A common jig for preventing continuous welding

Abstract

The utility model discloses a kind of prevent the shared tool of welding, it is related to wave-soldering jig technical field, including drag tin sheet, the drag tin sheet is double-layer structure, the drag tin sheet includes copper base and composite layer, the copper base is located in the lower layer of drag tin sheet, and the upper surface of copper base is plated with composite layer, the composite layer includes nickel layer, silver layer and Teflon layer in turn, the nickel layer is located in the upper layer of copper base close to composite layer below, and silver layer is located in the middle of composite layer, and Teflon layer is located in the upper of composite layer. The utility model in use, by making drag tin sheet setting in element pin relative to the rear of furnace direction, and half-enclosing in element pin side end by drag tin sheet edge notch, by the three depth gradient setting on notch, can layer guide solder flow, drag tin when PCB board tin, avoid the bridging of element pin, increase the straight-through rate of product, greatly reduce artificial cost.

Description

Technical Field

[0001] This utility model relates to the field of wave soldering fixture technology, specifically a common fixture for preventing bridging. Background Technology

[0002] The dense-pin components on existing router PCB A boards, network PCB A boards, automotive PCB A boards, etc. are prone to bridging and solder bridging during wave soldering. This bridging requires manual repair after reflow, which reduces the first-pass yield and increases labor costs.

[0003] The existing method of reserving a copper foil on the circuit board as a solder strip to solve the problem of solder bridging of densely pinned components still cannot effectively solve the problem of solder bridging. Utility Model Content

[0004] The purpose of this invention is to provide a common fixture for preventing weld bridging, so as to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a common fixture for preventing solder bridging, comprising a solder drag sheet, wherein the solder drag sheet has a double-layer structure, the solder drag sheet comprises a copper substrate and a composite layer, the copper substrate is located in the lower layer of the solder drag sheet, and the upper surface of the copper substrate is plated with a composite layer.

[0006] Furthermore, the composite layer sequentially includes a nickel layer, a silver layer, and a Teflon layer. The nickel layer is located below the composite layer and close to the upper layer of the copper substrate, the silver layer is located in the middle of the composite layer, and the Teflon layer is located above the composite layer.

[0007] Furthermore, the nickel layer has a thickness of 5 μm, the silver layer has a thickness of 2 μm, and the Teflon layer has a thickness of 0.1 μm.

[0008] Furthermore, the solder drag sheet is fixedly mounted on the wave soldering fixture, and the wave soldering fixture is provided with component leads.

[0009] Furthermore, the solder drag sheet is located behind the component leads in the reflow direction, and the edge of the solder drag sheet has a notch.

[0010] Furthermore, the notch partially surrounds the side of the component pin, and the notch has three levels of depth gradient, which are a first-level 45° inclined plane, a second-level circular arc surface, and a third-level vertical surface.

[0011] Compared with the prior art, the present invention has the following beneficial effects:

[0012] 1. The tin drag sheet of this application adopts a double-layer structure, with a nickel (5μm)-silver (2μm)-Teflon (0.1μm) composite layer sequentially plated on the surface of the copper substrate. The nickel layer provides support strength, the silver layer enhances thermal conductivity, and the Teflon layer can reduce the tin dross adhesion rate by 63%.

[0013] 2. In use, this utility model sets the solder drag sheet behind the component pins relative to the reflow direction, and the notch on the edge of the solder drag sheet partially surrounds the side of the component pins. Through the three-level depth gradient setting on the notch, the solder flow can be guided in layers. When reflowing the PCB board, the solder drag is performed, avoiding bridging of the component pins, increasing the first pass rate of the product, and greatly reducing labor costs. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of the device of this utility model;

[0015] Figure 2 This is a schematic diagram of part of the structure of the device of this utility model;

[0016] Figure 3 This is a schematic diagram of the tin-drafting sheet structure of this utility model.

[0017] In the diagram: 1. Solder strip; 12. Copper substrate; 13. Composite layer; 1301. Nickel layer; 1302. Silver layer; 1303. Teflon layer; 2. Wave soldering fixture; 3. Component lead; 4. Notch. Detailed Implementation

[0018] The embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of this utility model.

[0019] like Figures 1 to 3 As shown, a common fixture for preventing solder bridging includes a solder drag sheet 1, which has a double-layer structure. The solder drag sheet 1 includes a copper substrate 12 and a composite layer 13. The copper substrate 12 is located in the lower layer of the solder drag sheet 1, and the upper surface of the copper substrate 12 is plated with the composite layer 13. The composite layer 13 includes a nickel layer 1301, a silver layer 1302, and a Teflon layer 1303 in sequence. The nickel layer 1301 is located below the composite layer 13 and close to the upper layer of the copper substrate 12. The silver layer 1302 is located in the middle of the composite layer 13, and the Teflon layer 1303 is located above the composite layer 13. The thickness of the nickel layer 1301 is 5 μm, the thickness of the silver layer 1302 is 2 μm, and the thickness of the Teflon layer 1303 is 0.1 μm.

[0020] The specific operation is as follows: The tin drag sheet of this application adopts a double-layer structure. A nickel-silver-Teflon composite layer 13 is sequentially plated on the surface of the copper substrate 12. The nickel layer 1301 provides support strength, the silver layer 1302 enhances thermal conductivity, and the Teflon layer 1303 can reduce the tin dross adhesion rate by 63%.

[0021] like Figures 1 to 2 As shown, the solder drag sheet 1 is fixedly mounted on the wave soldering fixture 2, and the wave soldering fixture 2 is provided with component leads 3. The solder drag sheet 1 is located behind the component leads 3 in the reflow direction, and the edge of the solder drag sheet 1 is provided with a notch 4. The notch 4 partially surrounds the side end of the component leads 3, and the notch 4 is provided with a three-level depth gradient. The three-level depth gradient on the notch 4 are a first-level 45° inclined surface, a second-level arc surface, and a third-level vertical surface.

[0022] The specific operation is as follows: By placing the solder drag sheet 1 behind the component pin 3 relative to the reflow direction, and partially surrounding the side end of the component pin 3 with the edge notch 4 of the solder drag sheet 1, the solder flow can be guided in layers through the three-level depth gradient setting on the notch 4. When reflowing the PCB board, the solder drag is performed, avoiding bridging of the component pin 3, increasing the first pass rate of the product, and greatly reducing labor costs.

[0023] Working principle: The solder drag sheet of this application adopts a double-layer structure. A nickel-silver-Teflon composite layer 13 is sequentially plated on the surface of the copper substrate 12. The nickel layer 1301 provides support strength, the silver layer 1302 enhances thermal conductivity, and the Teflon layer 1303 can reduce the solder dross adhesion rate by 63%. In use, the solder drag sheet 1 is positioned behind the component lead 3 relative to the reflow direction, and the edge notch 4 of the solder drag sheet 1 partially surrounds the side end of the component lead 3. Through the three-level depth gradient setting on the notch 4, the solder flow can be guided in layers. When reflowing the PCB board, the solder drag is performed, avoiding bridging solder joints of the component lead 3, increasing the first pass rate of the product, and greatly reducing labor costs.

[0024] The embodiments of this utility model are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the utility model to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described in order to better illustrate the principles and practical applications of this utility model, and to enable those skilled in the art to understand this utility model and design various embodiments with various modifications suitable for a particular purpose.

Claims

1. A common fixture for preventing solder bridging, comprising a solder drag sheet (1), characterized in that, The tin-drawing sheet (1) has a double-layer structure. The tin-drawing sheet (1) includes a copper substrate (12) and a composite layer (13). The copper substrate (12) is located in the lower layer of the tin-drawing sheet (1), and the upper surface of the copper substrate (12) is plated with the composite layer (13).

2. The common fixture for preventing weld bridging according to claim 1, characterized in that, The composite layer (13) comprises a nickel layer (1301), a silver layer (1302), and a Teflon layer (1303) in sequence. The nickel layer (1301) is located below the composite layer (13) and close to the upper layer of the copper substrate (12). The silver layer (1302) is located in the middle of the composite layer (13), and the Teflon layer (1303) is located above the composite layer (13).

3. A common fixture for preventing weld bridging according to claim 2, characterized in that, The nickel layer (1301) has a thickness of 5 μm, the silver layer (1302) has a thickness of 2 μm, and the Teflon layer (1303) has a thickness of 0.1 μm.

4. A common fixture for preventing weld bridging according to claim 3, characterized in that, The solder drag sheet (1) is fixedly mounted on the wave soldering fixture (2), and the wave soldering fixture (2) is provided with component leads (3).

5. A common fixture for preventing weld bridging according to claim 4, characterized in that, The solder drag sheet (1) is located behind the component pin (3) in the reflow direction, and the edge of the solder drag sheet (1) is provided with a notch (4).

6. A common fixture for preventing weld bridging according to claim 5, characterized in that, The notch (4) partially surrounds the side of the component pin (3), and the notch (4) has three levels of depth gradient, which are a first-level 45° inclined plane, a second-level circular arc surface and a third-level vertical plane.

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