TO263 lead frame

Abstract

The utility model relates to T0263 lead frame technical field discloses a TO263 lead frame, including the product group of N along the length direction of lead frame sequential connection, product group includes a horizontal main ligament, two longitudinal main ligaments and two product units, two longitudinal main ligaments are connected with horizontal main ligament both ends, and two product units are set between two longitudinal main ligaments along the length direction of lead frame, product unit includes base island, gate pole bonding platform and source electrode bonding platform, when using, the utility model only sets up gate pole bonding platform and source electrode bonding platform in base island one side, and the area of gate pole bonding platform and source electrode bonding platform has been increased, can reduce the risk of gate pole false welding, and simultaneously, source electrode bonding platform can bond more quantity's bonding wire, and current carrying capacity promotes, in addition, the bottom surface of base island is the drain electrode of product unit, and the creepage distance between source electrode bonding platform and drain electrode is promoted, can satisfy the special application demand of customer.

Description

Technical Field

[0001] This utility model relates to the technical field of TO263 lead frame, specifically to a TO263 lead frame. Background Technology

[0002] Leadframes are now widely used in the packaging of semiconductor power devices, serving primary functions such as mechanical support, electrical connection, and heat dissipation. The traditional TO263 leadframe structure is as follows: Figure 1 As shown, the lead frame includes a base island 101, and below the base island 101, from left to right, there are a gate bonding region 102, a drain 103, and a source bonding region 104.

[0003] In practical use, the gate bonding region 102, drain 103 and source bonding region 104 are all located below the base island, resulting in a small area of ​​the source bonding region 104, which in turn leads to limited current carrying capacity and insufficient creepage distance. Utility Model Content

[0004] In view of the shortcomings of the prior art, the present invention provides a TO263 lead frame. The technical problem to be solved is that the current carrying capacity of the MOS transistor mounted on the existing TO263 lead frame is insufficient and the creepage distance is insufficient.

[0005] To solve the above technical problems, in the first aspect, this utility model provides the following technical solution: a TO263 lead frame, comprising N product groups connected sequentially along the length direction of the lead frame, where N is a positive integer;

[0006] The product group includes a transverse main connecting rib, two longitudinal main connecting ribs and two product units. The two longitudinal main connecting ribs are connected to both ends of the transverse main connecting rib, and the two product units are arranged between the two longitudinal main connecting ribs along the length of the lead frame.

[0007] The product unit includes a base island, a gate bonding platform, and a source bonding platform. The gate bonding platform and the source bonding platform are spaced apart along the length of the lead frame on the side of the base island near the transverse main connecting rib, and are respectively connected to the transverse main connecting rib through gate pins and source pins.

[0008] The transverse main connecting rib is provided with a longitudinal sub-connecting rib between the two product units in each product group; in each product group, along the length direction of the lead frame, the two longitudinal main connecting ribs, the gate pin of the product unit, the source pin of the product unit and the longitudinal sub-connecting rib are connected by a transverse sub-connecting rib.

[0009] The base islands of the two product units in each product group are connected on the near side, and the base islands of the two product units in each product group are connected to the far side with two longitudinal main connecting bars.

[0010] The transverse main connecting ribs are provided with positioning holes at the corresponding positions of each product unit, and each longitudinal sub-connecting rib is provided with adhesive channel holes.

[0011] Secondly, this utility model provides a TO263 lead frame with another structure, including N product groups connected sequentially along the length direction of the lead frame, where N is a positive integer;

[0012] The product group includes two transverse main connecting ribs, two longitudinal main connecting ribs and two product units. The two transverse main connecting ribs and the two longitudinal main connecting ribs are connected to form a rectangular frame structure. The two product units are arranged between the two longitudinal main connecting ribs along the length of the lead frame.

[0013] The product unit includes a base island, a gate bonding platform, and a source bonding platform. The base island of each product unit is connected to an adjacent transverse main connecting rib. The gate bonding platform and the source bonding platform are spaced apart along the length of the lead frame on one side of the transverse main connecting rib opposite to the base island, and are respectively connected to another transverse main connecting rib through a gate pin and a source pin.

[0014] A longitudinal sub-connector is provided on the transverse main connecting rib connected to the gate pin between the two product units in each product group; in each product group, along the length direction of the lead frame, the two longitudinal main connecting ribs, the gate pin of the product unit, the source pin of the product unit and the longitudinal sub-connector are connected by a transverse sub-connector.

[0015] Positioning holes are provided on the transverse main connecting ribs connected to the base island at the corresponding position of each product unit, and adhesive channel holes are provided on each longitudinal sub-connecting rib.

[0016] Thirdly, this utility model provides another TO263 lead frame, including N product groups connected sequentially along the length direction of the lead frame, where N is a positive integer;

[0017] The product group includes two transverse main connecting ribs, two longitudinal main connecting ribs, and four product units. The two transverse main connecting ribs and the two longitudinal main connecting ribs are connected to form a rectangular frame structure, and the four product units are arranged in two rows and two columns within the frame structure.

[0018] Two rows of product units are arranged vertically and vertically. Each product unit includes a base island, a gate bonding platform, and a source bonding platform. The base island of the upper row of product units is connected to the base island of the corresponding lower row of product units, and the base islands of the two rows of product units are connected on the near side, while the base islands of the two rows of product units are connected to two longitudinal main connecting ribs on the far side.

[0019] For each product unit, the gate bonding platform and the source bonding platform of the product unit are spaced apart along the length of the lead frame on one side of the base island near the transverse main connecting rib, and are connected to the nearby transverse main connecting rib through the gate pin and the source pin, respectively.

[0020] On the two transverse main connecting ribs, there are longitudinal sub-connecting ribs between the two product units in each row; for the two product units in each row, the two longitudinal main connecting ribs, the gate pin of the product unit, the source pin of the product unit and the longitudinal sub-connecting rib are connected by a transverse sub-connecting rib.

[0021] The transverse main connecting ribs that connect to the gate pins of the upper row of product units are provided with positioning holes at the corresponding positions of each product unit, and each longitudinal sub-connecting rib is provided with a glue channel hole.

[0022] Fourthly, this utility model provides another TO263 lead frame, comprising N product groups connected sequentially along the length direction of the lead frame, where N is a positive integer;

[0023] The product group includes a transverse main connecting bar, two longitudinal main connecting bars and four product units. The two ends of the transverse main connecting bar are respectively connected to the two longitudinal main connecting bars, and the four product units are arranged in two rows and two columns between the two longitudinal main connecting bars.

[0024] Two rows of product units are arranged vertically and vertically. Each product unit includes a base island, a gate bonding platform, and a source bonding platform. The base island of the upper row of product units is connected to the transverse main connecting rib, the adjacent sides of the two base islands of the lower row of product units are connected, and the opposite sides of the two base islands of the lower row of product units are connected to the two longitudinal main connecting ribs.

[0025] The gate bonding platforms and source bonding platforms of the two rows of product units are spaced apart along the length of the lead frame on opposite sides of the base islands of the two rows of product units, and are respectively connected to the gate pins and source pins; the gate pins and source pins of the upper row of product units are connected to the corresponding gate pins and corresponding source pins of the lower row of product units.

[0026] In each product group, there is a longitudinal sub-connecting rib between two columns of product units; for the two product units in the upper row, the two longitudinal main connecting ribs, the gate pin of the product unit, the source pin of the product unit and the longitudinal sub-connecting rib are connected by a transverse sub-connecting rib; for the two product units in the lower row, the two longitudinal main connecting ribs, the gate pin of the product unit, the source pin of the product unit and the longitudinal sub-connecting rib are connected by another transverse sub-connecting rib.

[0027] The transverse main connecting ribs are provided with positioning holes at the corresponding positions of each product unit, and each longitudinal sub-connecting rib is provided with adhesive channel holes.

[0028] Fifthly, this utility model provides another TO263 lead frame, comprising N product groups connected sequentially along the length direction of the lead frame, where N is a positive integer;

[0029] The product group includes two transverse main connecting ribs, two longitudinal main connecting ribs, and eight product units. The two transverse main connecting ribs and two longitudinal main connecting ribs are connected to form a rectangular frame structure, and the eight product units are arranged in four rows and two columns within the frame structure.

[0030] The four product units are arranged vertically and vertically. Each product unit includes a base island, a gate bonding platform, and a source bonding platform. The base islands of the two upper and two lower product units are interconnected. The two base islands of each row of two product units are connected to two longitudinal main connecting ribs on their opposite sides.

[0031] The gate bonding platform and source bonding platform of the upper row of product units are spaced apart along the length of the lead frame on the side of the base island near the transverse main connecting rib, and are connected to the nearby transverse main connecting rib through the gate pin and the source pin, respectively.

[0032] The gate bonding platform and source bonding platform of the middle two rows of product units are spaced apart along the length of the lead frame on the adjacent side of the base island of the middle two rows of product units, and are respectively connected to the gate pin and the source pin. The gate pin and the source pin of the middle two rows of product units are connected vertically.

[0033] The gate bonding platform and source bonding platform of the lower row product unit are spaced apart along the length of the lead frame on one side of the base island near the transverse main connecting rib, and are connected to the nearby transverse main connecting rib through the gate pin and the source pin, respectively.

[0034] For each product group, a first longitudinal sub-connecting rib is provided between two product units in the upper row on the transverse main connecting rib connected to the gate pin of the upper row product unit, a second longitudinal sub-connecting rib is provided between two product units in the middle row, and a third longitudinal sub-connecting rib is provided between two product units in the lower row on the transverse main connecting rib connected to the gate pin of the lower row product unit.

[0035] For each product group, two longitudinal main connecting ribs, the gate pins and source pins of the upper row product units, and the first longitudinal sub-connecting rib are connected by transverse sub-connecting ribs; two longitudinal main connecting ribs, the gate pins and source pins of an intermediate row product unit adjacent to the upper row product units, and the second longitudinal sub-connecting rib are connected by transverse sub-connecting ribs; two longitudinal main connecting ribs, the gate pins and source pins of another intermediate row product unit, and the second longitudinal sub-connecting rib are connected by transverse sub-connecting ribs; two longitudinal main connecting ribs, the gate pins and source pins of the lower row product units, and the third longitudinal sub-connecting rib are connected by transverse sub-connecting ribs.

[0036] The transverse main connecting ribs connected to the gate pins of the upper row of product units are respectively provided with positioning holes at the corresponding positions of each product unit, and at least one of the first longitudinal sub-connecting ribs, the second longitudinal sub-connecting ribs, and the third longitudinal sub-connecting ribs is provided with glue channel holes.

[0037] Sixthly, this utility model provides another TO263 lead frame, comprising N product groups connected sequentially along the length direction of the lead frame, where N is a positive integer;

[0038] The product group includes a transverse main connecting bar, two longitudinal main connecting bars and eight product units. The two ends of the transverse main connecting bar are respectively connected to the two longitudinal main connecting bars, and the eight product units are arranged in four rows and two columns between the two longitudinal main connecting bars.

[0039] The four product units are arranged vertically and vertically, and each product unit includes a base island, a gate bonding platform, and a source bonding platform.

[0040] The base island of the upper row of product units is connected to the adjacent transverse main connecting rib; the base islands of the middle two rows of product units are connected to each other; the adjacent sides of the two base islands of the lower row of product units are connected; the opposite sides of the two base islands of the two product units in each row are connected to the longitudinal main connecting rib.

[0041] The gate bonding platform and source bonding platform of the upper row of product units and the adjacent row of product units are arranged facing each other and are respectively connected to gate pins and source pins. The gate pins and source pins of the upper row of product units are connected to the corresponding gate pins and source pins of the adjacent row of product units.

[0042] The gate bonding platform and source bonding platform of the lower row of product units and the adjacent row of product units are arranged facing each other and are respectively connected to gate pins and source pins. The gate pins and source pins of the lower row of product units are connected to the corresponding gate pins and source pins of the adjacent row of product units.

[0043] For each product group, a first longitudinal sub-connecting rib is provided between the upper two rows of product units, and a second longitudinal sub-connecting rib is provided between the lower two rows of product units.

[0044] For the upper row of product units, the two longitudinal main connecting ribs, the gate pin and source pin of the upper row of product units, and the first longitudinal sub-connecting rib are connected by the transverse sub-connecting ribs.

[0045] For the middle row product unit adjacent to the upper row product unit, the two longitudinal main connecting ribs, the gate pin and source pin of the middle row product unit adjacent to the upper row product unit, and the first longitudinal sub-connecting rib are connected by the transverse sub-connecting ribs.

[0046] For the lower row of product units, the two longitudinal main connecting ribs, the gate pin and source pin of the lower row of product units, and the second longitudinal sub-connecting rib are connected by the transverse sub-connecting ribs.

[0047] For the middle row product unit adjacent to the lower row product unit, the two longitudinal main connecting ribs, the gate pin and source pin of the middle row product unit adjacent to the lower row product unit, and the second longitudinal sub-connecting rib are connected by the transverse sub-connecting ribs.

[0048] The transverse main connecting ribs are provided with positioning holes at the corresponding positions of each product unit, and the first longitudinal sub-connecting ribs and / or the second longitudinal sub-connecting ribs are provided with adhesive channel holes.

[0049] In further embodiments of the first to sixth aspects, the value of N is between 8 and 12, and the length of the lead frame is between 200 mm and 300 mm.

[0050] In a further embodiment of the first to sixth aspects, the area of ​​the base island is 35 mm. 2 ~50mm 2 Between; the area of ​​the gate bonding platform is 3.5 mm. 2 ~5.5mm 2 Between; the area of ​​the source bonding platform is 7mm. 2 ~9mm 2 between.

[0051] In a further embodiment of the first to sixth aspects, the positioning hole is circular in shape.

[0052] In further embodiments of the first to sixth aspects, the shape of the adhesive channel hole is circular, rectangular, or elliptical.

[0053] The advantages of this invention compared to the prior art are as follows: By placing the gate bonding platform and the source bonding platform only on one side of the base island, the area of ​​the gate bonding platform and the source bonding platform is increased, which reduces the risk of gate cold solder joints. At the same time, the source bonding platform can bond more bonding wires, thus improving the current carrying capacity. In addition, the bottom surface of the base island is the drain of the product unit, which increases the creepage distance between the source bonding platform and the drain, meeting the special application needs of customers. Attached Figure Description

[0054] Figure 1 This is a schematic diagram of the existing TO263 lead frame;

[0055] Figure 2 This is a schematic diagram of the TO263 lead frame in Example 1;

[0056] Figure 3 This is a schematic diagram of another structure of the TO263 lead frame in Embodiment 1;

[0057] Figure 4 This is a schematic diagram of the TO263 lead frame in Example 2;

[0058] Figure 5 This is a schematic diagram of another structure of the TO263 lead frame in Embodiment 2;

[0059] Figure 6 This is a schematic diagram of the TO263 lead frame in Example 3;

[0060] Figure 7 This is a schematic diagram of another structure of the TO263 lead frame in Embodiment 3;

[0061] Figure 8 This is a schematic diagram of the TO263 lead frame in Example 4;

[0062] Figure 9 This is a schematic diagram of another structure of the TO263 lead frame in Example 4;

[0063] Figure 10 This is a schematic diagram of the TO263 lead frame in Example 5;

[0064] Figure 11 This is a schematic diagram of another structure of the TO263 lead frame in Example 5;

[0065] Figure 12 This is a schematic diagram of the TO263 lead frame in Example 6;

[0066] Figure 13 This is a schematic diagram of another structure of the TO263 lead frame in Example 6. Detailed Implementation

[0067] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, illustrating only the basic structure of the present invention, and therefore only show the components relevant to the present invention.

[0068] Example 1

[0069] like Figure 2 As shown, a TO263 leadframe includes a product group.

[0070] The product group includes a transverse main connecting rib 10, two longitudinal main connecting ribs 11 and two product units. The two longitudinal main connecting ribs 11 are connected to both ends of the transverse main connecting rib 10, and the two product units are arranged between the two longitudinal main connecting ribs 11 along the length of the lead frame.

[0071] The product unit includes a base island 20, a gate bonding platform 21 and a source bonding platform 22. The gate bonding platform 21 and the source bonding platform 22 are spaced apart along the length of the lead frame on the side of the base island 20 near the transverse main connecting rib 10, and are connected to the transverse main connecting rib 10 through the gate pin 23 and the source pin 24, respectively.

[0072] A longitudinal sub-connecting rib 12 is provided on the transverse main connecting rib 10 between the two product units in each product group; in each product group, along the length direction of the lead frame, the two longitudinal main connecting ribs 11, the gate pin 23 of the product unit, the source pin 24 of the product unit and the longitudinal sub-connecting rib 12 are connected by a transverse sub-connecting rib 13.

[0073] The base islands 20 of the two product units in each product group are connected on the near side, and the base islands 20 of the two product units in each product group are connected to the two longitudinal main connecting bars 11 on the far side.

[0074] Positioning holes 100 are provided on the transverse main connecting ribs 10 at the corresponding position of each product unit, and adhesive channel holes 120 are provided on each longitudinal sub-connecting rib 12.

[0075] In practical use, this invention increases the area of ​​the gate bonding platform 21 and the source bonding platform 22 by placing them only on one side of the base island 20. This reduces the risk of gate solder joint failure and allows the source bonding platform 22 to bond a larger number of bonding wires, thus improving current carrying capacity. In addition, the bottom surface of the base island 21 is the drain of the product unit, which increases the creepage distance between the source bonding platform and the drain, meeting the special application requirements of customers.

[0076] Compared with the existing lead frame structure, the area of ​​the gate bonding platform 21 in this embodiment is increased by 15%, the area of ​​the source bonding platform 22 is increased by 20%, the current carrying capacity is improved by 25% to 33%, and the creepage distance between the source pin 24 and the drain connected to the source bonding platform 22 is increased from 1.18mm to 3.89mm, an increase of 230%.

[0077] Specifically, in this embodiment, the area of ​​the base island 20 is 35mm². 2 ~50mm 2 Between; the area of ​​the gate bonding platform 21 is 3.5 mm. 2 ~5.5mm 2 Between; the area of ​​the source bonding platform 22 is 7mm². 2 ~9mm 2 between.

[0078] Specifically, in this embodiment, the positioning hole 100 is circular in shape.

[0079] Specifically, in this embodiment, the shape of the adhesive channel 120 is circular, rectangular, or elliptical.

[0080] In practical applications, the number of lead frame product groups can be between 8 and 12, and the length of the lead frame can be between 200mm and 300mm. For example, ... Figure 3 As shown, the lead frame includes nine product groups, with longitudinal main connecting ribs 11 connecting adjacent product groups.

[0081] Example 2

[0082] like Figure 4 As shown, the TO263 lead frame provided in this embodiment includes a product group, which includes two transverse main connecting ribs 10, two longitudinal main connecting ribs 11 and two product units. The two transverse main connecting ribs 10 and the two longitudinal main connecting ribs 11 are connected to form a rectangular frame structure, and the two product units are arranged between the two longitudinal main connecting ribs 11 along the length direction of the lead frame.

[0083] The product unit includes a base island 20, a gate bonding platform 21, and a source bonding platform 22. The base island 20 of each product unit is connected to the adjacent transverse main connecting rib 10. The gate bonding platform 21 and the source bonding platform 22 are spaced apart along the length of the lead frame on the side of the base island 20 away from the connected transverse main connecting rib 10, and are respectively connected to another transverse main connecting rib 10 through the gate pin 23 and the source pin 24.

[0084] A longitudinal sub-connecting rib 12 is provided on the transverse main connecting rib 10 connected to the gate pin 23 between the two product units in each product group; in each product group, along the length direction of the lead frame, the two longitudinal main connecting ribs 11, the gate pin 23 of the product unit, the source pin 24 of the product unit and the longitudinal sub-connecting rib 12 are connected by a transverse sub-connecting rib 13.

[0085] The transverse main connecting rib 10 connected to the base island 20 is provided with positioning holes 100 at the corresponding position of each product unit, and each longitudinal sub-connecting rib 12 is provided with adhesive channel holes 120.

[0086] In practical use, this invention increases the area of ​​the gate bonding platform 21 and the source bonding platform 22 by placing them only on one side of the base island 20. This reduces the risk of gate solder joint failure and allows the source bonding platform 22 to bond a larger number of bonding wires, thus improving current carrying capacity. In addition, the bottom surface of the base island 21 is the drain of the product unit, which increases the creepage distance between the source bonding platform and the drain, meeting the special application requirements of customers.

[0087] Compared with the existing lead frame structure, the area of ​​the gate bonding platform 21 in this embodiment is increased by 15%, the area of ​​the source bonding platform 22 is increased by 20%, the current carrying capacity is improved by 25% to 33%, and the creepage distance between the source pin 24 and the drain connected to the source bonding platform 22 is increased from 1.18mm to 3.89mm, an increase of 230%.

[0088] Specifically, in this embodiment, the area of ​​the base island 20 is 35mm². 2 ~50mm 2 Between; the area of ​​the gate bonding platform 21 is 3.5 mm. 2 ~5.5mm 2 Between; the area of ​​the source bonding platform 22 is 7mm². 2 ~9mm 2 between.

[0089] Specifically, in this embodiment, the positioning hole 100 is circular in shape.

[0090] Specifically, in this embodiment, the shape of the adhesive channel 120 is circular, rectangular, or elliptical.

[0091] In practical applications, the number of lead frame product groups can be between 8 and 12, and the length of the lead frame can be between 200mm and 300mm. For example, ... Figure 5 As shown, the lead frame includes nine product groups, with longitudinal main connecting ribs 11 connecting adjacent product groups.

[0092] Example 3

[0093] like Figure 6 The TO263 lead frame provided in this embodiment includes a product group, which includes two transverse main connecting ribs 10, two longitudinal main connecting ribs 11 and four product units. The two transverse main connecting ribs 10 and the two longitudinal main connecting ribs 11 are connected to form a rectangular frame structure, and the four product units are arranged in two rows and two columns within the frame structure.

[0094] Two rows of product units are arranged vertically and vertically. Each product unit includes a base island 20, a gate bonding platform 21, and a source bonding platform 22. The base island 20 of the upper row of product units is connected to the base island 20 of the corresponding lower row of product units, and the close sides of the base island 20 of the two rows of product units are connected, while the away sides of the base island 20 of the two rows of product units are connected to two longitudinal main connecting ribs 11.

[0095] For each product unit, the gate bonding platform 21 and the source bonding platform 22 of the product unit are spaced apart along the length of the lead frame on one side of the base island 20 near the transverse main connecting rib 10, and are respectively connected to the nearby transverse main connecting rib 10 through the gate pin 23 and the source pin 24.

[0096] On the two transverse main connecting ribs 10, there are longitudinal sub-connecting ribs 12 between the two product units in each row; for the two product units in each row, the two longitudinal main connecting ribs 10, the gate pin 23 of the product unit, the source pin 24 of the product unit and the longitudinal sub-connecting rib 12 are connected by a transverse sub-connecting rib 13.

[0097] The transverse main connecting rib 10, which is connected to the gate pin of the upper row of product units, has a positioning hole 100 at the corresponding position of each product unit, and each longitudinal sub-connecting rib 12 has a glue channel hole 120.

[0098] In practical use, this invention increases the area of ​​the gate bonding platform 21 and the source bonding platform 22 by placing them only on one side of the base island 20. This reduces the risk of gate solder joint failure and allows the source bonding platform 22 to bond a larger number of bonding wires, thus improving current carrying capacity. In addition, the bottom surface of the base island 21 is the drain of the product unit, which increases the creepage distance between the source bonding platform and the drain, meeting the special application requirements of customers.

[0099] Compared with the existing lead frame structure, the area of ​​the gate bonding platform 21 in this embodiment is increased by 15%, the area of ​​the source bonding platform 22 is increased by 20%, the current carrying capacity is improved by 25% to 33%, and the creepage distance between the source pin 24 and the drain connected to the source bonding platform 22 is increased from 1.18mm to 3.89mm, an increase of 230%.

[0100] Specifically, in this embodiment, the area of ​​the base island 20 is 35mm². 2 ~50mm 2 Between; the area of ​​the gate bonding platform 21 is 3.5 mm. 2 ~5.5mm 2 Between; the area of ​​the source bonding platform 22 is 7mm². 2 ~9mm 2 between.

[0101] Specifically, in this embodiment, the positioning hole 100 is circular in shape.

[0102] Specifically, in this embodiment, the shape of the adhesive channel 120 is circular, rectangular, or elliptical.

[0103] In practical applications, the number of lead frame product groups can be between 8 and 12, and the length of the lead frame can be between 200mm and 300mm. For example, ... Figure 7 As shown, the lead frame includes nine product groups, with longitudinal main connecting ribs 11 connecting adjacent product groups.

[0104] Example 4

[0105] like Figure 8 As shown, the TO263 lead frame provided in this embodiment includes a product group, which includes a transverse main connecting rib 10, two longitudinal main connecting ribs 11 and four product units. The two ends of the transverse main connecting rib 10 are respectively connected to the two longitudinal main connecting ribs 11, and the four product units are arranged in two rows and two columns between the two longitudinal main connecting ribs 11.

[0106] Two rows of product units are arranged vertically and vertically. Each product unit includes a base island 20, a gate bonding platform 21, and a source bonding platform 22. The base island 20 of the upper row of product units is connected to the transverse main connecting rib 10. The adjacent sides of the two base islands 20 of the lower row of product units are connected. The opposite sides of the two base islands 20 of the lower row of product units are connected to the two longitudinal main connecting ribs 11.

[0107] For the two rows of product units, the gate bonding platform 23 and the source bonding platform 24 of the two rows of product units are spaced apart along the length of the lead frame on opposite sides of the base island 20 of the two rows of product units, and are respectively connected to the gate pin 23 and the source pin 24; the gate pin 23 and the source pin 24 of the upper row of product units are connected to the corresponding gate pin 23 and the corresponding source pin 24 of the lower row of product units.

[0108] In each product group, a longitudinal sub-connector 12 is provided between two columns of product units; for the two product units in the upper row, two longitudinal main connectors 11, the gate pin 23 of the product unit, the source pin 24 of the product unit and the longitudinal sub-connector 12 are connected by a transverse sub-connector 13; for the two product units in the lower row, two longitudinal main connectors 11, the gate pin 23 of the product unit, the source pin 24 of the product unit and the longitudinal sub-connector 12 are connected by another transverse sub-connector 13.

[0109] Positioning holes 100 are provided on the transverse main connecting ribs 10 at the corresponding positions of each product unit, and adhesive channel holes 120 are provided on each longitudinal sub-connecting rib.

[0110] In practical use, this invention increases the area of ​​the gate bonding platform 21 and the source bonding platform 22 by placing them only on one side of the base island 20. This reduces the risk of gate solder joint failure and allows the source bonding platform 22 to bond a larger number of bonding wires, thus improving current carrying capacity. In addition, the bottom surface of the base island 21 is the drain of the product unit, which increases the creepage distance between the source bonding platform and the drain, meeting the special application requirements of customers.

[0111] Compared with the existing lead frame structure, the area of ​​the gate bonding platform 21 in this embodiment is increased by 15%, the area of ​​the source bonding platform 22 is increased by 20%, the current carrying capacity is improved by 25% to 33%, and the creepage distance between the source pin 24 and the drain connected to the source bonding platform 22 is increased from 1.18mm to 3.89mm, an increase of 230%.

[0112] Specifically, in this embodiment, the area of ​​the base island 20 is 35mm². 2 ~50mm 2 Between; the area of ​​the gate bonding platform 21 is 3.5 mm. 2 ~5.5mm 2 Between; the area of ​​the source bonding platform 22 is 7mm². 2 ~9mm 2 between.

[0113] Specifically, in this embodiment, the positioning hole 100 is circular in shape.

[0114] Specifically, in this embodiment, the shape of the adhesive channel 120 is circular, rectangular, or elliptical.

[0115] In practical applications, the number of lead frame product groups can be between 8 and 12, and the length of the lead frame can be between 200mm and 300mm. For example, ... Figure 9 As shown, the lead frame includes nine product groups, with longitudinal main connecting ribs 11 connecting adjacent product groups.

[0116] Example 5

[0117] like Figure 10 As shown, the TO263 lead frame provided in this embodiment includes a product group, which includes two transverse main connecting ribs 10, two longitudinal main connecting ribs 11 and eight product units. The two transverse main connecting ribs 10 and the two longitudinal main connecting ribs 11 are connected to form a rectangular frame structure, and the eight product units are arranged in four rows and two columns within the frame structure.

[0118] The four rows of product units are arranged vertically and vertically. Each product unit includes a base island 20, a gate bonding platform 21, and a source bonding platform 22. For the upper two rows of product units and the lower two rows of product units, the base islands 20 of the two rows of product units are connected to each other. The opposite sides of the two base islands 20 of the two product units in each row are respectively connected to two longitudinal main connecting ribs 11.

[0119] The gate bonding platform 21 and source bonding platform 22 of the upper row product unit are spaced apart along the length of the lead frame on one side of the base island 20 near the transverse main connecting rib 10, and are respectively connected to the nearby transverse main connecting rib 10 through gate pin 23 and source pin 24.

[0120] The gate bonding platform 21 and source bonding platform 22 of the middle two rows of product units are spaced apart along the length of the lead frame on the adjacent side of the base island 20 of the middle two rows of product units, and are respectively connected to the gate pin 23 and the source pin 24. The gate pin 23 and the source pin 24 of the middle two rows of product units are connected vertically.

[0121] The gate bonding platform 21 and source bonding platform 22 of the lower row product unit are spaced apart along the length of the lead frame on one side of the base island 20 near the transverse main connecting rib 10, and are respectively connected to the nearby transverse main connecting rib 10 through gate pin 23 and source pin 24.

[0122] For each product group, a first longitudinal sub-connecting rib 12 is provided between two product units in the upper row on the transverse main connecting rib 10 connected to the gate pin 23 of the upper row product unit, a second longitudinal sub-connecting rib 14 is provided between two product units in the middle row, and a third longitudinal sub-connecting rib 15 is provided between two product units in the lower row on the transverse main connecting rib 10 connected to the gate pin 23 of the lower row product unit.

[0123] For each product group, two longitudinal main connecting ribs 11, the gate pin 23, the source pin 24 of the upper row product unit, and the first longitudinal sub-connecting rib 12 are connected by a transverse sub-connecting rib 13; two longitudinal main connecting ribs 11, the gate pin 23, the source pin 24 of an intermediate row product unit adjacent to the upper row product unit, and the second longitudinal sub-connecting rib 14 are connected by a transverse sub-connecting rib 13; two longitudinal main connecting ribs 11, the gate pin 23, the source pin 24 of another intermediate row product unit, and the second longitudinal sub-connecting rib 14 are connected by a transverse sub-connecting rib 13; two longitudinal main connecting ribs 11, the gate pin 23, the source pin 24 of the lower row product unit, and the third longitudinal sub-connecting rib 15 are connected by a transverse sub-connecting rib 13.

[0124] A positioning hole 100 is provided at the corresponding position of each product unit on the transverse main connecting rib 10 connected to the gate pin 23 of the upper row of product units. At least one longitudinal sub-connecting rib 15 among the first longitudinal sub-connecting rib 12, the second longitudinal sub-connecting rib 14, and the third longitudinal sub-connecting rib 15 is provided with a glue channel hole 120. Figure 10 In the middle, the first longitudinal sub-connecting rib 12 and the second longitudinal sub-connecting rib 14 are provided with adhesive channel holes 120.

[0125] In practical use, this invention increases the area of ​​the gate bonding platform 21 and the source bonding platform 22 by placing them only on one side of the base island 20. This reduces the risk of gate solder joint failure and allows the source bonding platform 22 to bond a larger number of bonding wires, thus improving current carrying capacity. In addition, the bottom surface of the base island 21 is the drain of the product unit, which increases the creepage distance between the source bonding platform and the drain, meeting the special application requirements of customers.

[0126] Compared with the existing lead frame structure, the area of ​​the gate bonding platform 21 in this embodiment is increased by 15%, the area of ​​the source bonding platform 22 is increased by 20%, the current carrying capacity is improved by 25% to 33%, and the creepage distance between the source pin 24 and the drain connected to the source bonding platform 22 is increased from 1.18mm to 3.89mm, an increase of 230%.

[0127] Specifically, in this embodiment, the area of ​​the base island 20 is 35mm². 2 ~50mm 2 Between; the area of ​​the gate bonding platform 21 is 3.5 mm. 2 ~5.5mm 2 Between; the area of ​​the source bonding platform 22 is 7mm². 2 ~9mm 2 between.

[0128] Specifically, in this embodiment, the positioning hole 100 is circular in shape.

[0129] Specifically, in this embodiment, the shape of the adhesive channel 120 is circular, rectangular, or elliptical.

[0130] In practical applications, the number of lead frame product groups can be between 8 and 12, and the length of the lead frame can be between 200mm and 300mm. For example, ... Figure 11 As shown, the lead frame includes nine product groups, with longitudinal main connecting ribs 11 connecting adjacent product groups.

[0131] Example 6

[0132] like Figure 12 As shown, the TO263 lead frame provided in this embodiment includes a product group, which includes a transverse main connecting rib 10, two longitudinal main connecting ribs 11 and eight product units. The two ends of the transverse main connecting rib 10 are respectively connected to the two longitudinal main connecting ribs 11, and the eight product units are arranged in four rows and two columns between the two longitudinal main connecting ribs 11.

[0133] The four product units are arranged vertically and vertically, and each product unit includes a base island 20, a gate bonding platform 21, and a source bonding platform 22.

[0134] The base island 20 of the upper row of product units is connected to the adjacent transverse main connecting bar 10, the base islands 20 of the middle two rows of product units are connected to each other, and the adjacent sides of the two base islands 20 of the lower row of product units are connected; the opposite sides of the two base islands 20 of the two product units in each row are connected to the longitudinal main connecting bar 11.

[0135] The gate bonding platform 21 and source bonding platform 22 of the upper row of product units and the adjacent row of product units are arranged facing each other, and are respectively connected to gate pin 23 and source pin 24. The gate pin 23 and source pin 24 of the upper row of product units are connected to the corresponding gate pin 23 and source pin 24 of the adjacent row of product units.

[0136] The gate bonding platform 21 and source bonding platform 22 of the lower row of product units and their adjacent row of product units are arranged facing each other and are respectively connected to gate pin 23 and source pin 24. The gate pin 23 and source pin 24 of the lower row of product units are connected to the corresponding gate pin 23 and source pin 24 of the adjacent row of product units.

[0137] For each product group, a first longitudinal sub-connecting rib 12 is provided between the upper two rows of product units, and a second longitudinal sub-connecting rib 14 is provided between the lower two rows of product units.

[0138] For the upper row of product units, the two longitudinal main connecting ribs 11, the gate pin 23 and the source pin 24 of the upper row of product units, and the first longitudinal sub-connecting rib 12 are connected by the transverse sub-connecting rib 13.

[0139] For the middle row product unit adjacent to the upper row product unit, the two longitudinal main connecting ribs 11, the gate pin 23 and the source pin 24 of the middle row product unit adjacent to the upper row product unit, and the first longitudinal sub-connecting rib 12 are connected by the transverse sub-connecting rib 13.

[0140] For the lower row of product units, the two longitudinal main connecting ribs 11, the gate pin 23 and the source pin 24 of the lower row of product units, and the second longitudinal sub-connecting rib 14 are connected by the transverse sub-connecting rib 13.

[0141] For the middle row product unit adjacent to the lower row product unit, the two longitudinal main connecting ribs 11, the gate pin 23 and the source pin 24 of the middle row product unit adjacent to the lower row product unit, and the second longitudinal sub-connecting rib 13 are connected by the transverse sub-connecting rib 13.

[0142] Positioning holes 100 are provided on the transverse main connecting rib 10 at the corresponding position of each product unit, and glue channel holes 120 are provided on the first longitudinal sub-connecting rib 12 and / or the second longitudinal sub-connecting rib 14.

[0143] In practical use, this invention increases the area of ​​the gate bonding platform 21 and the source bonding platform 22 by placing them only on one side of the base island 20. This reduces the risk of gate solder joint failure and allows the source bonding platform 22 to bond a larger number of bonding wires, thus improving current carrying capacity. In addition, the bottom surface of the base island 21 is the drain of the product unit, which increases the creepage distance between the source bonding platform and the drain, meeting the special application requirements of customers.

[0144] Compared with the existing lead frame structure, the area of ​​the gate bonding platform 21 in this embodiment is increased by 15%, the area of ​​the source bonding platform 22 is increased by 20%, the current carrying capacity is improved by 25% to 33%, and the creepage distance between the source pin 24 and the drain connected to the source bonding platform 22 is increased from 1.18mm to 3.89mm, an increase of 230%.

[0145] Specifically, in this embodiment, the area of ​​the base island 20 is 35mm². 2 ~50mm 2 Between; the area of ​​the gate bonding platform 21 is 3.5 mm. 2 ~5.5mm 2 Between; the area of ​​the source bonding platform 22 is 7mm². 2 ~9mm 2 between.

[0146] Specifically, in this embodiment, the positioning hole 100 is circular in shape.

[0147] Specifically, in this embodiment, the shape of the adhesive channel 120 is circular, rectangular, or elliptical.

[0148] In practical applications, the number of lead frame product groups can be between 8 and 12, and the length of the lead frame can be between 200mm and 300mm. For example, ... Figure 13 As shown, the lead frame includes nine product groups, with longitudinal main connecting ribs 11 connecting adjacent product groups.

[0149] Based on the above description and inspired by this utility model, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A TO263 lead frame, characterized in that, It includes N product groups connected sequentially along the length of the lead frame, where N is a positive integer; The product group includes a transverse main connecting rib, two longitudinal main connecting ribs and two product units. The two longitudinal main connecting ribs are connected to both ends of the transverse main connecting rib, and the two product units are arranged between the two longitudinal main connecting ribs along the length of the lead frame. The product unit includes a base island, a gate bonding platform, and a source bonding platform. The gate bonding platform and the source bonding platform are spaced apart along the length of the lead frame on the side of the base island near the transverse main connecting rib, and are respectively connected to the transverse main connecting rib through gate pins and source pins. The transverse main connecting rib is provided with a longitudinal sub-connecting rib between the two product units in each product group; in each product group, along the length direction of the lead frame, the two longitudinal main connecting ribs, the gate pin of the product unit, the source pin of the product unit and the longitudinal sub-connecting rib are connected by a transverse sub-connecting rib. The base islands of the two product units in each product group are connected on the near side, and the base islands of the two product units in each product group are connected to the far side with two longitudinal main connecting bars. The transverse main connecting ribs are provided with positioning holes at the corresponding positions of each product unit, and each longitudinal sub-connecting rib is provided with adhesive channel holes.

2. A TO263 lead frame, characterized in that, It includes N product groups connected sequentially along the length of the lead frame, where N is a positive integer; The product group includes two transverse main connecting ribs, two longitudinal main connecting ribs and two product units. The two transverse main connecting ribs and the two longitudinal main connecting ribs are connected to form a rectangular frame structure. The two product units are arranged between the two longitudinal main connecting ribs along the length of the lead frame. The product unit includes a base island, a gate bonding platform, and a source bonding platform. The base island of each product unit is connected to an adjacent transverse main connecting rib. The gate bonding platform and the source bonding platform are spaced apart along the length of the lead frame on one side of the transverse main connecting rib opposite to the base island, and are respectively connected to another transverse main connecting rib through a gate pin and a source pin. A longitudinal sub-connector is provided on the transverse main connecting rib connected to the gate pin between the two product units in each product group; in each product group, along the length direction of the lead frame, the two longitudinal main connecting ribs, the gate pin of the product unit, the source pin of the product unit and the longitudinal sub-connector are connected by a transverse sub-connector. Positioning holes are provided on the transverse main connecting ribs connected to the base island at the corresponding position of each product unit, and adhesive channel holes are provided on each longitudinal sub-connecting rib.

3. A TO263 lead frame, characterized in that, It includes N product groups connected sequentially along the length of the lead frame, where N is a positive integer; The product group includes two transverse main connecting ribs, two longitudinal main connecting ribs, and four product units. The two transverse main connecting ribs and the two longitudinal main connecting ribs are connected to form a rectangular frame structure, and the four product units are arranged in two rows and two columns within the frame structure. Two rows of product units are arranged vertically and vertically. Each product unit includes a base island, a gate bonding platform, and a source bonding platform. The base island of the upper row of product units is connected to the base island of the corresponding lower row of product units, and the base islands of the two rows of product units are connected on the near side, while the base islands of the two rows of product units are connected to two longitudinal main connecting ribs on the far side. For each product unit, the gate bonding platform and the source bonding platform of the product unit are spaced apart along the length of the lead frame on one side of the base island near the transverse main connecting rib, and are connected to the nearby transverse main connecting rib through the gate pin and the source pin, respectively. On the two transverse main connecting ribs, there are longitudinal sub-connecting ribs between the two product units in each row; for the two product units in each row, the two longitudinal main connecting ribs, the gate pin of the product unit, the source pin of the product unit and the longitudinal sub-connecting rib are connected by a transverse sub-connecting rib. The transverse main connecting ribs that connect to the gate pins of the upper row of product units are provided with positioning holes at the corresponding positions of each product unit, and each longitudinal sub-connecting rib is provided with a glue channel hole.

4. A TO263 lead frame, characterized in that, It includes N product groups connected sequentially along the length of the lead frame, where N is a positive integer; The product group includes a transverse main connecting bar, two longitudinal main connecting bars and four product units. The two ends of the transverse main connecting bar are respectively connected to the two longitudinal main connecting bars, and the four product units are arranged in two rows and two columns between the two longitudinal main connecting bars. Two rows of product units are arranged vertically and vertically. Each product unit includes a base island, a gate bonding platform, and a source bonding platform. The base island of the upper row of product units is connected to the transverse main connecting rib, the adjacent sides of the two base islands of the lower row of product units are connected, and the opposite sides of the two base islands of the lower row of product units are connected to the two longitudinal main connecting ribs. The gate bonding platforms and source bonding platforms of the two rows of product units are spaced apart along the length of the lead frame on opposite sides of the base islands of the two rows of product units, and are respectively connected to the gate pins and source pins; the gate pins and source pins of the upper row of product units are connected to the corresponding gate pins and corresponding source pins of the lower row of product units. In each product group, there is a longitudinal sub-connecting rib between two columns of product units; for the two product units in the upper row, the two longitudinal main connecting ribs, the gate pin of the product unit, the source pin of the product unit and the longitudinal sub-connecting rib are connected by a transverse sub-connecting rib; for the two product units in the lower row, the two longitudinal main connecting ribs, the gate pin of the product unit, the source pin of the product unit and the longitudinal sub-connecting rib are connected by another transverse sub-connecting rib. The transverse main connecting ribs are provided with positioning holes at the corresponding positions of each product unit, and each longitudinal sub-connecting rib is provided with adhesive channel holes.

5. A TO263 lead frame, characterized in that, It includes N product groups connected sequentially along the length of the lead frame, where N is a positive integer; The product group includes two transverse main connecting ribs, two longitudinal main connecting ribs, and eight product units. The two transverse main connecting ribs and two longitudinal main connecting ribs are connected to form a rectangular frame structure, and the eight product units are arranged in four rows and two columns within the frame structure. The four product units are arranged vertically and vertically. Each product unit includes a base island, a gate bonding platform, and a source bonding platform. The base islands of the two upper and two lower product units are interconnected. The two base islands of each row of two product units are connected to two longitudinal main connecting ribs on their opposite sides. The gate bonding platform and source bonding platform of the upper row of product units are spaced apart along the length of the lead frame on the side of the base island near the transverse main connecting rib, and are connected to the nearby transverse main connecting rib through the gate pin and the source pin, respectively. The gate bonding platform and source bonding platform of the middle two rows of product units are spaced apart along the length of the lead frame on the adjacent side of the base island of the middle two rows of product units, and are respectively connected to the gate pin and the source pin. The gate pin and the source pin of the middle two rows of product units are connected vertically. The gate bonding platform and source bonding platform of the lower row product unit are spaced apart along the length of the lead frame on one side of the base island near the transverse main connecting rib, and are connected to the nearby transverse main connecting rib through the gate pin and the source pin, respectively. For each product group, a first longitudinal sub-connecting rib is provided between two product units in the upper row on the transverse main connecting rib connected to the gate pin of the upper row product unit, a second longitudinal sub-connecting rib is provided between two product units in the middle row, and a third longitudinal sub-connecting rib is provided between two product units in the lower row on the transverse main connecting rib connected to the gate pin of the lower row product unit. For each product group, two longitudinal main connecting ribs, the gate pins and source pins of the upper row product units, and the first longitudinal sub-connecting rib are connected by transverse sub-connecting ribs; two longitudinal main connecting ribs, the gate pins and source pins of an intermediate row product unit adjacent to the upper row product units, and the second longitudinal sub-connecting rib are connected by transverse sub-connecting ribs; two longitudinal main connecting ribs, the gate pins and source pins of another intermediate row product unit, and the second longitudinal sub-connecting rib are connected by transverse sub-connecting ribs; two longitudinal main connecting ribs, the gate pins and source pins of the lower row product units, and the third longitudinal sub-connecting rib are connected by transverse sub-connecting ribs. The transverse main connecting ribs connected to the gate pins of the upper row of product units are respectively provided with positioning holes at the corresponding positions of each product unit, and at least one of the first longitudinal sub-connecting ribs, the second longitudinal sub-connecting ribs, and the third longitudinal sub-connecting ribs is provided with glue channel holes.

6. A TO263 lead frame, characterized in that, It includes N product groups connected sequentially along the length of the lead frame, where N is a positive integer; The product group includes a transverse main connecting bar, two longitudinal main connecting bars and eight product units. The two ends of the transverse main connecting bar are respectively connected to the two longitudinal main connecting bars, and the eight product units are arranged in four rows and two columns between the two longitudinal main connecting bars. The four product units are arranged vertically and vertically, and each product unit includes a base island, a gate bonding platform, and a source bonding platform. The base island of the upper row of product units is connected to the adjacent transverse main connecting rib; the base islands of the middle two rows of product units are connected to each other; the adjacent sides of the two base islands of the lower row of product units are connected; the opposite sides of the two base islands of the two product units in each row are connected to the longitudinal main connecting rib. The gate bonding platform and source bonding platform of the upper row of product units and the adjacent row of product units are arranged facing each other and are respectively connected to gate pins and source pins. The gate pins and source pins of the upper row of product units are connected to the corresponding gate pins and source pins of the adjacent row of product units. The gate bonding platform and source bonding platform of the lower row of product units and the adjacent row of product units are arranged facing each other and are respectively connected to gate pins and source pins. The gate pins and source pins of the lower row of product units are connected to the corresponding gate pins and source pins of the adjacent row of product units. For each product group, a first longitudinal sub-connecting rib is provided between the upper two rows of product units, and a second longitudinal sub-connecting rib is provided between the lower two rows of product units. For the upper row of product units, the two longitudinal main connecting ribs, the gate pin and source pin of the upper row of product units, and the first longitudinal sub-connecting rib are connected by the transverse sub-connecting ribs. For the middle row product unit adjacent to the upper row product unit, the two longitudinal main connecting ribs, the gate pin and source pin of the middle row product unit adjacent to the upper row product unit, and the first longitudinal sub-connecting rib are connected by the transverse sub-connecting ribs. For the lower row of product units, the two longitudinal main connecting ribs, the gate pin and source pin of the lower row of product units, and the second longitudinal sub-connecting rib are connected by the transverse sub-connecting ribs. For the middle row product unit adjacent to the lower row product unit, the two longitudinal main connecting ribs, the gate pin and source pin of the middle row product unit adjacent to the lower row product unit, and the second longitudinal sub-connecting rib are connected by the transverse sub-connecting ribs. The transverse main connecting ribs are provided with positioning holes at the corresponding positions of each product unit, and the first longitudinal sub-connecting ribs and / or the second longitudinal sub-connecting ribs are provided with adhesive channel holes.

7. A TO263 lead frame according to any one of claims 1-6, characterized in that, The value of N is between 8 and 12, and the length of the lead frame is between 200 mm and 300 mm.

8. A TO263 lead frame according to any one of claims 1-6, characterized in that, The area of ​​the base island is 35mm. 2 ~50mm 2 Between; the area of ​​the gate bonding platform is 3.5 mm. 2 ~5.5mm 2 Between; the area of ​​the source bonding platform is 7mm. 2 ~9mm 2 between.

9. A TO263 lead frame according to any one of claims 1-6, characterized in that, The positioning hole is circular in shape.

10. A TO263 lead frame according to any one of claims 1-6, characterized in that, The shape of the adhesive channel hole is circular, rectangular, or elliptical.

Images