Alternating lifting material receiving device
By using an alternating lifting receiving device, and through the coordinated action of the wafer lifting cylinder and the positioning pin lifting cylinder, the problems of low space utilization, insufficient positioning accuracy, and high risk of contamination in traditional wafer transfer devices are solved, achieving efficient and stable wafer transfer and cleanliness.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HAICHUANG INTELLIGENT EQUIP (YANTAI) CO LTD
- Filing Date
- 2025-06-30
- Publication Date
- 2026-07-10
AI Technical Summary
Traditional wafer transfer devices suffer from low space utilization, insufficient positioning accuracy, high equipment cost, and high risk of contamination, and are difficult to meet the requirements of different process heights.
By employing the coordinated action of wafer lifting cylinders and positioning pin lifting cylinders, combined with a three-point evenly distributed positioning pin structure, and in conjunction with a vacuum-welded bellows and protective cover design, automated alternating wafer placement and placement is achieved, simplifying the robot operation process, reducing equipment costs, and controlling the movement speed through a speed regulating throttle valve.
It achieves stable and reliable wafer transport, reduces equipment costs, improves positioning accuracy and sealing, adapts to the needs of different process heights, and meets the high cleanliness requirements of semiconductor processes.
Smart Images
Figure CN224482038U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of semiconductor manufacturing equipment technology, and in particular relates to a material receiving device with alternating lifting and lowering. Background Technology
[0002] In semiconductor manufacturing, wafers need to be transferred with high precision and efficiency between different process chambers. Traditional wafer transfer mainly relies on robotic arms for direct pick-and-place, which has the following technical drawbacks:
[0003] Low space utilization: The robotic arm needs to perform complex lifting and rotating movements inside the cavity, which occupies a lot of equipment space;
[0004] Insufficient positioning accuracy: When the robotic arm places the wafer directly, it is prone to positional deviation, which affects the uniformity of the process;
[0005] High equipment costs: To achieve high-precision transmission, high-performance robots are required, which significantly increases equipment investment;
[0006] High risk of pollution: The frequent entry and exit of robotic arms into process chambers can easily introduce particulate pollutants.
[0007] Existing technologies often employ fixed receiving platforms, but these generally suffer from limited functionality and an inability to adapt to varying process height requirements. This is particularly true in processes such as physical vapor deposition (PVD) and chemical vapor deposition (CVD), where wafers need to be precisely moved to specific process positions, making it difficult for traditional devices to simultaneously meet the dual demands of transport stability and process adaptability. Utility Model Content
[0008] In view of the shortcomings of the prior art, the purpose of this utility model is to provide a material receiving device with alternating lifting and lowering.
[0009] To achieve the above objectives, the technical solution adopted is:
[0010] A lifting and lowering alternating receiving device includes a lower base plate. Below the lower base plate are a wafer lifting cylinder and a positioning pin lifting cylinder. The output shaft of the wafer lifting cylinder is connected to a wafer placement base plate above the lower base plate. The output shaft of the positioning pin lifting cylinder is connected to a positioning pin mounting ring above the lower base plate. Multiple positioning pins for supporting wafers are connected above the positioning pin mounting ring. The wafer placement base plate is located above the positioning pin mounting ring and has through holes for the positioning pins to pass through.
[0011] The advantages of adopting the above-mentioned preferred technical solution are as follows: the transfer of the wafer from the robot to the process position is realized by the alternating action of two sets of cylinders, which simplifies the robot's action process, reduces the requirements for robot accuracy and cost, and the coordinated action of the positioning pin and the wafer placement base plate ensures that there is no risk of wafer displacement or slippage during the lifting process.
[0012] Based on the above technical solution, the present invention can be further improved as follows:
[0013] Preferably, there are three locating pins, evenly distributed on the locating pin mounting ring.
[0014] The beneficial effects of adopting the above-mentioned preferred technical solution are: the three points are evenly distributed to provide a stable wafer support force, avoiding wafer warping or cracking due to uneven force.
[0015] Preferably, the alternating lifting receiving device further includes a cavity, the lower base plate is located at the bottom of the cavity, and the wafer placement base plate and the positioning pin mounting ring are located inside the cavity.
[0016] Preferably, the upper part of the cavity is provided with a process bushing, and the cavity is provided with a robot inlet; more preferably, the robot inlet is located on one side of the cavity.
[0017] The advantages of adopting the above-mentioned preferred technical solution are as follows: the process bushing provides a process processing environment for the wafer, and the impurities generated during the process will fall into the bushing and will not enter the bottom plate or other positions in the cavity below. The robot entry facilitates automated material handling, and the cavity structure isolates external contamination, meeting the high cleanliness requirements of semiconductor processes.
[0018] More preferably, the output shaft of the wafer lifting cylinder is connected to a first connecting rod via a first connecting block.
[0019] Preferably, a first housing is provided on the outer periphery of the first connecting rod, the upper end of the first connecting rod and the first housing is connected to the wafer placement base plate, and a first vacuum-welded corrugated tube is sleeved on the outer periphery of the section of the first housing located between the wafer placement base plate and the lower base plate.
[0020] The beneficial effects of adopting the above-mentioned preferred technical solution are as follows: the first connecting block plays a certain floating role, similar to a floating joint, to prevent the mechanism from being stuck due to processing or installation problems, and works with the first connecting rod to realize the transmission of force. The bellows seals and prevents dust, while also buffering mechanical vibration.
[0021] Preferably, the output shaft, the first connecting block, and the outer side of the first housing of the wafer lifting cylinder are fitted with protective covers.
[0022] The beneficial effects of adopting the above-mentioned preferred technical solution are: the protective cover prevents personnel from accidentally touching moving parts, and at the same time blocks external particles from contaminating the internal mechanism.
[0023] Preferably, when the wafer placement base plate extends, its maximum lifting height is higher than the uppermost end of the positioning pin and can reach the process bushing. The process bushing has a bottom opening structure to facilitate the entry of the wafer placement base plate and the wafer into the process bushing.
[0024] The advantages of adopting the above-mentioned preferred technical solution are: ensuring that the wafer can completely detach from the positioning pin and enter the process bushing, thus avoiding process failure due to insufficient height.
[0025] Preferably, both the wafer lifting cylinder and the positioning pin lifting cylinder are connected to a speed regulating throttle valve.
[0026] The beneficial effects of adopting the above-mentioned preferred technical solution are as follows: the speed regulating valve is used to regulate the cylinder speed, so as to avoid the wafer from being damaged by displacement or vibration due to sudden rise and fall.
[0027] Preferably, a second connecting rod is connected above the output shaft of the positioning pin lifting cylinder, and a second housing is fitted over the second connecting rod. The upper ends of the second connecting rod and the second housing are connected to the positioning pin mounting ring, and a second vacuum-welded corrugated pipe is fitted around the outer periphery of the second housing between the positioning pin mounting ring and the lower base plate.
[0028] The advantages of adopting the above-mentioned preferred technical solution are as follows: the second connecting rod realizes the transmission of force, ensures the synchronous movement of the positioning pin mounting ring, and the bellows and housing combination protects the internal mechanism of the cylinder and extends its service life.
[0029] Preferably, a second connecting block is provided between the lower base plate and the positioning pin lifting cylinder.
[0030] The beneficial effects of adopting the above-mentioned preferred technical solution are as follows: the second connecting block is used to install the lifting cylinder with the positioning pin, and is adapted to the length of the output shaft of the lifting cylinder with the positioning pin.
[0031] Compared with existing technologies, the advantages of this utility model are as follows: This utility model provides a lifting and alternating receiving device. Through the coordinated action of the wafer lifting cylinder and the positioning pin lifting cylinder, the automated alternating receiving and placement of wafers from the robot to the process position is realized, simplifying the robot operation process and reducing equipment costs. The three-point evenly distributed positioning pin structure ensures stable wafer lifting, and the design of vacuum welding bellows and protective cover effectively improves sealing and dustproof capabilities. The speed of the cylinder movement is controlled by a speed regulating throttle valve to ensure a smooth and reliable lifting process. At the same time, the cavity integration and process bushing design are compatible with semiconductor process requirements. The overall structure is compact and suitable for precision receiving and placement operations in high-cleanliness environments. The adjustable stroke of the lifting cylinder makes it easier to control the relative height of the wafer placement base when it enters the process position. It has a wide range of applications, not limited to PVD equipment in the semiconductor industry, but also applicable to other lifting and alternating receiving scenarios. Attached Figure Description
[0032] Figure 1 This is a schematic diagram of the material receiving device with alternating lifting and lowering according to the present invention;
[0033] Figure 2 This is a cross-sectional view of the material receiving device with alternating lifting and lowering in this utility model inside the cavity;
[0034] Figure 3 This is a front view of the material receiving device with alternating lifting and lowering according to this utility model;
[0035] Figure 4 This is a cross-sectional view of the positioning pin lifting cylinder of the material receiving device with alternating lifting and lowering according to this utility model.
[0036] 1. Wafer lifting cylinder; 2. Positioning pin lifting cylinder; 3. Protective cover; 4. Second connecting plate; 5. Lower base plate; 6. Second vacuum welded bellows; 7. Positioning pin mounting ring; 8. Cavity; 9. Robot entrance; 10. First connecting block; 11. Process bushing; 12. Speed regulating throttle valve; 13. Wafer placement base plate; 14. First vacuum welded bellows; 15. Positioning pin; 16. First connecting rod; 17. Second connecting rod; 18. First housing; 19. Second housing; 20. Through hole. Detailed Implementation
[0037] The present invention will be described below with reference to examples. The examples are only used to explain the present invention and are not intended to limit the scope of the present invention.
[0038] In the description of this utility model, it should be noted that the terms "vertical", "up", "down", "horizontal", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0039] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0040] Reference Figures 1-4 A lifting and lowering alternating receiving device includes a lower base plate 5. A wafer lifting cylinder 1 and a positioning pin lifting cylinder 2 are provided below the lower base plate 5. The output shaft of the wafer lifting cylinder 1 is connected to a wafer placement base plate 13 above the lower base plate 5. The output shaft of the positioning pin lifting cylinder 2 is connected to a positioning pin mounting ring 7 above the lower base plate 5. A plurality of positioning pins 15 for supporting wafers are connected above the positioning pin mounting ring 7. The wafer placement base plate 13 is located above the positioning pin mounting ring 7, and the wafer placement base plate 13 is provided with through holes 20 for the positioning pins 15 to pass through.
[0041] In an optional embodiment, the locating pins 15 are configured as three, at 120°. 。 The spacing is evenly distributed on the locating pin mounting ring 7.
[0042] In an optional embodiment, the alternating lifting receiving device further includes a cavity 8, with the lower base plate 5 located at the bottom of the cavity 8, and the wafer placement base plate 13 and the positioning pin mounting ring 7 located inside the cavity 8.
[0043] In an optional embodiment, a process bushing 11 is provided in the upper part of the cavity 8, and the cavity 8 is provided with a robot inlet 9. In this embodiment, the robot inlet 9 is located on one side of the cavity 8.
[0044] In an optional embodiment, the output shaft of the wafer lifting cylinder 1 is connected to the first connecting rod 16 via the first connecting block 10.
[0045] In this embodiment, a first housing 18 is provided on the outer periphery of the first connecting rod 16. The upper ends of the first connecting rod 16 and the first housing 18 are connected to the wafer placement base plate 13. A first vacuum welding corrugated tube 14 is sleeved on the outer periphery of the section of the first housing 18 between the wafer placement base plate 13 and the lower base plate 5.
[0046] In this embodiment, a protective cover 3 is fitted on the outer side of the output shaft of the wafer lifting cylinder 1, the first connecting block 10, and the first housing 18.
[0047] In an optional embodiment, the wafer placement base plate 13 is lifted to a maximum height higher than the uppermost end of the positioning pin 15 when the wafer lifting cylinder 1 is extended, and can reach the process bushing 11. The process bushing 11 has a lower opening structure, which facilitates the entry of the wafer placement base plate 13 and the wafer into the process bushing 11.
[0048] In this embodiment, both the wafer lifting cylinder 1 and the positioning pin lifting cylinder 2 are connected to a speed regulating throttle valve 12.
[0049] In this embodiment, a second connecting rod 17 is connected above the output shaft of the positioning pin lifting cylinder 2. A second housing 19 is fitted over the second connecting rod 17. The upper ends of the second connecting rod 17 and the second housing 19 are connected to the positioning pin mounting ring 7. A second vacuum-welded corrugated pipe 6 is fitted around the outer periphery of the second housing 19 between the positioning pin mounting ring 7 and the lower base plate 5.
[0050] The work process is as follows:
[0051] (1) Initial state (standby position)
[0052] The wafer lifting cylinder 1 is in the retracted state, which drives the wafer placement base plate 13 to the lowest position;
[0053] The positioning pin lifting cylinder 2 is in the retracted state, which drives the positioning pin mounting ring 7 and positioning pin 15 to the lowest position.
[0054] (2) Robot feeding stage
[0055] The robot feeds the wafer into the cavity 8 through the robot inlet 9 and places the wafer on the wafer placement base plate 13 above the positioning pin 15. At this time, the positioning pin 15 is in a low position. The positioning pin lifting cylinder 2 is activated and extends upward. It pushes the positioning pin mounting ring 7 to rise through the second connecting plate 4, causing the three positioning pins 15 to move upward synchronously. The upper end of the positioning pin 15 passes through the through hole 20 to lift the wafer, and the wafer is removed from the wafer placement base plate 13.
[0056] (3) Robot exit phase
[0057] After confirming that the wafer is stably supported by the positioning pin 15, the robot exits the cavity 8 through the robot inlet 9, and the positioning pin lifting cylinder 2 remains extended to maintain the wafer's hovering position on the positioning pin 15.
[0058] (4) Wafer moved to process position
[0059] The wafer lifting cylinder 1 is activated and extends upward, pushing the wafer placement base plate 13 upward through the first connecting block 10.
[0060] Because the base plate travel is greater than the lifting height of the positioning pin 15, the wafer placement base plate 13 will contact the bottom of the wafer when it rises and continue to lift it until the wafer is completely in the process area of the process bushing 11.
[0061] (5) Descent phase after process completion
[0062] After the process is completed, the wafer lifting cylinder 1 retracts, causing the wafer placement base plate 13 and the wafer to descend. The wafer falls back onto the positioning pin 15, and the robot enters the cavity 8 again through the robot entrance 9, ready to pick up the wafer.
[0063] (6) Wafer transfer to robot
[0064] The positioning pin lifting cylinder 2 retracts, causing the positioning pin 15 to descend. The wafer slowly falls onto the robot's gripper, and the robot carries the wafer out of the cavity 8, completing the entire material receiving and unloading process.
[0065] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A material receiving device with alternating lifting and lowering, characterized in that, The device includes a lower base plate, below which are a wafer lifting cylinder and a positioning pin lifting cylinder. The output shaft of the wafer lifting cylinder is connected to a wafer placement base plate above the lower base plate, and the output shaft of the positioning pin lifting cylinder is connected to a positioning pin mounting ring above the lower base plate. Multiple positioning pins for lifting wafers are connected above the positioning pin mounting ring. The wafer placement base plate is located above the positioning pin mounting ring, and the wafer placement base plate has through holes for the positioning pins to pass through.
2. The alternating lifting receiving device according to claim 1, characterized in that, The positioning pins are set to 3, evenly distributed on the positioning pin mounting ring.
3. The alternating lifting receiving device according to claim 1, characterized in that, It also includes a cavity, with the lower base plate located at the bottom of the cavity, and the wafer placement base plate and the positioning pin mounting ring located inside the cavity.
4. The alternating lifting receiving device according to claim 3, characterized in that, The upper part of the cavity is provided with a process bushing, and the cavity is provided with a robot entrance.
5. The alternating lifting receiving device according to claim 1, characterized in that, The output shaft of the wafer lifting cylinder is connected to the first connecting rod via a first connecting block.
6. The alternating lifting receiving device according to claim 5, characterized in that, The first connecting rod is provided with a first housing on its outer periphery. The upper end of the first connecting rod and the first housing is connected to the wafer placement base plate. The outer periphery of the first housing located between the wafer placement base plate and the lower base plate is fitted with a first vacuum-welded corrugated tube.
7. The alternating lifting receiving device according to claim 1, characterized in that, The output shaft, the first connecting block, and the outer side of the first housing of the wafer lifting cylinder are fitted with protective covers.
8. The alternating lifting receiving device according to claim 1, characterized in that, The wafer placement base plate is lifted to a height higher than the top of the positioning pin when the wafer lifting cylinder extends.
9. The alternating lifting receiving device according to claim 1, characterized in that, Both the wafer lifting cylinder and the positioning pin lifting cylinder are connected to speed regulating throttle valves.
10. The alternating lifting receiving device according to claim 1, characterized in that, A second connecting rod is connected above the output shaft of the positioning pin lifting cylinder. A second housing is fitted over the second connecting rod. The upper ends of the second connecting rod and the second housing are connected to the positioning pin mounting ring. A second vacuum-welded corrugated pipe is fitted around the outer periphery of the second housing.