Acoustic microphone integrated device

Abstract

The embodiment of the application discloses a sound microphone integrated device, which comprises a first shell, a second shell, a flexible connecting piece, a sound and a microphone. The first shell forms a mounting cavity with an opening. The second shell is arranged on the first shell and connected with the first shell. The second shell and the first shell cooperatively form a containing cavity. The flexible connecting piece is connected with the first shell and arranged at the opening. The sound is mounted on the flexible connecting piece and arranged in the mounting cavity. The microphone is arranged in the containing cavity and connected with the first shell and / or the second shell. When the sound works, the sound will vibrate to make the flexible connecting piece deform to absorb the vibration of the sound, so that the vibration of the sound to the first shell can be reduced, the vibration of the first shell can be reduced, and the probability of the first shell driving the microphone to vibrate can be reduced, so that the influence of the vibration on the microphone can be reduced, the pickup effect of the microphone can be improved, and the sound amplification quality of the sound can be improved.

Description

Technical Field

[0001] This application relates to the field of electroacoustic technology, and more specifically, to an integrated audio microphone device. Background Technology

[0002] In existing teaching and meeting scenarios, it is often necessary to capture the speaker's voice and then amplify it so that the participants can hear the speaker clearly.

[0003] In related technical fields, microphones need to be set up for the speaker to pick up their voice, and speakers also need to be placed in the scene. The speakers and microphones work together to amplify the speaker's voice. However, because the speakers and microphones need to be placed separately, the placement scheme for the speakers and microphones is complex. Utility Model Content

[0004] This application provides an integrated speaker and microphone device, which integrates the speaker and microphone into a single device to achieve integrated installation of the microphone and speaker, thereby improving the efficiency of microphone and speaker placement. Furthermore, it utilizes flexible connectors to dampen speaker vibration, reducing the probability of speaker vibration being transmitted to the microphone, thus reducing the impact of vibration on the microphone and improving the microphone's sound pickup performance.

[0005] This application provides an integrated audio and microphone device, including a first housing, a second housing, a flexible connector, an audio speaker, and a microphone. The first housing forms an open mounting cavity. The second housing covers the first housing and is connected to the first housing, and the second housing and the first housing cooperate to form a receiving cavity. The flexible connector is connected to the first housing and is disposed at the opening. The audio speaker is mounted on the flexible connector and disposed within the mounting cavity. The microphone is disposed within the receiving cavity and is connected to the first housing and / or the second housing.

[0006] Based on the above embodiments, by integrating the speaker and microphone into a single device, the efficiency of microphone and speaker placement can be improved. Furthermore, since the speaker is mounted on a flexible connector connected to the first housing, and the speaker and the inner wall of the first housing are spaced apart, the speaker vibrates during operation, causing the flexible connector to deform and absorb the vibration. This reduces the transmission of speaker vibration to the first housing, thereby reducing the probability of the first housing causing microphone vibration and thus reducing the impact of vibration on the microphone. This improves microphone pickup and ultimately enhances speaker amplification quality. Moreover, since the speaker is housed within the mounting cavity and the microphone within the receiving cavity, the probability of speaker sound wave vibration being transmitted to the microphone is further reduced, further decreasing the probability of microphone vibration and further improving microphone pickup and speaker amplification quality.

[0007] In some embodiments, the flexible connector is provided with a cover opening.

[0008] Based on the above embodiments, by using a flexible connector to seal the opening, the probability of impurities entering the mounting cavity through the opening can be reduced, thereby protecting the speaker, reducing the probability of speaker damage, and thus enabling the speaker to have a longer service life, which in turn enables the integrated speaker and microphone device to have a longer service life.

[0009] In some embodiments, the flexible connector includes a first connecting portion, a second connecting portion, and a pleated portion. The first connecting portion is connected to a first housing; the second connecting portion is connected to a speaker and has a sound outlet through which the speaker can emit sound; the pleated portion is connected to the first connecting portion and the second connecting portion.

[0010] Based on the above embodiments, when the speaker vibrates, the pleats can deform to absorb the speaker's vibration, thereby reducing the transmission of the speaker's vibration to the first housing, reducing the probability of the first housing vibrating, and further reducing the probability of the microphone vibrating, thus reducing the impact of vibration on the microphone, improving the microphone's sound pickup effect, and improving the speaker's amplification quality.

[0011] In some embodiments, the first housing includes a first housing body and an extension portion. The first housing body has an opening. The extension portion is disposed at the opening and connected to the outer surface of the first housing body, and extends in a direction away from the opening. The extension portion has a first microphone port. A microphone is connected to the extension portion and is disposed corresponding to the first microphone port. The extension portion is connected to the second housing.

[0012] Based on the above embodiments, the microphone is positioned on the outer portion so that it can be moved away from the first housing body, thereby reducing the impact of vibration of the first housing body on the microphone and improving the microphone's sound pickup effect. Furthermore, since the outer portion has a first pickup port, and the microphone is correspondingly positioned to the first pickup port, the microphone can pick up the speaker's voice through the first pickup port, improving the clarity of the sound picked up by the microphone. This sound is then played back through the speaker's output port, thereby improving the speaker's amplification quality.

[0013] In some embodiments, the microphone is an electret microphone, and the integrated audio microphone device also includes a first flexible member connected to the extension portion. The first flexible member has a fixing hole, which is correspondingly disposed with the first pickup port, and the electret microphone is disposed in the fixing hole.

[0014] Based on the above embodiments, by using a first flexible member to wrap the electret microphone, when the first housing vibrates, the first flexible member can deform to absorb the vibration of the first housing and transmit it to the electret microphone, thereby reducing the probability of the electret microphone vibrating and improving the sound pickup effect of the electret microphone, thus improving the sound amplification quality of the audio system.

[0015] In some embodiments, the microphone is a microelectromechanical system (MEMS) microphone with an annular mounting groove on its extension portion. The integrated audio microphone device also includes an annular circuit board disposed within the annular mounting groove, with the MEMS microphone disposed on the annular circuit board.

[0016] Based on the above embodiments, placing the annular circuit board in the annular mounting groove can increase the contact area between the annular circuit board and the epitaxial portion, thereby improving the installation stability of the annular circuit board and thus improving the connection stability between the microphone of the microelectromechanical system and the epitaxial portion.

[0017] In some embodiments, the integrated audio microphone device further includes a second flexible member disposed on the periphery of the annular circuit board and connected to the groove wall of the annular mounting groove. The second flexible member is used to generate deformation to reduce the vibration transmission from the extension portion to the annular circuit board.

[0018] Based on the above embodiments, the deformable second flexible member can be used to fill the gap between the annular circuit board and the wall of the annular mounting groove, thereby improving the connection stability between the annular circuit board and the annular mounting groove. Furthermore, when the first housing vibrates, the second flexible member can deform, thereby absorbing the vibration generated by the first housing, reducing the transmission of the vibration of the first housing to the annular circuit board, and thus reducing the probability of the annular circuit board vibrating, thereby reducing the probability of the microelectromechanical system microphone vibrating, improving the microphone's pickup effect, and ultimately improving the sound amplification quality of the audio system.

[0019] In some embodiments, the first housing further includes an annular sound insulation portion that protrudes from the outer extension on the side away from the second housing and is located between the opening and the first pickup port.

[0020] Based on the above embodiments, by placing the annular sound insulation part between the opening and the first pickup port, the probability of sound from the sound outlet being transmitted to the pickup port can be reduced, thereby improving the accuracy of the pickup port in picking up the speaker's voice.

[0021] In some embodiments, the axis of the first pickup port is parallel to or at an acute angle to the axis of the output port.

[0022] Based on the above embodiments, when the integrated audio microphone device is installed in the installation environment, the speaker and the attendees are all located on one side of the opening. Therefore, when the axis of the first pickup port is parallel to or at an acute angle to the axis of the sound outlet, the first pickup port can be directed towards the speaker as much as possible, thereby improving the microphone's pickup effect. It can also be directed towards the attendees, thereby improving the attendees' listening effect.

[0023] In some embodiments, the second housing includes a second housing body and an inner extension. The second housing body covers the first housing. The inner extension is connected to the inner wall of the second housing body and extends toward the opening. The inner extension has a second microphone port. A microphone is connected to the inner extension and is correspondingly disposed to the second microphone port. The inner extension is connected to the first housing.

[0024] Based on the above embodiments, compared to placing the microphone on the first housing, placing the microphone in the inner extension can further reduce the probability of the speaker's vibration being transmitted to the microphone, thereby reducing the probability of microphone vibration and improving the microphone's sound pickup effect, thus improving the speaker's amplification quality.

[0025] In some embodiments, the integrated audio microphone device further includes a third flexible member, which is arranged around the periphery of the first housing and connected to the outer surface and inner extension of the first housing. The third flexible member is used to generate deformation to reduce the vibration transmission from the first housing to the inner extension.

[0026] Based on the above embodiments, the third flexible member connects the first housing and the second housing. When the first housing vibrates, the third flexible member can deform to absorb the vibration transmission from the first housing to the second housing, thereby reducing the vibration transmission from the first housing to the inner extension, reducing the probability of microphone vibration, and thus improving the microphone's sound pickup effect and the sound amplification quality of the audio system.

[0027] In some embodiments, the speaker includes a speaker body and a housing, with the speaker body emitting sound towards the opening; the housing is disposed on the side of the speaker body away from the opening and connected to the periphery of the speaker body, and the housing is connected to a flexible connector.

[0028] Based on the above embodiments, since the speaker includes a speaker body and a housing, and the cavity enclosed by the housing and the speaker body serves as the resonant cavity of the speaker body, it is possible to avoid using the receiving cavity as the resonant cavity of the speaker body, thereby reducing the probability of vibration of the first housing, which in turn reduces the probability of vibration being transmitted to the microphone, thereby improving the microphone's sound pickup effect and improving the speaker's amplification quality.

[0029] In some embodiments, the integrated speaker and microphone device also includes a main control board disposed within a housing cavity and electrically connected to the speaker and microphone.

[0030] Based on the above embodiments, the microphone acquires sound wave signals and converts them into electrical signals, which are then transmitted to the main control board. The main control board then controls the speaker to amplify the sound through the output port.

[0031] In some embodiments, the integrated audio microphone device also includes a boom connected to the second housing and used to hoist the integrated audio microphone device to the installation environment.

[0032] Based on the above embodiments, the integrated microphone and speaker device is transported to the installation environment using a boom pole to achieve integrated installation of the microphone and speaker. Compared with separate placement of the microphone and speaker, this can improve the placement efficiency of the microphone and speaker. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 This is a schematic diagram of the structure of an integrated audio microphone device in one embodiment of this application;

[0035] Figure 2 For along Figure 1 Schematic diagram of the cross-sectional structure of line AA in the middle;

[0036] Figure 3 for Figure 2 A magnified structural diagram at point B in the middle.

[0037] Explanation of reference numerals in the attached drawings: 1. Integrated audio and microphone device; 11. First housing; 11A. Opening; 11B. Mounting cavity; 111. First housing body; 112. Extension; 112A. First pickup port; 112B. Annular mounting groove; 113. Annular sound insulation part; 12. Second housing; 12A. Receiving cavity; 13. Flexible connector; 131. First connecting part; 132. Second connecting part; 132A. Sound outlet; 133. Folded part; 1331. First sub-part; 1332. Second sub-part; 14. Audio speaker; 141. Audio speaker body; 142. Outer shell; 15. Microphone; 16. Annular circuit board; 17. Second flexible component; 18. Main control board; 19. Hanging rod. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0039] In related technical fields, existing teaching and meeting scenarios often require capturing and amplifying the speaker's voice so that attendees can hear it clearly. Typically, this involves setting up a microphone for the speaker and arranging sound systems in the setting; the microphone and sound system work together to amplify the speaker's voice.

[0040] However, the need for separate placement of speakers and microphones makes the placement of speakers and microphones complex.

[0041] In this embodiment, by fabricating the speaker 14 and microphone 15 into an integrated speaker-microphone device 1, the microphone 15 and speaker 14 are integrated into one unit. Compared to arranging the microphone 15 and speaker 14 separately, the arrangement efficiency of the microphone 15 and speaker 14 can be improved. Furthermore, the flexible connector 13 can be used to dampen the speaker 14, thereby reducing the probability of vibration from the speaker 14 being transmitted to the microphone 15, reducing the impact of vibration on the microphone 15, and improving the sound pickup effect of the microphone 15.

[0042] Please refer to Figure 1 and Figure 2 This application provides an integrated audio and microphone device 1, which includes a first housing 11, a second housing 12, a flexible connector 13, an audio speaker 14, and a microphone 15.

[0043] The first housing 11 forms a mounting cavity 11B with an opening 11A. The speaker 14 is disposed within the mounting cavity 11B, and the microphone 15 is disposed outside the first housing 11. This allows the first housing 11 to limit the transmission of vibrations from the speaker 14 to the microphone 15, thereby reducing the vibration of the microphone 15 and improving its sound pickup performance. Furthermore, the speaker 14 is protected by the first housing 11 within the mounting cavity 11B, reducing the probability of damage and extending its lifespan. This, in turn, extends the lifespan of the speaker-microphone integrated device 1. For example, the first housing 11 can be a hemispherical shell or a cubic shell. In this embodiment, the shape of the first housing 11 is not specifically limited. For example, the material of the first housing 11 can be metal or plastic. In this embodiment, the material of the first housing 11 is not specifically limited.

[0044] The second housing 12 is fitted over and connected to the first housing 11. The second housing 12 and the first housing 11 cooperate to form a receiving cavity 12A. The microphone 15 is disposed within the receiving cavity 12A, thereby protecting the microphone 15 and reducing the probability of damage to the microphone 15. For example, the second housing 12 can be a hemispherical shell or a cubic shell. In this embodiment, the shape of the second housing 12 is not specifically limited. For example, the material of the second housing 12 can be metal or plastic; in this embodiment, the material of the second housing 12 is not specifically limited.

[0045] The flexible connector 13 is connected to the first housing 11 and is located at the opening 11A. The speaker 14 is mounted on the flexible connector 13. When the speaker 14 is working, it vibrates, causing the flexible connector 13 to deform and absorb the vibration of the speaker 14. This reduces the transmission of the speaker 14's vibration to the first housing 11, thereby reducing the vibration of the first housing 11 and consequently reducing the probability that the first housing 11 will cause the microphone 15 to vibrate. This reduces the impact of vibration on the microphone 15 and improves the microphone 15's sound pickup performance. For example, the flexible connector 13 can be made of silicone or rubber.

[0046] In this embodiment, the speaker 14 is placed in the mounting cavity 11B and the microphone 15 is placed in the receiving cavity 12A. A first housing 11 is provided between the mounting cavity 11B and the receiving cavity 12A. The first housing 11 reduces the transmission of sound waves from the speaker 14 to the microphone 15, thereby reducing the influence of the speaker 14 on the microphone 15 and improving the sound pickup effect of the microphone 15.

[0047] Furthermore, since the speaker 14 vibrates when it is working, the flexible connector 13 deforms to absorb the vibration of the speaker 14, thereby reducing the transmission of the vibration of the speaker 14 to the first housing 11, thereby reducing the vibration of the first housing 11, and further reducing the probability that the first housing 11 will cause the microphone 15 to vibrate, thereby reducing the impact of vibration on the microphone 15 and improving the sound pickup effect of the microphone 15.

[0048] Please refer to Figure 1 and Figure 2 In one embodiment, the flexible connector 13 is provided to cover the opening 11A, which can reduce the probability of impurities entering the mounting cavity 11B through the opening 11A, thereby protecting the speaker 14 and reducing the probability of damage to the speaker 14, so that the speaker 14 can have a longer service life, and thus the speaker-microphone integrated device 1 can have a longer service life.

[0049] Please refer to Figure 1 and Figure 2 In one embodiment, the flexible connector 13 includes a first connecting portion 131, a second connecting portion 132, and a pleated portion 133. The first connecting portion 131 is connected to the first housing 11; the second connecting portion 132 is connected to the speaker 14 and has a sound outlet 132A through which the speaker 14 can emit sound; the pleated portion 133 is connected to both the first connecting portion 131 and the second connecting portion 132. When the speaker 14 vibrates, the pleated portion 133 can deform to absorb the vibration of the speaker 14, thereby reducing the transmission of the vibration of the speaker 14 to the first housing 11, thus reducing the probability of the first housing 11 vibrating, and consequently reducing the probability of the microphone 15 vibrating, thereby reducing the impact of vibration on the microphone 15, improving the sound pickup effect of the microphone 15, and thus improving the amplification quality of the speaker 14.

[0050] Please refer to Figure 1 and Figure 2 Specifically, the pleated portion 133 may include a first sub-portion 1331 and a second sub-portion 1332. The first sub-portion 1331 is arranged around the second connecting portion 132 and extends towards the inner wall of the first housing 11. The second sub-portion 1332 is arranged around the second connecting portion 132 and extends away from the inner wall of the first housing 11. The first sub-portion 1331 and the second sub-portion 1332 are connected and are alternately arranged. By using multiple first sub-portions 1331 and multiple second sub-portions 1332 to form the pleated portion 133, the pleated portion 133 can have a large degree of deformation, thereby absorbing more vibrations from the speaker 14, reducing the probability of vibrations being transmitted to the microphone 15, reducing the impact of vibrations on the microphone 15, improving the sound pickup effect of the microphone 15, and thus improving the sound amplification quality of the speaker 14.

[0051] Please refer to Figure 1 and Figure 2 In one embodiment, the first housing 11 includes a first housing body 111 and an extension portion 112. The first housing body 111 has an opening 11A; the extension portion 112 is disposed at the opening 11A and connected to the outer surface of the first housing body 111, extending away from the opening 11A. The extension portion 112 has a first microphone port 112A. A microphone 15 is connected to the extension portion 112 and correspondingly disposed to the first microphone port 112A. The extension portion 112 is connected to the second housing 12. By disposing the microphone 15 on the extension portion 112, the microphone 15 can be moved away from the first housing body 111, thereby reducing the impact of vibration of the first housing body 111 on the microphone 15 and improving the microphone 15's sound pickup effect. Furthermore, since the extension portion 112 has a first pickup port 112A, and the microphone 15 is correspondingly set with the first pickup port 112A, the microphone 15 can pick up the speaker's voice through the first pickup port 112A, which can improve the clarity of the sound picked up by the microphone 15. Then, the sound is played through the speaker 14 via the sound outlet 132A, thereby improving the amplification quality of the speaker 14.

[0052] Please refer to Figure 1 and Figure 2 In one embodiment, the microphone 15 can be an electret microphone (ECM). The integrated audio microphone device 1 also includes a first flexible member (not shown in the figure), which is connected to the extension portion 112. The first flexible member has a fixing hole (not shown in the figure), which is correspondingly provided with the first pickup port 112A. The electret microphone is disposed in the fixing hole. By using the first flexible member to wrap the electret microphone, when the first housing 11 vibrates, the first flexible member can deform to absorb the vibration of the first housing 11 and transmit it to the electret microphone. This can reduce the probability of the electret microphone vibrating and improve the pickup effect of the electret microphone, thereby improving the amplification quality of the audio 14.

[0053] Understandably, the first flexible element may include at least one of a silicone pad or foam adhesive, both of which can wrap around the electret microphone and deform to absorb vibrations of the first housing 11 that are transmitted to the electret microphone.

[0054] Please refer to Figure 2 and Figure 3In one embodiment, the microphone 15 can be a microelectromechanical system microphone (MEMS microphone, MEMS). The epitaxial portion 112 has an annular mounting groove 112B. The integrated audio microphone device 1 also includes an annular circuit board 16, which is disposed in the annular mounting groove 112B. The microphone 15 is disposed on the annular circuit board 16. By disposing of the annular circuit board 16 in the annular mounting groove 112B, the contact area between the annular circuit board 16 and the epitaxial portion 112 can be increased, thereby improving the installation stability of the annular circuit board 16 and thus improving the connection stability between the microelectromechanical system microphone and the epitaxial portion 112.

[0055] It is understandable that the first pickup port 112A can be set at the bottom of the annular mounting groove 112B, so that after the annular circuit board 16 is installed in the annular mounting groove 112B, it is easy to align the microelectromechanical system microphone with the first pickup port 112A, which can reduce the assembly difficulty and improve the assembly efficiency of the integrated audio microphone device 1.

[0056] It is understood that in other embodiments, the extension portion 112 may also have multiple mounting slots (not shown in the figure), with adjacent mounting slots spaced apart. Each mounting slot corresponds one-to-one with the first microphone port 112A, and each microphone 15 is correspondingly disposed in its respective mounting slot and corresponding to the first microphone port 112A. For example, the number of microphones 15 in this application may be 4, 5, 6, 7, 8, etc. In other embodiments, the number of microphones 15 may also be other. In this embodiment, the number of microphones 15 is not specifically limited.

[0057] Please refer to Figure 2 and Figure 3 In one embodiment, the integrated audio microphone device 1 may further include a second flexible member 17. The second flexible member 17 is disposed on the periphery of the annular circuit board 16 and connected to the groove wall of the annular mounting groove 112B. The deformable second flexible member 17 can fill the gap between the annular circuit board 16 and the groove wall of the annular mounting groove 112B to improve the connection stability between the annular circuit board 16 and the annular mounting groove 112B. Furthermore, when the first housing 11 vibrates, the second flexible member 17 can deform to absorb the vibration generated by the first housing 11, thereby reducing the transmission of the vibration of the first housing 11 to the annular circuit board 16. This reduces the probability of the annular circuit board 16 vibrating, thereby reducing the probability of the microphone 15 vibrating, improving the sound pickup effect of the microphone 15, and thus improving the sound amplification quality of the audio speaker 14.

[0058] Please refer to Figure 2 and Figure 3In one embodiment, the first housing 11 further includes an annular sound insulation portion 113, which protrudes from the side of the extension portion 112 away from the second housing 12 and is located between the opening 11A and the first pickup port 112A. This can reduce the probability of sound from the sound outlet 132A being transmitted to the first pickup port 112A, thereby improving the accuracy of the first pickup port 112A in picking up the speaker's voice.

[0059] Please refer to Figure 1 and Figure 2 In one embodiment, the axis of the first pickup port 112A is parallel to or at an acute angle to the axis of the output port 132A. When the integrated audio-microphone device 1 is installed in the environment, the speaker and attendees are all located on one side of the opening 11A. Therefore, when the axis of the first pickup port 112A is parallel to or at an acute angle to the axis of the output port 132A, the first pickup port 112A can be oriented as much as possible toward the speaker, thereby improving the sound pickup effect of the microphone 15. It can also make the output port 132A face toward the attendees, thereby improving the listening effect for the attendees.

[0060] Please refer to Figure 1 and Figure 2 In this embodiment, the axis of the first pickup port 112A and the axis of the sound outlet 132A can both be arranged in the vertical direction. In other embodiments, the included angle between the axis of the first pickup port 112A and the axis of the sound outlet 132A can be other acute angles.

[0061] In other embodiments, the second housing 12 may include a second housing body (not shown in the figure) and an inner extension (not shown in the figure). The second housing body covers the first housing 11. The inner extension is connected to the inner wall of the second housing body and extends in a direction close to the opening 11A. The inner extension has a second pickup port. The microphone 15 is connected to the inner extension and is correspondingly arranged with the second pickup port. The inner extension is connected to the first housing 11. By placing the microphone 15 in the inner extension, the probability of the vibration of the speaker 14 being transmitted to the microphone 15 can also be reduced. In order to reduce the probability of the microphone 15 vibrating, the pickup effect of the microphone 15 can be improved, thereby improving the amplification quality of the speaker 14.

[0062] Furthermore, the integrated audio microphone device 1 may also include a third flexible member (not shown in the figure). The third flexible member is arranged around the periphery of the first housing 11 and is connected to the outer surface and inner extension of the first housing 11. When the first housing 11 vibrates, the third flexible member can deform to absorb the vibration transmission from the first housing 11 to the second housing 12, thereby reducing the vibration transmission from the first housing 11 to the inner extension, reducing the probability of the microphone 15 vibrating, and thus improving the sound pickup effect of the microphone 15, thereby improving the sound amplification quality of the audio 14.

[0063] Please refer to Figure 2 In one embodiment, the speaker 14 includes a speaker body 141 and a housing 142. The speaker body 141 emits sound towards the opening 11A. The housing 142 covers the side of the speaker body 141 away from the opening 11A and is connected to the periphery of the speaker body 141. The housing 142 is connected to a flexible connector 13. The cavity enclosed by the housing 142 and the speaker body 141 serves as the resonant cavity of the speaker body 141. This avoids using the receiving cavity 12A as the resonant cavity of the speaker body 141, thereby reducing the probability of vibration of the first housing 11 and reducing the probability of vibration being transmitted to the microphone 15. This improves the sound pickup effect of the microphone 15 and enhances the amplification quality of the speaker 14.

[0064] Please refer to Figure 2 In one embodiment, the integrated speaker and microphone device 1 further includes a main control board 18, which is disposed within the receiving cavity 12A and electrically connected to the speaker 14 and microphone 15. The microphone 15 acquires sound wave signals and converts them into electrical signals, which are then transmitted to the main control board 18. The main control board 18 controls the speaker 14 to amplify the sound through the sound outlet 132A. It is understood that both the first housing 11 and the second housing 12 have through holes for wiring to facilitate electrical connection between the main control board 18 and the microphone 15 and speaker 14.

[0065] Please refer to Figure 1 and Figure 2 In one embodiment, the integrated audio-microphone device 1 further includes a boom 19 connected to the second housing 12. The boom 19 is used to lift the integrated audio-microphone device 1 to the installation environment to achieve integrated installation of the microphone 15 and the speaker 14. Compared with the separate arrangement of the microphone 15 and the speaker 14, the arrangement efficiency of the microphone 15 and the speaker 14 can be improved.

[0066] In the accompanying drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components. In the description of this application, it should be understood that if terms such as "upper," "lower," "left," and "right" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, they are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the accompanying drawings are only for illustrative purposes and should not be construed as limiting this patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0067] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A device integrating an audio microphone, characterized in that, include: The first housing forms an installation cavity with an opening; The second housing covers the first housing and is connected to the first housing. The second housing and the first housing cooperate to form a receiving cavity. A flexible connector is connected to the first housing and is disposed at the opening; The speaker is mounted on the flexible connector and disposed within the mounting cavity; A microphone is disposed within the receiving cavity and connected to the first housing and / or the second housing.

2. The integrated audio microphone device as described in claim 1, characterized in that, The flexible connector covers the opening.

3. The integrated audio microphone device as described in claim 1, characterized in that, The flexible connector includes: The first connecting part is connected to the first housing. The second connecting part is connected to the speaker, and the second connecting part has a sound outlet, through which the speaker can emit sound; The pleated portion is connected to the first connecting portion and the second connecting portion.

4. The integrated audio microphone device as described in claim 1, characterized in that, The first housing includes: The first shell body has the opening; An extension portion is disposed at the opening and connected to the outer surface of the first shell body, and extends in a direction away from the opening. The extension portion has a first microphone port. The microphone is connected to the extension portion and is disposed corresponding to the first microphone port. The extension portion is connected to the second shell.

5. The integrated audio microphone device as described in claim 4, characterized in that, The microphone is an electret microphone, and the integrated audio microphone device also includes: A first flexible member is connected to the extended portion. The first flexible member has a fixing hole, which is correspondingly disposed with the first pickup port. The electret microphone is disposed within the fixing hole.

6. The integrated audio microphone device as described in claim 4, characterized in that, The microphone is a microelectromechanical system microphone, the outer portion has an annular mounting groove, and the integrated audio microphone device further includes: A ring-shaped circuit board is disposed within the ring-shaped mounting groove, and the microelectromechanical system microphone is disposed on the ring-shaped circuit board.

7. The integrated audio microphone device as described in claim 6, characterized in that, Also includes: The second flexible member is disposed on the periphery of the annular circuit board and connected to the groove wall of the annular mounting groove. The second flexible member is used to generate deformation to reduce the vibration transmission from the extension portion to the annular circuit board.

8. The integrated audio microphone device as described in claim 4, characterized in that, The first housing also includes: An annular sound insulation portion protrudes from the side of the outer extension away from the second housing and is located between the opening and the first pickup port.

9. The integrated audio microphone device as described in claim 4, characterized in that, The flexible connector has a sound outlet corresponding to the speaker, and the axis of the first pickup port is parallel to or at an acute angle to the axis of the sound outlet.

10. The integrated audio microphone device as described in claim 1, characterized in that, The second housing includes: The second shell body is fitted over the first shell body; The inner extension is connected to the inner wall of the second shell body and extends towards the opening. The inner extension has a second microphone port. The microphone is connected to the inner extension and is correspondingly arranged with the second microphone port. The inner extension is connected to the first shell.

11. The integrated audio microphone device as described in claim 10, characterized in that, Also includes: A third flexible member is arranged around the periphery of the first housing and connected to the outer surface of the first housing and the inner extension. The third flexible member is used to generate deformation to reduce the vibration transmission from the first housing to the inner extension.

12. The integrated audio microphone device as described in claim 1, characterized in that, The audio system includes: The speaker body has its sound output direction facing the opening; The outer shell covers the side of the speaker body opposite to the opening and is connected to the periphery of the speaker body. The outer shell is connected to the flexible connector.

13. The integrated audio microphone device as described in claim 1, characterized in that, Also includes: The main control board is located inside the cavity and is electrically connected to the speaker and the microphone.

14. The integrated audio microphone device as described in any one of claims 1 to 13, characterized in that, Also includes: A boom, connected to the second housing, is used to hoist the integrated audio microphone device to the installation environment.

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