A high current crimped packaged ac contactor

Abstract

The utility model relates to the technical field of large -current pressure joint package's AC contactor discloses a large -current pressure joint package's AC contactor, including elastic pressing plate, the elastic pressing plate passes through the hexagon bolt and is pressed into one for radiating heat with chip, conductive cathode, conductive anode, conductive voltage block, high thermal conductivity ceramic substrate and bottom plate, the chip is connected with conductive cathode and conductive anode through conductive voltage block with antiparallel connection mode, the utility model can be applicable to steel plant, wharf, freight station etc. Large -scale row hangs control system, the utility model can completely replace original AC contactor and the welding non -contact switch, and the through -flow capacity 50A -3000A of product can be used in various AC switches, including the radiator that product itself carries can reach long -time work without causing heat accumulation in work, will not burn out non -contact AC contactor, according to the occasion difference can reach the equipment compact, space occupation is small, trigger circuit is simple, is convenient for switchgear body installation.

Description

Technical Field

[0001] This utility model relates to the technical field of AC contactors with high-current crimp-packaged components, specifically to an AC contactor with high-current crimp-packaged components. Background Technology

[0002] In the process of modern industrial automation, contactless contactors have been widely used in the field of power control due to their advantages such as no mechanical contact wear, fast response speed, and high control precision. However, the current mainstream contactless contactors generally adopt a technology solution of soldering semiconductor chips, which has significant technical bottlenecks. First, due to the limitations of soldering process and chip layout, their current carrying capacity is mostly controlled below 500A, which is difficult to meet the high-power power demand of high-load operation scenarios such as port loading and unloading terminals and warehouse hoisting facilities. Second, under full load operation, the soldered semiconductor chips have high contact resistance, which easily generates a lot of heat. The solder material is prone to desoldering under continuous high temperature environment, which leads to contactor burnout, seriously affecting equipment stability and service life, and increasing maintenance costs and downtime risks. At the same time, in special places such as port loading and unloading terminals and warehouse hoisting facilities where contactors are frequently used, discrete devices are still commonly used as guide switches. These discrete devices are not only bulky and have low integration, but also have problems such as poor contact and poor reliability, making them difficult to adapt to the requirements of high-frequency and high-intensity operation, and unable to meet the needs of modern industry for efficient and stable power control. Utility Model Content

[0003] The purpose of this invention is to address the shortcomings of existing technologies by proposing a high-current press-fit AC contactor.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: a high-current press-fit AC contactor, comprising a spring plate, wherein the spring plate presses together a chip, a conductive cathode, a conductive anode, a voltage-conducting block, a high thermal conductivity ceramic substrate, and a base plate for heat dissipation via internal hexagonal bolts, and wherein the chip is connected to the conductive cathode and conductive anode in an anti-parallel manner via the voltage-conducting block.

[0005] As a further description of the above technical solution:

[0006] A housing is disposed above the base plate. A high thermal conductivity ceramic substrate is disposed inside the housing. The high thermal conductivity ceramic substrate is disposed above the base plate. A conductive anode is disposed above the high thermal conductivity ceramic substrate. A chip is disposed above the conductive anode. A voltage-conducting block is disposed above the chip. A conductive cathode is disposed above the voltage-conducting block.

[0007] As a further description of the above technical solution:

[0008] An integrated silicone gate electrode body is disposed above the conductive cathode. An insulating pad is disposed above the integrated silicone gate electrode body. A disc spring is disposed above the insulating pad. A spring plate is disposed above the disc spring. A second outer shell is disposed above the spring plate and the first outer shell. A terminal is disposed above the second outer shell.

[0009] As a further description of the above technical solution:

[0010] A chip positioning ring is provided between the insulating pad and the disc spring, and the chip positioning ring limits the position of the chip.

[0011] As a further description of the above technical solution:

[0012] The novel high-power contactless AC switch is triggered by a control chip inside a silicone integrated gate device. The silicone integrated gate device can be controlled by six chips individually, or each group can be triggered and controlled independently.

[0013] As a further description of the above technical solution:

[0014] The internal control lines of the novel high-power contactless AC switch are soldered with sockets and controlled by terminals to prevent the chip from falling off due to high temperature. The external control lines of the novel high-power contactless AC switch can be directly connected to the intelligent trigger board.

[0015] As a further description of the above technical solution:

[0016] The spring plate has internal hex bolts threaded through its four corners and above the base plate.

[0017] This utility model has the following beneficial effects:

[0018] 1. The new high-power contactless AC switch is made by pressing together reliable and high-quality chips and mounting them onto a copper base plate or directly onto a heat sink for heat dissipation. In the new high-power contactless AC switch, the semiconductor chip control can be controlled by six individual chips, or each group can be triggered and controlled independently.

[0019] 2. The press-fit structure allows for greater current carrying capacity and avoids the problem of chip detachment at high temperatures that occurs with soldered designs. The external control circuit can be directly connected to the intelligent trigger board, and the trigger signal voltage can be set to a wide range of VGT1.2V-6V. At the same time, the use of high trigger current chips IGT100mA-500mA improves its anti-interference capability. If TVS and varistor protection are installed internally, it can resist lightning strikes or false triggering and breakdown accidents caused by equipment leakage when used in outdoor equipment, while also eliminating inductive loads. Attached Figure Description

[0020] Figure 1This is a schematic diagram of the overall structure of a high-current press-fit AC contactor proposed in this utility model.

[0021] Legend:

[0022] 1. Base plate; 2. Outer shell one; 3. High thermal conductivity ceramic substrate; 4. Conductive anode; 5. Chip; 6. Conductive block; 7. Conductive cathode; 8. Silicone integrated gate device body; 9. Insulating gasket; 10. Chip positioning ring; 11. Disc spring; 12. Spring pressure plate; 13. Hex socket head cap screw; 14. Outer shell two; 15. Terminal. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Example 1:

[0025] like Figure 1 As shown, this embodiment provides a high-current press-fit AC contactor, including a spring plate 12. The spring plate 12 presses together a chip 5, a conductive cathode 7, a conductive anode 4, a voltage-conducting block 6, a high thermal conductivity ceramic substrate 3, and a base plate 1 for heat dissipation via hexagon socket screws 13. The chip 5 is connected to the conductive cathode 7 and the conductive anode 4 in an anti-parallel manner via the voltage-conducting block 6.

[0026] In this embodiment, the spring-loaded plate 12 presses together the base plate 1, the high thermal conductivity ceramic substrate 3, the conductive anode 4, the chip 5, the voltage-conducting block 6, and the conductive cathode 7 using hexagon socket bolts 13, utilizing a vertical structure for heat dissipation. The chip 5 is connected in anti-parallel to the conductive anode 4 and the conductive cathode 7 via the voltage-conducting block 6, enabling bidirectional current conduction. The press-fit structure reduces contact resistance and thermal resistance, and the anti-parallel connection allows the module to handle AC current, making it suitable for high-current scenarios.

[0027] Specifically, a housing 2 is provided above the base plate 1, a high thermal conductivity ceramic substrate 3 is provided inside the housing 2, the high thermal conductivity ceramic substrate 3 is provided above the base plate 1, a conductive anode 4 is provided above the high thermal conductivity ceramic substrate 3, a chip 5 is provided above the conductive anode 4, a voltage-conducting block 6 is provided above the chip 5, and a conductive cathode 7 is provided above the voltage-conducting block 6.

[0028] In this embodiment, the base plate 1 supports the high thermal conductivity ceramic substrate 3, which isolates electrical components and conducts heat. The conductive anode 4 and the conductive cathode 7 achieve electrical energy conversion through the chip 5, and the voltage-conducting block 6 ensures good contact between the chip 5 and the electrode. The high thermal conductivity ceramic substrate 3 quickly conducts heat from the chip 5, reduces the junction temperature, and improves the module's service life.

[0029] Specifically, an integrated silicone gate electrode device 8 is provided above the conductive cathode 7, an insulating pad 9 is provided above the integrated silicone gate electrode device 8, a disc spring 11 is provided above the insulating pad 9, a spring pressure plate 12 is provided above the disc spring 11, a second outer shell 14 is provided above the spring pressure plate 12 and the first outer shell 2, and a terminal 15 is provided above the second outer shell 14.

[0030] As a preferred implementation, the silicone integrated gate device body 8 controls the chip 5 for triggering, the insulating pad 9 isolates the electrical circuit, the disc spring 11 compensates for thermal expansion pressure, the pressure plate 12 evenly distributes the pressure, the outer shell 2 and the outer shell 14 protect the internal components, the terminal 15 connects to the external circuit, the disc spring 11 maintains stable pressure, the silicone integrated gate device body 8 is resistant to aging, and the welding structure of the terminal 15 ensures reliable connection at high temperatures.

[0031] Specifically, a chip positioning ring 10 is provided between the insulating pad 9 and the disc spring 11, and the chip positioning ring 10 limits the position of the chip 5.

[0032] It should be noted that the chip positioning ring 10 ensures the precise positioning of the chip 5 during press-fitting and thermal cycling through mechanical limiting, reducing chip 5 position deviation, avoiding local overheating, and improving module reliability.

[0033] Specifically, the new high-power contactless AC switch is triggered by the control chip 5 through the silicone integrated gate device 8. The silicone integrated gate device 8 can be controlled by each of the six chips individually, or each group can be triggered independently.

[0034] As a preferred implementation, the silicone integrated gate device body 8 integrates an independent trigger circuit, which can control the chip 5 individually or in groups, realize synchronous triggering of multiple chips 5, support high-frequency switching, and is suitable for AC power transmission systems.

[0035] Example 2:

[0036] Specifically, the internal control lines of the new high-power contactless AC switch are soldered with sockets and controlled by terminal 15 to prevent chip 5 from falling off at high temperatures. The external control lines of the new high-power contactless AC switch can be directly connected to the intelligent trigger board.

[0037] It should be noted that the internal control lines are soldered to terminal 15 via sockets. All internal control lines are soldered using sockets, and terminal 15 receives signals from the main control program to control each disconnection and operation, achieving high efficiency, safety, practicality, fatigue resistance, and anti-attenuation operation. Terminal 15 can be directly connected to the intelligent trigger board to transmit signals. The solder joints are reliable at high temperatures, and the intelligent trigger board integrates protection circuitry for fast response.

[0038] Specifically, the four corners of the spring plate 12 and the top of the base plate 1 are all connected by threaded hexagonal bolts 13.

[0039] In this embodiment, the hex bolts are tightened diagonally to generate uniform surface pressure on the pressure plate, ensuring uniform pressure distribution, consistent contact resistance in all areas of the chip, and good current sharing performance of the module.

[0040] In use, this high-current press-fit AC contactor presses together components such as chip 5, conductive cathode 7, and conductive anode 4 using a spring plate 12 and hex bolts 13. It utilizes a vertical structure for heat dissipation, and the chips 5 are connected in anti-parallel to achieve bidirectional current conduction. The internal triggering of chip 5 is controlled by an integrated silicone gate device 8, which can be controlled individually or in groups. The internal control line is connected to the intelligent trigger board via a socket weld and terminal 15 to transmit signals. The disc spring 11 maintains stable pressure, and the chip positioning ring 10 ensures the precise position of chip 5, thereby achieving efficient and stable power control.

[0041] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A high-current press-fit AC contactor, characterized in that: Includes a spring plate (12), which presses together the chip (5), conductive cathode (7), conductive anode (4), conductive voltage block (6), high thermal conductivity ceramic substrate (3) and base plate (1) for heat dissipation by means of internal hex bolts (13). The chip (5) is connected to the conductive cathode (7) and conductive anode (4) in anti-parallel manner through the conductive voltage block (6).

2. The AC contactor with high-current crimp-encapsulated packaging according to claim 1, characterized in that: A housing (2) is provided above the base plate (1). A high thermal conductivity ceramic substrate (3) is provided inside the housing (2). The high thermal conductivity ceramic substrate (3) is provided above the base plate (1). A conductive anode (4) is provided above the high thermal conductivity ceramic substrate (3). A chip (5) is provided above the conductive anode (4). A voltage-conducting block (6) is provided above the chip (5). A conductive cathode (7) is provided above the voltage-conducting block (6).

3. The AC contactor with high-current crimp-encapsulated packaging according to claim 2, characterized in that: A silicone integrated gate electrode device body (8) is provided above the conductive cathode (7), an insulating pad (9) is provided above the silicone integrated gate electrode device body (8), a disc spring (11) is provided above the insulating pad (9), a spring plate (12) is provided above the disc spring (11), a second outer shell (14) is provided above the spring plate (12) and the first outer shell (2), and a terminal (15) is provided above the second outer shell (14).

4. The AC contactor with high-current crimp-encapsulated packaging according to claim 3, characterized in that: A chip positioning ring (10) is provided between the insulating pad (9) and the disc spring (11), and the chip positioning ring (10) limits the position of the chip (5).

5. The AC contactor with high-current crimp-encapsulated packaging according to claim 3, characterized in that: The contactless AC switch is triggered by the control chip (5) through the silicone integrated gate device (8). The silicone integrated gate device (8) can be controlled by six chips individually or by each group independently.

6. The AC contactor with high-current crimp-encapsulated packaging according to claim 3, characterized in that: The internal control line of the contactless AC switch is soldered with a socket and controlled by the terminal (15) to prevent the chip (5) from falling off at high temperature. The external control line of the contactless AC switch can be directly connected to the intelligent trigger board.

7. The AC contactor with high-current crimp-encapsulated packaging according to claim 1, characterized in that: The four corners of the spring plate (12) and the top of the base plate (1) are all connected by internal hex bolts (13) with threads.

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