A laminated film capacitor

Abstract

This utility model relates to the field of multilayer film capacitor technology, specifically a multilayer film capacitor, including an antistatic metal shell and a capacitor body disposed inside the antistatic metal shell. Multiple aluminum fins are fixedly disposed on the periphery of the antistatic metal shell. These aluminum fins are used for heat dissipation of the capacitor body, and each aluminum fin extends into the interior of the antistatic metal shell on the side closest to the capacitor body. Because each aluminum fin extends into the interior of the antistatic metal shell on the side closest to the capacitor body, when the capacitor body is in contact with the aluminum fins, the aluminum fins can dissipate heat from the capacitor body, thereby improving the heat dissipation effect of the capacitor body. This improves the heat dissipation efficiency of the capacitor body during use.

Description

Technical Field

[0001] This utility model relates to a multilayer thin film capacitor, belonging to the technical field of multilayer thin film capacitors. Background Technology

[0002] Multilayer film capacitors are compact capacitors made by alternating stacking of multiple layers of thin film dielectrics and electrodes. Their core structure is made of polymer films (such as polyester, polypropylene, polyphenylene sulfide, etc.) and metallized electrodes (vacuum-deposited layers such as aluminum and zinc) through a precision stacking process. After being wound or stacked in flat plates, they are externally encapsulated with epoxy resin or sealed with a metal shell to enhance mechanical stability.

[0003] During capacitor installation, a protective casing is usually required. However, if the casing is designed to be too airtight, it will significantly hinder the capacitor's heat dissipation efficiency. This poor heat dissipation will cause the capacitor's operating temperature to rise, thereby affecting its operational stability and accelerating component aging, ultimately resulting in a decline in capacitor performance and a shortened lifespan.

[0004] Therefore, it is urgent to improve the casing of multilayer film capacitors to solve the above-mentioned problems. Utility Model Content

[0005] The purpose of this invention is to provide a multilayer film capacitor that utilizes aluminum fins to dissipate heat from the capacitor body, thereby improving the heat dissipation effect of the capacitor body and thus enhancing its heat dissipation efficiency when in use.

[0006] To achieve the above objectives, the main technical solution adopted by this utility model includes: a multilayer film capacitor, comprising an antistatic metal shell and a capacitor body disposed inside the antistatic metal shell, wherein multiple aluminum fins are fixedly disposed on the periphery of the antistatic metal shell, the aluminum fins are used for heat dissipation of the capacitor body, and each aluminum fin extends into the interior of the antistatic metal shell on the side near the capacitor body.

[0007] Preferably, a reinforcing plate is fixedly provided between each pair of aluminum fins, and the reinforcing plate is used to rigidly reinforce the space between each pair of aluminum fins.

[0008] Preferably, the reinforcing plate has multiple corrugated flow channels on the side away from the antistatic metal shell, and each corrugated flow channel is opened horizontally.

[0009] Preferably, the antistatic metal shell is further provided with multiple fixing plates on its periphery, and the outer side of the antistatic metal shell is provided with multiple mounting grooves for limiting the position of the fixing plates.

[0010] Preferably, a heat-conducting layer is fixedly disposed on the side of the fixing plate near the capacitor body, and the heat-conducting layer is used for heat dissipation.

[0011] Preferably, an antistatic layer is fixedly provided on the side of the fixing plate away from the capacitor body, and the antistatic layer is used for electrostatic protection of the capacitor body.

[0012] Preferably, the bottom of the antistatic metal housing is provided with threaded holes, and every two threaded holes form a group that communicates with the mounting groove.

[0013] Preferably, each of the threaded holes is threadedly connected to a fastening screw, the fastening screw extending into the antistatic layer, and the fastening screw being threadedly connected to the antistatic layer.

[0014] Preferably, a metal film is wound around the outside of the capacitor body, and the metal film is a stacked design.

[0015] Preferably, each of the thermally conductive layers and the aluminum fins is in contact with the outer surface of the metal film.

[0016] This utility model has at least the following beneficial effects:

[0017] 1. Each aluminum fin extends into the antistatic metal casing on the side closest to the capacitor body. When the capacitor body comes into contact with the aluminum fin, the aluminum fin can dissipate heat from the capacitor body, thereby improving the heat dissipation effect of the capacitor body. As a result, the heat dissipation efficiency of the capacitor body can be improved when it is in use.

[0018] 2. The reinforcing plate not only strengthens the connection between each aluminum fin, but the corrugated airflow channels on the reinforcing plate also guide airflow to the aluminum fins on both sides, thereby providing a wind-cooling effect for the aluminum fins and further improving their heat dissipation performance. Attached Figure Description

[0019] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments of this application and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0020] Figure 1 This is a schematic diagram of the overall three-dimensional structure of a multilayer thin-film capacitor according to an embodiment of the present invention;

[0021] Figure 2 This is a schematic diagram showing the disassembled aluminum fins and reinforcing plate of a multilayer thin-film capacitor according to an embodiment of the present invention.

[0022] Figure 3This is a schematic diagram showing the disassembled fixing plate and antistatic metal shell of a multilayer film capacitor in an embodiment of this utility model.

[0023] Figure 4 This is a schematic diagram of the planar structure of a stacked thin film capacitor, including a fixing plate, an antistatic layer, and a thermally conductive layer, according to an embodiment of this utility model.

[0024] Figure 5 This is a schematic diagram of the bottom structure of the antistatic metal casing of a multilayer film capacitor according to an embodiment of the present invention.

[0025] Figure 6 This is a schematic diagram showing the separation of the capacitor body and the antistatic metal shell of a multilayer film capacitor in an embodiment of this utility model.

[0026] In the diagram, 1. Antistatic metal casing; 2. Antistatic layer; 3. Aluminum fins; 4. Reinforcing plate; 401. Corrugated flow channel; 5. Heat-conducting layer; 6. Mounting slot; 7. Metal film; 8. Fixing plate; 9. Capacitor body; 10. Threaded hole; 11. Fastening screw. Detailed Implementation

[0027] The following will describe in detail the implementation of this application with reference to the accompanying drawings and embodiments, so that the implementation process of how this application uses technical means to solve technical problems and achieve technical effects can be fully understood and implemented accordingly.

[0028] Examples, such as Figures 1-6 As shown, a multilayer film capacitor includes an antistatic metal housing 1 and a capacitor body 9 disposed inside the antistatic metal housing 1. Multiple aluminum fins 3 are fixedly disposed on the periphery of the antistatic metal housing 1. The aluminum fins 3 are used for heat dissipation of the capacitor body 9. Each aluminum fin 3 extends into the antistatic metal housing 1 on the side close to the capacitor body 9. When the capacitor body 9 comes into contact with the aluminum fins 3, the aluminum fins 3 can be used to dissipate heat from the capacitor body 9, thereby improving the heat dissipation effect of the capacitor body 9. Thus, when the capacitor body 9 is in use, its heat dissipation efficiency can be improved.

[0029] A reinforcing plate 4 is fixedly installed between each pair of aluminum fins 3. The reinforcing plate 4 is used to rigidly reinforce the connection between each pair of aluminum fins 3. Multiple corrugated airflow channels 401 are opened on the side of the reinforcing plate 4 away from the antistatic metal shell 1. Each corrugated airflow channel 401 is opened horizontally. The reinforcing plate 4 can not only strengthen the connection between each aluminum fin 3, but also the corrugated airflow channels 401 on the reinforcing plate 4 can guide the airflow to the aluminum fins 3 on both sides, thereby providing a wind-cooling effect for the aluminum fins 3 and further improving the heat dissipation effect of the aluminum fins 3.

[0030] Furthermore, multiple fixing plates 8 are provided around the antistatic metal shell 1. Multiple mounting grooves 6 are provided on the outer side of the antistatic metal shell 1 to limit the position of the fixing plates 8. A heat-conducting layer 5 is fixedly provided on the side of the fixing plate 8 near the capacitor body 9. The heat-conducting layer 5 is used to disperse heat. An antistatic layer 2 is fixedly provided on the side of the fixing plate 8 away from the capacitor body 9. The antistatic layer 2 is used for electrostatic protection of the capacitor body 9. The setting of the fixing plate 8 can fix the position of the antistatic layer 2 and the heat-conducting layer 5, so that the heat-conducting layer 5 can play a role in dispersing heat. At the same time, the material of the antistatic layer 2 is the same as that of the antistatic metal shell 1, which can avoid the external factors (such as static electricity and other factors) from affecting the capacitor body 9 due to the setting of the fixing plate 8.

[0031] Furthermore, the bottom of the antistatic metal housing 1 is provided with threaded holes 10. Every two threaded holes 10 form a group that communicates with the mounting groove 6. Each threaded hole 10 is threadedly connected to a fastening screw 11. The fastening screw 11 extends into the antistatic layer 2 and is threadedly connected to the antistatic layer 2. The threaded holes 10 enable the fastening screw 11 to be threadedly connected to the antistatic metal housing 1 and the fixing plate 8. Thus, the fixing plate 8 can be threadedly fixed to the mounting groove 6 by the fastening screw 11, thereby allowing the fixing plate 8 to be fixed on the antistatic metal housing 1 for use.

[0032] Furthermore, a metal film 7 is wound around the outside of the capacitor body 9. The metal film 7 has a stacked design, with each heat-conducting layer 5 and aluminum fins 3 in contact with the outer surface of the metal film 7. The stacked process can achieve a higher capacitance value in the same volume, meeting the requirements of equipment miniaturization. At the same time, the heat-conducting layer 5 and aluminum fins 3 are in contact with the metal film 7, thereby enabling heat dissipation of the metal film 7. Heat dissipation can significantly improve the performance and reliability of the metal film 7, and at the same time, heat dissipation can delay material aging (such as dielectric oxidation and electrode deterioration).

[0033] In this embodiment, as Figures 1-6 As shown, the principle of a multilayer thin-film capacitor provided in this embodiment is as follows:

[0034] When the capacitor body 9 comes into contact with the aluminum fins 3, the aluminum fins 3 can be used to dissipate heat from the capacitor body 9, thereby improving the heat dissipation effect of the capacitor body 9. As a result, the heat dissipation efficiency of the capacitor body 9 can be improved when it is in use.

[0035] A reinforcing plate 4 is fixedly installed between each pair of aluminum fins 3. The reinforcing plate 4 is used to rigidly reinforce the connection between each pair of aluminum fins 3. Multiple corrugated airflow channels 401 are opened on the side of the reinforcing plate 4 away from the antistatic metal shell 1. Each corrugated airflow channel 401 is opened horizontally. The reinforcing plate 4 can not only strengthen the connection between each aluminum fin 3, but also the corrugated airflow channels 401 on the reinforcing plate 4 can guide the airflow to the aluminum fins 3 on both sides, thereby providing a wind-cooling effect for the aluminum fins 3 and further improving the heat dissipation effect of the aluminum fins 3.

[0036] If certain terms are used in the specification and claims to refer to specific components, those skilled in the art will understand that hardware manufacturers may use different names to refer to the same component. This specification and claims do not distinguish components based on differences in name, but rather on differences in function. The term "comprising" as used throughout the specification and claims is an open-ended term and should be interpreted as "comprising but not limited to." "Approximately" means that within an acceptable margin of error, those skilled in the art can solve the technical problem and substantially achieve the technical effect within a certain margin of error.

[0037] It should be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a product or system comprising a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a product or system. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the product or system that includes that element.

[0038] The foregoing description illustrates and describes several preferred embodiments of the present invention. However, as previously stated, it should be understood that the present invention is not limited to the forms disclosed herein and should not be construed as excluding other embodiments. It can be used in various other combinations, modifications, and environments, and can be altered within the scope of the inventive concept described herein through the foregoing teachings or techniques or knowledge in related fields. Any modifications and variations made by those skilled in the art that do not depart from the spirit and scope of the present invention should be within the protection scope of the appended claims.

Claims

1. A multilayer thin-film capacitor, characterized in that: The device includes an antistatic metal housing (1) and a capacitor body (9) disposed inside the antistatic metal housing (1). Multiple aluminum fins (3) are fixedly disposed on the periphery of the antistatic metal housing (1). The aluminum fins (3) are used for heat dissipation of the capacitor body (9). Each aluminum fin (3) extends into the interior of the antistatic metal housing (1) on the side near the capacitor body (9).

2. A multilayer thin-film capacitor according to claim 1, characterized in that: A reinforcing plate (4) is fixedly provided between each pair of aluminum fins (3), and the reinforcing plate (4) is used to rigidly reinforce the space between each pair of aluminum fins (3).

3. A multilayer thin-film capacitor according to claim 2, characterized in that: The reinforcing plate (4) has multiple corrugated guide grooves (401) on the side away from the antistatic metal shell (1), and each corrugated guide groove (401) is opened horizontally.

4. A multilayer thin-film capacitor according to claim 1, characterized in that: The antistatic metal shell (1) is also provided with multiple fixing plates (8) around its periphery, and multiple mounting grooves (6) are provided on the outer side of the antistatic metal shell (1) to limit the position of the fixing plates (8).

5. A multilayer thin-film capacitor according to claim 4, characterized in that: A heat-conducting layer (5) is fixedly provided on the side of the fixed plate (8) near the capacitor body (9), and the heat-conducting layer (5) is used for heat dissipation.

6. A multilayer thin-film capacitor according to claim 5, characterized in that: An antistatic layer (2) is fixedly provided on the side of the fixing plate (8) away from the capacitor body (9), and the antistatic layer (2) is used for electrostatic protection of the capacitor body (9).

7. A multilayer thin-film capacitor according to claim 6, characterized in that: The bottom of the antistatic metal housing (1) is provided with threaded holes (10), and every two threaded holes (10) form a group that communicates with the mounting groove (6).

8. A multilayer thin-film capacitor according to claim 7, characterized in that: Each of the threaded holes (10) is threadedly connected to a fastening screw (11), which extends into the antistatic layer (2) and is threadedly connected to the antistatic layer (2).

9. A multilayer thin-film capacitor according to claim 8, characterized in that: The capacitor body (9) is wrapped with a metal film (7) on the outside, and the metal film (7) is a stacked design.

10. A multilayer thin-film capacitor according to claim 9, characterized in that: Each of the thermally conductive layers (5) and the aluminum fins (3) are in contact with the outer surface of the metal film (7).

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