Optical module
By designing the recessed portion and cofferdam structure of the ceramic tube shell, combined with the optimized arrangement of signal lines and impedance control, the problem of high-speed signal transmission of optical modules in extreme environments was solved, achieving high-reliability and low-loss signal transmission.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HISENSE & JONHON OPTICAL ELECTRICAL TECH CO LTD
- Filing Date
- 2025-07-21
- Publication Date
- 2026-07-17
AI Technical Summary
Existing optical module products struggle to achieve reliable high-speed signal transmission in extreme high and low temperatures, vacuum environments, and other challenging conditions.
It adopts a ceramic tube shell design, with a recessed structure and a cofferdam combination. The signal line is connected to the pad through the signal hole, forming exposed traces and interlayer traces of ceramic sheets. Combined with differential and single-ended impedance control, the signal transmission path is optimized.
It achieves high-reliability transmission of high-speed signals in extreme environments, reduces signal loss, and improves stability and temperature resistance.
Smart Images

Figure CN224519005U_ABST
Abstract
Claims
1. An optical module characterized by comprising: include: A ceramic tube shell has a recessed portion formed on its upper surface. The ceramic tube shell includes multiple interconnected ceramic sheets, and a first pad is formed on the outer edge of the ceramic tube shell. A driver chip is disposed in the recessed portion, and a second pad is formed thereon; A cofferdam is constructed around the recessed portion and welded to the upper surface of the ceramic tube shell. The signal line has one end connected to the second pad and the other end extending toward the bottom wall of the recess and passing through the ceramic tube shell to connect to the first pad. Signal holes are formed on the ceramic layer between the bottom wall of the recess and the first pad. The signal holes correspond to the first pad and are configured to allow the signal lines to pass through for signal transmission.
2. The optical module according to claim 1, characterized in that, The signal line includes a first segment, a second segment, and a third segment connected in sequence. The first segment is located in the recess and connected to the second pad. The second segment is located below the dam and sandwiched between two adjacent ceramic layers. The third segment passes through the signal hole and is connected to the first pad.
3. The optical module according to claim 2, characterized by The third line segment is perpendicularly interconnected with the first pad.
4. The optical module according to claim 2, characterized by The ceramic tube shell has a return ground hole circumferentially arranged around the signal hole, and the return ground hole and the signal hole satisfy the following relationship: ; wherein, is the impedance of the signal hole, which is matched to the single-ended impedance of the second line segment; is the dielectric constant of the ceramic package; is the aperture of the signal hole; is the distance between the center of the signal hole and the hole wall of the return flow ground hole.
5. The optical module of claim 2, wherein The first line segment controls the line width and / or spacing of the signal line according to a differential impedance of 100 ohms.
6. The optical module of claim 2, wherein, The second line segment controls the line width and / or spacing of the signal line according to a single-ended impedance of 50 ohms.
7. The optical module of claim 1, wherein, The signal holes in two adjacent ceramic layers are arranged in a stacked manner.
8. The optical module according to claim 7, characterized by The projection of the axis of the signal hole onto the first pad is located on the side of the first pad facing the recess.
9. The optical module according to claim 1, characterized in that, The first pad is located on the upper or lower surface of the ceramic tube shell.
10. The optical module according to claim 9, characterized in that, The optical module also includes: A pin, which is soldered to the first pad, is configured to connect to a user motherboard.