Variable pitch laser processing apparatus

Abstract

The utility model provides a kind of variable pitch laser processing equipment, comprising: feeding conveying line;Discharging conveying line;Laser processing subassembly;First transfer subassembly includes first rotary table, first adsorption swing arm and second adsorption swing arm;Feeding conveying line and discharging conveying line are all by several conveying belt units Composition, each conveying belt unit includes side by side arranged first belt structure, second belt structure;First distance adjusting mechanism and second distance adjusting mechanism can all promote the distance between the first belt structure and the second belt structure of the same conveying belt unit to increase or shorten, to adjust the width of conveying belt unit.The utility model can adjust the longitudinal distance between multiple side-by-side silicon wafers during conveying silicon wafer, and through first adsorption swing arm and second adsorption swing arm handling transfer, multiple side-by-side silicon wafers are reasonably arranged close to laser processing center area position, for high-quality laser processing.

Description

Technical Field

[0001] This utility model relates to the field of battery processing technology, and in particular to a variable-distance laser processing device. Background Technology

[0002] In existing conveyor lines, multiple materials are too far apart longitudinally. After being fed onto the conveyor line, the longitudinal distance between multiple materials or two materials placed side by side cannot be adjusted. Therefore, when the longitudinal distance between multiple materials is too far and they cannot be reasonably arranged to approach the center area of ​​the laser, the processing of the materials will not achieve the ideal laser processing effect. Utility Model Content

[0003] To address the shortcomings of existing technologies, the purpose of this invention is to provide a variable-pitch laser processing device that can adjust the longitudinal distance between multiple side-by-side silicon wafers during the silicon wafer transport process. By using a first adsorption arm and a second adsorption arm to transport and move the silicon wafers, the multiple side-by-side silicon wafers are arranged in a reasonable manner and close to the laser processing center area for high-quality laser processing.

[0004] The embodiments of this utility model are achieved through the following technical solutions:

[0005] A variable-pitch laser processing device includes: a feeding conveyor line, wherein a first transfer station is provided at the end of the feeding conveyor line;

[0006] The unloading conveyor line has a second transfer station at its beginning, which is located behind the first transfer station. The loading conveyor line is parallel to the unloading conveyor line and the conveying directions are opposite.

[0007] A laser processing assembly, wherein a processing position is provided at the bottom of the laser processing assembly;

[0008] A first transfer assembly is located between the first transfer station and the second transfer station, with the processing station located on one side of the first transfer assembly. The first transfer assembly includes a first turntable, a first adsorption swing arm disposed on the first turntable, and a second adsorption swing arm disposed on the first turntable. The first turntable causes the first adsorption swing arm and the second adsorption swing arm to rotate, thereby realizing the switching of materials between the first transfer station, the processing station, and the second transfer station.

[0009] Both the feeding conveyor line and the unloading conveyor line are composed of several conveyor belt units, and each conveyor belt unit includes a first belt structure and a second belt structure arranged side by side;

[0010] The conveyor belt unit corresponding to the first transfer station is provided with a first adjustment mechanism, and the conveyor belt unit corresponding to the second transfer station is provided with a second adjustment mechanism. Both the first adjustment mechanism and the second adjustment mechanism can cause the distance between the first belt structure and the second belt structure of the same conveyor belt unit to increase or decrease, so as to adjust the width of the conveyor belt unit.

[0011] According to a preferred embodiment, both the first adjusting mechanism and the second adjusting mechanism include an adjusting drive, a first drive frame and a second drive frame, and the two moving ends of the adjusting drive are respectively connected to the first drive frame and the second drive frame.

[0012] The first belt structure is disposed on the first drive frame, and the second belt structure is disposed on the second drive frame.

[0013] According to a preferred embodiment, both the first belt structure and the second belt structure are provided with belt drive components.

[0014] According to a preferred embodiment, a laser processing position is also provided below the laser processing component;

[0015] The laser processing assembly includes a detection unit and a laser output unit. The detection unit is located above the processing position, and the laser output unit is located above the laser processing position.

[0016] According to a preferred embodiment, the system further includes a second transfer assembly, which includes a second turntable, a first receiving arm, and a second receiving arm; the second turntable causes the first receiving arm and the second receiving arm to rotate, so as to switch the material between the processing position and the laser processing position.

[0017] According to a preferred embodiment, the material conveying line is sequentially configured with a material feeding station, a first inspection station, and a first transfer station along the conveying direction; the material feeding station and the first inspection station are respectively respectively equipped with a material feeding mechanism and a first inspection mechanism.

[0018] The material conveying line is arranged in sequence along the conveying direction as the second transfer station, the second inspection station, and the unloading station; the second inspection station and the unloading station are respectively equipped with a second inspection mechanism and an unloading mechanism.

[0019] According to a preferred embodiment, both the first adsorption swing arm and the second adsorption swing arm include a swing arm unit and a suction cup unit, wherein the suction cup unit is disposed at the end of the corresponding swing arm unit.

[0020] Both the first receiving arm and the second receiving arm include a material arm unit and a material receiving tray unit, with the material receiving tray unit located at the end of the material arm unit.

[0021] According to a preferred embodiment, both the feeding mechanism and the unloading mechanism are provided with a horizontally movable material rack and a cutting unit. The cutting unit moves the material on the material rack to the conveyor belt unit or moves the material on the conveyor belt unit to the material rack.

[0022] The technical solution of this utility model embodiment has at least the following advantages and beneficial effects:

[0023] This invention can adjust the longitudinal distance between multiple side-by-side silicon wafers during the silicon wafer conveying process. By using the first and second adsorption swing arms to transport and move the wafers, the multiple side-by-side silicon wafers can be reasonably arranged close to the laser processing center area for high-quality laser processing.

[0024] This invention features a high degree of automation, automatically adjusting the width of the conveyor belt unit formed by the first and second belt structures to meet the transfer size requirements of the first and second transfer components and the processing position requirements of the laser processing component. Attached Figure Description

[0025] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 A schematic diagram of the structure of a variable-pitch laser processing device provided in this embodiment of the present invention;

[0027] Figure 2 A side view of a variable-pitch laser processing device provided for an embodiment of this utility model;

[0028] Figure 3 A side view of the first adjusting mechanism provided in an embodiment of the present utility model;

[0029] Figure 4 A three-dimensional structural schematic diagram of the first adjusting mechanism provided in an embodiment of this utility model;

[0030] Figure 5 Another top view of the first adjusting mechanism provided in this embodiment of the utility model;

[0031] Figure 6A top view of the first transfer component and the second transfer component provided in the embodiments of this utility model.

[0032] Icons: 1. Feeding conveyor line; 2. Discharging conveyor line; 3. Laser output unit; 4. Detection unit; 5. First turntable; 6. First adsorption swing arm; 61. Swing arm unit; 62. Suction cup unit; 7. Second adsorption swing arm; 8. First belt structure; 9. Second belt structure; 10. Belt drive component; 11. Second turntable; 12. First receiving arm; 121. Material arm unit; 122. Receiving tray unit; 13. Second receiving arm; 14. Feeding mechanism; 15. First detection mechanism; 16. Second detection mechanism; 17. Discharging mechanism; 18. Material rack; 19. Cutting unit; 20. First distance adjustment mechanism; 21. Second distance adjustment mechanism; 22. First drive frame; 23. Second drive frame; 24. Distance adjustment drive component. Detailed Implementation

[0033] To better understand and implement this invention, the technical solutions in the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings.

[0034] In the description of this utility model, it should be noted that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0036] Example

[0037] like Figures 1 to 6As shown, a variable-pitch laser processing device includes: a feeding conveyor line 1, with a first transfer station at its end; a discharging conveyor line 2, with a second transfer station at its beginning, located behind the first transfer station; the feeding conveyor line 1 and the discharging conveyor line 2 are arranged parallel to each other and in opposite directions; a laser processing component, with a processing position below it; and a first transfer component located between the first and second transfer stations, with the processing position located on one side of the first transfer component. The first transfer component includes a first turntable 5, a first adsorption arm 6 disposed on the first turntable 5, and a second adsorption arm 6 disposed on the first turntable 5. 7; The first turntable 5 causes the first adsorption swing arm 6 and the second adsorption swing arm 7 to rotate, so as to realize the switching of materials between the first transfer station, the waiting station, and the second transfer station; The feeding conveyor line 1 and the unloading conveyor line 2 are both composed of several conveyor belt units. Each conveyor belt unit includes a first belt structure 8 and a second belt structure 9 arranged side by side; The conveyor belt unit corresponding to the first transfer station is equipped with a first adjustment mechanism 20, and the conveyor belt unit corresponding to the second transfer station is equipped with a second adjustment mechanism 21. Both the first adjustment mechanism 20 and the second adjustment mechanism 21 can cause the distance between the first belt structure 8 and the second belt structure 9 of the same conveyor belt unit to increase or decrease, so as to adjust the width of the conveyor belt unit.

[0038] Optionally, both the first adjusting mechanism 20 and the second adjusting mechanism 21 include an adjusting drive 24, a first drive frame 22 and a second drive frame 23, and the two moving ends of the adjusting drive 24 are respectively connected to the first drive frame 22 and the second drive frame 23.

[0039] The first belt structure 8 is mounted on the first drive frame 22, and the second belt structure 9 is mounted on the second drive frame 23.

[0040] Optionally, both the first belt structure 8 and the second belt structure 9 are provided with belt drive components 10.

[0041] Optionally, there is also a corresponding laser processing position below the laser processing component;

[0042] The laser processing assembly includes a detection unit 4 and a laser output unit 3. The detection unit 4 is located above the processing position, and the laser output unit 3 is located above the laser processing position.

[0043] Optionally, it also includes a second transfer assembly, which includes a second turntable 11, a first receiving arm 12 and a second receiving arm 13; the second turntable 11 causes the first receiving arm 12 and the second receiving arm 13 to rotate so as to switch the material between the processing position and the laser processing position.

[0044] Optionally, the feeding station, the first inspection station, and the first transfer station are sequentially set along the conveying direction of the feeding conveyor line 1; the feeding station and the first inspection station are respectively equipped with a feeding mechanism 14 and a first inspection mechanism 15.

[0045] Along the conveying direction of the unloading conveyor line 2, the second transfer station, the second inspection station, and the unloading station are set up in sequence; the second inspection station and the unloading station are respectively equipped with a second inspection mechanism 16 and an unloading mechanism 17.

[0046] Optionally, both the first adsorption swing arm 6 and the second adsorption swing arm 7 include a swing arm unit 61 and a suction cup unit 62, with the suction cup unit 62 disposed at the end of the corresponding swing arm unit 61.

[0047] The first receiving arm 12 and the second receiving arm 13 both include a material arm unit 121 and a receiving tray unit 122, with the receiving tray unit 122 located at the end of the material arm unit 121.

[0048] Optionally, both the feeding mechanism 14 and the unloading mechanism 17 are equipped with a horizontally movable material rack 18 and a cutting unit 19. The cutting unit 19 moves the material on the material rack 18 to the conveyor belt unit or moves the material on the conveyor belt unit to the material rack 18.

[0049] The working principle of this utility model:

[0050] In this embodiment, the feeding mechanism 14 transfers the battery cells of the rack 18 to the feeding conveyor line 1 through the cutting unit 19. The cutting unit 19 can be a feeding lifting structure or a feeding adsorption structure. The cutting unit 19 adsorbs the battery cells of the rack 18 through the feeding adsorption structure. The cutting unit 19 moves the battery cells to the feeding belt unit on the feeding conveyor line 1 through the feeding lifting structure, and then conveys them from front to back.

[0051] On the feeding conveyor line 1, the battery cells first fall into the feeding station and are then conveyed to the first inspection mechanism 15. The first inspection mechanism 15 can perform microcrack detection on the battery cells. Battery cells that fail the inspection can be removed by the rejection mechanism. The rejection mechanism can be composed of a mechanical clamping arm and a mechanical moving mechanism, which are not marked with reference numerals in this embodiment.

[0052] The feeding conveyor line 1 transports the battery cells (located at the first inspection station) that have been inspected by the first inspection mechanism 15 to the first transfer station; in this embodiment, the first transfer station has two positions where the battery cells can be transferred. In this embodiment, the first adsorption swing arm 6 is provided with one swing arm unit 61 and two suction cup units 62. Similarly, the second adsorption swing arm 7 is provided with one swing arm unit 61 and two suction cup units 62. The first receiving arm 12 and the second receiving arm 13 are on the same horizontal plane and perpendicular to each other. When the first turntable 5 rotates counterclockwise, the two battery cells on the first transfer station are adsorbed by the two suction cup units 62 and transferred to the processing position. The processing position corresponds to two receiving plate units 122. Each material arm unit 121 corresponds to two receiving plate units 122. In this embodiment, the two material arm units 121 are on the same horizontal plane and on the same straight line. The two material arm units 121 in this embodiment can be set with an inclination angle or included angle according to the specific situation. Similarly, the included angle between the first adsorption swing arm 6 and the second adsorption swing arm 7 can be set according to the specific actual needs.

[0053] like Figure 1 As shown, the unloading conveyor line 2 is located on one side of the loading conveyor line 1, and the second transfer station is located on the other side of the first turntable 5 opposite to the first transfer station. Therefore, when the first turntable 5 rotates, when the first adsorption arm 6 is located at the processing position, the second adsorption arm 7 is located at the second transfer station. The rotation of the first turntable 5 can transfer the battery cell at the processing position to the second transfer station while simultaneously transferring the battery cell at the first transfer station to the processing position. A detection unit 4, a dust removal unit, or a positioning unit can be set at the processing position to further inspect the battery cell. When the second turntable 11 rotates, the battery cell at the processing position and the battery cell at the laser processing position below the laser processing component switch between each other, converting the processed battery cell into the processing battery cell.

[0054] Similarly, after the battery cells have been processed, they are transferred to the second transfer station. The conveying direction of the unloading conveyor line 2 is opposite to that of the loading conveyor line 1, that is, they are conveyed sequentially from back to front. First, they are inspected by the second inspection mechanism 16. The second inspection mechanism 16 can be set as an AOI inspection unit 4. Similarly, the first inspection mechanism 15 can also be set as an AOI inspection unit 4.

[0055] In this embodiment, the loading mechanism 14 and unloading mechanism 17 are the same. The laser processing component can be selected as laser output unit 3, first reflector, aperture, second reflector, beam expander, laser beam shaper, dynamic rotating mirror or rotating mirror, and field mirror. The laser outputs a laser beam, which passes sequentially through the first reflector, aperture, second reflector, beam expander, laser beam shaper, dynamic rotating mirror or rotating mirror, and field mirror, and is finally output to the working surface of the solar cell for thinning. Alternatively, laser output unit 3 can be selected to perform welding or other processing on the silicon wafer.

[0056] In this embodiment, since the distance between the two suction cup units 62 of the first adsorption swing arm 6 is the same as the distance between the two suction cup units 62 of the second adsorption swing arm 7 and both are fixed widths, and the distance between the two receiving tray units 122 of the first receiving arm 12 is the same as the distance between the two receiving tray units of the second receiving arm 13 and both are fixed widths; the width of the conveying unit of the loading conveyor line 1 and the unloading conveyor line 2 is greater than the distance (width) between the two suction cup units 62 of the first adsorption swing arm 6 and the distance (width) between the two suction cup units 62 of the second adsorption swing arm 7, a first adjusting mechanism 20 and a second adjusting mechanism 21 are respectively provided at the first transfer station and the second transfer station; both the first adjusting mechanism 20 and the second adjusting mechanism 21 can be driven by a linear module, and the adjusting driving component 24 drives the first driving frame 22 and the second driving frame 23 to move closer to each other or further away from each other through the slider of the linear module, so that the distance between the first driving frame 22 and the second driving frame 23 of the same adjusting mechanism changes. Alternatively, the distance between the first belt structure 8 and the second belt structure 9 can be varied by using a second drive frame 23 to move closer to or further away from the first drive frame 22, which is fixed to the first drive frame 22 and has the same adjustment mechanism. Both the first belt structure 8 and the second belt structure 9 are individually equipped with a belt drive component 10, which can drive either the first belt structure 8 or the second belt structure 9 independently. The material mentioned in this embodiment is a silicon wafer or a solar cell.

[0057] The technical means disclosed in this utility model are not limited to those disclosed in the above embodiments, but also include technical solutions composed of any combination of the above technical features. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of this utility model, and these improvements and modifications are also considered within the scope of protection of this utility model.

Claims

1. A variable-pitch laser processing device, characterized in that, include: A feeding conveyor line, wherein a first transfer station is provided at the end of the feeding conveyor line; The unloading conveyor line has a second transfer station at its beginning, which is located behind the first transfer station. The loading conveyor line is parallel to the unloading conveyor line and the conveying directions are opposite. A laser processing assembly, wherein a processing position is provided at the bottom of the laser processing assembly; A first transfer assembly is located between the first transfer station and the second transfer station, with the processing station located on one side of the first transfer assembly. The first transfer assembly includes a first turntable, a first adsorption swing arm disposed on the first turntable, and a second adsorption swing arm disposed on the first turntable. The first turntable causes the first adsorption swing arm and the second adsorption swing arm to rotate, thereby realizing the switching of materials between the first transfer station, the processing station, and the second transfer station. Both the feeding conveyor line and the unloading conveyor line are composed of several conveyor belt units, and each conveyor belt unit includes a first belt structure and a second belt structure arranged side by side; The conveyor belt unit corresponding to the first transfer station is provided with a first adjustment mechanism, and the conveyor belt unit corresponding to the second transfer station is provided with a second adjustment mechanism. Both the first adjustment mechanism and the second adjustment mechanism can cause the distance between the first belt structure and the second belt structure of the same conveyor belt unit to increase or decrease, so as to adjust the width of the conveyor belt unit.

2. The variable-pitch laser processing equipment according to claim 1, characterized in that, Both the first and second adjustment mechanisms include an adjustment drive, a first drive frame, and a second drive frame, with the two moving ends of the adjustment drive connected to the first drive frame and the second drive frame, respectively. The first belt structure is disposed on the first drive frame, and the second belt structure is disposed on the second drive frame.

3. The variable-pitch laser processing equipment according to claim 1, characterized in that, Both the first belt structure and the second belt structure are equipped with belt drive components.

4. The variable-pitch laser processing equipment according to claim 1, characterized in that, Below the laser processing component is a corresponding laser processing position; The laser processing assembly includes a detection unit and a laser output unit. The detection unit is located above the processing position, and the laser output unit is located above the laser processing position.

5. The variable-pitch laser processing equipment according to claim 4, characterized in that, It also includes a second transfer assembly, which includes a second turntable, a first receiving arm, and a second receiving arm; the second turntable causes the first receiving arm and the second receiving arm to rotate, so as to switch the material between the processing position and the laser processing position.

6. The variable-pitch laser processing equipment according to claim 1, characterized in that, Along the conveying direction of the feeding conveyor line, a feeding station, a first inspection station, and a first transfer station are sequentially set up; the feeding station and the first inspection station are respectively equipped with a feeding mechanism and a first inspection mechanism; The material conveying line is arranged in sequence along the conveying direction as the second transfer station, the second inspection station, and the unloading station; the second inspection station and the unloading station are respectively equipped with a second inspection mechanism and an unloading mechanism.

7. The variable-pitch laser processing equipment according to claim 5, characterized in that, Both the first and second adsorption swing arms include a swing arm unit and a suction cup unit, with the suction cup unit disposed at the end of the corresponding swing arm unit. Both the first receiving arm and the second receiving arm include a material arm unit and a material receiving tray unit, with the material receiving tray unit located at the end of the material arm unit.

8. The variable-pitch laser processing equipment according to claim 6, characterized in that, Both the feeding mechanism and the unloading mechanism are equipped with a horizontally movable material rack and a cutting unit. The cutting unit moves the material on the material rack to the conveyor belt unit or moves the material on the conveyor belt unit to the material rack.

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