Multi-functional wafer carrier and wafer processing apparatus

Abstract

The application provides a multifunctional wafer carrier and a wafer processing device, and relates to the technical field of semiconductors. The multifunctional wafer carrier comprises a cover body and a base. The base and the cover body are detachably connected. The cover body is provided with a first placing part on the side away from the base, and the first placing part is used for carrying a first wafer. The base is provided with a second placing part on the side facing the cover body, and the second placing part is used for carrying a second wafer. The base is provided with a liquid inlet hole, and the liquid inlet hole is used for injecting a cleaning agent into the second placing part. The first placing part of the multifunctional wafer carrier can carry the first wafer, and the first wafer is convenient to grind. The base can also place the second wafer, and the second wafer is used for cleaning, storing or transferring, the function is rich, and the multifunctional wafer carrier can be applied in various scenes.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a multifunctional wafer carrier and wafer processing equipment. Background Technology

[0002] In the chemical refining process of wafers, wafer carriers are needed for support to prevent wafers from cracking due to thinning during the thinning process. After the refining process, wafer carriers are also needed for transport to subsequent processes. Most existing wafer carriers can only support wafers of a single size and cannot support wafers of multiple sizes. For example, in the wafer cleaning process, wafer carriers of different sizes need to be changed separately. Wafer cassettes used in the wafer transfer process need to be purchased separately, and different wafers require separate carriers for handling. The entire process involves a large number and variety of wafer carriers. Utility Model Content

[0003] The purpose of this invention is to provide a multifunctional wafer carrier and wafer processing equipment with a wide range of functions. It can be used to support and carry wafers during grinding and cleaning processes, and can also be used as a wafer box to store and transfer wafers.

[0004] In a first aspect, this utility model provides a multifunctional wafer carrier, including a cover and a base;

[0005] The base and the cover are detachably connected; the cover has a first placement part on the side away from the base, and the first placement part is used to support the first wafer;

[0006] The base has a second placement portion on the side facing the cover, and the second placement portion is used to support the second wafer;

[0007] The base is provided with a liquid inlet hole, which is used to inject cleaning agent into the second placement part.

[0008] In an optional embodiment, the second placement portion is provided with a groove for accommodating the second wafer; the groove wall is provided with the liquid inlet hole.

[0009] In an optional embodiment, the base has an annular protrusion on the side facing the cover, and the annular protrusion and the base together form the groove; the annular protrusion has the liquid inlet hole.

[0010] In an optional embodiment, the annular protrusion is provided with a plurality of liquid inlet holes, which are evenly distributed along the circumference of the annular protrusion; the liquid inlet holes penetrate the annular protrusion radially.

[0011] In an optional embodiment, the base has a drainage groove on the side facing the cover, and the drainage groove is located around the second placement part.

[0012] In an optional embodiment, the bottom of the drainage trough is provided with adsorption holes.

[0013] In an alternative embodiment, the drainage channel extends to the edge of the base.

[0014] In an optional embodiment, the cover and the base are snap-fitted together.

[0015] In an optional embodiment, the cover has a slot on the side facing the base, and the annular protrusion is inserted into the slot.

[0016] Secondly, this utility model provides a wafer processing equipment, including a machine base and a multifunctional wafer carrier as described in any of the foregoing embodiments, wherein the multifunctional wafer carrier is mounted on the machine base.

[0017] The multifunctional wafer carrier and wafer processing equipment provided in this embodiment of the utility model have the following beneficial effects:

[0018] The multifunctional wafer carrier provided in this embodiment of the invention has a first placement part on the cover for placing a first wafer. This part is applicable in grinding processes, where it supports and carries the first wafer during grinding, reducing the risk of wafer cracking. The second placement part on the base can hold a second wafer, suitable for scenarios involving cleaning or transferring the second wafer. When transferring the second wafer, this multifunctional wafer carrier can function as a wafer cassette. It offers rich functionality, wide applicability, and reduces the number and types of carriers used in wafer processing.

[0019] The wafer processing equipment provided in this embodiment includes the aforementioned multifunctional wafer carrier, which can adapt to multiple scenarios in the wafer processing process and can realize wafer grinding support, cleaning support, storage and transfer, etc. It has rich functions and wide application scenarios. Attached Figure Description

[0020] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0021] Figure 1 A schematic diagram of the overall structure of the multifunctional wafer carrier provided in this embodiment of the utility model;

[0022] Figure 2 A schematic diagram of the disassembled structure of the multifunctional wafer carrier provided in an embodiment of this utility model;

[0023] Figure 3 A schematic diagram of a multifunctional wafer carrier provided in this embodiment of the present invention for preventing the separation of a first wafer and a second wafer;

[0024] Figure 4 Another structural schematic diagram of the base of the multifunctional wafer carrier provided in this embodiment of the utility model;

[0025] Figure 5 This is a schematic diagram of the cover of the multifunctional wafer carrier provided in an embodiment of the present invention from another perspective.

[0026] Icons: 100-Multifunctional wafer carrier; 110-Cover; 111-First placement part; 112-First wafer; 113-Card slot; 120-Base; 121-Groove; 122-Second wafer; 123-Annular protrusion; 124-Liquid inlet; 125-Drainage groove; 126-Adsorption hole; 130-Bonding adhesive. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0028] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0029] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0030] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0031] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0032] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0033] The following detailed description, in conjunction with the accompanying drawings, outlines some embodiments of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0034] Please combine Figures 1 to 3 The present invention provides a multifunctional wafer carrier 100, which can carry and support wafers during the wafer grinding process, carry wafers during the wafer cleaning process, and store and transfer wafers as a wafer box.

[0035] The multifunctional wafer carrier 100 includes a cover 110 and a base 120. The base 120 and the cover 110 are detachably connected. A first placement portion 111 is provided on the side of the cover 110 away from the base 120, for supporting a first wafer 112. A second placement portion is provided on the side of the base 120 facing the cover 110, for supporting a second wafer 122. The base 120 has a liquid inlet 124 for injecting cleaning agent into the second placement portion, facilitating cleaning of the second wafer 122. The first placement portion 111 of the multifunctional wafer carrier 100, which supports the first wafer 112, is suitable for use in grinding processes. When grinding the surface of the first wafer 112, the first placement portion 111 provides support and bearing, reducing the risk of wafer breakage during grinding. The second placement portion on the base 120, which supports the second wafer 122, is suitable for scenarios involving cleaning or transferring the second wafer 122. When transferring the second wafer 122, the multifunctional wafer carrier 100 can be used as a wafer box. It has a wide range of functions and is applicable to many scenarios. It can reduce the number and types of carriers used in the wafer processing process, making it convenient to use and saving costs.

[0036] Optionally, the second placement portion is provided with a groove 121 for accommodating the second wafer 122. The groove 121 has a liquid inlet hole 124 on its wall. Optionally, the area of ​​the first placement portion 111 is larger than the area of ​​the groove 121; therefore, the first placement portion 111 is suitable for placing the larger first wafer 112, and the groove 121 is suitable for placing the smaller second wafer 122. For example, the first wafer 112 is a 12-inch wafer, and the second wafer 122 is an 8-inch or 10-inch wafer; or, the first wafer 112 is a 12-inch or 10-inch wafer, and the second wafer 122 is an 8-inch or 6-inch wafer; no specific limitation is made here.

[0037] In this embodiment, the base 120 has an annular protrusion 123 on the side facing the cover 110, and the annular protrusion 123 and the base 120 together form a groove 121. The groove 121 provides a limiting function for the second wafer 122, making its support more stable. The annular protrusion 123 has a liquid inlet hole 124. It is easy to understand that the base 120 and the cover 110 are approximately disk-shaped, and the annular protrusion 123 is approximately circular. The axis of the liquid inlet hole 124 is perpendicular to the axis of the annular protrusion 123, meaning the liquid inlet hole 124 is radially arranged along the base 120 and penetrates the annular protrusion 123. Thus, the liquid inlet hole 124 allows cleaning agent to be injected into the groove 121 from the outside, thereby cleaning the surface of the second wafer 122.

[0038] In this embodiment, multiple liquid inlet holes 124 are provided, and the multiple liquid inlet holes 124 are evenly spaced along the circumference of the annular protrusion 123. When cleaning the second wafer 122, the cleaning agent can enter simultaneously from multiple liquid inlet holes 124 and be sprayed onto the surface of the second wafer 122 from different directions, thereby improving the cleaning ability of the second wafer 122 and improving the cleaning effect. The size, shape, and number of liquid inlet holes 124 are not specifically limited. For example, the cross-sectional shape of the liquid inlet holes 124 can be circular, elliptical, crescent-shaped, arc-shaped, triangular, quadrilateral, pentagonal, hexagonal, or other polygonal shapes.

[0039] Optionally, a drainage groove 125 is provided on the side of the base 120 facing the cover 110, and the drainage groove 125 is located on the periphery of the second placement part. In this embodiment, the drainage groove 125 is located on the periphery of the groove 121. The drainage groove 125 facilitates the rapid discharge of waste liquid after wafer cleaning. Optionally, the drainage groove 125 extends to the edge of the base 120 to facilitate the discharge of cleaning waste liquid outside the base 120. In this embodiment, the drainage groove 125 extends radially from the periphery of the groove 121 to the edge of the base 120. The shape of the drainage groove 125 is not limited and can be a straight channel, a curved channel, or a channel of other shapes. In this embodiment, the cross-section of the drainage groove 125 is arc-shaped or semi-circular, which has a large drainage volume and high drainage efficiency, avoiding the residue of cleaning waste liquid.

[0040] It is understood that multiple drainage channels 125 are provided at intervals along the edge of the base 120. The multiple drainage channels 125 are evenly distributed to improve the drainage efficiency and facilitate more thorough and sufficient discharge of cleaning waste liquid.

[0041] It should be noted that in some embodiments, the number, shape and size of the drainage channels 125 can be flexibly designed, and no specific limitation is made here.

[0042] Please combine Figure 4 Optionally, the bottom of the drainage channel 125 is provided with an adsorption hole 126. The adsorption hole 126 can be used as a fixing hole. For example, by introducing negative pressure gas into the adsorption hole 126, the base 120 and the cover 110 can be vacuum adsorbed and fixed, making the support of the wafer by the base 120 and the cover 110 more stable and reliable.

[0043] Please combine Figure 5 Optionally, the cover 110 and the base 120 are snap-fitted together. The cover 110 has a slot 113 on the side facing the base 120, and an annular protrusion 123 is inserted into the slot 113 to achieve the snap-fit ​​connection between the base 120 and the cover 110. It can be understood that after the annular protrusion 123 is inserted into the slot 113, the annular protrusion 123 abuts against the wall of the slot 113, thus connecting the cover 110 and the base 120.

[0044] Of course, in other embodiments, the cover 110 and the base 120 may also be connected by thread, screw, magnetic adsorption or other connection methods, which are not specifically limited here.

[0045] This utility model embodiment also provides a wafer processing equipment, including a machine base and the aforementioned multifunctional wafer carrier 100, wherein the multifunctional wafer carrier 100 is mounted on the machine base. The machine base can be any equipment used in the wafer processing process, such as a grinding machine, a cleaning machine, or a conveying device.

[0046] The multifunctional wafer carrier 100 provided in this embodiment of the utility model operates on the following principle:

[0047] If chemical polishing is required for the first wafer 112, bonding adhesive 130 is applied to the surface of the cover 110 away from the base 120, i.e., bonding adhesive 130 is applied to the first placement portion 111. The first wafer 112 is then mounted onto the bonding adhesive 130. The first wafer 112 is then polished again using a chemical polishing process, which can thin the front or back side of the first wafer 112.

[0048] After the grinding process is completed, the cover 110 of the multi-functional wafer carrier 100 can be opened, and the second wafer 122 can be placed into the groove 121 of the base 120. The second wafer 122 and the base 120 are then placed into the wafer cleaning machine. The cleaning agent is sprayed from the nozzle of the wafer cleaning machine. The cleaning agent enters the groove 121 through the liquid inlet 124, thereby cleaning the front or back of the second wafer 122 and removing metal residues or colloidal residues from the surface of the second wafer 122.

[0049] The waste liquid after cleaning is discharged along the drain trough 125. The drain trough 125 can quickly discharge the cleaning waste liquid to the edge of the base 120, thereby avoiding the residue of the cleaning waste liquid and improving the cleaning effect.

[0050] It is understood that the second wafer 122 is placed in the groove 121 of the base 120 and the cover 110 is closed. This multifunctional wafer carrier 100 can protect the second wafer 122 and can be used as a wafer box for handling and storing the second wafer 122.

[0051] The multifunctional wafer carrier 100 and wafer processing equipment provided in this embodiment of the invention can provide support and load-bearing capacity during the wafer grinding process, reducing the risk of wafer cracking. It can also be used to support wafers in the wafer cleaning process, and as a wafer cassette for storing and transferring wafers. With its rich functionality and wide applicability, it reduces the number and types of carriers used in wafer processing, is easy to use, and saves costs.

[0052] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features. Any modifications, equivalent substitutions, improvements, etc., should be included within the protection scope of this utility model.

Claims

1. A multifunctional wafer carrier, characterized in that, Includes the cover and the base; The base and the cover are detachably connected; the cover has a first placement part on the side away from the base, and the first placement part is used to support the first wafer; The base has a second placement portion on the side facing the cover, and the second placement portion is used to support the second wafer; The base is provided with a liquid inlet hole, which is used to inject cleaning agent into the second placement part.

2. The multifunctional wafer carrier according to claim 1, characterized in that, The second placement part is provided with a groove for accommodating the second wafer; the groove wall is provided with the liquid inlet hole.

3. The multifunctional wafer carrier according to claim 2, characterized in that, The base has an annular protrusion on the side facing the cover, and the annular protrusion and the base together form the groove; the annular protrusion has the liquid inlet hole.

4. The multifunctional wafer carrier according to claim 3, characterized in that, The annular protrusion is provided with a plurality of liquid inlet holes, which are evenly distributed along the circumference of the annular protrusion; the liquid inlet holes penetrate the annular protrusion radially.

5. The multifunctional wafer carrier according to claim 1, characterized in that, The base has a drainage groove on the side facing the cover, and the drainage groove is located on the periphery of the second placement part.

6. The multifunctional wafer carrier according to claim 5, characterized in that, The bottom of the drainage trough is provided with adsorption holes.

7. The multifunctional wafer carrier according to claim 5, characterized in that, The drainage channel extends to the edge of the base.

8. The multifunctional wafer carrier according to claim 3, characterized in that, The cover and the base are connected by a snap-fit ​​mechanism.

9. The multifunctional wafer carrier according to claim 8, characterized in that, The cover has a slot on the side facing the base, and the annular protrusion is inserted into the slot.

10. A wafer processing equipment, characterized in that, It includes a machine base and a multi-functional wafer carrier as described in any one of claims 1 to 9, wherein the multi-functional wafer carrier is mounted on the machine base.

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