A dust removing device for a surface of a substrate

Abstract

The utility model relates to paper production and processing technical field. A kind of substrate surface dust removal device, including support, several guide rollers are equipped in support, dust removal system is equipped in support, dust removal system includes several ultrasonic wave air knife modules and negative pressure dust removal module being set on the both sides of substrate upper and lower, dust removal system includes the electrostatic device being equipped in the front end of dust removal system, substrate passes through electrostatic device and dust removal system in turn after outfeed along guide roller. The utility model provides a kind of substrate surface dust removal device that can be dusted by non-contact mode, substrate surface will not be damaged and any physical, chemical reaction, high-efficiency dust removal can be realized, can be adjusted according to substrate size adaptation, can satisfy higher production demand;The dust removal device of the substrate such as paper in the prior art is relatively single, cannot guarantee dust removal effect and paper quality, cannot satisfy higher production demand technical problem.

Description

Technical Field

[0001] This utility model relates to the field of paper production and processing technology, and in particular to a dust removal device for a substrate surface. Background Technology

[0002] With economic development and the rapid development of the manufacturing industry, people's demand for paper is increasing, and the demand for paper printing and production quality is getting higher and higher.

[0003] In the current production process of paper and other substrates, dust removal is required to prevent it from affecting the quality of subsequent processing. Currently, paper dust removal devices are usually physical friction or air blowing dust removal. Physical friction causes greater damage to the paper and cannot guarantee the quality of the paper, while ordinary air blowing dust removal cannot guarantee the dust removal effect and cannot meet higher production requirements. Therefore, there is a need for improvement. Utility Model Content

[0004] This utility model provides a dust removal device for substrate surfaces that can remove dust in a non-contact manner without causing damage to the substrate surface or any physical or chemical reactions. It can achieve efficient dust removal, adapt to the substrate size, and meet higher production requirements. It solves the technical problem that the existing dust removal devices for paper and other substrates are relatively simple, cannot guarantee the dust removal effect and paper quality, and cannot meet higher production requirements.

[0005] The above-mentioned technical problem of this utility model is solved by the following technical solution: A dust removal device for a substrate surface includes a support frame, a plurality of guide rollers are arranged inside the support frame, and a dust removal system is arranged inside the support frame. The dust removal system includes a plurality of ultrasonic air knife modules and a negative pressure dust removal module arranged on the upper and lower sides of the substrate. The dust removal system includes an antistatic device at the front end of the dust removal system. The substrate is discharged after passing through the antistatic device and the dust removal system in sequence along the guide rollers. During processing, the substrate enters the antistatic device and the dust removal system in sequence along the guide rollers. The substrate first passes through the antistatic device to remove static electricity, and then the substrate enters the dust removal system for dust removal treatment. The negative pressure dust removal modules on both sides form a negative pressure environment, while the ultrasonic air knife module in the middle forms an air knife that blows air onto the substrate surface. The ultrasonic airflow and the negative pressure environment on both sides will generate high-frequency short-wave oscillations on the substrate surface. The high-frequency oscillations decompose and detach the dust and impurities on the substrate surface, and the dust and impurities are adsorbed away under the action of strong vacuum negative pressure.

[0006] Preferably, the static eliminator is installed at the front end of the dust removal system inlet. In this invention, the static eliminator is installed at the front end of the dust removal system inlet. During processing, the substrate enters the static eliminator and the dust removal system sequentially along the guide rollers. The substrate first passes through the static eliminator to remove static electricity, and then enters the dust removal system for dust removal.

[0007] Preferably, the ultrasonic air knife module includes ultrasonic cavities symmetrically arranged on the upper and lower sides of the middle of the substrate. Each ultrasonic cavity contains an air duct and a high-pressure vortex generator. During processing, the substrate sequentially enters the static eliminator and dust removal system along guide rollers. The substrate first passes through the static eliminator to remove static electricity, and then enters the dust removal system for dust removal. The negative pressure dust removal modules on both sides create a negative pressure environment, while the ultrasonic air knife module in the middle blows air onto the substrate surface. The high-pressure airflow blown from the high-pressure vortex generator is compressed and regulated to form an ultrasonic airflow. The ultrasonic airflow and the negative pressure environment on both sides generate high-frequency short-wave oscillations on the substrate surface. These high-frequency oscillations decompose and remove dust and impurities from the substrate surface.

[0008] Preferably, the air duct and the high-pressure vortex generator forming air knife are blown onto the substrate. The high-pressure airflow blown from the high-pressure vortex generator is compressed and regulated to form an ultrasonic airflow. The ultrasonic airflow and the negative pressure environment on both sides will generate high-frequency short-wave oscillations on the surface of the substrate. The high-frequency oscillations decompose and remove dust and impurities from the surface of the substrate.

[0009] Preferably, the negative pressure dust removal module includes negative pressure cavities disposed on the left and right sides of the ultrasonic air knife module. A dust removal host connected to the negative pressure cavity is provided on one side of the bracket, and the dust removal host is connected to the negative pressure cavity via a pipeline. During processing, the substrate enters the static eliminator and dust removal system sequentially along the guide rollers. The substrate first passes through the static eliminator to remove static electricity, and then enters the dust removal system for dust removal. The negative pressure dust removal modules on both sides create a negative pressure environment, while the ultrasonic air knife module in the middle forms an air knife that blows air onto the surface of the substrate. The high-pressure airflow blown from the high-pressure vortex host is compressed and regulated through multiple washes to form an ultrasonic airflow. The ultrasonic airflow and the negative pressure environment on both sides generate high-frequency short-wave oscillations on the surface of the substrate. The high-frequency oscillations decompose and detach the dust and impurities on the surface of the substrate, and under the action of strong vacuum negative pressure, the dust and impurities are sucked into the negative pressure cavity and enter the dust removal host for filtration along the pipeline.

[0010] Preferably, the dust collector is equipped with a multi-stage filtration system. This multi-stage filtration system can effectively remove micron-sized dust from the surface of the substrate.

[0011] Therefore, the dust removal device for substrate surface of this utility model has the following advantages: it can remove dust in a non-contact manner, without causing damage to the substrate surface or any physical or chemical reaction, can achieve efficient dust removal, can be adapted and adjusted according to the substrate size, and can meet higher production requirements. Attached Figure Description

[0012] Figure 1 This is a three-dimensional structural diagram of a dust removal device for a substrate surface according to the present invention.

[0013] Figure 2yes Figure 1 A cross-sectional view of the dust removal system.

[0014] In the diagram, 1 is the support frame, 2 is the guide roller, 3 is the dust removal system, 4 is the static electricity removal device, 5 is the ultrasonic air knife module, 6 is the negative pressure dust removal module, and 7 is the dust removal host. Detailed Implementation

[0015] The technical solution of the utility model will be further described in detail below through embodiments and in conjunction with the accompanying drawings.

[0016] Example:

[0017] like Figure 1 and 2 As shown, a dust removal device for a substrate surface includes a support 1, a plurality of guide rollers 2 installed inside the support 1, a dust removal system 3 and an antistatic device 4 installed inside the support 1, and the substrate is discharged after passing through the antistatic device 4 and the dust removal system 3 in sequence along the guide rollers 2.

[0018] The static eliminator 4 is installed at the front end of the discharge port of the dust removal system 3.

[0019] The dust removal system 3 includes several ultrasonic air knife modules 5 and a negative pressure dust removal module 6 installed on the upper and lower sides of the substrate. The ultrasonic air knife module 5 includes ultrasonic cavities symmetrically installed on the upper and lower sides of the middle of the substrate.

[0020] The ultrasonic cavity contains an air duct and a high-pressure vortex generator. The air duct and the high-pressure vortex generator form an air knife that blows onto the surface of the substrate.

[0021] The negative pressure dust removal module 6 includes negative pressure cavities installed on the left and right sides of the ultrasonic air knife module 5. A dust removal host 7 connected to the negative pressure cavity is installed on one side of the bracket 1. The dust removal host 7 is connected to the negative pressure cavity through a pipeline.

[0022] The dust collector 7 is equipped with a multi-stage filtration system.

[0023] During processing, the substrate enters the static eliminator 4 and the dust removal system 3 sequentially along the guide roller 2. The substrate first passes through the static eliminator 4 to remove static electricity, and then enters the dust removal system 3 for dust removal. The negative pressure dust removal modules 6 on both sides create a negative pressure environment, while the ultrasonic air knife module 5 in the middle forms an air knife that blows air onto the surface of the substrate. The high-pressure airflow blown from the high-pressure vortex host is compressed and regulated by multiple washes to form an ultrasonic airflow. The ultrasonic airflow and the negative pressure environment on both sides will generate high-frequency short-wave oscillations on the surface of the substrate. The high-frequency oscillations decompose and remove dust and impurities on the surface of the substrate. Under the action of strong vacuum negative pressure, the dust and impurities are sucked into the negative pressure chamber and enter the dust removal host 7 for filtration along the pipeline.

[0024] This invention removes dust in a non-contact manner, without causing damage to the substrate surface or any physical or chemical reactions, thus achieving highly efficient dust removal.

[0025] The number and width of the ultrasonic air knife module 5 and the negative pressure dust removal module 6 in this invention can be adjusted according to the width of the substrate, and the width of the air knife can be adjusted to adapt to different production needs.

[0026] The specific embodiments described herein are merely illustrative of the concept of the invention. Those skilled in the art to which this invention pertains may make various modifications or additions to the described specific embodiments or use similar methods to replace them, without departing from the spirit of the invention or exceeding the scope defined by the appended claims.

Claims

1. A dust removal device for a substrate surface, characterized in that: The system includes a support frame, which contains several guide rollers and a dust removal system. The dust removal system includes several ultrasonic air knife modules and a negative pressure dust removal module located on the upper and lower sides of the substrate. The dust removal system also includes an antistatic device at the front end of the dust removal system. The substrate is discharged after passing through the antistatic device and the dust removal system in sequence along the guide rollers.

2. The dust removal device for a substrate surface according to claim 1, characterized in that: The static electricity removal device is installed at the front end of the dust removal system's feed inlet.

3. The dust removal device for a substrate surface according to claim 1, characterized in that: The ultrasonic air knife module includes ultrasonic cavities symmetrically arranged on the upper and lower sides of the middle of the substrate, and an air duct and a high-pressure vortex generator are installed inside the ultrasonic cavities.

4. A dust removal device for a substrate surface according to claim 3, characterized in that: The air duct and the high-pressure vortex generator forming air knife are blown onto the substrate.

5. A dust removal device for a substrate surface according to claim 1, characterized in that: The negative pressure dust removal module includes negative pressure cavities arranged on the left and right sides of the ultrasonic air knife module. A dust removal host connected to the negative pressure cavity is provided on one side of the bracket. The dust removal host and the negative pressure cavity are connected by pipeline.

6. A dust removal device for a substrate surface according to claim 5, characterized in that: The dust removal host is equipped with a multi-stage filtration device.

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