Liquid handling device

Abstract

The utility model relates to a liquid processing device, and the processing liquid is inhibited from winding to the lower surface of the substrate. The liquid processing device is provided with a holding part, a liquid supply part, a first cup body and a second cup body. The holding part holds the substrate and rotates it. The liquid supply part supplies the processing liquid to the upper surface of the substrate held by the holding part. The first cup body is annularly arranged on the lower surface side of the substrate held by the holding part and below the periphery of the substrate. The second cup body is annularly arranged at a position inside the first cup body and has a plurality of annular protrusion parts arranged in a concentric manner on the opposite surface side opposite to the lower surface of the substrate and protruding toward the lower surface of the substrate.

Description

Technical Field

[0001] This utility model relates to a liquid treatment device. Background Technology

[0002] Conventional liquid processing apparatuses are known to perform liquid processing by supplying a processing liquid to the upper surface of a substrate, such as a semiconductor wafer, while the substrate is rotated. These apparatuses utilize an outer cup and an inner cup arranged to surround the rotating substrate to collect processing liquid that spills from the substrate.

[0003] In addition, there is a liquid treatment device in which the inner cup is divided into a first cup body located on the lower surface side of the substrate and below the periphery of the substrate, and a second cup body located on the inner side of the first cup body, and the second cup body is provided with a protrusion protruding toward the lower surface of the substrate (see Patent Document 1).

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2015-76534 Utility Model Content

[0007] Problems to be solved by utility models

[0008] This invention provides a technique to prevent the processing liquid from flowing onto the lower surface of the substrate.

[0009] Solution for solving the problem

[0010] The liquid treatment apparatus of this utility model includes a holding part, a liquid supply part, a first cup body, and a second cup body. The holding part holds a substrate and rotates it. The liquid supply part supplies treatment liquid to the upper surface of the substrate held by the holding part. The first cup body is arranged in a ring shape on the lower surface side of the substrate held by the holding part and is located below the periphery of the substrate. The second cup body is arranged in a ring shape at a position closer to the first cup body, and has a plurality of annular protrusions arranged concentrically and protruding toward the lower surface of the substrate on the opposite side facing the lower surface of the substrate.

[0011] Alternatively, the second cup body may have a main body portion formed in an annular shape, and the plurality of protrusions may be detachably provided on the main body portion from the opposite side of the main body portion.

[0012] Alternatively, the main body may have a stepped portion formed in an annular shape on the outer periphery of the opposite surface, and the second cup body may have a base member having an annular portion that fits into the stepped portion and a plurality of arms extending radially from the inner periphery of the annular portion toward the annular portion above the opposite surface. The plurality of protrusions are concentrically arranged on the annular portion and the plurality of arms along the radial direction of the annular portion, and can be detachably mounted on the main body by means of the base member.

[0013] Alternatively, one or more of the protrusions disposed on the multiple arms may be separated from the opposite surface of the main body.

[0014] Alternatively, each of the plurality of arms, when viewed in a side section perpendicular to the circumference of the main body, has a curved surface that is recessed toward the opposite surface at the position where it is sandwiched between adjacent protrusions.

[0015] Alternatively, the main body may have a groove formed on the opposing surface and extending radially in the main body, and the base member may have other arms extending radially from the inner periphery of the annular portion toward the annular portion at a position lower than the plurality of arms, the other arms engaging with the groove.

[0016] Alternatively, the opposing surface of the main body may be inclined downward from the outer peripheral surface of the main body toward the inner peripheral surface, and the other arm may have an inclined surface that is continuous with the opposing surface when the other arm is engaged with the groove.

[0017] Alternatively, the plurality of arms may be arranged at intervals along the circumference of the annular portion, with the other arms overlapping with at least one of the plurality of arms to form a single unit.

[0018] Alternatively, the height of the tip of at least one of the plurality of protrusions may be lower than the height of the tips of the other protrusions located at a position more inward than the protrusion itself.

[0019] Alternatively, the tip of at least one of the plurality of protrusions may be bent outward.

[0020] Alternatively, at least one of the plurality of protrusions may have a rounded end face at its tip.

[0021] Effects of the utility model

[0022] According to this invention, it is possible to prevent the processing liquid from flowing onto the lower surface of the substrate. Attached Figure Description

[0023] Figure 1 This is a top view showing the structure of the liquid treatment apparatus according to the first embodiment.

[0024] Figure 2 This is a cross-sectional view showing the structure of the liquid treatment apparatus of the first embodiment.

[0025] Figure 3 This is an enlarged view showing the vicinity of the recycling cup in the first embodiment.

[0026] Figure 4 This is a top view showing the structure of the second cup body in the first embodiment.

[0027] Figure 5 This is a diagram illustrating an example of a state where the protruding structure is separated from the second cup body.

[0028] Figure 6 It means Figure 4 A diagram showing an example of a cross-sectional view along line A-A.

[0029] Figure 7 It means Figure 4 A diagram showing an example of a cross-sectional view along line B-B.

[0030] Figure 8 This is a cross-sectional view showing the structure of the second cup body in the second embodiment.

[0031] Figure 9 This is a cross-sectional view showing the structure of the second cup body in the third embodiment.

[0032] Figure 10 This is a cross-sectional view showing the structure of the second cup body in the fourth embodiment.

[0033] Figure 11 This is a cross-sectional view showing the structure of the first cup body and the second cup body in the fifth embodiment.

[0034] Explanation of reference numerals in the attached figures

[0035] 1. Liquid processing device; 2. Substrate rotation part; 4. Recovery cup; 21. Vacuum holding tray; 31. Developer supply nozzle; 41. Outer cup; 42. Inner cup; 50. First cup body; 51. Inclined wall; 52. Vertical wall; 53. Protrusion; 60. Second cup body; 61. Main body; 61a. Upper surface; 61b. Stepped part; 61c. Groove; 62. Protruding structure; 63. Base member; 63a. Ring body; 63b. Arm; 63c. Curved surface; 63d. Vertical surface; 63d1. Inclined surface; 63e. Inclined surface; 63f. Other arms; 63g. End face; 64. Protrusion; W. Wafer. Detailed Implementation

[0036] The following describes in detail, with reference to the accompanying drawings, the liquid treatment apparatus for implementing this invention (hereinafter referred to as "Embodiment"). However, this invention is not limited to this embodiment. Furthermore, the various embodiments can be appropriately combined without contradicting the processing content. In the following embodiments, the same reference numerals are used to label the same parts, and repeated descriptions are omitted.

[0037] Furthermore, in the accompanying figures mentioned below, to facilitate understanding, an orthogonal coordinate system is sometimes shown, defining mutually orthogonal X-axis, Y-axis, and Z-axis directions, with the positive Z-axis direction as the vertically upward direction. Additionally, the direction of rotation centered on the vertical axis is sometimes referred to as the θ direction.

[0038] Furthermore, in the embodiments shown below, expressions such as "constant," "orthogonal," "perpendicular," or "parallel" are sometimes used, but these expressions do not need to be strictly "constant," "orthogonal," "perpendicular," or "parallel." That is, the above expressions allow for deviations in manufacturing precision, setting precision, etc.

[0039] Conventional liquid processing apparatuses are known to perform liquid processing by supplying a processing liquid to the upper surface of a substrate, such as a semiconductor wafer, while the substrate is rotated. These apparatuses utilize an outer cup and an inner cup arranged to surround the rotating substrate to collect processing liquid that spills from the substrate.

[0040] Alternatively, there exists a liquid treatment apparatus in which an inner cup is divided into a first cup body located on the lower surface of a substrate and below the periphery of the substrate, and a second cup body located further inward than the first cup body. The second cup body has a protrusion extending toward the lower surface of the substrate. According to this liquid treatment apparatus, by bringing the protrusion close to the lower surface of the substrate, the treatment liquid flowing from the upper surface of the substrate to the lower surface is blocked.

[0041] However, in the aforementioned prior art, there is a situation where the processing liquid bypasses the protrusion and flows around to the lower surface of the substrate, and there is room for improvement in effectively suppressing the processing liquid from flowing around to the lower surface of the substrate.

[0042] Therefore, it is desirable to provide a technique that can prevent the processing liquid from flowing onto the lower surface of the substrate.

[0043] (First Embodiment)

[0044] <Structure of the liquid treatment device>

[0045] First, refer to Figures 1-3 The structure of the liquid treatment apparatus 1 of the first embodiment will be described. Figure 1 This is a top view showing the structure of the liquid treatment apparatus 1 according to the first embodiment. Figure 2This is a cross-sectional view showing the structure of the liquid treatment apparatus 1 according to the first embodiment. Figure 3 This is an enlarged view showing the vicinity of the recycling cup 4 in the first embodiment.

[0046] like Figures 1-3 As shown, the liquid processing apparatus 1 of the first embodiment is, for example, a developing apparatus, which includes a substrate rotating part 2 (an example of a holding part), an upper surface supply part 3, and a recovery cup 4.

[0047] The substrate rotation unit 2 holds the wafer W (an example of a substrate) so that it can rotate. Specifically, the substrate rotation unit 2 includes a vacuum holding disk 21, a shaft 22, and a drive unit 23. The vacuum holding disk 21 holds the wafer W by vacuuming. The diameter of the vacuum holding disk 21 is smaller than the diameter of the wafer W, and it holds the center of the lower surface of the wafer W.

[0048] The shaft portion 22 horizontally supports the vacuum holding disk 21 at its top end. The drive portion 23 is connected to the base end of the shaft portion 22. The drive portion 23 rotates the shaft portion 22 about a vertical axis and raises and lowers the shaft portion 22 and the vacuum holding disk 21 supported by the shaft portion 22.

[0049] The upper surface supply unit 3 supplies developer and rinsing solution, which are processing solutions, to the upper surface of the wafer W. The upper surface supply unit 3 includes a developer supply nozzle 31 (an example of a liquid supply unit) and a rinsing solution supply nozzle 32.

[0050] The developer supply nozzle 31 is positioned above the wafer W with the nozzle outlet facing downwards, and sprays developer onto the upper surface of the wafer W. The developer supply nozzle 31 is connected to a moving mechanism (not shown) and can move between a processing position above the wafer W and a standby position further outwards from the processing position.

[0051] The rinsing fluid supply nozzle 32 is positioned above the wafer W with its outlet facing downwards, spraying rinsing fluid onto the upper surface of the wafer W. The rinsing fluid supply nozzle 32 is connected to a moving mechanism (not shown) and can move between a processing position above the wafer W and a standby position further outwards from that processing position. Furthermore, pure water (DIW) can be used as the rinsing fluid, for example.

[0052] The recovery cup 4 is arranged to surround the outer edge of the wafer W to recover droplets of processing liquid that have scattered from the wafer W. The recovery cup 4 has an outer cup 41 and an inner cup 42.

[0053] The outer cup 41 is arranged in a ring shape to cover the periphery of the wafer W held by the substrate rotating part 2. For example, the outer cup 41 is arranged to surround the side of the wafer W.

[0054] The inner cup 42 is disposed inside the outer cup 41 and below the wafer W held by the substrate rotating part 2. The inner cup 42 is composed of a first cup body 50 and a second cup body 60 disposed inside the first cup body 50.

[0055] The first cup body 50 and the second cup body 60 are detachably mounted on a circular plate-shaped base 5 using a locking mechanism such as a threaded component. A lower surface rinsing fluid supply nozzle 6 is provided on the base 5. The lower surface rinsing fluid supply nozzle 6 is connected to a rinsing fluid supply source 8 via a flow adjustment mechanism 7 such as a valve, and sprays rinsing fluid onto the lower surface of the wafer W. The lower surface rinsing fluid supply nozzle 6 supplies rinsing fluid to a position on the lower surface of the wafer W that is closer to the inside of the second cup body 60.

[0056] The first cup body 50 is annularly disposed on the lower surface side of the wafer W and below the periphery of the wafer W. The first cup body 50 has: an annular inclined wall 51, which slopes outward and downward from a position close to and opposite to the periphery of the lower surface side of the wafer W; and an annular vertical wall 52, which is continuous with the lower edge of the inclined wall 51 and extends downward. The inclined wall 51 and the vertical wall 52 guide the processing liquid dripping from the wafer W to the liquid receiving portion 41a of the outer cup 41. The liquid receiving portion 41a is provided with a drain port for discharging the processing liquid to the outside.

[0057] The second cup body 60 is arranged in a ring shape and positioned inside the first cup body 50. The second cup body 60 has a main body portion 61 formed in a ring shape and a protruding structure 62 detachably provided above the main body portion 61. The specific structure of the second cup body 60 will be described later.

[0058] A discharge path 70, forming an annular space, is formed between the first cup body 50 and the second cup body 60. A drain port (not shown) is provided below the discharge path 70. The developer solution blocked by the protruding structure 62 of the second cup body 60 is discharged to the outside through the drain port via the discharge path 70. Furthermore, the drain port is not limited to a position below the discharge path 70; for example, it may be formed on the surface of the base 5 at a portion inside the second cup body 60.

[0059] In addition, the liquid treatment apparatus 1 includes a control device 11. The control device 11 is, for example, a computer, and includes a control unit 12 and a storage unit 13.

[0060] The storage unit 13 is implemented, for example, using semiconductor memory elements such as RAM or flash memory, or storage devices such as hard disks or optical disks, and stores programs that control various processes executed in the liquid processing device 1.

[0061] The control unit 12 includes a microcomputer with a CPU (Central Processing Unit), ROM (Read-Only Memory), RAM (Random Access Memory), input / output ports, and various circuits. The control unit 12 controls the operation of the liquid processing device 1 by reading and executing the program stored in the storage unit 13.

[0062] Furthermore, the program can also be recorded on a computer-readable storage medium and loaded from that storage medium into the storage unit 13 of the control device 11. Examples of computer-readable storage media include hard disks (HD), floppy disks (FD), optical disks (CD), magneto-optical disks (MO), and memory cards.

[0063] <Specific structure of the second cup>

[0064] Next, refer to Figures 4-7 Explain the specific structure of the second cup body 60. Figure 4 This is a top view showing the structure of the second cup body 60 in the first embodiment. Figure 5 This is a diagram illustrating an example of the state in which the protruding structure 62 is separated from the second cup body 60. Figure 6 It means Figure 4 A diagram showing an example of a cross-sectional view along line A-A. Figure 7 It means Figure 4 A diagram showing an example of a cross-sectional view along line B-B. Furthermore, Figure 6 and Figure 7 The cross-section shown corresponds to a side cross-section perpendicular to the circumference of the second cup body 60.

[0065] like Figure 4 and Figure 5 As shown, the second cup body 60 has an annular main body 61 and a protruding structure 62 detachably provided on the main body 61.

[0066] The main body 61 has its upper surface 61a facing the back surface of the wafer W. That is, the upper surface 61a of the main body 61 is the opposite surface to the lower surface of the wafer W. In addition, the upper surface 61a of the main body 61 slopes downward from the outer peripheral surface of the main body 61 toward the inner peripheral surface. An annular step portion 61b is formed on the outer periphery of the upper surface 61a.

[0067] The protruding structure 62 has a base member 63 and a plurality of (three in this case) protrusions 64. The base member 63 is a support member that supports the protrusions 64 from below, and has an annular body 63a that fits into the stepped portion 61b and a plurality of (four in this case) arms 63b extending radially from the inner circumference of the annular body 63a above the upper surface 61a of the main body portion 61. The plurality of arms 63b are arranged at intervals along the circumference of the annular body 63a.

[0068] Multiple protrusions 64 are annular. The multiple protrusions 64 protrude toward the lower surface of the wafer W. Each of the multiple protrusions 64 has a blade-shaped tip (upper end). The height of the tips of the multiple protrusions 64 may also be equal. The end face (upper surface) of each of the multiple protrusions 64 may also be a flat surface. The distance between the tip of each of the multiple protrusions 64 and the lower surface of the wafer W is set to a predetermined distance such that a developer liquid seal is formed in the space between the tip of each of the multiple protrusions 64 and the lower surface of the wafer W. The number of multiple protrusions 64 is not limited to three; two or more are acceptable.

[0069] Multiple protrusions 64 are arranged concentrically on the annular body 63a and multiple arms 63b along the radial direction of the annular body 63a, and are detachably provided on the main body 61 by means of the annular body 63a and multiple arms 63b.

[0070] Thus, in this embodiment, the second cup body 60 has a plurality of annular protrusions 64 arranged concentrically and protruding toward the lower surface of the wafer W on the upper surface 61a side of the main body 61. This forms a liquid seal for the developer in the space between the tip of each of the plurality of protrusions 64 and the lower surface of the wafer W, thereby preventing developer from entering the lower surface of the wafer W from the upper surface. Therefore, it is possible to suppress the developer from flowing around to the lower surface of the wafer W.

[0071] Furthermore, multiple protrusions 64 are detachably provided on the main body 61 from the upper surface 61a side. Specifically, the multiple protrusions 64 are detachably provided on the main body 61 via the base member 63. Thus, during the periodic maintenance of the second cup 60, the protrusion structure 62 (i.e., the base member 63 and the multiple protrusions 64) can be separated from the main body 61 from the second cup 60, and the replacement of the multiple protrusions 64 can be performed easily.

[0072] like Figure 6As shown, with the multiple protrusions 64 mounted on the main body 61 via the base member 63, two of the protrusions 64 located on the multiple arms 63b are separated from the upper surface 61a of the main body 61. That is, a gap is formed between the lower end of each of the two protrusions 64 located on the multiple arms 63b and the upper surface 61a of the main body 61. This structure allows the developer solution dripping from the two protrusions 64 onto the upper surface 61a of the main body 61 to flow smoothly towards the lower end of the upper surface 61a of the main body 61, improving drainage.

[0073] Each of the plurality of protrusions 64 has a vertical surface 63d located on the outer peripheral surface side of the annular body 63a and an inclined surface 63e that slopes downward from the upper edge of the vertical surface 63d toward the inner peripheral surface side of the annular body 63a. Because each of the plurality of protrusions 64 has a vertical surface 63d, a liquid seal for the developer can be formed more effectively in the space between the top of each of the plurality of protrusions 64 and the lower surface of the wafer W, stably preventing the developer from entering the lower surface of the wafer W from the upper surface. Therefore, it is possible to more reliably suppress the developer from flowing around to the lower surface of the wafer W. Furthermore, because each of the plurality of protrusions 64 has an inclined surface 63e, the rinsing liquid supplied from the lower surface rinsing liquid supply nozzle 6 to the lower surface of the wafer W can easily flow to a position further outward than the second cup body 60. Therefore, the cleaning efficiency of the rinsing liquid on the lower surface of the wafer W for the developer can be improved.

[0074] Furthermore, each of the multiple arm portions 63b has a curved surface 63c that is recessed toward the upper surface 61a of the main body portion 61 at the position where it is sandwiched between adjacent protrusions 64 in a side cross-section. As a result, the developer dripping from the adjacent protrusions 64 onto the arm portion 63b can be guided from the arm portion 63b toward the upper surface 61a of the main body portion 61, thereby improving drainage.

[0075] like Figure 5 As shown, a groove 61c extending radially along the main body 61 is formed on the upper surface 61a of the main body 61. The groove 61c is connected to a stepped portion 61b formed on the outer periphery of the main body 61. The groove 61c extends from the stepped portion 61b to the inner peripheral surface of the main body 61.

[0076] like Figure 7 As shown, the base member 63 has other arms 63f extending radially from the inner circumference of the annular body 63a at a position lower than the plurality of arms 63b. The other arms 63f extend from the inner circumferential surface of the annular body 63a to the inner circumferential surface of the main body 61. The other arms 63f engage with the groove 61c of the main body 61. With the plurality of protrusions 64 mounted on the main body 61 by means of the base member 63, the engagement of the other arms 63f of the base member 63 with the groove 61c of the main body 61 suppresses positional displacement of the base member 63.

[0077] Furthermore, the other arms 63f have inclined surfaces 63d1 that are continuous with the upper surface 61a of the main body 61 when the other arms 63f are engaged with the groove 61c of the main body 61. With this structure, the flow of developer at the upper surface 61a of the main body 61 can be prevented from being hindered by the other arms 63f, thereby improving drainage.

[0078] Furthermore, the other arms 63f overlap with at least one of the multiple arms 63b to form a single unit. This structure strengthens the other arms 63f, thus further suppressing positional displacement of the base member 63.

[0079] Thus, in the liquid processing apparatus 1 of the first embodiment, a second cup body 60 is provided inside the first cup body 50, and a plurality of annular protrusions 64 are concentrically arranged on the upper surface 61a side of the second cup body 60 opposite to the lower surface of the wafer W. Therefore, the plurality of protrusions 64 can block the developer solution from entering the lower surface of the wafer W from the upper surface, and can prevent the developer solution from wrapping around the lower surface of the wafer W.

[0080] (Second Implementation)

[0081] Figure 8 This is a cross-sectional view showing the structure of the second cup body 60 in the second embodiment. In the first embodiment described above, an example is shown in which the heights of the tips of the plurality of protrusions 64 relative to the base member 63 are equal, but the heights of the tips of the plurality of protrusions 64 relative to the base member 63 may also be different.

[0082] For example, such as Figure 8 As shown, the height of the tip of at least one of the plurality of protrusions 64 relative to the base member 63 may also be lower than the height of the tips of other protrusions 64 disposed at a position more inward than the protrusion 64 relative to the base member 63. Figure 8 In the example, the closer the multiple protrusions 64 are to the periphery of the wafer W, the lower the height of their tops relative to the base member 63. Using this structure, even in cases of wafer bending where the periphery of the wafer W droops, damage to the wafer W can be suppressed because the multiple protrusions 64 do not easily contact the lower surface of the wafer W.

[0083] (Third Implementation)

[0084] Figure 9This is a cross-sectional view showing the structure of the second cup body 60 in the third embodiment. In the second embodiment described above, an example is shown where the height of the tip of at least one of the plurality of protrusions 64 relative to the base member 63 is lower than the height of the tips of the other protrusions 64 disposed at a position closer to the inside of the protrusion 64 relative to the base member 63. Furthermore, in the third embodiment, the tip of at least one of the plurality of protrusions 64 may also be bent outward.

[0085] For example, such as Figure 9 As shown, the tips of two of the multiple protrusions 64, excluding the innermost protrusion 64, are bent outwards. With this structure, since the multiple protrusions 64 are less likely to come into contact with the lower surface of the wafer W, damage to the wafer W can be further suppressed.

[0086] (Fourth implementation)

[0087] Figure 10 This is a cross-sectional view showing the structure of the second cup body 60 in the fourth embodiment. (Example) Figure 10 As shown, at least one of the plurality of protrusions 64 has a rounded end face 63g at its tip. Figure 10 In the example, all of the multiple protrusions 64 have rounded end faces 63g at their top ends. With this structure, damage to the wafer W can be suppressed because the external force exerted by the protrusions 64 when they come into contact with the lower surface of the wafer W is mitigated.

[0088] (Fifth Embodiment)

[0089] Figure 11 This is a cross-sectional view showing the structure of the first cup body 50 and the second cup body 60 in the fifth embodiment. In the embodiments described above, an example is shown where a plurality of annular protrusions 64 are arranged on the upper surface 61a side of the second cup body 60 opposite to the lower surface of the wafer W. However, other protrusions may also be arranged below the periphery Wa of the wafer W or at a position further outward than the periphery of the wafer W. For example, as... Figure 11 As shown, an annular protrusion 53 may also be provided on the first cup body 50 at the position below the periphery Wa of the wafer W.

[0090] In this way, by providing an annular protrusion 53 in the first cup body 50, the developer solution that enters from the upper surface of the wafer W via the periphery Wa can be more stably blocked. Therefore, it is possible to further suppress the developer solution from flowing around to the lower surface of the wafer W.

[0091] (Other implementation methods)

[0092] In the above embodiments, an example is shown in which the main body 61 and the protruding structure 62 of the second cup body 60 are formed separately, but the main body 61 and the protruding structure 62 can also be formed integrally.

[0093] As described above, the liquid processing apparatus of the embodiment (liquid processing apparatus 1, for example) includes a holding part (substrate rotation part 2, for example), a liquid supply part (developer supply nozzle 31), a first cup body (first cup body 50, for example), and a second cup body (second cup body 60, for example). The holding part holds the substrate (wafer W, for example) and rotates it. The liquid supply part supplies processing liquid (developer, for example) to the upper surface of the substrate held by the holding part. The first cup body is arranged in a ring shape on the lower surface side of the substrate held by the holding part and is located below the periphery of the substrate. The second cup body is arranged in a ring shape at a position closer to the first cup body, and has a plurality of annular protrusions (protrusions 64, for example) arranged concentrically and protruding toward the lower surface of the substrate on the opposite side (upper surface 61a, for example) opposite to the lower surface of the substrate. As a result, it is possible to prevent the developer from wrapping around the lower surface of the wafer W.

[0094] It should be considered that the embodiments disclosed herein are merely illustrative in all respects and are not restrictive. In fact, the above-described embodiments can be implemented in a wide variety of forms. Furthermore, the above-described embodiments can be omitted, substituted, or modified in various forms without departing from the appended claims and their spirit.

Claims

1. A liquid treatment device, characterized in that, This liquid treatment device has the following features: A holding section that holds the substrate and rotates it; A liquid supply unit supplies processing liquid to the upper surface of the substrate held by the holding unit; The first cup body is arranged in a ring shape on the lower surface of the substrate held by the holding part, and is located below the periphery of the substrate; and The second cup body is arranged in a ring shape at a position closer to the inside than the first cup body, and has a plurality of annular protrusions arranged concentrically and protruding toward the lower surface of the substrate on the opposite side opposite to the lower surface of the substrate.

2. The liquid treatment apparatus according to claim 1, characterized in that, The second cup body has a main body portion formed in a ring shape. The plurality of protrusions are detachably provided on the main body from the opposite side of the main body.

3. The liquid treatment apparatus according to claim 2, characterized in that, The main body has a stepped portion formed in a ring shape on the outer periphery of the opposite surfaces. The second cup body has a base member having an annular portion that engages with the stepped portion and a plurality of arms extending radially from the inner periphery of the annular portion toward the annular portion above the opposing surface. The plurality of protrusions are concentrically arranged on the annular portion and the plurality of arms along the radial direction of the annular portion, and are detachably mounted on the main body portion by means of the base member.

4. The liquid treatment apparatus according to claim 3, characterized in that, One or more of the plurality of protrusions disposed on the plurality of arms are separated from the opposite surface of the main body.

5. The liquid treatment apparatus according to claim 3, characterized in that, Each of the plurality of arms, when viewed in a side section perpendicular to the circumference of the main body, has a curved surface that is recessed toward the opposite face at the position where it is sandwiched between the adjacent protrusions.

6. The liquid treatment apparatus according to claim 3, characterized in that, The main body portion has a groove formed on the opposing surface and extending radially in the main body portion. The base member has other arms that extend radially from the inner periphery of the annular portion toward the annular portion at a position lower than the plurality of arms. The other arm portions fit into the groove portion.

7. The liquid treatment apparatus according to claim 6, characterized in that, The opposing surfaces of the main body portion slope downwards from the outer peripheral surface toward the inner peripheral surface of the main body portion. The other arm has an inclined surface that is continuous with the opposite surface when the other arm is fitted into the groove.

8. The liquid treatment apparatus according to claim 6, characterized in that, The plurality of arms are arranged at intervals around the circumference of the annular portion. The other arms overlap with at least one of the plurality of arms to form a single unit.

9. The liquid treatment apparatus according to claim 1, characterized in that, At least one of the protrusions has a tip height lower than the tip height of the other protrusions located at a position more inward than the protrusion itself.

10. The liquid treatment apparatus according to claim 9, characterized in that, The tip of at least one of the plurality of protrusions bends outward.

11. The liquid treatment apparatus according to claim 1, characterized in that, At least one of the plurality of protrusions has a rounded end face at its tip.

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