Bonding wire processing anti-splashing cooling mechanism

By using anti-splash components and a cooling nozzle system in the bonding wire processing device, the problems of water and debris splashing are solved, the processing environment is improved and water resources are recycled.

CN224488639UActive Publication Date: 2026-07-14FUJIAN QUANZHOU ZHONGXIN ZHILIAN SEMICON MATERIAL CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
FUJIAN QUANZHOU ZHONGXIN ZHILIAN SEMICON MATERIAL CO LTD
Filing Date
2025-08-11
Publication Date
2026-07-14

AI Technical Summary

Technical Problem

During the grinding process, existing bonding wire processing equipment results in poor hygiene due to splashing water and debris, requiring manual cleaning by staff.

Method used

It employs splash-proof components, including an upper protective cover, a lower protective cover, and a sliding protective cover, to form a sealed space. Combined with a water pump and cooling nozzle system, it prevents water stains and debris from splashing and enables the recycling of water resources.

Benefits of technology

It effectively prevents water stains and debris splashing, improves the hygiene of the processing environment, reduces post-processing cleaning work, and enables the reuse of water resources.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a kind of anti-splashing cooling mechanisms for bonding wire processing, including mounting seat and polishing mechanism, the front of mounting seat is provided with splash-proof component, splash-proof component includes upper protective cover, lower protective cover, sliding protective cover and two limit hooks, the both sides of lower protective cover top are uniformly fixedly installed with fixed protective strip, the both sides of sliding protective cover bottom are uniformly provided with limit slot, the both sides of sliding protective cover are uniformly fixedly provided with limit handle ring, the inner surface of lower protective cover is fixedly connected with traction plate, the front of mounting seat is provided with two sliding grooves, sliding protective cover is slidably installed between the inside of two sliding grooves, sliding protective cover is between upper protective cover and lower protective cover, the area formed by polishing head polishing forms closed space, water source and a small amount of chippings splashed to left side driven by polishing head high-speed rotation will be intercepted by sliding protective cover, prevent polishing head driven water stain and chippings splashing to reduce the health of processing environment, avoid later staff manual arrangement.
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Description

Technical Field

[0001] This utility model relates to the field of cooling technology, and in particular to an anti-splash cooling mechanism for bonding wire processing. Background Technology

[0002] Bonding wire is a widely used product, found in integrated circuits, large-scale integrated wafers, and transistors. Its advantages include: meeting various packaging types such as DIPS, I / O, QFP, and BGA packages; conforming to the latest package types, such as stacked packages and ultra-thin thickness packages; and offering cost reductions using finer diameter wires with higher tensile strength.

[0003] The existing patent CN202120684246.0 discloses a surface polishing device for bonding wire processing with a cooling mechanism, including a support frame and a water tank. The water tank is connected to the upper middle part of the support frame, and a water collection tank is provided at the bottom middle part of the support frame. The water collection tank includes a water trough in its inner cavity and a drain hole on the side of the water trough. A filter plate is installed in the inner cavity of the water trough to facilitate cooling of the bonding wire being polished and to allow the cooling water to be circulated and utilized. A first turntable A is movably connected to the side of the support frame, and a first turntable B is provided at the bottom of the first turntable A, which can improve the efficiency of the polishing disc in polishing the bonding wire. A connecting rod is provided at the side of the polishing disc, and an electric push rod is installed at the bottom of the connecting rod, which can adjust the contact distance between the polishing disc and the bonding wire, thereby improving the functionality of the polishing disc in polishing the bonding wire.

[0004] In this patent, during the grinding process, the grinding disc rotates continuously, which in turn drives the water sprayed on the grinding disc, causing the water and the debris mixed in with the water to splash in the direction of rotation. This results in debris and water stains being left everywhere, reducing the hygiene of the processing environment and requiring workers to spend time cleaning it up afterward. Utility Model Content

[0005] To overcome the technical defects of the existing technology, this utility model provides a splash-proof cooling mechanism for bonding wire processing. By setting up splash-proof components, it prevents water stains and debris from splashing from the grinding head, which would reduce the hygiene of the processing environment and avoid manual cleaning by the staff later.

[0006] The technical solution adopted by this utility model is as follows: it includes a mounting base and a grinding mechanism. The front of the mounting base is provided with a splash-proof component. The splash-proof component includes an upper protective cover, a lower protective cover, a sliding protective cover and two limiting hooks. Fixed protective strips are fixedly installed on both sides of the top of the lower protective cover. Limiting grooves are opened on both sides of the bottom of the sliding protective cover. Limiting handles are fixedly provided on both sides of the sliding protective cover. A traction plate is fixedly connected to the inner surface of the lower protective cover.

[0007] Preferably, in order to limit the sliding trajectory of the sliding protective cover, two sliding grooves are provided on the front of the mounting base, the sliding protective cover is slidably installed between the two sliding grooves, and a through hole is provided on the right side of the upper protective cover.

[0008] Preferably, in order to clean the inner wall of the sliding protective cover, a water pipe is provided on the top of the mounting base, and several cooling nozzles are fixedly provided on the outer surface of the water pipe, and a rotating handle is fixedly connected to the right end of the water pipe.

[0009] Preferably, in order to filter out debris inside the sprayed water source, the rotating handle is rotatably installed inside the through hole, and a collection groove is provided on the top of the mounting base, with a filter layer provided inside the collection groove.

[0010] Preferably, in order to reuse the filtered water, the mounting base has a water storage cavity inside, and a water pump is fixedly installed on the back of the mounting base by a mounting bracket.

[0011] Preferably, in order to reduce water waste, the water pump is fixedly connected to an inlet pipe at its inlet end and to an outlet pipe at its outlet end.

[0012] Preferably, in order to polish the surface of the bonding wire, the polishing mechanism includes several polishing heads, a motor, several gears and a toothed ring, and several polishing heads are rotatably mounted on the front of the mounting base.

[0013] Preferably, in order to drive several grinding heads to operate together, several gears are fixedly connected to one end of several grinding heads respectively, and all of the gears mesh with the tooth surfaces of the gear ring.

[0014] The beneficial effects of this utility model are: the sliding protective cover is located between the upper and lower protective covers, forming a sealed space in the area where the grinding head is grinding. The water and a small amount of debris splashed to the left by the high-speed rotation of the grinding head will be intercepted by the sliding protective cover, preventing the grinding head from splashing water stains and debris, reducing the hygiene of the processing environment, and avoiding manual cleaning by the staff later. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0016] Figure 2 This is a rear view of the present invention.

[0017] Figure 3 This is a cross-sectional view of the mounting base of this utility model from the left.

[0018] Figure 4 This is an exploded view of the splash-proof component of this utility model.

[0019] Explanation of reference numerals in the attached diagram: 1. Mounting bracket;

[0020] 2. Grinding mechanism; 201. Grinding head; 202. Motor; 203. Gear; 204. Gear ring;

[0021] 3. Splash protection components; 301. Upper protective cover; 302. Lower protective cover; 303. Sliding protective cover; 304. Limit hook; 305. Fixed protective strip; 306. Limit groove; 307. Limit handle ring; 308. Traction plate;

[0022] 4. Slide groove; 5. Through hole; 6. Water pipe; 7. Cooling nozzle; 8. Rotating handle; 9. Collection tank; 10. Filter layer; 11. Water storage chamber; 12. Water pump; 13. Inlet pipe; 14. Outlet pipe. Detailed Implementation

[0023] The present invention will be further described below with reference to the accompanying drawings:

[0024] like Figure 1-4 As shown, this embodiment provides a splash-proof cooling mechanism for bonding wire processing, including a mounting base 1 and a grinding mechanism 2. A splash-proof component 3 is provided on the front of the mounting base 1. The splash-proof component 3 includes an upper protective cover 301, a lower protective cover 302, a sliding protective cover 303, and two limiting hooks 304. The upper protective cover 301, lower protective cover 302, and sliding protective cover 303 are all made of transparent material to facilitate observation of the grinding process. Fixed protective strips 305 are fixedly installed on both sides of the top of the lower protective cover 302. The top of the fixed protective strips 305 has an arc-shaped groove. The bottom of the sliding protective cover 303... Both sides have limiting grooves 306. The top of the inner wall of the limiting groove 306 has an arc-shaped groove 2. The arc-shaped groove 1 and the arc-shaped groove 2 are spliced ​​together to form a circle for the bonding wire to pass through. Both sides of the sliding protective cover 303 are fixedly provided with limiting handle rings 307. The ring on the limiting handle ring 307 is hooked by the limiting hook 304, which can limit the position of the sliding protective cover 303 and prevent the sliding protective cover 303 from sliding down. The inner surface of the lower protective cover 302 is fixedly connected with a traction plate 308. The traction plate 308 is used to introduce water flow into the opening area of ​​the collection tank 9 for accurate collection.

[0025] The mounting base 1 has two sliding grooves 4 on its front side. The upper protective cover 301 is fixedly installed on the top of the inner wall of the mounting base 1, and the lower protective cover 302 is fixedly installed on the bottom of the inner wall of the mounting base 1, around the collection groove 9. The sliding protective cover 303 is slidably installed between the two sliding grooves 4. A support strip is fixedly connected to the bottom of the sliding protective cover 303. A support groove is opened on the top of the lower protective cover 302. The support strip and the support groove correspond to each other, which can seal the joint between the two to prevent water stains from seeping out from the gap between them. The upper protective cover 301... A through hole 5 is provided on the right side. A water pipe 6 is provided on the top of the mounting base 1. Several cooling nozzles 7 are fixedly provided on the outer surface of the water pipe 6. A flexible hose is provided on the top of the cooling nozzle 7. One end of the flexible hose is connected to the water storage chamber 11 and a solenoid valve is provided inside. A rotating handle 8 is fixedly connected to the right end of the water pipe 6. The rotating handle 8 makes it easy to change the orientation of the water pipe 6 and the cooling nozzles 7, so that the cooling nozzles 7 can wash away the debris on the sliding protective cover 303, the lower protective cover 302 and the upper protective cover 301, and prevent the debris from adhering to the protective cover due to water stains.

[0026] The rotating handle 8 is rotatably installed inside the through hole 5. When the rotating handle 8 is not rotated by external force, the water pipe 6 and the cooling nozzle 7 will remain hanging due to their own weight. The top of the mounting base 1 is provided with a collection tank 9, which is used to collect water containing debris sprayed from the cooling nozzle 7. The inside of the collection tank 9 is provided with a filter layer 10, which can be pulled out from the inside of the collection tank 9 for cleaning to prevent the top of the filter layer 10 from being blocked by debris, reducing the filtration efficiency and the rate of water flow. The inside of the mounting base 1 is provided with a water storage chamber 11, and the top of the water storage chamber 11 is provided with a water inlet. A sealing plug is provided in the water inlet to introduce water into the water storage chamber 11, and the sealing plug prevents water from flowing out. The back of the mounting base 1 is fixedly installed with a water pump 12 by a mounting bracket. The water pump 12 is connected to an external control switch through existing technology.

[0027] The water pump 12 is fixedly connected to the water inlet pipe 13, one end of which extends into the inside of the collection tank 9. The water pump 12 is fixedly connected to the water outlet pipe 14, which extracts the filtered water from the collection tank 9. One end of the water outlet pipe 14 extends into the inside of the water storage chamber 11, which sends the filtered water into the water storage chamber 11 for reuse. The grinding mechanism 2 includes several grinding heads 201, a motor 202, several gears 203, and a toothed ring 204. The motor 202 is connected to the motor through existing technology and an external control switch. Several grinding heads 201 are rotatably mounted on the front of the mounting base 1. Several gears 203 are fixedly connected to one end of several grinding heads 201 respectively. The back of the mounting base 1 has a mounting groove, and the gears 203 are in the mounting groove. One end of the output shaft of the motor 202 is fixed to one of the gears 203. Several gears 203 mesh with the tooth surfaces of the toothed ring 204.

[0028] During use: During the bonding wire grinding process, the sliding protective cover 303 is positioned between the upper protective cover 301 and the lower protective cover 302, forming a sealed space in the area being ground by the grinding head 201. The solenoid valve in the hose is activated, drawing water from the water storage chamber 11 into the water pipe 6 and the cooling nozzle 7. The cooling nozzle 7 sprays water onto the grinding position of the grinding head 201, cooling the bonding wire and the grinding head 201 as a whole. The washed-off bonding wire debris falls with the water, passing through the traction plate 308 into the collection tank 9, and then is filtered and reused through the filter layer 10. Once the water in the collection tank 9 accumulates to a certain level, the water pump 12 is activated to draw the filtered water into the inlet pipe 13, and then through the outlet pipe 14 into the water storage chamber 11 for reuse. Water and a small amount of debris splashed to the left by the high-speed rotation of the grinding head 201 will be intercepted by the sliding protective cover 303, preventing the grinding head 201 from carrying water stains and debris. The splashing of debris reduces the hygiene of the processing environment and avoids the need for manual cleaning by staff later. After grinding, the rotating handle 8 is manually rotated to change the angle of the water pipe 6 and the cooling nozzle 7. The cooling nozzle 7 sprays water onto the inner walls of the sliding protective cover 303, the lower protective cover 302, and the upper protective cover 301 to wash away the splashed debris. After releasing the rotating handle 8, the water pipe 6 and the cooling nozzle 7 will return to their original vertical downward position. Then, two people lift the sliding protective cover 303 upward, exposing the grinding head 201 and the bonding wire. The limiting hook 304 is hung on the limiting handle ring 307 to limit the position of the sliding protective cover 303. The manual operation process before and after the next bonding wire processing can be carried out. After the operation, the limiting hook 304 is removed from the limiting handle ring 307, and the sliding protective cover 303 can be slid downward to close the processing space between the grinding head 201 and the bonding wire.

[0029] The foregoing has shown and described the basic principles and main features of this invention, as well as its advantages. Those skilled in the art should understand that this invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this invention. Various changes and modifications can be made to this invention without departing from its spirit and scope. All such changes and modifications fall within the scope of this invention as defined by the appended claims and their equivalents.

Claims

1. A kind of bonding wire processing anti-splashing cooling mechanism, including mounting seat (1) and polishing mechanism (2), it is characterized by: The front surface of the mounting seat (1) is provided with a splash-proof assembly (3), the splash-proof assembly (3) comprises an upper protective cover (301), a lower protective cover (302), a sliding protective cover (303) and two limiting hooks (304), both sides of the top of the lower protective cover (302) are fixedly provided with a fixed protective strip (305), both sides of the bottom of the sliding protective cover (303) are provided with a limiting groove (306), both sides of the sliding protective cover (303) are fixedly provided with a limiting handle ring (307), and the inner surface of the lower protective cover (302) is fixedly connected with a traction plate (308).

2. The anti-splashing cooling mechanism for bonding wire processing according to claim 1, characterized in that: The front surface of the mounting seat (1) is provided with two sliding grooves (4), the sliding protective cover (303) is slidingly installed between the two sliding grooves (4), and the right side of the upper protective cover (301) is provided with a through hole (5).

3. The anti-splashing cooling mechanism for bonding wire processing according to claim 2, characterized in that: The top of the mounting seat (1) is provided with a water pipe (6), a plurality of cooling nozzles (7) are fixedly arranged on the outer surface of the water pipe (6), and the right end of the water pipe (6) is fixedly connected with a rotating handle (8).

4. The anti-splashing cooling mechanism for bonding wire processing according to claim 3, characterized in that: The rotating handle (8) is rotatably installed in the through hole (5), and the top of the mounting seat (1) is provided with a collecting groove (9), and the inside of the collecting groove (9) is provided with a filter layer (10).

5. The anti-splashing cooling mechanism for bonding wire processing according to claim 1, characterized in that: The inside of the mounting seat (1) is provided with a water storage cavity (11), and the back surface of the mounting seat (1) is fixedly provided with a water pump (12) through a mounting frame.

6. The anti-splashing cooling mechanism for bonding wire processing according to claim 5, characterized in that: The water inlet end of the water pump (12) is fixedly connected with a water inlet pipe (13), and the water outlet end of the water pump (12) is fixedly connected with a water outlet pipe (14).

7. The anti-splashing cooling mechanism for bonding wire processing according to claim 1, characterized in that: The polishing mechanism (2) comprises a plurality of polishing heads (201), a motor (202), a plurality of gears (203) and a gear ring (204), and the plurality of polishing heads (201) are rotatably installed on the front surface of the mounting seat (1).

8. The anti-splashing cooling mechanism for bonding wire processing according to claim 7, characterized in that: A plurality of gears (203) are respectively fixedly connected with one end of a plurality of polishing heads (201), and a plurality of gears (203) are respectively fixedly connected with one end of a plurality of polishing heads (201).