Heat dissipation module
By combining a bendable heat pipe with a vapor chamber, and utilizing sealed connections and capillary gas-liquid conversion, the problem of heat accumulation at bends, drops, and slopes where existing vapor chambers cannot dissipate heat is solved, achieving a more efficient heat conduction effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN STONEPLUS THERMAL MANAGEMENT TECHNOLOGIES LIMITED
- Filing Date
- 2025-04-11
- Publication Date
- 2026-07-07
AI Technical Summary
Existing vapor chambers in electronic products such as mobile phones and tablets often fail to dissipate heat effectively due to their planar structure, resulting in localized areas such as bends, drops, and slopes that cannot dissipate heat. This leads to overheating and excessively high temperatures in the device.
A combination of bendable heat pipes and a vapor chamber is used, and the capillary structure of the heat pipes is connected to the capillary structure of the vapor chamber through a sealed connection to achieve gas-liquid conversion, accelerate the heat conduction speed, and conduct heat through the flexibility of the heat pipes to contact any surface.
It effectively solves the heat dissipation problem at locations with bends, drops, and slopes, improves overall heat dissipation efficiency, and ensures temperature control of electronic components.
Smart Images
Figure CN224473589U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a heat conduction technology for electronic products, and more particularly to a heat dissipation module for conducting heat in mobile phones and tablets. Background Technology
[0002] As we all know, vapor chambers are an advanced heat dissipation technology that is widely used in devices such as mobile phones, tablets, computers, servers, and graphics cards to dissipate heat.
[0003] Currently, in applications where single vapor chambers are used to dissipate heat from electronic products such as mobile phones and tablets, the vapor chambers are mainly planar structures, and heat dissipation can only be done in one planar direction. Therefore, the vapor chambers cannot reach certain areas of mobile phones, tablets, etc., where there are bends, drops, or slopes. As a result, the heat in these areas cannot be dissipated, leading to overheating and excessive temperature of the device.
[0004] Therefore, there is an urgent need for a heat dissipation module to overcome one or more of the above-mentioned defects. Utility Model Content
[0005] The purpose of this utility model is to provide a heat dissipation module to solve the problem of excessive heat generation in electronic components with bending, drop, or sloping surfaces, and to accelerate the gas-liquid conversion of the entire heat dissipation module and speed up the heat conduction.
[0006] To achieve the above objectives, the technical solution of this utility model is as follows: A heat dissipation module is provided, including a heat spreader and a bendable heat pipe. The heat spreader includes a heat spreader shell, a heat spreader cavity located within the heat spreader shell, and a heat spreader capillary structure located on the inner wall of the heat spreader shell. The heat pipe includes a heat pipe shell, a heat pipe cavity located within the heat pipe shell, and a heat pipe capillary structure located on the inner wall of the heat pipe shell. The heat pipe shell is provided with a heat pipe connection portion that communicates with and is open to the heat pipe cavity. The heat spreader shell is provided with a heat spreader connection portion that communicates with and is open to the heat spreader cavity. The heat spreader connection portion and the heat pipe connection portion are sealed together, so that the heat pipe capillary structure is connected to the heat spreader capillary structure and the heat pipe cavity is connected to the heat spreader cavity. The heat pipe cavity and the heat spreader cavity are filled with a working fluid.
[0007] Compared to existing technologies, the flexibility of heat pipes allows them to contact any surface, thus conducting heat to any surface and solving the problem of excessive heat generation in electronic components with bends, drops, or slopes. Simultaneously, the sealed assembly of the heat pipe and heat spreader connection between the heat pipe capillary structure and the heat spreader capillary structure, as well as the communication between the heat pipe cavity and the heat spreader cavity, accelerates the gas-liquid conversion of the entire heat dissipation module, speeding up heat conduction. Furthermore, the combination of the bendable heat pipe and heat spreader allows the heat dissipation module to fit more completely within the casing, achieving optimal heat dissipation and resolving issues of excessive heat inside the casing and insufficient heat dissipation for individual components.
[0008] Preferably, one of the heat spreader connection portion and the heat pipe connection portion is provided with a protruding and hollow insert head, and the other of the heat spreader connection portion and the heat pipe connection portion is provided with an insert space for inserting the insert head.
[0009] Preferably, the heat pipe housing is flat, and the thickness directions of both the heat pipe housing and the heat spreader housing are oriented in the same direction.
[0010] Preferably, the heat spreader shell has a heat spreader contact surface for contacting an external heat source in the thickness direction of the heat spreader shell, and the heat pipe shell has a heat pipe contact surface for contacting an external heat source in the thickness direction of the heat pipe shell.
[0011] Preferably, the contact surface of the temperature distribution plate is a plane.
[0012] Preferably, both the vapor chamber shell and the heat pipe shell are L-shaped, and the vapor chamber shell and the heat pipe shell are arranged in an enclosing manner so that an enclosing space is defined between the vapor chamber shell and the heat pipe shell.
[0013] Preferably, the heat spreader shell and the heat pipe shell are arranged diagonally around each other.
[0014] Preferably, at least one of the heat spreader capillary structure and the heat pipe capillary structure is a copper mesh capillary structure.
[0015] Preferably, the heat spreader connection and the heat pipe connection are fixed together by argon arc welding or laser welding.
[0016] Preferably, the heat spreader connection portion protrudes outward from the heat spreader shell, and the heat spreader connection portion is also aligned linearly with the heat pipe connection portion. Attached Figure Description
[0017] Figure 1 This is a plan view of the heat dissipation module of this utility model.
[0018] Figure 2 yes Figure 1 Enlarged view of part A in the middle.
[0019] Figure 3 It is along Figure 1 Internal view of the section cut along the BB line.
[0020] Figure 4 It is along Figure 1 Internal view of the section cut along the CC line.
[0021] Figure 5 yes Figure 1 The diagram shown is a plan view of the heat dissipation module viewed from back to front.
[0022] Figure 6 yes Figure 1 The diagram shows the state of the heat pipes and the vapor chamber in the heat dissipation module after they have been separated.
[0023] Figure 7 yes Figure 6 Enlarged view of section E in the middle.
[0024] Figure 8 This is a plan view of the heat dissipation module of this utility model installed on the casing.
[0025] Figure 9 yes Figure 8 A floor plan viewed from left to right.
[0026] Figure 10 yes Figure 9 A plan view showing the heat dissipation module of this utility model hidden. Detailed Implementation
[0027] Embodiments of the present invention will now be described with reference to the accompanying drawings, in which similar element reference numerals represent similar elements.
[0028] please Figure 8 and Figure 9 The heat dissipation module 100 of this utility model is installed on the housing 200 to conduct heat to the heat source SOC 210 and electronic components 220 on the housing 200, thereby solving the problem of excessive heat generation of electronic components 200 due to bending, height difference, or inclined surfaces. The height difference between the electronic components 200 and the area 230 where the heat source SOC 210 is located on the housing 200 is as indicated by arrow D. Figure 10 As shown.
[0029] Combined Figures 1 to 4As an example, the heat dissipation module 100 of this utility model includes a heat spreader 10 and a bendable heat pipe 20. The heat spreader 10 includes a heat spreader shell 11, a heat spreader cavity 12 located within the heat spreader shell 11, and a heat spreader capillary structure 13 located on the inner wall 111 of the heat spreader shell 11; the heat pipe 20 includes a heat pipe shell 21, a heat pipe cavity 22 located within the heat pipe shell 21, and a heat pipe capillary structure 23 located on the inner wall 211 of the heat pipe shell 21. The heat pipe shell 21 is provided with a heat pipe connection portion 24 that communicates with and is open to the heat pipe cavity 22, while the heat spreader shell 11 is provided with a heat spreader connection portion 14 that communicates with and is open to the heat spreader cavity 12. The heat spreader connection portion 14 and the heat pipe connection portion 24 are sealed together. Optionally, in Figure 2 In this example, the heat spreader plate connection 14 and the heat pipe connection 24 are fixed together by argon arc welding or laser welding, so that a sealed welded structure 40 is formed between the heat spreader plate connection 14 and the heat pipe connection 24, thereby improving the airtightness and stability between the heat spreader plate connection 14 and the heat pipe connection 24. Obviously, depending on actual needs, the heat spreader plate connection 14 and the heat pipe connection 24 can also be connected in a sealed assembly in other ways known in the art, so they will not be described in detail here. Furthermore, when the heat pipe connection 24 and the heat pipe connection 14 are connected in a sealed assembly, the heat pipe capillary structure 23 is also connected to the heat pipe capillary structure 13, and the heat pipe cavity 22 is connected to the heat pipe cavity 12. This satisfies the requirement that the working fluid filling the heat pipe cavity 22 and the heat pipe cavity 12 can continuously circulate between the heat pipe capillary structure 23 and the heat pipe capillary structure 13, thereby accelerating the gas-liquid conversion of the entire heat dissipation module 100 of this invention, and thus accelerating the heat conduction speed. More specifically, as follows:
[0030] Combination Figure 2 , Figure 6 and Figure 7 As an example, the heat spreader connecting portion 14 protrudes beyond the heat spreader housing 11 to facilitate the assembly and connection between the heat spreader connecting portion 14 and the heat pipe connecting portion 24. Furthermore, the heat spreader connecting portion 14 and the heat pipe connecting portion 24 are aligned linearly to ensure a more rational connection between them. Additionally, the heat spreader connecting portion 14 is provided with a protruding and hollow insert head 141, and the heat pipe connecting portion 24 is provided with an insert space 241 for inserting the insert head 141. Clearly, this is determined according to actual needs. Alternatively, the heat spreader connection portion 14 can be provided with an inlay space 241, and the heat pipe connection portion 24 can be provided with an inlay head 141. This achieves the same goal of quickly and accurately positioning the heat spreader connection portion 14 and the heat pipe connection portion 24 before fixing, by using the cooperation of the inlay head 141 and the inlay space 241. After positioning, welding is then used to seal and fix the heat spreader connection portion 14 and the heat pipe connection portion 24 together, improving the airtightness and fixing reliability of the connection between the heat pipe 20 and the heat spreader 10. Specifically, in Figure 1 and Figure 6 In this example, the heat exchanger plate connecting portion 14 protrudes outward from the side of the heat exchanger plate housing 11; obviously, depending on actual needs, the heat exchanger plate connecting portion 14 can also protrude outward from the heat exchanger plate housing 11 in other directions, so it is not considered as... Figure 1 and Figure 6 The above is the limit.
[0031] like Figure 1 and Figure 5 As shown, as an example, both the heat spreader housing 11 and the heat pipe housing 21 are L-shaped, and they are arranged in a closed enclosure, so that a closed space 30 is defined between them. This further allows the heat dissipation module 100 of this invention to completely fit the entire housing 200 (see...). Figure 8 and Figure 9 Specifically, at Figure 1 and Figure 5 In this example, the heat spreader housing 11 and the heat pipe housing 21 are arranged diagonally around each other. This design makes the space occupied by the heat spreader housing 11 and the heat pipe housing 21 smaller after being enclosed, thus making them more compact.
[0032] Combination Figure 1 , Figure 3 , Figure 4 and Figure 9 As an example, the heat pipe housing 21 is flat to effectively increase the contact area between the heat pipe housing 21 and external heat sources (e.g., but not limited to...). Figure 8 and Figure 9 The contact area of the electronic component (as indicated by reference numeral 220) is increased, thereby effectively improving the heat conduction effect; in addition, the thickness directions of both the heat pipe housing 21 and the heat spreader housing 11 (see the direction indicated by arrow D and the opposite direction) are the same, so that the heat pipe housing 21 can be bent relative to the heat spreader housing 11 in its thickness direction, thereby allowing the heat pipe housing 21 to make better contact with the electronic component 220. Specifically, in combination with Figure 5 and Figure 9 As an example, the heat spreader housing 11 has a feature in the thickness direction of the heat spreader housing 11 for contact with an external heat source (e.g., but not limited to...). Figure 9 The heat pipe housing 21 has a heat spreader contact surface 112 in contact with the heat source (SOC) referred to in reference numeral 210. Optionally, as an example, the heat spreader contact surface 112 is a plane; the heat pipe housing 21 has a surface in the thickness direction of the heat pipe housing 21 for contact with an external heat source (e.g., but not limited to...). Figure 9 The heat pipe contact surface 212 (referring to the electronic component indicated by reference numeral 220) is in contact with the device; see condition [link to relevant documentation]. Figure 5As shown; since the area of the heat pipe contact surface 212 is smaller than the area of the heat spreader contact surface 112, the heat spreader contact surface 112 is used for large-area heat dissipation, and the heat pipe contact surface 212 is used for small-area heat dissipation where there is excessive heat in electronic components 220 due to bending, drop, tilting, etc.
[0033] Combination Figures 1 to 4 and Figures 6 to 7 As shown, as an example, both the vapor chamber capillary structure 13 and the heat pipe capillary structure 23 are copper mesh capillary structures. Obviously, depending on actual needs, either the vapor chamber capillary structure 13 or the heat pipe capillary structure 23 can also be a copper mesh capillary structure. This design has the advantages of "good heat flux density carrying capacity, good temperature uniformity, excellent machinability, and good pore size consistency." Obviously, depending on actual needs, the vapor chamber capillary structure 13 and the heat pipe capillary structure 23 can also be other structures well-known in the art, so they will not be described further here. Furthermore, the material of the vapor chamber shell 11 can be copper or a copper-steel composite material, while the material of the heat pipe shell 21 can be C1020 (i.e., oxygen-free copper).
[0034] Compared with existing technologies, the flexibility of the heat pipe 20 allows it to contact any surface, thus conducting heat to any surface and solving the problem of excessive heat generation in electronic components 220 due to bends, drops, or slopes. Simultaneously, the sealed assembly connection between the heat pipe connection 14 and the heat pipe connection 24 connects the heat pipe capillary structure 23 with the heat pipe capillary structure 13 and the heat pipe inner cavity 22 with the heat pipe inner cavity 12, accelerating the gas-liquid conversion of the entire heat dissipation module 100 and speeding up heat conduction. Furthermore, the combination of the bendable heat pipe 20 and the heat pipe 10 allows the heat dissipation module 100 to fit more completely into the entire casing, achieving optimal performance and solving the problem of excessive heat inside the casing 200 and insufficient heat dissipation for individual products.
[0035] It should be further noted that during the argon arc welding process between the heat spreader plate connection 14 and the heat pipe connection 24, the welding current ranges from 6 to 12 A, the welding voltage ranges from 10 to 100 V, and the welding time ranges from 0.5 to 2 seconds. During the laser welding process between the heat spreader plate connection 14 and the heat pipe connection 24, the power output ranges from 50 to 300 W, and the laser travel speed ranges from 200 mm / s to 500 mm / s.
[0036] The above-disclosed embodiments are merely preferred embodiments of the present utility model and should not be construed as limiting the scope of the present utility model. Therefore, any equivalent changes made in accordance with the claims of the present utility model shall still fall within the scope of the present utility model.
Claims
1. A heat dissipation module, comprising a heat spreader, the heat spreader including a heat spreader shell, a heat spreader cavity located within the heat spreader shell, and a heat spreader capillary structure located on the inner wall of the heat spreader shell, characterized in that, The heat dissipation module also includes a bendable heat pipe, which comprises a heat pipe shell, a heat pipe cavity located within the heat pipe shell, and a heat pipe capillary structure located on the inner wall of the heat pipe shell. The heat pipe shell is provided with a heat pipe connection portion that communicates with and is open to the heat pipe cavity. The heat spreader shell is provided with a heat spreader connection portion that communicates with and is open to the heat spreader cavity. The heat spreader connection portion and the heat pipe connection portion are sealed together to connect the heat pipe capillary structure with the heat spreader capillary structure and to communicate with the heat pipe cavity with the heat spreader cavity. The heat pipe cavity and the heat spreader cavity are filled with working fluid.
2. The heat dissipation module according to claim 1, characterized in that, One of the heat spreader connection and the heat pipe connection is provided with a protruding and hollow insert head, and the other of the heat spreader connection and the heat pipe connection is provided with an insert space for the insert head to be inserted.
3. The heat dissipation module according to claim 1, characterized in that, The heat pipe housing is flat, and the thickness directions of both the heat pipe housing and the heat spreader housing are aligned in the same direction.
4. The heat dissipation module according to claim 3, characterized in that, The heat spreader shell has a heat spreader contact surface for contacting an external heat source in the thickness direction of the heat spreader shell, and the heat pipe shell has a heat pipe contact surface for contacting an external heat source in the thickness direction of the heat pipe shell.
5. The heat dissipation module according to claim 4, characterized in that, The contact surface of the temperature distribution plate is a plane.
6. The heat dissipation module according to claim 4, characterized in that, The heat spreader shell and the heat pipe shell are both L-shaped, and they are arranged together in an enclosing manner so that an enclosing space is defined between them.
7. The heat dissipation module according to claim 6, characterized in that, The heat spreader shell and the heat pipe shell are arranged diagonally around each other.
8. The heat dissipation module according to claim 1, characterized in that, At least one of the heat spreader capillary structure and the heat pipe capillary structure is a copper mesh capillary structure.
9. The heat dissipation module according to claim 1, characterized in that, The heat spreader connection and the heat pipe connection are fixed together by argon arc welding or laser welding.
10. The heat dissipation module according to claim 1, characterized in that, The heat spreader plate connecting part protrudes outward from the heat spreader plate shell, and the heat spreader plate connecting part is also aligned linearly with the heat pipe connecting part.