Electromagnetic ultrasonic thickness measurement module
By stacking the signal receiving board, electromagnetic ultrasonic excitation board, and data processing and transmission board, and using an independent power supply structure, the problem of excessively large ultrasonic thickness measurement devices has been solved, enabling miniaturized thickness measurement on automatic crawlers and drones, and ensuring stable signal transmission and efficient data processing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- GUANGDONG GOWORLD
- Filing Date
- 2025-12-12
- Publication Date
- 2026-07-21
AI Technical Summary
Existing ultrasonic thickness measurement devices are bulky and heavy, making them unsuitable for stable mounting on devices with limited installation space, such as automatic crawlers and drones.
The design employs a stacked structure of a signal receiving board, an electromagnetic ultrasonic excitation board, and a data processing and transmission board, combined with independent power supply and multiple communication interfaces, to achieve miniaturization of the module and multi-channel collaborative measurement. Thickness measurement is performed by exciting ultrasonic waves through an electromagnetic ultrasonic thickness measuring probe.
The module has been miniaturized (150mm×26mm×25mm), making it suitable for confined spaces such as automatic crawlers and drones. This ensures lossless signal transmission, efficient data processing, and improved reliability and measurement accuracy in complex environments.
Smart Images

Figure CN224535050U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of ultrasonic testing, and in particular to an electromagnetic ultrasonic thickness measurement module. Background Technology
[0002] In the field of industrial non-destructive testing, thickness measurement of metal workpieces (such as pipes, storage tanks, and high-altitude panels) is a crucial step in ensuring the safe operation of equipment. The application of automated equipment such as automatic crawlers and drones has become a core solution for addressing the challenges of inspecting large, high-altitude, or confined space components. A significant characteristic of this type of automated equipment is its extremely limited installation space, imposing strict volume restrictions on the thickness measuring device it carries. Most existing ultrasonic thickness measuring devices employ a flat layout of functional components, dispersing excitation, signal reception, and data processing components without integration optimization. This results in a large overall size, heavy weight, and significant space occupation, far exceeding the installation space requirements of automatic crawlers and drones, making stable mounting impossible. Utility Model Content
[0003] The technical problem to be solved by this utility model is to provide an electromagnetic ultrasonic thickness measurement module. This electromagnetic ultrasonic thickness measurement module is small in size and can be easily mounted on equipment with limited installation space, such as automatic crawlers and drones, to perform continuous thickness measurement.
[0004] To solve the above technical problems, the following technical solution is adopted: An electromagnetic ultrasonic thickness measurement module is characterized by comprising a signal receiving board, an electromagnetic ultrasonic excitation board, a data processing and transmission board, and an electromagnetic ultrasonic thickness measurement probe, wherein the signal receiving board, the electromagnetic ultrasonic excitation board, and the data processing and transmission board are stacked and assembled sequentially from top to bottom; the signal receiving board, the electromagnetic ultrasonic excitation board, and the data processing and transmission board are electrically connected to each other in pairs, and the electromagnetic ultrasonic thickness measurement probe is electrically connected to the electromagnetic ultrasonic excitation board.
[0005] The aforementioned electromagnetic ultrasonic thickness measurement module is divided into three sections based on transmission, reception, and data processing. These sections are then stacked vertically for three-dimensional assembly. Compared to the traditional flat layout, this significantly reduces the overall size of the module (achieving a miniaturized size of approximately 150mm × 26mm × 25mm) and weight (approximately 150g including the probe). This allows it to fit into the limited installation space of small automated equipment such as automatic crawlers and drones, meeting the needs of space-constrained scenarios.
[0006] In the preferred embodiment, the signal receiving board is provided with a first power supply circuit and an ultrasonic signal acquisition and analog signal receiving amplification circuit; the electromagnetic ultrasonic excitation board is provided with a second power supply circuit, a probe interface circuit, and a high-voltage excitation circuit; the data processing and transmission board is provided with an analog-to-digital conversion circuit, a digital processing circuit, a network communication interface, a serial communication interface, a WIFI communication circuit, and a cascading interface; the signal output terminal of the high-voltage excitation circuit is electrically connected to the signal input terminal corresponding to the probe interface circuit, and the signal output terminal of the probe interface circuit is electrically connected to the signal input terminal corresponding to the electromagnetic ultrasonic thickness measuring probe; the signal output terminal of the electromagnetic ultrasonic thickness measuring probe is electrically connected to the signal input terminal corresponding to the ultrasonic signal acquisition and analog signal receiving amplification circuit, and the signal output terminal of the ultrasonic signal acquisition and analog signal receiving amplification circuit is electrically connected to the signal input terminal corresponding to the ultrasonic signal acquisition and analog signal receiving amplification circuit. The output terminal is electrically connected to the signal input terminal corresponding to the analog-to-digital conversion circuit. The signal output terminal of the analog-to-digital conversion circuit is electrically connected to the signal input terminal corresponding to the digital processing circuit. The signal output terminal corresponding to the digital processing circuit is electrically connected to the signal input terminals corresponding to the network communication interface, serial communication interface, WIFI communication circuit, and cascade interface, respectively. The power supply output terminal of the first power supply circuit is electrically connected to the power supply input terminals of the ultrasonic signal capture and analog signal receiving amplification circuit on the signal receiving board, the analog-to-digital conversion circuit on the data processing and transmission board, the digital processing circuit, the network communication interface, the serial communication interface, the WIFI communication circuit, and the cascade interface, respectively. The power supply output terminal of the second power supply circuit is electrically connected to the power supply input terminals of the probe interface circuit and the high-voltage excitation circuit on the electromagnetic ultrasonic excitation board, respectively.
[0007] During thickness measurement, the high-frequency excitation signal generated by the high-voltage excitation circuit is transmitted to the electromagnetic ultrasonic thickness measuring probe via the probe interface circuit, driving the probe to excite ultrasonic waves. The returned ultrasonic echo signal is captured and amplified by the ultrasonic signal capture and analog signal receiving and amplification circuit, then converted from analog to digital by the analog-to-digital converter circuit, and finally the thickness data is calculated by the digital processing circuit. This data is then transmitted back in real time through multiple communication interfaces, ensuring lossless signal transmission and efficient data processing. In single-channel operation, a single module is sufficient. When multi-channel collaborative measurement is required, the cascading interface provides a connection basis for interconnecting multiple modules, allowing them to be connected and solving the problem of low efficiency in traditional single-module measurements. Meanwhile, by adopting a dual-power-circuit independent power supply design, the first power supply circuit powers all circuits and interfaces on the signal receiving board and data processing transmission board, while the second power supply circuit focuses on powering the high-voltage excitation and probe operation. This avoids electromagnetic interference and voltage fluctuations caused by different types of circuits sharing the same power supply (for example, the high-voltage excitation circuit needs to output an instantaneous high-frequency high-voltage signal to drive the probe coil to induce eddy currents, resulting in drastic current changes, high power consumption peaks, and strong electromagnetic radiation during operation; while the ultrasonic signal acquisition and analog signal receiving circuits process the weak echo signal at the microvolt level returned by the probe, which is extremely sensitive to electromagnetic interference and requires a stable low-voltage power supply environment), ensuring the signal-to-noise ratio of ultrasonic signal acquisition and the stability of data processing. The independent power supply structure can also flexibly match power supply parameters according to the power consumption requirements of each circuit, reducing the overall power consumption of the system, improving the reliability of the module in complex industrial environments, and avoiding measurement interruptions caused by unstable power supply.
[0008] Typically, the signal receiving board and the electromagnetic ultrasonic excitation board are equipped with matching transmit and receive signal plugs / sockets; the electromagnetic ultrasonic excitation board and the data processing and transmission board are equipped with matching signal control plugs / sockets; the signal receiving board and the data processing and transmission board are equipped with matching ultrasonic analog signal plugs / sockets; the signal receiving board and the data processing and transmission board are also equipped with matching system grounding and power supply plugs / sockets; the three boards are electrically connected to each other through the combination of these four plugs / sockets.
[0009] In a further preferred embodiment, the cascaded interface includes a synchronization input signal pin, a synchronization output signal pin, a reset input signal pin, a reset output signal pin, and a ground signal pin. Multiple electromagnetic ultrasonic thickness measurement modules are combined to achieve multi-module, multi-channel collaborative measurement. When multiple electromagnetic ultrasonic thickness measurement modules are cascaded, the synchronization output signal pin of the preceding module is electrically connected to the synchronization input signal pin of the following module, the reset output signal pin of the preceding module is electrically connected to the reset input signal pin of the following module, the reset output signal pin of the last module is electrically connected to the reset input signal pin of the first module, and the ground signal pins of all modules are electrically connected to each other. This structure enables orderly collaboration among multiple modules, ensuring the overall stability of the system.
[0010] In the preferred embodiment, the electromagnetic ultrasonic thickness gauge probe includes a shell, a permanent magnet, a sound insulation layer, an electromagnetic coil, and a heat insulation composite layer. The permanent magnet, sound insulation layer, and electromagnetic coil are sequentially installed inside the shell from top to bottom, with the permanent magnet and electromagnetic coil corresponding to each other. The shell has a lower opening communicating with the interior, and the heat insulation composite layer is installed at and covers the lower opening, positioned below the electromagnetic coil. The permanent magnet provides a stable static magnetic field, which interacts with the eddy currents induced in the electromagnetic coil to generate a Lorentz force, thereby exciting ultrasonic waves. The sound insulation layer can block the influence of external environmental noise and internal circuit interference on the electromagnetic coil, reducing noise interference in the ultrasonic echo signal and improving measurement accuracy. The heat insulation composite layer ensures that the probe can directly contact the high-temperature metal workpiece, effectively blocking high-temperature heat radiation from being conducted into the probe, protecting the permanent magnet, electromagnetic coil, and other core components from high-temperature damage, making the probe suitable for high-temperature measurement scenarios.
[0011] In a further preferred embodiment, the thermal insulation layer comprises, from top to bottom, a polyimide plate, a porous vacuum silicone insulation cotton, and an aluminum silicate ceramic plate. The thermal insulation layer consists of three layers: the bottom aluminum silicate ceramic plate directly contacts the high-temperature workpiece and possesses excellent high-temperature resistance; the middle layer of porous vacuum silicone insulation cotton utilizes a vacuum structure to block heat conduction, while the silicone material also acts as a buffer, reducing mechanical impact when the probe contacts the workpiece; the top polyimide plate has good mechanical strength and insulation properties, both fixing the lower insulation material and preventing electrical interference between the electromagnetic coil and the insulation layer. The three-layer structure integrates high-temperature resistance, efficient thermal insulation, and structural support, resulting in a more significant thermal insulation effect compared to a single insulation material. This allows the probe to operate continuously and stably at 350°C, meeting the continuous thickness measurement requirements of high-temperature metal workpieces.
[0012] In a further preferred embodiment, the electromagnetic ultrasonic thickness measuring probe further includes a probe cover, a plug wire, and a lead wire. The outer casing is cylindrical, with the probe cover mounted on top and covering the upper opening of the casing. An outlet is located on the outer side of the casing, the plug wire is fixed at the outlet and extends outwards, and the lead wire is disposed inside the casing. One end of the lead wire is soldered to the electrode of the electromagnetic coil, and the other end extends to the outlet and connects to the plug wire. The lead wire connects the coil to the plug wire, and the plug wire allows the probe to interface with the probe interface circuit of the electromagnetic ultrasonic excitation board.
[0013] The beneficial effects of this utility model are that this electromagnetic ultrasonic thickness measurement module is small in size and can be easily mounted on equipment with limited installation space, such as automatic crawlers and drones, to perform continuous thickness measurement. Attached Figure Description
[0014] Figure 1 This is a schematic diagram of the electromagnetic ultrasonic thickness measurement module in an embodiment of this utility model; Figure 2 This is an exploded view of the electromagnetic ultrasonic thickness measurement module in this embodiment of the present invention; Figure 3 This is a schematic diagram of the signal receiving board in an embodiment of the present invention; Figure 4 This is a schematic diagram of the electromagnetic ultrasonic excitation plate in an embodiment of the present invention; Figure 5 This is a schematic diagram of the data processing and transmission board in an embodiment of the present invention; Figure 6 This is a schematic diagram of the electromagnetic ultrasonic thickness measuring probe in an embodiment of this utility model. Detailed Implementation
[0015] The present invention will be further described below with reference to the accompanying drawings and specific embodiments: like Figure 1-6 An electromagnetic ultrasonic thickness measurement module is shown, comprising a signal receiving board 1, an electromagnetic ultrasonic excitation board 2, a data processing and transmission board 3, and an electromagnetic ultrasonic thickness measurement probe 4. The signal receiving board 1, the electromagnetic ultrasonic excitation board 2, and the data processing and transmission board 3 are stacked and assembled sequentially from top to bottom. The signal receiving board 1, the electromagnetic ultrasonic excitation board 2, and the data processing and transmission board 3 are electrically connected to each other in pairs, and the electromagnetic ultrasonic thickness measurement probe 4 is electrically connected to the electromagnetic ultrasonic excitation board 2.
[0016] The aforementioned electromagnetic ultrasonic thickness measurement module is divided into three sections based on transmission, reception, and data processing. These sections are then stacked vertically for three-dimensional assembly. Compared to the traditional flat layout, this significantly reduces the overall size of the module (achieving a miniaturized size of approximately 150mm × 26mm × 25mm) and weight (approximately 150g including the probe). This allows it to fit into the limited installation space of small automated equipment such as automatic crawlers and drones, meeting the needs of space-constrained scenarios.
[0017] The signal receiving board 1 is equipped with a first power supply circuit 101 and an ultrasonic signal capture and analog signal receiving amplification circuit 102; the electromagnetic ultrasonic excitation board 2 is equipped with a second power supply circuit 201, a probe interface circuit 202, and a high-voltage excitation circuit 203; the data processing and transmission board 3 is equipped with an analog-to-digital conversion circuit 301, a digital processing circuit 302, a network communication interface 303, a serial communication interface 304, a WIFI communication circuit (located on the lower surface of the data processing and transmission board 3), and a cascading interface 305; the signal output terminal of the high-voltage excitation circuit 203 is electrically connected to the corresponding signal input terminal of the probe interface circuit 202, and the signal output terminal of the probe interface circuit 202 is electrically connected to the corresponding signal input terminal of the electromagnetic ultrasonic thickness measuring probe 4; the signal output terminal of the electromagnetic ultrasonic thickness measuring probe 4 is electrically connected to the corresponding signal input terminal of the ultrasonic signal capture and analog signal receiving amplification circuit 102, and the signal output terminal of the ultrasonic signal capture and analog signal receiving amplification circuit 102 is electrically connected to the corresponding signal input terminal of the electromagnetic ultrasonic thickness measuring probe 4. The signal input terminal of the analog-to-digital converter 301 is electrically connected to the signal input terminal of the digital processing circuit 302. The signal output terminal of the digital processing circuit 302 is electrically connected to the signal input terminals of the network communication interface 303, serial communication interface 304, WIFI communication circuit, and cascade interface 305, respectively. The power supply output terminal of the first power supply circuit 101 is electrically connected to the power supply input terminals of the ultrasonic signal capture and analog signal receiving amplification circuit 102 on the signal receiving board 1, the analog-to-digital converter 301 on the data processing and transmission board 3, the digital processing circuit 302, the network communication interface 303, the serial communication interface 304, the WIFI communication circuit, and the cascade interface 305, respectively. The power supply output terminal of the second power supply circuit 201 is electrically connected to the power supply input terminals of the probe interface circuit 202 and the high-voltage excitation circuit 203 on the electromagnetic ultrasonic excitation board 2, respectively.
[0018] During thickness measurement, the high-frequency excitation signal generated by the high-voltage excitation circuit 203 is transmitted to the electromagnetic ultrasonic thickness measuring probe 4 via the probe interface circuit 202, driving the electromagnetic ultrasonic thickness measuring probe 4 to excite ultrasonic waves. The returned ultrasonic echo signal is captured and amplified by the ultrasonic signal capture and analog signal receiving amplification circuit 102, then converted from analog to digital by the analog-to-digital conversion circuit 301, and the thickness data is calculated by the digital processing circuit 302. Finally, the data is transmitted back in real time through multiple communication interfaces, ensuring lossless signal transmission and efficient data processing. In single-channel operation, one module is sufficient. When multi-channel collaborative measurement is required, the cascading interface 305 provides a connection basis for interconnecting multiple modules, allowing various modules to be connected through the cascading interface 305, solving the problem of low efficiency in traditional single-module measurements. Meanwhile, by adopting a dual-power-circuit independent power supply design, the first power supply circuit 101 supplies power to various circuits and interfaces on the signal receiving board 1 and the data processing and transmission board 3, while the second power supply circuit 201 focuses on supplying power to the high-voltage excitation and probe operation. This avoids electromagnetic interference and voltage fluctuations caused by different types of circuits sharing the same power supply (for example, the high-voltage excitation circuit 203 needs to output an instantaneous high-frequency high-voltage signal to drive the probe coil to induce eddy currents, resulting in drastic current changes, high power consumption peaks, and strong electromagnetic radiation during operation; while the ultrasonic signal acquisition and analog signal receiving circuit processes the microvolt-level weak echo signal returned by the probe, which is extremely sensitive to electromagnetic interference and requires a stable low-voltage power supply environment), ensuring the signal-to-noise ratio of ultrasonic signal acquisition and the stability of data processing; the independent power supply structure can also flexibly match the power supply parameters according to the power consumption requirements of each circuit, reduce the overall power consumption of the system, improve the reliability of the module in complex industrial environments, and avoid measurement interruptions caused by unstable power supply.
[0019] The signal receiving board 1 and the electromagnetic ultrasonic excitation board 2 are respectively equipped with matching transmit and receive signal plugs / sockets 5; the electromagnetic ultrasonic excitation board 2 and the data processing and transmission board 3 are respectively equipped with matching signal control plugs / sockets 6; the signal receiving board 1 and the data processing and transmission board 3 are respectively equipped with matching ultrasonic analog signal plugs / sockets 7; the signal receiving board 1 and the data processing and transmission board 3 are also respectively equipped with matching system grounding and power supply plugs / sockets 8; the three boards are electrically connected to each other through the combination of these four plugs / sockets.
[0020] The cascade interface 305 includes a synchronization input signal pin, a synchronization output signal pin, a reset input signal pin, a reset output signal pin, and a ground signal pin. Multiple electromagnetic ultrasonic thickness measurement modules are combined to achieve multi-module, multi-channel collaborative measurement. When multiple electromagnetic ultrasonic thickness measurement modules are cascaded, the synchronization output signal pin of the preceding module is electrically connected to the synchronization input signal pin of the following module; the reset output signal pin of the preceding module is electrically connected to the reset input signal pin of the following module; the reset output signal pin of the last module is electrically connected to the reset input signal pin of the first module; and the ground signal pins of all modules are electrically connected to each other. This structure enables orderly collaboration among multiple modules, ensuring the overall stability of the system.
[0021] The electromagnetic ultrasonic thickness measuring probe 4 includes a housing 401, a permanent magnet 402, a sound insulation layer 403, an electromagnetic coil 404, and a heat insulation composite layer 405. The permanent magnet 402, the sound insulation layer 403, and the electromagnetic coil 404 are installed sequentially from top to bottom inside the housing 401, and the permanent magnet 402 and the electromagnetic coil 404 are positioned correspondingly. The housing 401 has a lower opening that communicates with the interior. The heat insulation composite layer 405 is installed at the lower opening of the housing 401 and covers the lower opening. The heat insulation composite layer 405 is located below the electromagnetic coil 404. The permanent magnet 402 provides a stable static magnetic field, which interacts with the eddy currents induced by the electromagnetic coil 404 to generate Lorentz force, thereby exciting ultrasonic waves. The sound insulation layer 403 can block the influence of external environmental noise and internal circuit interference on the electromagnetic coil 404, reduce the noise interference of ultrasonic echo signals, and improve measurement accuracy. The heat insulation composite layer 405 ensures that the probe can directly contact the high-temperature metal workpiece, effectively blocking the conduction of high-temperature heat radiation into the probe, protecting the core components such as the permanent magnet 402 and the electromagnetic coil 404 from high-temperature damage, and making the probe suitable for high-temperature measurement scenarios.
[0022] The thermal insulation layer 405 comprises, from top to bottom, a polyimide plate 4051, a porous vacuum silicone insulation cotton 4052, and an aluminum silicate ceramic plate 4053. The thermal insulation layer 405 is composed of three layers. The bottom aluminum silicate ceramic plate 4053 directly contacts the high-temperature workpiece and possesses excellent high-temperature resistance. The middle layer, the porous vacuum silicone insulation cotton 4052, utilizes a vacuum structure to block heat conduction, while the silicone material also acts as a buffer, reducing mechanical impact when the probe contacts the workpiece. The top polyimide plate 4051 has good mechanical strength and insulation properties, both fixing the lower insulation material and preventing electrical interference between the electromagnetic coil 404 and the insulation layer. The three-layer structure integrates high-temperature resistance, efficient thermal insulation, and structural support, resulting in a more significant thermal insulation effect compared to a single insulation material. This allows the probe to operate continuously and stably at 350℃, meeting the continuous thickness measurement requirements of high-temperature metal workpieces.
[0023] The electromagnetic ultrasonic thickness measuring probe 4 also includes a probe cover 406, a plug wire 407, and a lead wire 408. The outer shell 401 is cylindrical, and the probe cover 406 is installed on the top of the outer shell 401, covering the upper opening of the outer shell 401. An outlet is opened on the outside of the outer shell 401, and the plug wire 407 is fixed at the outlet and extends outward. The lead wire 408 is disposed inside the outer shell 401, with one end of the lead wire 408 soldered to the electrode of the electromagnetic coil 404, and the other end of the lead wire 408 extending to the outlet and connecting to the plug wire 407. The lead wire 408 connects the coil to the plug wire 407, and the plug wire 407 allows the probe to interface with the probe interface circuit 202 of the electromagnetic ultrasonic excitation board 2.
Claims
1. An electromagnetic ultrasonic thickness measurement module, characterized in that: It includes a signal receiving board, an electromagnetic ultrasonic excitation board, a data processing and transmission board, and an electromagnetic ultrasonic thickness measuring probe. The signal receiving board, the electromagnetic ultrasonic excitation board, and the data processing and transmission board are stacked and assembled in sequence from top to bottom. The signal receiving board, the electromagnetic ultrasonic excitation board, and the data processing and transmission board are electrically connected to each other in pairs, and the electromagnetic ultrasonic thickness measuring probe is electrically connected to the electromagnetic ultrasonic excitation board.
2. The electromagnetic ultrasonic thickness measurement module as described in claim 1, characterized in that: The signal receiving board is equipped with a first power supply circuit and an ultrasonic signal acquisition and analog signal receiving amplification circuit; the electromagnetic ultrasonic excitation board is equipped with a second power supply circuit, a probe interface circuit, and a high-voltage excitation circuit; the data processing and transmission board is equipped with an analog-to-digital conversion circuit, a digital processing circuit, a network communication interface, a serial communication interface, a WIFI communication circuit, and a cascading interface; the signal output terminal of the high-voltage excitation circuit is electrically connected to the signal input terminal corresponding to the probe interface circuit, and the signal output terminal of the probe interface circuit is electrically connected to the signal input terminal corresponding to the electromagnetic ultrasonic thickness measuring probe; the signal output terminal of the electromagnetic ultrasonic thickness measuring probe is electrically connected to the signal input terminal corresponding to the ultrasonic signal acquisition and analog signal receiving amplification circuit, and the signal output terminal of the ultrasonic signal acquisition and analog signal receiving amplification .... The signal input terminals of the analog-to-digital conversion circuit are electrically connected, and the signal output terminals of the analog-to-digital conversion circuit are electrically connected to the signal input terminals of the digital processing circuit. The signal output terminals of the digital processing circuit are electrically connected to the signal input terminals of the network communication interface, serial communication interface, WIFI communication circuit, and cascade interface, respectively. The power supply output terminals of the first power supply circuit are electrically connected to the power supply input terminals of the ultrasonic signal capture and analog signal receiving amplification circuit on the signal receiving board, the analog-to-digital conversion circuit on the data processing and transmission board, the digital processing circuit, the network communication interface, the serial communication interface, the WIFI communication circuit, and the cascade interface, respectively. The power supply output terminals of the second power supply circuit are electrically connected to the power supply input terminals of the probe interface circuit and the high-voltage excitation circuit on the electromagnetic ultrasonic excitation board, respectively.
3. The electromagnetic ultrasonic thickness measurement module as described in claim 2, characterized in that: The cascaded interface includes a synchronous input signal pin, a synchronous output signal pin, a reset input signal pin, a reset output signal pin, and a ground signal pin.
4. The electromagnetic ultrasonic thickness measurement module as described in claim 1, characterized in that: The electromagnetic ultrasonic thickness measuring probe includes a shell, a permanent magnet, a sound insulation layer, an electromagnetic coil, and a heat insulation composite layer. The permanent magnet, the sound insulation layer, and the electromagnetic coil are installed inside the shell from top to bottom, and the permanent magnet and the electromagnetic coil are positioned correspondingly. The shell has a lower opening that communicates with the interior. The heat insulation composite layer is installed at the lower opening of the shell and covers the lower opening. The heat insulation composite layer is located below the electromagnetic coil.
5. The electromagnetic ultrasonic thickness measurement module as described in claim 4, characterized in that: The thermal insulation composite layer comprises, from top to bottom, a polyimide plate, a porous vacuum silicone insulation cotton, and an aluminum silicate ceramic plate.
6. The electromagnetic ultrasonic thickness measurement module as described in claim 4, characterized in that: The electromagnetic ultrasonic thickness measuring probe also includes a probe cover, a plug wire, and a lead wire. The outer shell is cylindrical, and the probe cover is installed on the top of the outer shell and covers the upper opening of the outer shell. The outer side of the outer shell has an outlet, the plug wire is fixed at the outlet and extends outward, the lead wire is set inside the outer shell, and one end of the lead wire is welded to the electrode of the electromagnetic coil, and the other end of the lead wire extends to the outlet and is connected to the plug wire.