A patch-type supercapacitor

Abstract

The utility model discloses a patch type super capacitor relates to capacitor technical field, including capacitor main part, the both sides of capacitor main part are provided with the welding leg, the inside of welding leg is provided with first welding hole, the bottom of welding leg is provided with the second welding hole with first welding hole intercommunication, the bottom of capacitor main part is provided with copper seat, the bottom of copper seat is provided with inner inclined slot, a plurality of inner extension holes are set up in the inside of inner inclined slot on copper seat and be provided with, the both sides of copper seat are provided with and the inner extension hole intercommunication of filling wind hole. The plurality of inner extension holes that set up in the inside of inner inclined slot on copper seat are used for the transmission of heat on capacitor main part, when the device and traditional capacitor installation environment's equivalent condition, if the installation environment has the situation of wind flow, the setting of inner extension hole can make the heat dissipation promotion effect of capacitor main part, and the both sides of copper seat are provided with and the inner extension hole intercommunication of filling wind hole is used for the circulation of capacitor main body surrounding environment.

Description

Technical Field

[0001] This utility model relates to the field of capacitor technology, and in particular to a surface-mount supercapacitor. Background Technology

[0002] Surface mount capacitors (also known as multilayer ceramic chip capacitors, MLCCs) are a type of surface mount technology (SMT) electronic component widely used in modern electronic devices. Their core functions are to store charge, filter, decouple, tune, or couple signals. They are composed of alternating layers of ceramic dielectric and metal electrodes, and are externally soldered to the circuit board via metal terminal electrodes. They are characterized by their small size, light weight, good high-frequency performance, high reliability, and suitability for automated mass production.

[0003] Traditional surface-mount capacitors often have their bottom surface in direct contact with the circuit board, which can lead to poor heat dissipation at the contact point and even heat transfer between the circuit board and the capacitor, affecting its normal operation. Therefore, we propose a surface-mount supercapacitor to solve the above-mentioned technical problems. Utility Model Content

[0004] The purpose of this invention is to provide a surface-mount supercapacitor to solve the problems mentioned in the background section.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: It includes a capacitor body, with solder feet on both sides of the capacitor body, a first soldering hole on the inner side of each solder foot, a second soldering hole communicating with the first soldering hole at the bottom of each solder foot, a copper base at the bottom of the capacitor body, an inner inclined groove at the bottom of the copper base, multiple inner expansion holes on the copper base and located inside the inner inclined groove, air filling holes communicating with the inner expansion holes on both sides of the copper base, and a heat insulation pad at the bottom of the copper base.

[0006] As a preferred embodiment, the copper base is further provided with a first welding foot groove corresponding to the welding foot, the welding foot extends to the inner side of the first welding foot groove, and a plurality of connecting rods are fixedly provided at the bottom of the copper base.

[0007] As a preferred embodiment, the heat insulation pad is integrally formed with an inner inclined heat insulation pad, and the inner inclined heat insulation pad is provided with an outer expansion hole corresponding to the inner expansion hole.

[0008] As a preferred embodiment, the heat insulation pad has a second welding foot groove, and the welding foot extends to the inner side of the second welding foot groove.

[0009] As a preferred embodiment, the heat insulation pad is further provided with a connection hole, and the connecting rod extends to the inside of the connection hole.

[0010] As a preferred embodiment, an overhead foot is fixedly provided on the heat insulation pad and located on the outside of the inner inclined heat insulation pad.

[0011] Compared with the prior art, this utility model has obvious advantages and beneficial effects. Specifically, as can be seen from the above technical solution, its main features are:

[0012] When the capacitor body generates heat during use, this device can transfer the heat from the capacitor body to the copper base, thereby expanding the heat dissipation area of ​​the capacitor body. As a result, under the same installation environment as traditional capacitors, this device can have a better heat dissipation effect. The inner inclined groove at the bottom of the copper base is used to expand the heat dissipation area of ​​the copper base. Multiple inner expansion holes on the copper base and located inside the inner inclined groove are used for heat transfer from the capacitor body. Under the same installation environment as traditional capacitors, if there is airflow in the installation environment, the setting of the inner expansion holes can improve the heat dissipation effect of the capacitor body. The air inlet holes on both sides of the copper base, which are connected to the inner expansion holes, are used for air circulation around the capacitor body.

[0013] The heat insulation pad at the bottom of the copper base is used to isolate the heat transfer between the copper base and the circuit board, preventing the device from overheating due to the heat generated by the circuit board during use.

[0014] To more clearly illustrate the structural features and effects of this utility model, the following detailed description of this utility model is provided in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description

[0015] Figure 1 This is a top view of an embodiment of the present utility model;

[0016] Figure 2 This is a bottom view structural diagram of an embodiment of the present utility model;

[0017] Figure 3 This is a schematic diagram of the copper base structure according to an embodiment of the present utility model;

[0018] Figure 4 This is a schematic diagram of the heat insulation pad structure according to an embodiment of the present utility model;

[0019] Figure 5 This is a cross-sectional schematic diagram of a portion of the weld leg structure according to an embodiment of this utility model.

[0020] Explanation of reference numerals in the attached drawings: 1. Capacitor body; 2. Solder foot; 3. First solder hole; 4. Second solder hole; 5. Copper base; 6. Air inlet hole; 7. Inner inclined groove; 8. Inner expansion hole; 9. Connecting rod; 10. First solder foot groove; 11. Heat insulation pad; 12. Connecting hole; 13. Second solder foot groove; 14. Inner inclined heat insulation pad; 15. Outer expansion hole; 16. Overhead foot. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the scope of the present utility model.

[0022] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0023] Please see Figures 1 to 5This utility model embodiment provides a surface-mount supercapacitor, including a capacitor body 1, with solder feet 2 on both sides of the capacitor body 1, a first soldering hole 3 on the inner side of the solder feet 2, a second soldering hole 4 communicating with the first soldering hole 3 on the bottom of the solder feet 2, a copper base 5 at the bottom of the capacitor body 1, an inner inclined groove 7 at the bottom of the copper base 5, a plurality of inner expansion holes 8 on the copper base 5 and located inside the inner inclined groove 7, air filling holes 6 communicating with the inner expansion holes 8 on both sides of the copper base 5, and a heat insulation pad 11 at the bottom of the copper base 5. During the use of this device, the solder feet 2 on both sides of the capacitor body 1 are used for electrical connection between the capacitor body 1 and the circuit board to ensure the operation of the capacitor. The circuit board mentioned above is mature existing technology and will not be described in detail here. The first soldering hole 3 opened on the inner side of the solder foot 2 is used to solder the solder foot 2 to the circuit board during the connection process. Solder is applied to the inside of the first soldering hole 3 to achieve the connection between the solder foot 2 and the circuit board. The solder and solder material mentioned in this article are mature existing technology and will not be described in detail here. In conjunction with the second soldering hole 4 opened at the bottom of the solder foot 2 and connected to the first soldering hole 3, the solder entering the first soldering hole 3 flows through the second soldering hole 4 to the connection point between the solder foot 2 and the circuit board, thereby completing the installation of this device on the circuit board. The copper base 5 at the bottom of the capacitor body 1 is made of copper and has a high thermal conductivity. When the capacitor generates heat during use, it can transfer the heat from the capacitor body 1 to the copper base 5, thereby expanding the heat dissipation area of ​​the capacitor body 1. Under the same conditions as traditional capacitor installation environments, this device can have a better heat dissipation effect. The inner inclined groove 7 at the bottom of the copper base 5 is used to expand the heat dissipation area of ​​the copper base 5. Multiple inner expansion holes 8 on the copper base 5 and located inside the inner inclined groove 7 are used to transfer heat from the capacitor body 1. Under the same conditions as traditional capacitor installation environments, if there is airflow in the installation environment, the setting of the inner expansion holes 8 can improve the heat dissipation effect of the capacitor body 1. The air inlet holes 6 on both sides of the copper base 5, which are connected to the inner expansion holes 8, are used to allow airflow around the capacitor body 1. The heat insulation pad 11 at the bottom of the copper base 5 is used to isolate the heat transfer between the copper base 5 and the circuit board, preventing the device from overheating due to the heat generated by the circuit board during use.

[0024] Please see Figures 1 to 5The copper base 5 also has a first welding foot groove 10 corresponding to the welding foot 2. The welding foot 2 extends to the inner side of the first welding foot groove 10. Multiple connecting rods 9 are fixedly installed at the bottom of the copper base 5. During the use of this device, the first welding foot groove 10 on the copper base 5, corresponding to the welding foot 2, is used for loading and fixing the welding foot 2. The welding foot 2 extends to the inner side of the first welding foot groove 10. Multiple connecting rods 9 fixedly installed at the bottom of the copper base 5 are used for connecting the copper base 5 and the heat insulation pad 11. The two are conveniently connected by plugging in.

[0025] Please see Figures 1 to 5 An inner inclined heat insulation pad 14 is integrally formed on the heat insulation pad 11, and an outer expansion hole 15 corresponding to the inner expansion hole 8 is formed on the inner inclined heat insulation pad 14. During the use of this device, the inner inclined heat insulation pad 14 integrally formed on the heat insulation pad 11 is used to correspond with the inner inclined groove 7 on the copper base 5 to ensure the excellent heat dissipation effect of this device. The outer expansion hole 15 formed on the inner inclined heat insulation pad 14, corresponding to the inner expansion hole 8, is used to communicate with the inner expansion hole 8, together to achieve efficient heat dissipation of this device.

[0026] Please see Figures 1 to 5 The heat insulation pad 11 has a second welding foot groove 13, and the welding foot 2 extends to the inner side of the second welding foot groove 13. During the use of this device, the second welding foot groove 13 on the heat insulation pad 11 is used for loading the welding foot 2, and the welding foot 2 can extend to the inner side of the second welding foot groove 13.

[0027] Please see Figures 1 to 5 The heat insulation pad 11 is also provided with a connection hole 12, and the connecting rod 9 extends to the inside of the connection hole 12. During the use of this device, the connection hole 12 on the heat insulation pad 11 is used to cooperate with the connecting rod 9 to achieve a quick connection with the copper base 5.

[0028] Please see Figures 1 to 5 An overhead foot 16 is fixedly installed on the heat insulation pad 11 and on the outside of the inner inclined heat insulation pad 14. During the use of this device, the overhead foot 16 fixedly installed on the heat insulation pad 11 and on the outside of the inner inclined heat insulation pad 14 is used to connect the heat insulation pad 11 to the circuit board, with a gap to facilitate heat dissipation and ventilation of the copper base 5 and the inside of the heat insulation pad 11.

[0029] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A surface-mount supercapacitor, comprising a capacitor body (1), wherein solder feet (2) are provided on both sides of the capacitor body (1), characterized in that: The inner side of the welding foot (2) is provided with a first welding hole (3), and the bottom of the welding foot (2) is provided with a second welding hole (4) that communicates with the first welding hole (3). The bottom of the capacitor body (1) is provided with a copper base (5), and the bottom of the copper base (5) is provided with an inner inclined groove (7). Multiple inner expansion holes (8) are provided on the copper base (5) and located inside the inner inclined groove (7). Air filling holes (6) that communicate with the inner expansion holes (8) are provided on both sides of the copper base (5). A heat insulation pad (11) is provided at the bottom of the copper base (5).

2. A surface-mount supercapacitor according to claim 1, characterized in that: The copper base (5) is also provided with a first welding foot groove (10) opposite to the welding foot (2), the welding foot (2) extends to the inner side of the first welding foot groove (10), and a plurality of connecting rods (9) are fixedly provided at the bottom of the copper base (5).

3. A surface-mount supercapacitor according to claim 1, characterized in that: An inner inclined heat insulation pad (14) is integrally formed on the heat insulation pad (11), and an outer expansion hole (15) corresponding to the inner expansion hole (8) is opened on the inner inclined heat insulation pad (14).

4. A surface-mount supercapacitor according to claim 2, characterized in that: The heat insulation pad (11) has a second welding foot groove (13), and the welding foot (2) extends to the inside of the second welding foot groove (13).

5. A surface-mount supercapacitor according to claim 2, characterized in that: The heat insulation pad (11) is also provided with a connection hole (12), and the connecting rod (9) extends to the inside of the connection hole (12).

6. A surface-mount supercapacitor according to claim 3, characterized in that: An overhead leg (16) is fixedly installed on the heat insulation pad (11) and on the outside of the inner inclined heat insulation pad (14).

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