An electronic package housing with high heat dissipation
By setting the first heat sink at equal and even intervals on the housing and covering it with a breathable second heat sink, the problem of wire harness entanglement caused by the gaps between the heat sinks is solved, and a highly efficient and stable heat dissipation effect is achieved.
CN224419148UActive Publication Date: 2026-06-26TAIZHOU ZHUDING NEW MATERIAL MFG CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- TAIZHOU ZHUDING NEW MATERIAL MFG CO LTD
- Filing Date
- 2025-07-25
- Publication Date
- 2026-06-26
AI Technical Summary
Technical Problem
The existing package housing becomes irregular in shape after adding heat sinks, and the gaps between the heat sinks can easily cause wire harnesses to become tangled, affecting heat dissipation efficiency and reducing user experience.
Method used
The first heat sink is evenly distributed at equal intervals on the shell, and the first heat sink is covered by a second heat sink. The second heat sink is designed to be breathable to ensure air exchange efficiency and prevent external objects from entering the gap and affecting heat dissipation.
Benefits of technology
It achieves stable and efficient heat dissipation, avoids the problem of wire tangling caused by gaps in the heat sink, and improves heat dissipation efficiency and user experience.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN224419148U_ABST
Abstract
The utility model relates to the technical field of packaging shell, provide an electronic packaging shell of high -efficient heat dissipation, its including shell, first fin and second fin, the shell is sealed housing, is equipped with the interface on the lateral wall of shell, first fin is the flat plate, first fin is integrally formed on the top surface of shell in vertical form, first fin is equidistant evenly distributed on the top surface of shell, second fin is the air -permeable board, second fin horizontal arrangement integrally formed connection all first fin. The electronic packaging shell of high -efficient heat dissipation can guarantee the exchange efficiency of shell surface air, realizes stable and high -efficiently to complete heat dissipation.
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