A component array-type heat dissipation structure

Abstract

This utility model relates to the field of heat dissipation for circuit board components, and more particularly to an array-type heat dissipation structure for components. It includes a circuit board on which a plurality of heat-generating components are arranged in an array. Each heat-generating component has a heat-conducting element on its top, and the top of all heat-conducting elements contacts the bottom surface of a heat dissipation assembly. Airflow channels are formed between adjacent heat-generating components. The heat-generating components are individually arranged in an array on the circuit board, occupying a small area. There are pathways between the heat-generating components on the circuit board for wiring, improving the utilization rate of the circuit board's wiring space. Furthermore, the heat dissipation assembly and the circuit board sandwich the array of heat-generating components in the middle, thus forming airflow channels between the heat-generating components. Heat can not only be conducted to the top heat sink through the heat-conducting elements but also be directly carried away by the airflow through the airflow channels, improving heat dissipation efficiency.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation of circuit board components, and in particular to a component array heat dissipation structure. Background Technology

[0002] Many components on a circuit board generate heat. If this heat cannot be dissipated in time, it can lead to low operating efficiency of electronic devices or even damage to the circuit board and its components. Therefore, heat dissipation for heat-generating components on circuit boards is an important branch of electronic technology. Currently, for multiple components of the same type, they are usually packaged into a component module. The entire component module is placed on the circuit board, and then a heat sink is connected to the module to conduct heat from the components to the component module. The heat is then blown away from the heat sink by air cooling to achieve heat dissipation. However, the existing method of heat dissipating multiple components by packaging them into component modules has the following problems: First, the component module occupies a large area of ​​the circuit board, and the occupied area cannot be designed with other traces, resulting in low utilization of the circuit board wiring space. Second, the heat-generating components in the component module can only dissipate heat by transferring heat to the heat sink, which is inefficient. Utility Model Content

[0003] To overcome the above problems, this utility model provides a component array-type heat dissipation structure. The technical solution adopted by this utility model to solve its technical problems is as follows:

[0004] A component array-type heat dissipation structure includes a circuit board on which a plurality of heat-generating components are arranged in an array. Each heat-generating component has a heat-conducting element on its top. The top of all heat-conducting elements is in contact with the bottom surface of the same heat dissipation component, and airflow channels are formed between adjacent heat-generating components.

[0005] Furthermore, the heat dissipation assembly includes a heat sink and an insulating thermally conductive pad, the insulating thermally conductive pad being located on the bottom surface of the heat sink, and the heat dissipation assembly being connected to the thermally conductive component through the insulating thermally conductive pad.

[0006] Furthermore, the insulating and thermally conductive pad is an alumina ceramic sheet.

[0007] Furthermore, the heat-conducting component is encapsulated in a sheet-like form on top of the heat-generating element, and the heat-conducting component is electrically connected to the heat-generating element.

[0008] Furthermore, a side guide is formed on one side of the heat-conducting component extending downward along the side wall of the heating element. The side guide is in close contact with the side wall of the heating element, and the bottom of the side guide is connected to the circuit board.

[0009] Furthermore, the heat-conducting components are made of copper or copper alloys.

[0010] The beneficial effects of this utility model are as follows:

[0011] The heat dissipation structure includes a circuit board on which several heat-generating components are arranged in an array. Each heat-generating component has a heat-conducting element on its top, and the top of all heat-conducting elements contacts the bottom surface of the same heat dissipation component. Airflow channels are formed between adjacent heat-generating components. The heat-generating components are individually arranged in an array on the circuit board, occupying a small area of ​​the circuit board. The design of the heat-generating components on the circuit board, similar to an alleyway, allows for wiring and improves the utilization of the circuit board's wiring space. Furthermore, the heat dissipation component and the circuit board sandwich the array of heat-generating components in the middle, thus forming airflow channels between the heat-generating components. Heat can not only be conducted to the heat dissipation component at the top through the heat-conducting elements, but can also be directly carried away by the airflow through the airflow channels, improving heat dissipation efficiency. Attached Figure Description

[0012] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, wherein:

[0013] Figure 1 This is a three-dimensional view of the heat dissipation structure;

[0014] Figure 2 This is an exploded view of the heat dissipation structure;

[0015] Figure 3 It is a three-dimensional view of the heat-conducting components on the circuit board.

[0016] Figure number marking:

[0017] 100. Circuit board; 101. Heat-generating components; 102. Thermal conductive components; 103. Heat dissipation assembly; 1031. Heat sink; 1032. Insulating thermally conductive pad; 104. Side guide. Detailed Implementation

[0018] To better understand the purpose, structure, and function of this utility model, the following detailed description of a specific embodiment of the "Component Array Heat Dissipation Structure" of this utility model is provided in conjunction with the accompanying drawings.

[0019] See Figure 1 and Figure 2In this embodiment, the component array heat dissipation structure includes a circuit board 100, on which a plurality of heat-generating components 101 are disposed. The heat-generating components 101 are arranged in an array on the circuit board 100. The bottom of the heat-generating components 101 is directly electrically connected to the circuit on the circuit board 100 by means of plug-in or soldering. The heat-generating components 101 on the circuit board 100 form alleyways similar to those between houses. Each heat-generating component 101 is provided with a heat-conducting element 102 on its top. A heat dissipation assembly 103 is covered on the top of all the heat-conducting elements 102. The top of each heat-conducting element 102 is in contact with the bottom surface of the heat dissipation assembly 103 so that the heat on all the heat-generating components 101 can be conducted to the heat dissipation assembly 103, and then the heat is dissipated uniformly through the heat dissipation assembly. An airflow channel is formed between adjacent heat-generating components 101 so that the airflow passes through the heat-generating components 101 and directly carries away the heat of the heat-generating components 101.

[0020] It should be noted that in the component array heat dissipation structure of this embodiment, the heat-generating components 101 are all individually arranged in an array on the circuit board 100. In this way, each heat-generating component 101 occupies only the space of its own bottom area on the circuit board 100, and the total area occupied by the heat-generating components 101 is smaller than that of the component modules. Furthermore, the heat-generating components 101 on the circuit board 100 form a channel-like design, and these spaces can be used for wiring, improving the space utilization rate of the wiring on the circuit board 100. Moreover, the heat dissipation component 103 and the circuit board 100 sandwich the arrayed heat-generating components 101 in the middle, thus forming an airflow channel between the heat-generating components 101. The heat generated by the heat-generating components 101 can not only be conducted to the heat dissipation component 103 at the top through the heat conductor 102, but can also be directly carried away by the airflow through the airflow channel, improving the heat dissipation efficiency.

[0021] It should also be noted that in traditional component modules, each component needs to be led out of the component module through an additional lead before being electrically connected to the circuit on the circuit board 100. This increases the lead design. In this embodiment, the bottom of the heat-generating component 101 of the heat dissipation structure is directly electrically connected to the circuit on the circuit board 100, which further reduces the drive loop, improves drive reliability, and reduces manufacturing costs.

[0022] See further Figure 2 In this embodiment, the heat dissipation assembly 103 includes a heat sink 1031 and an insulating thermally conductive pad 1032. The insulating thermally conductive pad 1032 is located on the bottom surface of the heat sink 1031. The heat dissipation assembly 103 is connected to the thermally conductive component 102 through the insulating thermally conductive pad 1032 to prevent short circuits caused by communication between the heat-generating component 101 and the heat sink 1031.

[0023] Furthermore, as a preferred embodiment, the insulating thermally conductive pad 1032 is preferably an alumina ceramic sheet. The alumina ceramic sheet has excellent thermal conductivity, with a thermal conductivity coefficient ≥24W / m*k; at the same time, it has excellent insulation properties, with an insulation strength ≥15KV / mm; and a volume resistivity ≥1*10^14Ω*cm. It ensures insulation while also having excellent thermal conductivity.

[0024] See further Figure 2 and Figure 3 In this embodiment, the heat-conducting component 102 is packaged in a sheet shape on the top of the heat-generating component 101, and the heat-conducting component 102 is electrically connected to the heat-generating component 101 to form an integrated structure, such as a back-mounted IGBT, which has excellent structural stability and excellent thermal conductivity and heat dissipation performance.

[0025] More specifically, in this embodiment, a side guide 104 is formed on one side of the heat-conducting component 102 extending downward along the side wall of the heating element 101. The side guide 104 is close to the side wall of the heating element 101 to increase the contact area with the heating element 101 and improve the heat conduction efficiency. At the same time, the bottom of the side guide 104 is connected to the circuit board 100, so that the side guide 104 can also conduct the heat of the nearby circuit board 100 to the heat dissipation assembly 103, thereby improving the heat dissipation effect.

[0026] Preferably, in this embodiment, the heat-conducting element 102 is made of copper or a copper alloy, which has excellent thermal conductivity.

[0027] It is understood that this utility model has been described through some embodiments, and those skilled in the art will recognize that various changes or equivalent substitutions can be made to these features and embodiments without departing from the spirit and scope of this utility model. Furthermore, under the teachings of this utility model, these features and embodiments can be modified to adapt to specific situations and materials without departing from the spirit and scope of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are within the protection scope of this utility model.

[0028] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this utility model. In the description of this application, "multiple" and "several" are understood as "at least two." "And / or" describes the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can indicate three situations: A exists alone, A and B exist simultaneously, and B exists alone. A and B are connected, which can indicate two situations: A and B are directly connected and A and B are connected through C. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

Claims

1. A component array-type heat dissipation structure, comprising a circuit board (100), wherein a plurality of heat-generating components (101) are disposed on the circuit board (100), characterized in that, The heating elements (101) are arranged in an array on the circuit board (100). Each heating element (101) has a heat-conducting element (102) on its top. A continuous heat dissipation assembly (103) covers the top of all the heat-conducting elements (102), and the bottom surface of the heat dissipation assembly (103) is connected to the top surface of the heat-conducting elements (102). An airflow channel is formed between adjacent heating elements (101). A side guide (104) extends downward along the side wall of the heating element (101) on one side of the heat-conducting element (102). The side guide (104) is close to the side wall of the heating element (101), and the bottom of the side guide (104) is connected to the circuit board (100).

2. The component array-type heat dissipation structure according to claim 1, characterized in that, The heat dissipation assembly (103) includes a heat sink (1031) and an insulating thermally conductive pad (1032). The insulating thermally conductive pad (1032) is located on the bottom surface of the heat sink (1031). The heat dissipation assembly (103) is connected to the thermally conductive component (102) through the insulating thermally conductive pad (1032).

3. The component array-type heat dissipation structure according to claim 2, characterized in that, The insulating thermally conductive pad (1032) is an alumina ceramic sheet.

4. The component array-type heat dissipation structure according to claim 1, characterized in that, The heat-conducting component (102) is encapsulated in a sheet shape on the top of the heating element (101), and the heat-conducting component (102) is electrically connected to the heating element (101).

5. The component array-type heat dissipation structure according to claim 4, characterized in that, The heat-conducting component (102) is made of copper or a copper alloy.

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