PCB circuit board structure with improved heat dissipation

Abstract

The utility model discloses a kind of PCB circuit board structures of improving heat dissipation, it is related to circuit board technical field, including circuit board main body, the outside of circuit board main body is equipped with heat-conducting frame, the top left side of heat-conducting frame is equipped with connecting groove, the left and right sides of heat-conducting frame are vertically equipped with four threaded holes;The inside of connecting groove is embedded with suction assembly, and the suction assembly includes damping plugboard, and the damping plugboard is embedded in the inside of connecting groove, and the top of damping plugboard is equipped with micro air pump.The utility model is cooperated by suction assembly and air blowing component, so as to be convenient for fixing suction pump in the top of heat-conducting frame, so as to be convenient for by suction pump outside air is sucked into and is blown to the inside of second heat dissipation hole, so as to carry out heat dissipation treatment to the inside of circuit board main body, improve the heat dissipation effect of the device, simultaneously convenient for disassembling heat dissipation structure.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, specifically a PCB circuit board structure that improves heat dissipation. Background Technology

[0002] A PCB (Printed Circuit Board) is an important electronic component. It serves as the support for electronic components and the carrier for their electrical connections. Because it is manufactured using electronic printing technology, it is called a "printed" circuit board. Circuit boards are a product of the development of electronic technology towards high speed, multi-functionality, large capacity, and small size. However, as the number of electronic components on the circuit board gradually increases, these components will generate a certain amount of heat while working normally. Since there are a large number of electronic components on the circuit board, they will generate a lot of heat when they work together.

[0003] Existing patent CN219499614U discloses a heat-dissipating PCB circuit board, including a substrate, a heat sink fixedly connected to the bottom of the inner wall of the substrate, a circuit connection board fixedly connected to the top of the heat sink through a thermally conductive silicone bonding layer, an insulating plate provided on the top of the circuit connection board, and electronic components fixedly connected to the top of the circuit connection board through a conductor; this utility model can dissipate the heat generated by the PCB board through the heat sink and heat dissipation holes.

[0004] However, the circuit board still has some defects. As more and more electronic components are piled up on the heat sink, the temperature also gets higher and higher. During use, the heat dissipation effect of the circuit board by heat dissipation holes and heat sink alone is not good. The circuit board is easily damaged due to high temperature, and it is not convenient to disassemble the heat dissipation structure, which makes it inconvenient to use.

[0005] Based on this, a PCB circuit board structure that improves heat dissipation is now provided, which can eliminate the drawbacks of existing devices. Utility Model Content

[0006] The purpose of this invention is to provide a PCB circuit board structure that improves heat dissipation, so as to solve the problems of poor heat dissipation effect and inconvenient disassembly of heat dissipation structure in the background art.

[0007] To achieve the above objectives, this utility model provides the following technical solution:

[0008] A PCB circuit board structure for improving heat dissipation includes a circuit board body, a heat-conducting frame is installed on the outer side of the circuit board body, a connecting groove is provided on the top left side of the heat-conducting frame, and four threaded holes are vertically opened on the left and right sides of the heat-conducting frame.

[0009] An air extraction assembly is fitted inside the connecting groove. The air extraction assembly includes a damping plate, which is fitted inside the connecting groove. A micro air pump is installed on the top of the damping plate. A filter cartridge is installed at the air inlet end of the micro air pump, and an air outlet pipe is installed at the air outlet end of the micro air pump.

[0010] An air blowing assembly is installed on one side of the air outlet pipe;

[0011] The internal threaded connection of the threaded hole is supported by a support component.

[0012] Based on the above technical solutions, this utility model also provides the following optional technical solutions:

[0013] In one alternative: the surface of the damping insert is provided with a silicone layer, a first heat dissipation hole is vertically penetrating the middle of the circuit board body, and a second heat dissipation hole is horizontally penetrating the side of the circuit board body.

[0014] In one alternative: the left and right sides of the heat-conducting frame have horizontal insertion holes, and the front and rear sides of the heat-conducting frame are equipped with heat dissipation fins.

[0015] In one alternative: the air blowing assembly includes an air outlet plate, which is installed at the bottom of the air outlet pipe, and an air outlet head is installed on one side of the air outlet plate.

[0016] In one alternative: the support assembly includes a connecting bolt threaded into the interior of a threaded hole, a fixing block clamped on the outer middle of the connecting bolt, the fixing block and the heat-conducting frame being mounted together by the connecting bolt, and a support rod mounted on one side of the fixing block.

[0017] In one alternative: heat dissipation components are installed on both sides of the support rod.

[0018] In one alternative: the heat dissipation assembly includes a heat sink, the top of which is covered with a layer of thermal grease, and the bottom of which is provided with fins.

[0019] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0020] 1. This utility model uses the combined use of the air extraction component and the air blowing component to facilitate the fixing of the air pump on the top of the heat-conducting frame. This allows the air pump to draw in outside air and blow it into the interior of the second heat dissipation hole, thereby dissipating heat from the inside of the circuit board body. This improves the heat dissipation effect of the device and also facilitates the disassembly of the heat dissipation structure.

[0021] 2. This utility model uses a combination of support components and heat dissipation components, and installs and fixes the support components and heat dissipation components with connecting bolts to facilitate the disassembly of the heat dissipation structure. The heat dissipation effect is improved by using a silicone grease layer to bond the heat dissipation plate to the bottom of the circuit board body. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0023] Figure 2 This is a schematic diagram of the main body of the circuit board of this utility model.

[0024] Figure 3 This is a schematic diagram of the air extraction component and air blowing component of this utility model.

[0025] Figure 4 This is a schematic diagram of the support component and heat dissipation component of this utility model.

[0026] Figure reference numerals: 1. Circuit board body; 11. First heat dissipation hole; 12. Second heat dissipation hole; 13. Heat-conducting frame; 14. Connecting groove; 15. Threaded hole; 16. Insertion hole; 17. Heat dissipation fins; 2. Damping insert plate; 21. Miniature air pump; 22. Filter cartridge; 23. Air outlet pipe; 24. Air outlet plate; 25. Air outlet head; 3. Connecting bolt; 31. Fixing block; 32. Support rod; 33. Heat dissipation plate; 34. Silicone grease layer; 35. Fin plate. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments.

[0028] In one embodiment, such as Figure 1 - Figure 4 As shown, a PCB circuit board structure for improving heat dissipation includes a circuit board body 1, a heat-conducting frame 13 is installed on the outer side of the circuit board body 1, a connecting groove 14 is provided on the top left side of the heat-conducting frame 13, and four threaded holes 15 are vertically opened on the left and right sides of the heat-conducting frame 13.

[0029] An air extraction assembly is fitted inside the connecting groove 14. The air extraction assembly includes a damping plate 2, which is fitted inside the connecting groove 14. A micro air pump 21 is installed on the top of the damping plate 2. A filter cartridge 22 is installed at the air inlet end of the micro air pump 21, and an air outlet pipe 23 is installed at the air outlet end of the micro air pump 21.

[0030] An air blowing assembly is installed on one side of the air outlet pipe 23;

[0031] The threaded hole 15 has a support component connected to its internal thread.

[0032] In this embodiment, the support component is quickly installed by threading the threaded hole 15 to the support component. The micro air pump 21 is installed by inserting the damping insert 2 into the connecting groove 14. The micro air pump 21 filters the drawn-in air through the filter cartridge 22 and sends the air into the blowing assembly through the air outlet pipe 23. Finally, the air is sent into the second heat dissipation hole 12 through the blowing assembly, thereby quickly dissipating heat from the circuit board body 1 and improving the heat dissipation effect of the circuit board.

[0033] In one embodiment, such as Figure 1 and Figure 2 As shown, the surface of the damping insert 2 is provided with a silicone layer, the middle of the circuit board body 1 is vertically penetrated by a first heat dissipation hole 11, and the side of the circuit board body 1 is horizontally penetrated by a second heat dissipation hole 12. The circuit board body 1 is rapidly cooled through the first heat dissipation hole 11 and the second heat dissipation hole 12. The silicone layer is avoided by the damping insert 2, so that the damping insert 2 has damped sliding inside the connecting groove 14.

[0034] In one embodiment, such as Figure 1 and Figure 2 As shown, the heat-conducting frame 13 has horizontal insertion holes 16 on both the left and right sides, and heat dissipation fins 17 are installed on the front and rear sides of the heat-conducting frame 13. The heat-conducting frame 13 conducts the temperature of the circuit board body 1, and the heat dissipation fins 17 dissipate the heat of the heat-conducting frame 13.

[0035] In one embodiment, such as Figure 1 and Figure 3 As shown, the air blowing assembly includes an air outlet plate 24, which is installed at the bottom of the air outlet pipe 23. An air outlet head 25 is installed on one side of the air outlet plate 24. Air is sent into the air outlet plate 24 through the air outlet pipe 23, and the gas is sent into the second heat dissipation hole 12 through the air outlet head 25 on one side of the air outlet plate 24.

[0036] In one embodiment, such as Figure 1 , Figure 2 and Figure 4 As shown, the support assembly includes a connecting bolt 3, which is threaded into the threaded hole 15. The middle outer side of the connecting bolt 3 holds a fixing block 31. The fixing block 31 and the heat-conducting frame 13 are installed together by the connecting bolt 3. A support rod 32 is installed on one side of the fixing block 31. The fixing block 31 is installed by the connecting bolt 3 passing through the threaded hole 15 and threadedly connected to it. The support rod 32 supports the heat sink 33.

[0037] In one embodiment, such as Figure 1 and Figure 4 As shown, heat dissipation components are installed on both sides of the support rod 32. By attaching the heat dissipation components to the bottom of the circuit board body 1, the heat dissipation effect of the circuit board body 1 is improved.

[0038] In one embodiment, such as Figure 1 and Figure 4 As shown, the heat dissipation assembly includes a heat sink 33, a thermal grease layer 34 is installed on the top of the heat sink 33, and a fin 35 is provided at the bottom of the heat sink 33. The thermal grease layer 34 on the top of the heat sink 33 fills the gap between the heat sink 33 and the circuit board body 1, thereby improving the heat conduction effect. The heat sink 33 and the fin 35 dissipate heat to the bottom of the circuit board body 1.

[0039] The above embodiment discloses a PCB circuit board structure for improved heat dissipation. The heat-conducting frame 13 on the outer side of the circuit board body 1 conducts heat to the circuit board body 1, facilitating rapid heat dissipation. Heat dissipation fins 17 dissipate heat from both sides of the circuit board body 1, thereby improving the heat dissipation effect. The first heat dissipation hole 11 improves airflow around the circuit board body 1. A damping insert 2 at the bottom of the micro air pump 21 is inserted into the connecting slot 14 for installation. The damping engagement between the damping insert 2 and the connecting slot 14 enhances the stability of the micro air pump 21 installation. The air outlet 25 is inserted into the insertion hole 16 on the left side of the heat-conducting frame 13. The operation of the micro air pump 21 draws in outside air filtered through the filter cartridge 22, and the filtered air is then delivered to the air outlet plate 24 through the air outlet pipe 23. Finally, air is blown into the second heat dissipation hole 12 through the air outlet 25 on one side of the air outlet plate 24, thereby promoting the air circulation inside the second heat dissipation hole 12, improving the heat dissipation effect on the circuit board body 1, avoiding the problem of electronic components burning out due to poor heat dissipation, and facilitating quick disassembly of the heat dissipation device. The fixing block 31 is fixed to the bottom of the heat-conducting frame 13 by the connecting bolt 3, the fixing block 31 supports the support rod 32, the support rod 32 supports the heat dissipation plate 33, and the gap between the heat dissipation plate 33 and the bottom of the circuit board body 1 is filled by the thermal grease layer 34 on the top of the heat dissipation plate 33, thereby improving the heat conduction effect. The heat dissipation effect on the circuit board body 1 is improved by the cooperation of the heat dissipation plate 33 and its bottom fin plate 35. At the same time, the connecting bolt 3 facilitates the disassembly of the support component and the heat dissipation component, improving the practicality and convenience of the device.

[0040] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A PCB circuit board structure for improving heat dissipation, comprising a circuit board body (1), characterized in that, A heat-conducting frame (13) is installed on the outside of the circuit board body (1). A connecting groove (14) is provided on the top left side of the heat-conducting frame (13). Four threaded holes (15) are vertically opened on the left and right sides of the heat-conducting frame (13). An air extraction assembly is fitted inside the connecting groove (14). The air extraction assembly includes a damping plate (2). The damping plate (2) is fitted inside the connecting groove (14). A micro air pump (21) is installed on the top of the damping plate (2). A filter cartridge (22) is installed at the air inlet end of the micro air pump (21). An air outlet pipe (23) is installed at the air outlet end of the micro air pump (21). An air blowing assembly is installed on one side of the air outlet pipe (23); The internal threaded connection of the threaded hole (15) is a support component.

2. The PCB circuit board structure for improving heat dissipation according to claim 1, characterized in that, The surface of the damping insert (2) is provided with a silicone layer, the circuit board body (1) has a first heat dissipation hole (11) vertically penetrating through the middle, and the circuit board body (1) has a second heat dissipation hole (12) horizontally penetrating through the side.

3. The PCB circuit board structure for improving heat dissipation according to claim 1, characterized in that, The heat-conducting frame (13) has horizontal insertion holes (16) on its left and right sides, and heat dissipation fins (17) are installed on the front and rear sides of the heat-conducting frame (13).

4. The PCB circuit board structure for improving heat dissipation according to claim 1, characterized in that, The air blowing assembly includes an air outlet plate (24), which is installed at the bottom of the air outlet pipe (23), and an air outlet head (25) is installed on one side of the air outlet plate (24).

5. A PCB circuit board structure for improving heat dissipation according to claim 1, characterized in that, The support assembly includes a connecting bolt (3), which is threaded into the inside of a threaded hole (15). A fixing block (31) is clamped on the middle outer side of the connecting bolt (3). The fixing block (31) and the heat-conducting frame (13) are installed together by the connecting bolt (3). A support rod (32) is installed on one side of the fixing block (31).

6. A PCB circuit board structure for improving heat dissipation according to claim 5, characterized in that, Heat dissipation components are installed on both sides of the support rod (32).

7. A PCB circuit board structure for improving heat dissipation according to claim 6, characterized in that, The heat dissipation assembly includes a heat sink (33), a silicone grease layer (34) is installed on the top of the heat sink (33), and a fin plate (35) is provided on the bottom of the heat sink (33).

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