A laser positioning device for assembling a multilayer wiring board

Abstract

The utility model discloses a kind of laser positioning devices for multilayer circuit board assembly, more specifically to multilayer circuit board assembly technical field, including support plate, the top of support plate is equipped with fixed plate, the side corner of support plate both sides is evenly provided with screw rod, the center of support plate is provided with supporting plate, the outer wall both ends of screw rod are evenly provided with sliding plate;The bottom of fixed plate is provided with extrusion plate, the center of fixed plate is fixedly connected with hydraulic push rod, the corner of fixed plate is fixedly connected with slide bar;The side of sliding plate away from support plate center is evenly installed with moving plate, and the end of moving plate is installed with laser level;The top of supporting plate is installed with circuit board, and the diagonal of supporting plate is evenly provided with extrusion block.The utility model has the advantages of being convenient to adjust, different laser positioning, convenient to limit multiple circuit boards, and being convenient to multilayer circuit board compression assembly.

Description

Technical Field

[0001] This utility model relates to the field of multilayer circuit board assembly technology, and specifically to a laser positioning device for multilayer circuit board assembly. Background Technology

[0002] The manufacturing process of multilayer boards generally involves first creating the inner layer pattern, then using printing and etching to create a single-sided or double-sided substrate, which is then placed into the designated interlayer. After heating and pressing, the substrate is bonded together. The subsequent drilling process is the same as the plated through-hole method for double-sided boards.

[0003] A multilayer circuit board pressing device, with existing patent number CN222464970U, includes a main body with a lifting plate internally connected to it. A pressing plate is located at the bottom of the lifting plate, and a driving mechanism connected to the lifting plate is fixed at the top of the main body. A power line is connected between the driving mechanism and the main body. An assembly and stabilizing mechanism is provided between the pressing plate and the lifting plate. A wire fixing mechanism is provided on the surface of the driving mechanism. The assembly and stabilizing mechanism includes a sliding component located at the connection between the pressing plate and the lifting plate. Through the designed sliding groove, slider, guide groove, and guide block, the pressing plate and the lifting plate can be accurately slidably connected. Simultaneously, with the designed limiting groove, limiting buckle, positioning hole, and positioning screw, the pressing plate can be firmly positioned, allowing the pressing plate to stably press the multilayer circuit board.

[0004] The aforementioned existing technology has some shortcomings in its use. The device needs to be fixed through corresponding guide grooves and guide blocks, but ordinary circuit boards do not have guide blocks installed on their surfaces. Therefore, additional installation and fixing are required during the fixing process, which is not convenient. At the same time, there is a lack of auxiliary positioning structure during installation. If the installation is misaligned, it cannot be observed in time, which leads to a low yield rate during subsequent pressing. Therefore, a laser positioning device for multilayer circuit board assembly is needed to solve the problem of the lack of positioning mechanism in the existing equipment. Utility Model Content

[0005] The purpose of this invention is to provide a laser positioning device for assembling multilayer circuit boards, which solves the problems of existing devices lacking positioning devices and being inconvenient to fix.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a laser positioning device for assembling multilayer circuit boards, comprising a support plate, a fixing plate installed on the top of the support plate, lead screws provided on both sides of one corner of the support plate, a support plate provided at the center of the support plate, and sliding plates provided at both ends of the outer wall of the lead screws;

[0007] A pressing plate is provided at the bottom of the fixed plate, a hydraulic push rod is fixedly connected at the center of the fixed plate, and a sliding rod is fixedly connected at each corner of the fixed plate.

[0008] Each sliding plate is equipped with a movable plate on the side of the sliding plate away from the center of the support plate, and a laser level is installed at one end of the movable plate.

[0009] A circuit board is installed on the top of the support plate, and pressing blocks are provided at opposite corners of the support plate. An electric push rod is connected to the side of the pressing block closest to the sliding plate.

[0010] Preferably, the top of the support plate is slidably connected to the bottom of the sliding plate, both ends of the outer wall of the lead screw are threadedly connected to the sliding plate, the thread directions of the two ends of the outer wall of the lead screw are opposite, and both ends of the bottom of the support plate are provided with support legs.

[0011] Preferably, a magnet is installed at one end of the outer wall of the electric push rod, and the electric push rod is fixed to the side wall of the sliding plate by the magnet. The inner protruding end of the electric push rod is fixedly connected to the extrusion block.

[0012] Preferably, one end of the movable plate is slidably connected to the side wall of the sliding plate, and a fixing bolt is threaded inside the end of the movable plate near the sliding plate. One end of the fixing bolt passes through the interior of the movable plate and fits against the side of the sliding plate.

[0013] Preferably, the extrusion block has a slot at the corner near the circuit board, and the corner of the circuit board corresponds to and fits into the slot inside the electric push rod. An electric lifting rod is installed at the bottom of the support plate, and the electric lifting rod is fixedly connected to the support plate.

[0014] Preferably, the bottom protruding end of the hydraulic push rod is fixedly connected to the top center of the extrusion plate, and the corners of the extrusion plate are slidably connected to the slide rod.

[0015] The technical effects and advantages provided by this utility model in the above technical solution are as follows:

[0016] 1. When the lead screw rotates, it can easily move the two sliding plates closer or further apart. The sliding plates can drive the moving plate to move, which in turn drives the laser level to move, thereby adjusting the position of the laser level. At the same time, the fixing bolts can be released, allowing the moving plate to move up and down easily, which in turn drives the laser level to move up and down, further adjusting the position of the laser level. This can easily meet the needs of installing and positioning circuit boards of different sizes.

[0017] 2. The sliding plate drives the electric push rod to move, thereby adjusting the position of the extrusion block. Since one end of the electric push rod is magnetically attached to the sliding plate, the height of the electric push rod can be easily adjusted according to the height of the installed circuit board, thus adjusting the position and height of the extrusion block. The electric push rod can then be easily activated, extending to move the extrusion block to one side of the circuit board, thereby achieving the fit between the groove of the extrusion block and the edge of the circuit board, thus limiting the position of the circuit board. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings.

[0019] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0020] Figure 2 This is a front view of the present invention;

[0021] Figure 3 This is a schematic diagram of the top structure of the support plate of this utility model;

[0022] Figure 4 This is a top view of the top structure of the support plate of this utility model;

[0023] Figure 5 This is a schematic diagram of the external connection structure of the support plate of this utility model.

[0024] Explanation of reference numerals in the attached figures:

[0025] 1. Support plate; 2. Fixing plate; 201. Extrusion plate; 202. Hydraulic push rod; 203. Slide rod; 3. Lead screw; 4. Support plate; 401. Circuit board; 402. Extrusion block; 403. Electric push rod; 404. Electric lifting rod; 5. Sliding plate; 501. Moving plate; 502. Fixing bolt; 503. Laser level. Detailed Implementation

[0026] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings.

[0027] This utility model provides, for example Figures 1-5The laser positioning device for assembling multilayer circuit boards shown includes a support plate 1, a fixed plate 2 mounted on the top of the support plate 1, lead screws 3 on both sides of one corner of the support plate 1, a support plate 4 at the center of the support plate 1, and sliding plates 5 at both ends of the outer wall of the lead screws 3; a pressing plate 201 at the bottom of the fixed plate 2, a hydraulic push rod 202 fixedly connected to the center of the fixed plate 2, and sliding rods 203 fixedly connected to the corners of the fixed plate 2; a moving plate 501 mounted on the side of the sliding plate 5 away from the center of the support plate 1, and a laser level 503 mounted on one end of the moving plate 501; a circuit board 401 mounted on the top of the support plate 4, pressing blocks 402 at opposite corners of the support plate 4, and an electric push rod 403 connected to the side of the pressing blocks 402 near the sliding plate 5.

[0028] The lead screw 3 drives the sliding plate 5 to move along the top of the support plate 1. Since the threads at both ends of the lead screw 3 are reversed, the two sliding plates 5 can be easily moved closer or further apart during rotation. The sliding plates 5 can drive the moving plate 501 to move, which in turn drives the laser level 503 to move, thereby adjusting the position of the laser level 503. The hydraulic push rod 202 is activated, which drives the extrusion plate 201 to move to the bottom along the slide rod 203. Since the electric push rod 403 is only fixed to the side wall of the sliding plate 5 by magnetic attraction, when the extrusion plate 201 extrudes to the bottom, it can easily push the extrusion block 402 to the bottom, so that the electric push rod 403 is also pushed to the bottom, avoiding extrusion block 402, thereby extruding the circuit board 401.

[0029] like Figure 3 , Figure 4 As shown, the top of the support plate 1 is slidably connected to the bottom of the sliding plate 5. Both ends of the outer wall of the lead screw 3 are threadedly connected to the sliding plate 5, and the thread directions of the two ends of the outer wall of the lead screw 3 are opposite. Both ends of the bottom of the support plate 1 are provided with support legs. One side wall of the moving plate 501 is slidably connected to the side wall of the sliding plate 5. The inner thread of the moving plate 501 near the sliding plate 5 is connected to a fixing bolt 502. One end of the fixing bolt 502 passes through the interior of the moving plate 501 and fits against the side of the sliding plate 5, so that the lead screw 3 drives the sliding plate 5 to move along the top of the support plate 1. At the same time, since the threads at both ends of the lead screw 3 are opposite, it can easily drive the two sliding plates 5 to move closer or further apart when rotating. The moving plate 501 can be moved by the sliding plate 5, which in turn drives the laser level 503 to move, thereby realizing the adjustment of the position of the laser level 503. At the same time, the fixing bolt 502 can be released, so that the moving plate 501 can be easily raised and lowered, thereby driving the laser level 503 to move up and down, and further adjusting the position of the laser level 503.

[0030] like Figure 2 ,Figure 5 As shown, a magnet is installed at one end of the outer wall of the electric push rod 403. The electric push rod 403 is fixed to the side wall of the sliding plate 5 by the magnet. The inner protruding end of the electric push rod 403 is fixedly connected to the pressing block 402. A slot is provided at the corner of the pressing block 402 near the circuit board 401. The corner of the circuit board 401 corresponds to the slot inside the electric push rod 403. An electric lifting rod 404 is installed at the bottom of the support plate 4. The electric lifting rod 404 is fixedly connected to the support plate 1. The sliding plate 5 drives the electric push rod 403 to move, so that... The position of the pressing block 402 is adjusted. At the same time, since one end of the electric push rod 403 is fixed to the sliding plate 5 by a magnet, the height of the electric push rod 403 can be easily adjusted according to the height of the installed circuit board 401, thereby adjusting the position and height of the pressing block 402. Then, the electric push rod 403 can be easily started, and the electric push rod 403 extends to move the pressing block 402 to one side of the circuit board 401, thereby making the groove of the pressing block 402 fit with the edge of the circuit board 401, thus limiting the position of the circuit board 401.

[0031] like Figure 1 , Figure 2 As shown, the bottom protruding end of the hydraulic push rod 202 is fixedly connected to the top center of the extrusion plate 201. The corners of the extrusion plate 201 are slidably connected to the slide rod 203, which facilitates the activation of the hydraulic push rod 202, thereby driving the extrusion plate 201 to move to the bottom along the slide rod 203. At the same time, since the electric push rod 403 is only fixed to the side wall of the slide plate 5 by magnetic adsorption, when the extrusion plate 201 is extruded to the bottom, it can easily push the extrusion block 402 to the bottom, so that the electric push rod 403 is also pushed to the bottom, avoiding extrusion block 402 being extruded, thereby realizing the extrusion of the circuit board 401 and realizing the pressing and assembly of the circuit board 401. It can easily realize the fixing and extrusion of the circuit board 401.

[0032] In use, the corresponding circuit board 401 can be easily placed on the surface of the support plate 4, and then the laser level 503 can be activated. Then, according to the required size of the circuit board 401, the two lead screws 3 can be rotated. Since the sliding plate 5 is threadedly connected to the lead screw 3, and the bottom of the sliding plate 5 is slidably connected to the top of the support plate 1, the lead screw 3 can drive the sliding plate 5 to move along the top of the support plate 1. At the same time, since the threads at both ends of the lead screw 3 are reversed, the two sliding plates 5 can be easily moved closer or further apart during rotation. The sliding plate 5 can drive the moving plate 501 to move, which in turn drives the laser level 503 to move, thereby adjusting the position of the laser level 503. At the same time, the fixing bolts 502 can be released, so that the moving plate 501 can be easily raised and lowered, thereby driving the laser level 503 to move up and down, and further adjusting the position of the laser level 503. This can easily meet the installation and positioning needs of circuit boards 401 of different sizes.

[0033] When installing circuit board 401, the sliding plate 5 can be easily moved by rotating the lead screw 3, which in turn moves the electric push rod 403, thus adjusting the position of the pressing block 402. Since one end of the electric push rod 403 is magnetically attached to the sliding plate 5, its height can be easily adjusted according to the height of the installed circuit board 401, thereby adjusting the position and height of the pressing block 402. Then, the electric push rod 403 can be easily activated, extending to move the pressing block 402 towards one side of the circuit board 401, thus aligning the groove of the pressing block 402 with the wire. The circuit board 401 is fitted at the edge to limit its position. During compression, the hydraulic push rod 202 can be easily activated, which in turn drives the compression plate 201 to move to the bottom along the slide rod 203. At the same time, since the electric push rod 403 is only fixed to the side wall of the slide plate 5 by magnetic attraction, when the compression plate 201 is compressed to the bottom, the compression block 402 can be easily pushed to the bottom, so that the electric push rod 403 is also pushed to the bottom, avoiding compression of the compression block 402. This achieves compression of the circuit board 401, realizing the compression assembly of the circuit board 401, and facilitating the fixation and compression of the circuit board 401.

[0034] The foregoing description only illustrates certain exemplary embodiments of the present invention. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A laser positioning device for assembling multilayer circuit boards, comprising a support plate (1), characterized in that: A fixing plate (2) is installed on the top of the support plate (1), and a screw rod (3) is provided on both sides of one corner of the support plate (1). A support plate (4) is provided at the center of the support plate (1), and a sliding plate (5) is provided at both ends of the outer wall of the screw rod (3). The bottom of the fixed plate (2) is provided with an extrusion plate (201), a hydraulic push rod (202) is fixedly connected to the center of the fixed plate (2), and a slide rod (203) is fixedly connected to the corner of the fixed plate (2). Each sliding plate (5) is equipped with a movable plate (501) on one side away from the center of the support plate (1), and a laser level (503) is installed at one end of the movable plate (501); A circuit board (401) is installed on the top of the support plate (4), and a pressing block (402) is provided at each diagonal of the support plate (4). An electric push rod (403) is connected to the side of the pressing block (402) near the sliding plate (5).

2. The laser positioning device for assembling multilayer circuit boards according to claim 1, characterized in that: The top of the support plate (1) is slidably connected to the bottom of the sliding plate (5), and both ends of the outer wall of the screw (3) are threadedly connected to the sliding plate (5). The thread directions of the outer walls of the two ends of the screw (3) are opposite, and both ends of the bottom of the support plate (1) are provided with support legs.

3. The laser positioning device for assembling multilayer circuit boards according to claim 1, characterized in that: A magnet is installed on one end of the outer wall of the electric push rod (403). The electric push rod (403) is fixed to the side wall of the sliding plate (5) by the magnet. The inner protruding end of the electric push rod (403) is fixedly connected to the extrusion block (402).

4. The laser positioning device for assembling multilayer circuit boards according to claim 1, characterized in that: One side wall of the movable plate (501) is slidably connected to the side wall of the sliding plate (5). A fixing bolt (502) is threadedly connected to the end of the movable plate (501) near the sliding plate (5). One end of the fixing bolt (502) passes through the interior of the movable plate (501) and fits against the side of the sliding plate (5).

5. The laser positioning device for assembling multilayer circuit boards according to claim 1, characterized in that: The extrusion block (402) has a slot at the corner of the side near the circuit board (401). The corner of the circuit board (401) corresponds to the slot inside the electric push rod (403). An electric lifting rod (404) is installed at the bottom of the support plate (4). The electric lifting rod (404) is fixedly connected to the support plate (1).

6. The laser positioning device for assembling multilayer circuit boards according to claim 1, characterized in that: The bottom protruding end of the hydraulic push rod (202) is fixedly connected to the top center of the extrusion plate (201), and the corners of the extrusion plate (201) are slidably connected to the slide rod (203).

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