than the ambient dew point temperature, the aforementioned humidity sensor can further dynamically adjust the internal temperature of chamber 2. The specific relationship between the humidity value and the internal temperature of chamber 2 can be set based on experiments and requirements, and is not specifically limited thereto.
[0059] Please see Figure 3 In this embodiment, in order to reduce the heating of the air outside the air chamber 2, a heat insulation cover 3 and a structural fastener 4 are also provided on the outside of the air chamber 2; wherein, the heat insulation cover 3 can cover the air chamber 2 and reduce the heating of the air outside the air chamber 2 by the air chamber heating module 7, while the structural fastener 4 can fix the heat insulation cover 3 to the PCBA module 1.
[0060] Specifically, the heat insulation cover 3 can be slotted in the middle, so that the heat insulation cover 3 can completely cover the air chamber 2, and the location of the multiple air holes 22 on the air chamber 2 (i.e. the location of the waterproof and breathable membrane 21) can be exposed to the external environment, ensuring that the gas to be tested can enter the interior of the air chamber 2 through the waterproof and breathable membrane 21 and the multiple air holes 22, and complete the test.
[0061] The function of the aforementioned fastener 4 is to fix the heat insulation cover 3 to the PCBA module 1. Under the premise of ensuring the fixation effect of the heat insulation cover 3, any fastening structure can be used between it and the PCBA module 1, so that the heat insulation cover 3 can be quickly installed and removed from the PCBA module 1.
[0062] Please see Figure 3In this embodiment, to further improve the heat insulation effect, the aforementioned heat insulation encapsulation module 5 may further include a second heat insulation layer 52. The second heat insulation layer 52 may be an aerogel heat insulation layer, which may be fixedly attached to the inner wall of the heat insulation cover 3. Thus, when the heat insulation cover 3 covers the air chamber 2, the second heat insulation layer 52 may improve the heat insulation effect of the heat insulation cover 3, and further reduce the power consumption loss of the air chamber heating module 7.
[0063] It should be noted that both the first heat insulation layer 51 and the second heat insulation layer 52 mentioned above can be aerogel heat insulation layers, which can be silica aerogel composite materials. Based on this, the thickness of the first heat insulation layer 51 and / or the second heat insulation layer 52 can be greater than or equal to 2 mm, while its thermal conductivity can be less than or equal to 0.02 W / (m·K), and its temperature resistance can be greater than or equal to 200℃, thereby fully ensuring the heat insulation effect of the first heat insulation layer 51 and / or the second heat insulation layer 52. With this setting, the temperature fluctuation in the working area of PCBA module 1 can be less than ±0.5℃ / min.
[0064] Meanwhile, the aforementioned PCBA module is also equipped with a control module, which can be an embedded microcontroller. The embedded microcontroller can be electrically connected to the aforementioned air chamber heating module 7, infrared optical detection module 6, temperature feedback module, and humidity sensor to execute refrigerant leak detection algorithms and achieve automatic control of the relevant modules.
[0065] It is understandable that how to achieve electrical connection between the embedded microcontroller and each module on the PCBA module, and how to achieve automatic control of each module by the embedded microcontroller, are existing technologies in this field and are not the focus of this utility model, so they will not be elaborated here.
[0066] To better understand this embodiment, the following is combined with... Figure 1-3 The technical solution of this embodiment will be described in detail below:
[0067] In actual operation, the gas to be tested can enter the interior of the air chamber 2 through the waterproof and breathable membrane 21 and multiple air holes 22 on the air chamber 2. The air chamber heating module 7 can heat the gas inside the air chamber 2, and the heat insulation encapsulation module 5 can isolate the air chamber 2 from the PCBA module 1, reduce heating power consumption, concentrate the heat source to the air chamber 2, and prevent the PCBA module 1 from experiencing temperature drift due to heating.
[0068] Based on this, PCBA module 1 can monitor the internal and external temperatures of air chamber 2 in real time through the temperature feedback module, and control the processing power of air chamber heating module 7 through the circuit so that the internal temperature of air chamber 2 is always 10-15℃ higher than the external temperature, so that the internal temperature of air chamber 2 is always kept above the ambient dew point temperature, thus avoiding condensation inside air chamber 2.
[0069] Meanwhile, the infrared optical detection module 6, in conjunction with the detection circuit on the PCBA module 1, can detect the concentration of the relevant refrigerant in the gas to be tested in the gas chamber 2, and determine whether a refrigerant leak has occurred based on the refrigerant concentration value.
[0070] Therefore, by using the above method, anti-condensation can be achieved with lower heating power, reducing power consumption and minimizing the impact of heat source on PCBA module 1, thereby improving detection accuracy and reliability.
[0071] Example 2:
[0072] Please see Figure 4-5 Embodiment 2 of this utility model also provides a refrigerant leak detection sensor, which has a structure that is basically the same as that of Embodiment 1, except for the arrangement of the gas chamber heating module 7, the heat insulation encapsulation module 5, and the infrared optical detection module 6, as detailed below:
[0073] In this embodiment, the first heat insulation layer 51 can be a ceramic substrate; based on this, the gas chamber heating module 7 can be a metallized thin film heating layer 72 etched onto the ceramic substrate. Meanwhile, the infrared optical detection module 6 can use a patch-type infrared light source 61 and a thermopile 62, and weld them onto the ceramic substrate.
[0074] At this point, the air chamber 2 can be mounted entirely on the ceramic substrate. The ceramic substrate not only serves to mount the air chamber 2 but also provides thermal insulation between the air chamber 2 and the PCBA module 1. A metallized thin-film heating layer 72 is etched onto the ceramic substrate and located inside the air chamber 2. The metallized thin-film heating layer 72 can be electrically connected to the PCBA module 1 via wires or contacts. A surface-mount infrared light source 61 and a thermopile 62 are soldered and fixed to the ceramic substrate and can be electrically connected to corresponding terminals on the PCBA module 1 via wires.
[0075] It should be noted that, in this embodiment, the thickness of the metallized thin film heating layer 72 can be 50-200 μm, and the resistivity ≤5×10⁻ 6 The gas chamber heating module 7 can be directly formed on the ceramic substrate by magnetron sputtering, which can be deposited on the surface of the ceramic substrate.
[0076] At this point, to further improve the heating effect, the metallized thin film heating layer 72 can be configured as a continuous curved structure, for example, it can adopt such a... Figure 5 The serpentine circuit structure shown allows the metallized thin-film heating layer 72 to rapidly change the internal temperature of the gas chamber 2, thereby enabling dynamic control of the internal temperature of the gas chamber 2. Similarly, the aforementioned first temperature sensor can also be composed of a temperature-sensing resistance wire etched on a ceramic substrate.
[0077] Based on this, in this embodiment, a heat insulation cover 3 is still provided on the outside of the air chamber 2, and a second heat insulation layer 52 can also be provided on the inner wall of the heat insulation cover 3; multiple air holes 22 are also provided on the air chamber 2, and waterproof and breathable membranes 21 are also provided at the positions of the multiple air holes 22. The configuration of other parts of this refrigerant leak detection sensor can refer to the configuration of the corresponding parts in embodiment 1, and will not be described again here.
[0078] Example 3:
[0079] Please see Figure 6 The present invention also provides a refrigerant leak detection device, including a housing 8, wherein the refrigerant leak detection sensor of Embodiment 1 or Embodiment 2 is disposed inside the housing 8.
[0080] Specifically, the aforementioned refrigerant leak detection sensor can be fixed inside the housing 8 by screws or snap-fit. Meanwhile, the housing 8 is provided with an air inlet 81, which can communicate with multiple air holes 22 on the air chamber 2, allowing the gas to be detected to sequentially enter the air chamber 2 through the air inlet 81 and the aforementioned multiple air holes 22.
[0081] The housing 8 is also equipped with a display screen 9 and an operation panel 10, both of which are electrically connected to the PCBA module 1. Various parameters during the refrigerant leak detection process (such as the internal and external temperatures of the gas chamber 2, ambient humidity, refrigerant concentration, etc.) can be displayed on the display screen 9 for user reference; while with the help of the operation panel 10, users can also manually adjust or view multiple parameters on the refrigerant leak detection sensor.
[0082] It should be noted that how to display relevant parameters through the display screen 9 and how to control the refrigerant leak detection sensor through the operation panel 10 are both existing technologies in this field and are not the focus of this utility model, so they will not be described in detail here.
[0083] In the description of this application, it should be noted that the terms "upper" and "lower," etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.
[0084] It should be noted that in this application, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
[0085] The specific embodiments of this utility model described above do not constitute a limitation on the scope of protection of this utility model. Any other corresponding changes and modifications made based on the technical concept of this utility model should be included within the scope of protection of the claims of this utility model.
Claims
1. A refrigerant leak detection sensor, characterized in that, include: PCBA module; A gas chamber, located on the PCBA module, is used to contain the gas to be tested; An air chamber heating module is disposed inside the air chamber and electrically connected to the PCBA module for heating the air inside the air chamber; A thermal insulation encapsulation module isolates the PCBA module from the air chamber; and An infrared optical detection module is installed inside the gas chamber and electrically connected to the PCBA module for detecting refrigerant concentration.
2. The refrigerant leak detection sensor according to claim 1, characterized in that, The heat insulation encapsulation module includes a first heat insulation layer, which is fixedly disposed between the air chamber and the PCBA module, and the first heat insulation layer is an aerogel heat insulation layer or a ceramic substrate.
3. The refrigerant leak detection sensor according to claim 2, characterized in that, The air chamber heating module is a metal heating film, which is fixedly disposed between the first heat insulation layer and the air chamber and electrically connected to the PCBA module.
4. The refrigerant leak detection sensor according to claim 2, characterized in that, When the first heat insulation layer is a ceramic substrate, the gas chamber heating module is a metallized thin film heating layer. The metallized thin film heating layer is etched and formed on the side of the ceramic substrate near the gas chamber and is electrically connected to the PCBA module.
5. The refrigerant leak detection sensor according to claim 4, characterized in that, The metallized thin film heating layer has a continuous curved structure.
6. The refrigerant leak detection sensor according to any one of claims 1-5, characterized in that, The heat insulation encapsulation module includes a second heat insulation layer, which covers and is disposed on the outside of the air chamber to isolate the air chamber from the outside air.
7. The refrigerant leak detection sensor according to any one of claims 1-5, characterized in that, The air chamber has multiple air holes, and a waterproof and breathable membrane is installed at each of the multiple air holes. The outside of the air chamber is also covered with a heat insulation cover.
8. The refrigerant leak detection sensor according to any one of claims 1-5, characterized in that, It also includes a temperature feedback module, which includes: A first temperature sensor, disposed inside the air chamber and electrically connected to the PCBA module, is used to detect the internal temperature of the air chamber; and A second temperature sensor is disposed outside the air chamber and electrically connected to the PCBA module for detecting the external temperature of the air chamber. The PCBA module controls the heating power of the air chamber heating module to make the internal temperature higher than the external temperature.
9. A refrigerant leak detection device, characterized in that, Including the refrigerant leak detection sensor as described in any one of claims 1-8.