Automatic sealing device for chip packaging

Abstract

This utility model relates to the field of chip packaging equipment technology, and discloses an automatic sealing device for chip packaging, comprising: a movable frame fixedly mounted below a drive assembly; a packaging film assembly consisting of one set of mounting plates connected by bolts to two sets of mounting plates arranged on the mounting frame, and another set arranged on the movable frame; a platform assembly arranged by bolts on the mounting frame; a drive assembly fixedly arranged above the interior of the mounting frame and connected to the movable frame below; a packaging film slidably mounted on the outer wall of the film cylinder and the rotating cylinder; a second telescopic rod with its bottom bolted to the lower middle part of the packaging film, and its telescopic end fixedly connected to a shearing box; and a packaging assembly fixedly arranged at the telescopic end of the second telescopic rod. The packaging film forms an upper and lower wrapping structure, which, together with the liftable packaging assembly, simultaneously completes sealing and shearing; a heating strip enables rapid heat-sealing, and the shearing blade simultaneously separates the packaging film, ensuring a tight seal and neat cut, suitable for mass packaging production.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging equipment technology, specifically an automatic sealing device for chip packaging. Background Technology

[0002] Against the backdrop of the rapid development of the semiconductor industry, the reliability and safety of chips, as core components, during their production, transportation, and storage directly determine the performance of end products. Packaging and sealing, as a critical step before chips leave the factory, must not only provide physical protection for the chips but also isolate them from external environmental factors such as moisture, dust, and oxygen to prevent chip pin oxidation and circuit failure. At the same time, it must also meet the industry's multiple demands for efficiency, precision, and cost. The research and application of automatic sealing devices for chip packaging are gradually advancing based on the technical pain points, market demands, and limitations of traditional processes in the development of the semiconductor industry. Traditional chip packaging sealing mainly relies on "manual sealing" or "semi-automatic sealing equipment," which have shortcomings in precision, efficiency, and reliability and can no longer meet the development needs of the semiconductor industry.

[0003] A search revealed existing technology (application number: 202221838890.X), which describes "a chip packaging sealing device." This utility model discloses a chip packaging sealing device comprising a base, a conveyor belt mounted above the base, a sealing machine mounted on one side of the conveyor belt on the base, a mounting frame fixedly connected to one side of the sealing machine on the base, a movable platform slidably connected to the mounting frame, a telescopic rod mounted on the mounting frame, one end of the telescopic rod fixedly connected to the movable platform, and a windproof cover fixedly connected to the movable platform.

[0004] However, while existing technologies have improved overall adjustability, facilitated overall applicability, and improved the self-checking of incomplete sealing, thereby improving the overall packaging effect, some shortcomings still exist: manual bagging is required before packaging; the packaging bags cannot enter the sealing machine independently and accurately, which may limit sealing efficiency; and excess packaging material cannot be cut. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies by proposing an automatic sealing device for chip packaging.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: an automatic sealing device for chip packaging, comprising: a mounting frame placed on an operating platform; mounting plates bolted to the mounting frame, having two sets of holes in the middle, for a total of four sets; a movable frame fixedly mounted above a drive assembly; packaging film assemblies, one set of which is bolted to the two sets of mounting plates arranged on the mounting frame, and the other set arranged on the movable frame; a platform assembly bolted to the mounting frame and located between the two sets of packaging film assemblies; a drive assembly fixedly arranged above the interior of the mounting frame and connected to the movable frame below; packaging films slidably mounted on the outer walls of the film cylinder and the rotating cylinder, for a total of two sets; a second telescopic rod bolted to the bottom of the packaging film in the lower middle, with its telescopic end fixedly connected to a shearing box; and a packaging assembly fixedly arranged at the telescopic end of the second telescopic rod.

[0007] As a further description of the above technical solution:

[0008] The packaging film starts from a set of film tubes that are not connected to a motor, goes around to a set of rotating tubes on the same side, then passes through another set of rotating tubes, and connects to another set of film tubes, forming a complete circuit. Both sets of packaging film are located above the platform assembly.

[0009] As a further description of the above technical solution:

[0010] The equipment mounting frame is trapezoidal, with the lower dimension being larger than the upper dimension.

[0011] As a further description of the above technical solution:

[0012] The packaging film assembly includes: a film tube, which is rotatably installed in the hole of the mounting plate via rotating shafts fixed on both sides, and there are two sets in total; a base, which is fixedly installed on the outside of the mounting plate; a motor, which is installed on the base via bolts, and the output end is connected to the rotating shaft via a coupling; and a rotating cylinder, which is rotatably installed on the mounting frame via pins on both sides, and there are two sets in total.

[0013] As a further description of the above technical solution:

[0014] The platform components include: mounting strips, which are fixedly installed on the mounting frame, and there are two sets of them; and sealing plates, which are fixedly installed between the mounting strips and are higher than the upper surface of the mounting strips.

[0015] As a further description of the above technical solution:

[0016] The drive assembly includes: a mounting beam, which is fixedly installed inside the upper part of the mounting frame; and two sets of first telescopic rods, which are bolted to the mounting beam at the bottom, with the telescopic ends of the two sets fixedly connected to the drive bar.

[0017] As a further description of the above technical solution:

[0018] The packaging assembly includes: a shearing blade, fixedly installed below the shearing box; a sealing box, welded into the groove of the shearing box, with a heating device inside; and a heating strip, bolted to the top of the sealing box and connected to the heating device inside the sealing box.

[0019] This utility model has the following beneficial effects:

[0020] 1. By coordinating the dual packaging film assemblies and the platform assembly, the automated sealing operation of chip packaging is achieved. The two sets of packaging films form an upper and lower wrapping structure. With the lifting packaging assembly, the sealing and cutting processes can be completed simultaneously, improving packaging efficiency.

[0021] 2. The packaging components are moved down by the telescopic rod, the heating strip achieves rapid heat sealing, and the shearing blade simultaneously separates the packaging film, ensuring a tight seal and neat cut. At the same time, the trapezoidal mounting frame enhances the stability of the equipment, making it suitable for efficient packaging production of batch chips. Attached Figure Description

[0022] Figure 1 This is a perspective view of an automatic sealing device for chip packaging proposed in this utility model;

[0023] Figure 2 This is a frame structure diagram of an automatic sealing device for chip packaging proposed in this utility model;

[0024] Figure 3 This is an exploded view of the packaging film assembly of an automatic sealing device for chip packaging according to the present invention.

[0025] Figure 4 This is a schematic diagram of the installation of the drive assembly of an automatic sealing device for chip packaging proposed in this utility model;

[0026] Figure 5 This is an exploded view of the packaging components of an automatic sealing device for chip packaging according to the present invention.

[0027] Legend:

[0028] 1. Mounting frame; 2. Mounting plate; 3. Film tube; 4. Rotating shaft; 5. Base; 6. Motor; 7. Rotating cylinder; 8. Mounting strip; 9. Sealing plate; 10. Mounting beam; 11. First telescopic rod; 12. Drive strip; 13. Moving frame; 14. Packaging film; 15. Second telescopic rod; 16. Shearing box; 17. Shearing knife; 18. Sealing box; 19. Heating strip. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0030] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The utility model will be further described in detail below with reference to the accompanying drawings.

[0031] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0032] Example 1:

[0033] like Figures 1 to 5 As shown, this embodiment provides an automatic sealing device for chip packaging, comprising: a mounting frame 1 placed on an operating platform; mounting plates 2 bolted to the mounting frame 1, having two sets of holes in the middle, for a total of four sets; a movable frame 13 fixedly mounted above the drive assembly; packaging film assemblies, one set of which is bolted to the two sets of mounting plates 2 arranged on the mounting frame 1, and the other set arranged on the movable frame 13; a platform assembly bolted to the mounting frame 1 and located between the two sets of packaging film assemblies 14; a drive assembly fixedly arranged above the interior of the mounting frame 1 and connected to the movable frame 13 below; two sets of packaging films 14 slidably mounted on the outer walls of the film cylinder 3 and the rotating cylinder 7; a second telescopic rod 15 bolted to the lower middle of the packaging film 14, with its telescopic end fixedly connected to a shearing box 16; and a packaging assembly fixedly arranged at the telescopic end of the second telescopic rod 15.

[0034] In this embodiment, the packaging component and the packaging film component constitute an automatic sealing device for chip packaging according to this application.

[0035] Understandable Figure 1 This illustration only schematically shows some components of an automated sealing device for chip packaging; the actual shape, size, position, and construction of these components are not subject to change. Figure 1 Due to limitations, an automatic sealing device for chip packaging can also include, compared to... Figure 1 More or fewer parts.

[0036] In addition, when the connection method of each component is bolted, the bolts used for the connection are not shown in the figure. As long as a stable connection is achieved, commonly used types on the market can be used.

[0037] It should also be understood that the motor 6, the first telescopic rod 11, and the second telescopic rod 15 were all purchased from the market and are common knowledge in this field. They are only used and not modified, so the control method and circuit connection will not be described in detail.

[0038] In addition, the mounting frame 1, placed on the operating platform, is made of metal; both packaging film components are made of metal; the packaging film 14 is a plastic film; each component is fixedly installed through the mounting frame 1 and mounting plate 2, forming a complete automatic sealing device structural foundation, providing support for subsequent packaging operations, achieving stable installation of each component, ensuring the stability of the device structure, and providing a foundation for automatic sealing operations.

[0039] Specifically, the packaging film 14 starts from a set of film tubes 3 that are not connected to the motor 6, goes around to a set of rotating tubes 7 on the same side, then passes through another set of rotating tubes 7, and connects to another set of film tubes 3, forming a complete circuit. Both sets of packaging films 14 are located above the platform assembly.

[0040] In this embodiment, the packaging film 14 is wound horizontally around a set of rotating cylinders 7 on the same side, then horizontally through another set of rotating cylinders 7, and finally tilted to connect to another set of film cylinders 3. The packaging film 14 is wound along a specific path to form two layers, providing a film material path for chip wrapping, so that the packaging film 14 can move in an orderly manner, ensuring that the chip is completely wrapped and preparing for sealing.

[0041] Specifically, the equipment mounting frame 1 is trapezoidal, with the lower dimension being larger than the upper dimension.

[0042] As a preferred implementation, the equipment mounting frame 1 is trapezoidal, with the lower dimension being larger than the upper dimension, and is made of welded steel. The trapezoidal structure design makes the bottom of the mounting frame 1 more stable, supports the weight of all components above, enhances the overall stability of the device, and prevents shaking or tipping during operation.

[0043] Example 2:

[0044] Based on Example 1, in order to ensure stable transmission of the packaging film and provide conditions for subsequent packaging, a packaging film assembly and a platform assembly are arranged within the mounting frame 1.

[0045] Specifically, the packaging film assembly includes: film tube 3, which is rotatably installed in the hole of mounting plate 2 via rotating shaft 4 fixedly installed on both sides, and there are two sets in total; base 5, which is fixedly installed on the outside of mounting plate 2; motor 6, which is installed on base 5 by bolts, and the output end is connected to rotating shaft 4 via coupling; and rotating cylinder 7, which is rotatably installed on mounting frame 1 via pins on both sides, and there are two sets in total.

[0046] In this embodiment, the film tube 3 is a cylindrical metal tube with a length adapted to the distance between the two sets of mounting plates 2; the motor 6 is a servo motor; the rotating cylinder 7 is a cylindrical metal tube with a length consistent with the film tube 3; the motor 6 drives the rotating shaft 4 to rotate the film tube 3, so that the packaging film 14 is transmitted between the film tube 3 and the rotating cylinder 7, thereby realizing the automatic conveying of the packaging film 14, controlling the moving speed and length of the packaging film 14, and meeting the packaging requirements.

[0047] Specifically, the platform components include: mounting strips 8, which are fixedly installed on the mounting frame 1, and there are two sets; and sealing plates 9, which are fixedly installed between the mounting strips 8 and are higher than the upper surface of the mounting strips 8.

[0048] With this setup, the mounting strip 8 is a long strip of metal, the length of which matches the width of the mounting frame 1, and they are distributed in parallel. The sealing plate 9 is a rectangular metal plate, the length of which is the same as that of the mounting strip 8, and the upper surface is 2-5 cm higher than the upper surface of the mounting strip 8. The chip is placed on the sealing plate 9, which serves as an operating platform for packaging and sealing, providing a stable placement position for the chip, facilitating the wrapping of the packaging film 14 and subsequent sealing operations.

[0049] Example 3:

[0050] Based on Example 1, in order to complete the packaging work, a drive assembly and a packaging assembly are arranged inside the upper part of the mounting frame 1;

[0051] Specifically, the drive assembly includes: a mounting beam 10, which is fixedly installed inside the upper part of the mounting frame 1; and two sets of first telescopic rods 11, which are bolted to the mounting beam 10 at the bottom. The telescopic ends of the two sets are fixedly connected to the drive bar 12.

[0052] The mounting beam 10 is a rectangular metal beam with a length consistent with the top width of the mounting frame 1. The first telescopic rod 11 extends and retracts, driving the drive bar 12 and the moving frame 13 to move up and down, controlling the position of the moving frame 13 and the packaging film assembly below, adjusting the distance between the packaging film 14 and the platform assembly, and adapting to chip packaging of different thicknesses.

[0053] Specifically, the packaging components include: a shearing blade 17, which is fixedly installed below the shearing box 16; a sealing box 18, which is welded into the groove of the shearing box 16 and has a heating device inside; and a heating strip 19, which is bolted to the top of the sealing box 18 and connected to the heating device inside the sealing box 18.

[0054] In this embodiment, the shearing blade 17 is a metal blade; the sealing box 18 is a rectangular metal box with a heating device inside, which is welded into the groove of the shearing box 16; the heating strip 19 is a metal electric heating wire, which is connected to the heating device inside the sealing box 18; the second telescopic rod 15 extends and retracts to move the packaging assembly up and down, the heating strip 19 heats and heat-seals the packaging film 14, and the shearing blade 17 cuts the packaging film 14, thereby sealing and cutting the packaging film 14 that wraps the chip, and completing the automatic packaging of the chip.

[0055] In actual use, the user installs the new packaging film 14 on the two sets of packaging film 14 assemblies. Specifically, the film is first installed on the film tube 3 that is not connected to the motor 6. One end of the film is wrapped around a set of rotating tubes 7 on the same side, then passes through another set of rotating tubes 7, and is connected to another set of film tubes 3. Then, the first telescopic rod 11 is opened to lower the upper packaging film 14 assembly and bring it close to the lower packaging film 14 assembly. The chip is placed on the lower film. The second telescopic rod 15 is opened to lower the packaging assembly onto the sealing plate 9. The chip is sealed and the surrounding film is cut using the shearing blade 17 and the heating strip 19. The second telescopic rod 15 is opened to reset the packaging assembly. The motor 6 is started to rotate the discarded end of the film onto the film tube 3 connected to the motor 6, and the cycle is repeated.

[0056] The heating strip 19 can also be other heating devices to achieve heating encapsulation. It is not limited to electric heating wire, as long as it can achieve heating encapsulation.

[0057] Motor 6, first telescopic rod 11 and second telescopic rod 15 are all electrically connected to PLC controller. PLC controller is electrically connected to external power supply. With the provided PLC controller, it is convenient to control the power supply of electrical equipment. When electrical equipment needs power, it can be powered on, avoiding the situation where it cannot be powered on when power is needed.

[0058] It should be noted that the controller can be a conventional known device that is controlled by a computer or other means. The detailed description of known functions and known components is omitted in the specific embodiments of this disclosure. In order to ensure the compatibility of the device, the operating methods used are consistent with the parameters of commercially available instruments.

[0059] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An automatic sealing device for chip packaging, characterized in that: include: The mounting frame (1) is placed on the operating platform; The mounting plate (2) is bolted to the mounting frame (1), and has two sets of holes in the middle, for a total of four sets; The movable frame (13) is fixedly mounted on the lower part of the drive component; The packaging film assembly consists of one set of two mounting plates (2) connected by bolts on the mounting frame (1) and another set on the movable frame (13); The platform assembly is bolted to the mounting frame (1) and located between the two sets of packaging film (14) assemblies; The drive component is fixedly arranged inside the mounting frame (1) at the top and connected to the movable frame (13) at the bottom; The packaging film (14) is slidably installed on the outer wall of the film tube (3) and the rotating tube (7), and there are two sets in total; The second telescopic rod (15) is bolted to the bottom of the packaging film (14) at the middle, and the telescopic end is fixedly connected to the shearing box (16); The packaging assembly is fixedly arranged at the telescopic end of the second telescopic rod (15).

2. The automatic sealing device for chip packaging according to claim 1, characterized in that: The packaging film (14) starts from a set of film tubes (3) that are not connected to the motor (6), goes around to a set of rotating tubes (7) on the same side, passes through another set of rotating tubes (7), and connects to another set of film tubes (3) to form a complete line. Both sets of packaging films (14) are located above the platform assembly.

3. The automatic sealing device for chip packaging according to claim 2, characterized in that: The equipment mounting frame (1) is trapezoidal, with the lower dimension being larger than the upper dimension.

4. The automatic sealing device for chip packaging according to claim 1, characterized in that: The packaging film (14) assembly includes: The membrane tube (3) is rotatably installed in the hole of the mounting plate (2) through the rotating shaft (4) fixed on both sides; there are two sets in total. The base (5) is fixedly installed on the outside of the mounting plate (2); The motor (6) is bolted to the base (5), and its output end is connected to the rotating shaft (4) via a coupling; The rotating cylinder (7) is mounted on the mounting frame (1) by means of pins on both sides, and there are two sets in total.

5. The automatic sealing device for chip packaging according to claim 1, characterized in that: The platform components include: The mounting strip (8) is fixedly installed on the mounting frame (1), and there are two sets in total; The sealing plate (9) is fixedly installed between the mounting strips (8) and is higher than the upper surface of the mounting strips (8).

6. The automatic sealing device for chip packaging according to claim 1, characterized in that: The driving component includes: Mounting beam (10) is fixedly installed inside the upper part of mounting frame (1); The first telescopic rod (11) is bolted to the mounting beam (10) at the bottom. There are two sets of the first telescopic rod, and the two sets of telescopic ends are fixedly connected to the drive bar (12).

7. The automatic sealing device for chip packaging according to claim 1, characterized in that: The packaging component includes: The shearing blade (17) is fixedly installed below the shearing box (16); The sealing box (18) is installed in the groove of the shearing box (16) by welding, and is equipped with heating equipment inside; The heating strip (19) is bolted to the top of the sealing box (18).

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