Integrated piezoelectric micropump heat dissipation and nanofluid cooling system

Abstract

The utility model discloses an integrated piezoelectric micro -pump heat dissipation and nanometer liquid cooling system, including the circulating pipeline of being equipped with the heat transfer fluid in, and the external heat exchanger and integrated micro -cooler of being connected on circulating pipeline, add nanometer particle in heat transfer fluid, integrated micro -cooler includes integrated casing, the front surface of integrated casing is embedded with multibank piezoelectric micro -pump, the inside of integrated casing still is equipped with integrated micro -channel, and each piezoelectric micro -pump on single -bank piezoelectric micro -pump is connected together through integrated micro -channel, and two adjacent rows piezoelectric micro -pump also are connected through integrated micro -channel, and the whole connection path is S shape layout, and the starting end of integrated micro -channel is equipped with liquid inlet, and the end is equipped with liquid outlet, and integrated micro -cooler is connected on circulating pipeline through liquid inlet and liquid outlet. The utility model improves heat exchange efficiency, has strengthened the heat dissipation effect, has reduced the overall volume of system greatly, especially applicable to the electronic equipment of aerospace field etc.

Description

Technical Field

[0001] This utility model relates to the field of electronic heat dissipation equipment technology, and in particular to an integrated piezoelectric micropump heat dissipation system and its nano-liquid cooling system. Background Technology

[0002] As electronic devices rapidly evolve towards higher performance, miniaturization, and greater integration, the power consumption per unit volume continues to rise, whether in consumer electronics (CPUs and GPUs) or in aerospace satellites (precise electronic components), leading to increasingly stringent heat dissipation requirements. Traditional heat dissipation methods are no longer adequate for current technological demands: air cooling relies on a combination of fans and heat sinks, which not only occupies a large space and generates significant noise, but also has limited heat dissipation efficiency due to air thermal conductivity, failing to meet the heat dissipation needs of high-power devices; conventional liquid cooling systems often employ a separate design, with independent components such as drive pumps, radiators, and valves, requiring connections via piping. This not only increases system size and installation and maintenance difficulty but also poses risks of poor sealing performance and leakage, making them particularly unsuitable for confined spaces such as those found in satellites and microelectronic devices. Meanwhile, although existing microchannel liquid cooling technology has improved heat dissipation efficiency, it still has many shortcomings: some microchannel cooling systems have not achieved integrated integration of driving components and channels, requiring separate installation space for the driving pump, which restricts the level of system integration; some systems lack precise temperature feedback and flow control mechanisms, and cannot dynamically adjust the coolant flow rate according to the real-time temperature of electronic devices, resulting in excessive or insufficient heat dissipation, which wastes energy and may affect the stability of device operation; in addition, the traditional valve-pump separation design not only increases the system size, but also makes it difficult to guarantee airtightness and watertightness in the long term due to the splicing of multiple components, which is especially prone to failure risk in fields with extremely high reliability requirements such as aerospace. Utility Model Content

[0003] To address the problems existing in the prior art, this utility model aims to provide an integrated piezoelectric micropump cooling system and its nano-liquid cooling system that is highly integrated, compact, and has good heat dissipation efficiency, in order to solve the problem of heat dissipation difficulties in existing electronic devices.

[0004] To achieve the above objectives, this utility model proposes an integrated piezoelectric micropump heat dissipation and nano-liquid cooling system, including a circulation pipe with a heat transfer fluid inside, an external heat exchanger connected to the circulation pipe, and an integrated micro-cooler. Nanoparticles are added to the heat transfer fluid. The external heat exchanger is located at a relatively outer position in the circulation pipe, while the integrated micro-cooler is located at a relatively inner end of the circulation pipe. The integrated micro-cooler includes an integrated shell. The back of the integrated shell is used for heat dissipation by contacting the heat-generating element. Multiple rows of piezoelectric micropumps are embedded in the front of the integrated shell. An integrated microchannel is also provided inside the integrated shell. Each piezoelectric micropump in a single row is connected in series through the integrated microchannel. Adjacent rows of piezoelectric micropumps are also connected through the integrated microchannel, and the overall connection path is S-shaped. The integrated microchannel has an inlet at the beginning and an outlet at the end. The integrated micro-cooler is connected to the circulation pipe through the inlet and outlet.

[0005] In the above scheme: the piezoelectric micropump includes a pump body housing and a pump body cover plate. The pump body housing has an open chamber at the top. A piezoelectric sheet is fixed between the middle of the two side walls of the chamber to divide the chamber into an upper compression chamber and a lower compression chamber. Elastic vibrators are fixedly covered on both sides of the piezoelectric sheet. Gaskets are provided between the two elastic vibrators and the piezoelectric sheet. The pump body cover plate is placed on top of the pump body housing to seal the chamber. The pump body housing also has an inlet channel and an outlet channel communicating with the lower compression chamber. V-type check valves are provided on both the inlet channel and the outlet channel. The two V-type check valves are arranged in opposite directions. The piezoelectric sheet and the V-type check valves are both connected to a control circuit. When the piezoelectric element bends in the forward direction, it elongates, increasing the volume of the lower compression chamber. This reduces the fluid pressure within the chamber, opening the V-shaped check valve on the inlet channel and closing the V-shaped check valve on the outlet channel, allowing fluid to enter the chamber. Conversely, when the piezoelectric element bends in the reverse direction, it contracts, decreasing the volume of the lower compression chamber. This increases the fluid pressure within the chamber, closing the V-shaped check valve on the inlet channel and opening the V-shaped check valve on the outlet channel, squeezing out the liquid and creating a smooth, continuous, directional flow. The voltage frequency of the piezoelectric elements in each piezoelectric micropump must be consistent to ensure smooth fluid flow.

[0006] In the above scheme: the integrated housing is made of copper, aluminum, silver, copper alloy, aluminum alloy or silver alloy, and the integrated housing needs to be made of metal or metal alloy with good heat dissipation.

[0007] In the above scheme: the piezoelectric element is made of lead zirconate titanate piezoelectric ceramic with a thickness of 0.2-0.5 mm; the elastic vibrator is made of metal with a thickness of 0.1-0.2 mm. The piezoelectric element, as the core component of the pump body, is fixed at the top and bottom by washers; the elastic vibrator is used to amplify the amplitude, and is fixed at the top and bottom by washers and the pump body housing, respectively, preferably made of spring steel.

[0008] In the above scheme, the base fluid of the heat transfer fluid is a fluorinated liquid with a dielectric constant less than 3.0, a heat of vaporization higher than 150 kJ / kg, and a boiling point between 40℃ and 100℃. This base fluid is compatible with metals used in electronic devices, such as copper, brass, 304 stainless steel, and 316 stainless steel. Furthermore, the fluorinated liquid will not react with or degrade dopants in semiconductor materials (such as silicon, GaAs, GaN, and indium-based semiconductors) or semiconductor devices. In addition, the base liquid may also contain density reducers and flame retardants. The density reducers are selected from diethyl ether, petroleum ether, tetrahydrofuran, hexane, heptane, octane, cyclohexane diethylene glycol, 2-butanone, ethyl acetate, ethyl propionate, methyl propionate, hexane, heptane, octene, or dimethyl carbonate. The flame retardants are selected from heptafluoropropane, pentafluoroethane, bromochlorodifluoromethane, trifluorobromomethane, perfluoro(2-methyl-3-pentanone), perfluoro(2,4-dimethyl-3-pentanone), heptafluoro-1-methoxypropane, methyl nonafluoroisobutyl ether, ethyl nonafluoroisobutyl ether, 3-methoxyperfluoro(2-methylbutane), tributyl phosphate, triphenyl phosphate, trimethylbenzene phosphate, or tri(1-chloro-2-propyl) phosphate.

[0009] In the above scheme, the nanoparticles added to the heat transfer fluid are Al2O3, TiO2, SiO2, CuO, Cu, Au, Ag, boron nitride nanoparticles, aluminum nitride nanoparticles, carbon nanotubes, graphene, or graphene oxide. The mass fraction of the nanoparticles in the heat transfer fluid is 0.01-10%, and their particle size is 0.1-5 nm. Adding nanoscale metal or non-metal particles to a liquid to prepare a nanoparticle suspension can significantly improve the thermal conductivity of the fluid and enhance the convective heat transfer coefficient.

[0010] In the above scheme, two adjacent piezoelectric micropumps on a single row of piezoelectric micropumps are connected together by a U-shaped integrated microchannel, which is convenient to deploy and helps to increase the length of the integrated microchannel to improve heat dissipation efficiency.

[0011] The beneficial effects of this invention are as follows: 1. Nanoparticles are added to the heat transfer fluid to form a nanofluid. The presence of nanoparticles significantly improves the thermal conductivity of the fluid and enhances the convective heat transfer coefficient. This allows the nanofluid to carry and transfer more heat than ordinary fluids under the same flow conditions, thereby more efficiently removing the heat generated by the heating element and effectively meeting the increasing heat dissipation requirements of high-performance electronic devices with high heat flux density. 2. The integrated microchannels of the integrated microcooler adopt an S-shaped layout, and each piezoelectric micropump on a single row is connected in series through the integrated microchannels, and adjacent rows of piezoelectric micropumps are also connected through the integrated microchannels. This layout increases the flow path length and flow complexity of the fluid in the cooler, allowing for more sufficient contact and heat exchange time between the fluid and the cooler wall and the piezoelectric micropumps, further improving heat exchange efficiency and enhancing the heat dissipation effect. 3. Integrating the heat dissipation channel and the piezoelectric micropump in the integrated microcooler avoids the traditional method of setting up drive pumps, radiators, and other components independently and connecting them through pipes. This integrated design significantly reduces the overall system size, saving valuable space, making it particularly suitable for electronic devices in fields with extremely demanding space requirements, such as consumer electronics and aerospace. 4. Due to its high level of integration, the number of connecting pipes and interfaces between multiple independent components is reduced, lowering the complexity and difficulty of installation. Furthermore, during equipment maintenance, there is no need to inspect and repair multiple dispersed components individually; only the integrated miniature cooler and related circulation pipes need to be operated, improving maintenance efficiency and reducing maintenance costs. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the overall design of this utility model.

[0013] Figure 2 This is a schematic diagram of the integrated housing structure.

[0014] Figure 3 This is an exploded view of the internal structure of a piezoelectric micropump.

[0015] Figure 4 This is a cross-sectional view of the internal structure of a piezoelectric micropump. Detailed Implementation

[0016] like Figure 1 As shown in Figure 4, an integrated piezoelectric micropump heat dissipation and nano-liquid cooling system mainly consists of a circulation pipe 1 containing a heat transfer fluid, an external heat exchanger 2 connected to the circulation pipe 1, and an integrated micro-cooler 3. The external heat exchanger 2 is located at a relatively outer position of the circulation pipe 1, while the integrated micro-cooler 3 is located at a relatively inner end of the circulation pipe 1.

[0017] The base fluid for heat transfer can be a fluorinated liquid with a dielectric constant (Dk) less than 3.020-40 GHz, a heat of vaporization higher than 150 kJ / kg, and a boiling point between 40°C and 100°C. This base fluid is compatible with metals used in electronic devices, such as copper, brass, 304 stainless steel, and 316 stainless steel. Furthermore, the fluorinated liquid will not react with or degrade semiconductor materials (such as silicon, GaAs, GaN, and indium-based semiconductors) or dopants in semiconductor devices. In addition, the base liquid may also contain density reducers and flame retardants. The density reducers are selected from diethyl ether, petroleum ether, tetrahydrofuran, hexane, heptane, octane, cyclohexane diethylene glycol, 2-butanone, ethyl acetate, ethyl propionate, methyl propionate, hexane, heptane, octene, or dimethyl carbonate. The flame retardants are selected from heptafluoropropane, pentafluoroethane, bromochlorodifluoromethane, trifluorobromomethane, perfluoro(2-methyl-3-pentanone), perfluoro(2,4-dimethyl-3-pentanone), heptafluoro-1-methoxypropane, methyl nonafluoroisobutyl ether, ethyl nonafluoroisobutyl ether, 3-methoxyperfluoro(2-methylbutane), tributyl phosphate, triphenyl phosphate, trimethylbenzene phosphate, or tri(1-chloro-2-propyl) phosphate.

[0018] Nanoparticles are added to the heat transfer fluid. These nanoparticles can be Al₂O₃, TiO₂, SiO₂, CuO, Cu, Au, Ag, boron nitride nanoparticles, aluminum nitride nanoparticles, carbon nanotubes, graphene, or graphene oxide. The mass fraction of the nanoparticles in the heat transfer fluid is 0.01-10%, and their particle size is 0.1-5 nm. Adding nanoscale metal or non-metal particles to a liquid to prepare a nanoparticle suspension can significantly improve the fluid's thermal conductivity and enhance convective heat transfer.

[0019] The integrated micro cooler 3 includes an integrated housing 31. The back of the integrated housing 31 is used to contact the heat-generating element for heat dissipation. The front of the integrated housing 31 is embedded with multiple rows of piezoelectric micropumps 32. The interior of the integrated housing 31 is also provided with an integrated microchannel. Each piezoelectric micropump 32 on a single row of piezoelectric micropumps 32 is connected in series through the integrated microchannel. Adjacent rows of piezoelectric micropumps 32 are also connected through the integrated microchannel, and the connection path is arranged in an S-shape. The starting end of the integrated microchannel is provided with a liquid inlet 33 and the end is provided with a liquid outlet 34. The integrated micro cooler 3 is connected to the circulation pipe 1 through the liquid inlet 33 and the liquid outlet 34.

[0020] The piezoelectric micropump 32 includes a pump body housing 321 and a pump body cover plate 322. The pump body housing 321 has an open chamber at the top. A piezoelectric sheet 323 is fixed between the middle of the two side walls of the chamber to divide the chamber into an upper compression chamber 324 and a lower compression chamber 325. Elastic vibrating plates 326 are fixedly covered on both sides of the piezoelectric sheet 323. Gaskets 327 are provided between the two elastic vibrating plates 326 and the piezoelectric sheet 323. The pump body cover plate 322 is placed on top of the pump body housing 321 to seal the chamber. The pump body housing 321 also has an inlet channel and an outlet channel that communicate with the lower compression chamber 325. A V-type check valve 328 is provided on both the inlet channel and the outlet channel. The two V-type check valves 328 are arranged in opposite directions. The piezoelectric sheet 323 and the V-type check valve 328 are both connected to a control circuit.

[0021] When the piezoelectric element 323 bends in the forward direction, it elongates, increasing the volume of the lower compression chamber 325. This reduces the fluid pressure within the chamber, opening the V-type check valve 328 on the inlet channel and closing the V-type check valve 328 on the outlet channel, allowing fluid to enter the chamber. When the piezoelectric element 323 bends in the reverse direction, it contracts, decreasing the volume of the lower compression chamber 325. This increases the fluid pressure within the chamber, closing the V-type check valve 328 on the inlet channel and opening the V-type check valve 328 on the outlet channel, squeezing out the liquid and creating a smooth, continuous, directional flow. The voltage frequency of the piezoelectric element 323 in each piezoelectric micropump 32 must be consistent to ensure smooth liquid flow.

[0022] The integrated housing 31 is made of metal or metal alloy with good heat dissipation properties, specifically copper, aluminum, silver, copper alloy, aluminum alloy or silver alloy.

[0023] The piezoelectric element 323 can be made of lead zirconate titanate piezoelectric ceramic with a thickness of 0.2-0.5 mm; the elastic vibrator 326 can be made of metal with a thickness of 0.1-0.2 mm. The piezoelectric element 323, as the core component of the pump body, is fixed at both ends by washers 327; the elastic vibrator 326 is used to amplify the amplitude, and is fixed at both ends by washers 327 and the pump body housing 321, with spring steel being the preferred material.

[0024] Specifically, two adjacent piezoelectric micropumps 32 on a single row of piezoelectric micropumps 32 are connected together by a U-shaped integrated microchannel, which is convenient to deploy and helps to increase the length of the integrated microchannel to improve heat dissipation efficiency.

Claims

1. An integrated piezoelectric micropump heat dissipation system and its nano-liquid cooling system, characterized in that: The device includes a circulating pipe (1) containing a heat transfer fluid, an external heat exchanger (2) connected to the circulating pipe (1), and an integrated micro-cooler (3). The heat transfer fluid contains nanoparticles. The external heat exchanger (2) is located on the outer side of the circulating pipe (1), while the integrated micro-cooler (3) is located on the inner side of the circulating pipe (1). The integrated micro-cooler (3) includes an integrated housing (31), the back of which is used to contact and dissipate heat with a heating element. The front is embedded with multiple rows of piezoelectric micropumps (32), and the interior of the integrated housing (31) is also provided with an integrated microchannel. Each piezoelectric micropump (32) on the single row of piezoelectric micropumps (32) is connected in series through the integrated microchannel. Adjacent rows of piezoelectric micropumps (32) are also connected through the integrated microchannel, and the connection path is arranged in an S-shape. The starting end of the integrated microchannel is provided with an inlet (33) and the end is provided with an outlet (34). The integrated micro cooler (3) is connected to the circulation pipe (1) through the inlet (33) and the outlet (34).

2. The integrated piezoelectric micropump heat dissipation and nano-liquid cooling system according to claim 1, characterized in that: The piezoelectric micropump (32) includes a pump body housing (321) and a pump body cover plate (322). The pump body housing (321) has an open chamber at the top. A piezoelectric plate (323) is fixed between the middle of the two side walls of the chamber to divide the chamber into an upper compression chamber (324) and a lower compression chamber (325). Elastic vibrators (326) are fixedly covered on both sides of the piezoelectric plate (323). Between the two elastic vibrators (326) and the piezoelectric plate (323) All are equipped with gaskets (327). The pump body cover plate (322) is placed on top of the pump body housing (321) to seal the chamber. The pump body housing (321) is also provided with an inlet channel and an outlet channel that communicate with the lower compression chamber (325). Both the inlet channel and the outlet channel are equipped with V-type check valves (328). The two V-type check valves (328) are arranged in opposite directions. The piezoelectric sheet (323) and the V-type check valves (328) are both connected to a control circuit.

3. The integrated piezoelectric micropump heat dissipation and nano-liquid cooling system according to claim 1, characterized in that: The integrated housing (31) is made of copper, aluminum, silver, copper alloy, aluminum alloy or silver alloy.

4. The integrated piezoelectric micropump heat dissipation and nano-liquid cooling system according to claim 2, characterized in that: The piezoelectric element (323) is made of lead zirconate titanate piezoelectric ceramic with a thickness of 0.2-0.5 mm; the elastic vibrator (326) is made of metal with a thickness of 0.1-0.2 mm.

5. The integrated piezoelectric micropump heat dissipation and nano-liquid cooling system according to claim 1, characterized in that: The base fluid of the heat transfer fluid is a fluorinated fluid.

6. The integrated piezoelectric micropump heat dissipation and nano-liquid cooling system according to claim 1, characterized in that: Two adjacent piezoelectric micropumps (32) on a single row of piezoelectric micropumps (32) are connected together by a U-shaped integrated microchannel.

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