Cooling device and computing device

Abstract

The embodiment of the application provides a cooling device and a computing device, the cooling device comprises at least one liquid cooling module, the liquid cooling module comprises a liquid cooling plate and at least one computing power plate; the inside of the liquid cooling plate is defined with a cooling flow channel for the flow of a cooling medium, and at least one side surface of the liquid cooling plate is formed with a liquid cooling surface; one side of the computing power plate is provided with a plurality of computing modules, and the computing modules are in contact with the liquid cooling surface; the computing module is in close contact with the liquid cooling surface of the liquid cooling plate, so that the liquid cooling surface of the liquid cooling plate can take away the heat of the computing power plate at the position, the heat dissipation efficiency of the computing power plate is improved, so that the computing power plate can maintain a lower temperature when operating under high load, and the performance decline or damage caused by overheating of the computing power plate is avoided.

Description

[0001] This application claims priority to Chinese Patent Application No. 202520133765.6, filed on January 20, 2025, entitled "Cooling Apparatus and Computing Device", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of computing device technology, and more particularly to a cooling device and a computing device. Background Technology

[0003] Data centers typically house multiple computing devices and cooling systems. The computing devices generate a significant amount of heat during operation, and the cooling systems ensure that the computing devices operate within a safe temperature range, preventing performance degradation and hardware damage due to overheating.

[0004] In related technologies, cooling equipment generally includes multiple fans to dissipate heat from computing devices. However, since the cooling airflow can only flow through a limited number of components, the overall heat dissipation effect of computing devices still needs to be improved. Utility Model Content

[0005] This application provides a cooling device and a computing device to solve or alleviate one or more technical problems in the prior art.

[0006] As one aspect of the embodiments of this application, this application provides a cooling device, which includes:

[0007] At least one liquid cooling module, each liquid cooling module including a liquid cooling plate and at least one computing board; the interior of the liquid cooling plate defines a cooling channel for the flow of cooling medium, and at least one side surface of the liquid cooling plate is formed with a liquid cooling surface;

[0008] One side of the computing board has multiple computing modules, which are in contact with the liquid-cooled surface.

[0009] In some embodiments, liquid cooling surfaces are formed on opposite sides of the liquid cooling plate, and two computing boards are respectively disposed on the two liquid cooling surfaces of the liquid cooling plate.

[0010] In some embodiments, the number of computing boards is two, and the computing modules of the two computing boards are respectively opposite to different liquid-cooled surfaces.

[0011] In some embodiments, each liquid cooling module further includes at least one cover plate for securing the computing board to the liquid cooling surface.

[0012] In some embodiments, liquid cooling surfaces are formed on opposite sides of the liquid cooling plate, and each liquid cooling surface is provided with a cover plate and a computing board, with a computing module on the side of the computing board away from the cover plate.

[0013] In some embodiments, liquid cooling surfaces are formed on opposite sides of the liquid cooling plate, and two cover plates are provided, with the two cover plates connected to the two liquid cooling surfaces respectively.

[0014] In some embodiments, the liquid-cooled surface is non-planar.

[0015] In some embodiments, the liquid-cooled surface has at least one boss that contacts the computing module.

[0016] In some embodiments, multiple computing modules are arranged in columns, with each column of computing modules corresponding to a boss.

[0017] In some embodiments, the number of liquid cooling modules is two or more, and the two or more liquid cooling modules are stacked.

[0018] In some embodiments, the cooling channels of different liquid cooling modules are connected.

[0019] In some embodiments, the cooling channels of different liquid cooling modules are arranged in parallel.

[0020] In some embodiments, the cooling channels of different liquid cooling modules are connected in series.

[0021] In some embodiments, the cooling channel includes at least two channels.

[0022] In some embodiments, at least two flow channels are oriented in the same and / or opposite directions.

[0023] In some embodiments, the cooling channel includes a first channel and a second channel, the output end of the first channel is connected to the input end of the second channel, and the flow direction of the first channel is opposite to that of the second channel.

[0024] In some embodiments, the extension path of the first flow channel is the same as the extension path of the second flow channel.

[0025] In some embodiments, in two adjacent liquid cooling modules, the output end of the first flow channel of the first liquid cooling module is connected to the input end of the first flow channel of the second liquid cooling module, the output end of the first flow channel of the second liquid cooling module is connected to the input end of the second flow channel of the second liquid cooling module, and the output end of the second flow channel of the second liquid cooling module is connected to the input end of the second flow channel of the first liquid cooling module.

[0026] In some embodiments, the input and output ends of the first flow channel of the first liquid cooling module and the input and output ends of the second flow channel are respectively provided with connectors, and the input and output ends of the first flow channel of the second liquid cooling module and the second flow channel are respectively provided with connectors.

[0027] The output end of the first flow channel of the first liquid cooling module and the input end of the first flow channel of the second liquid cooling module are connected by a first connecting pipe, the output end of the first flow channel of the second liquid cooling module and the input end of the second flow channel of the second liquid cooling module are connected by a second connecting pipe, and the output end of the second flow channel of the second liquid cooling module and the input end of the second flow channel of the first liquid cooling module are connected by a third connecting pipe.

[0028] In some embodiments, the computing board is provided with multiple sets of computing modules arranged at intervals along the second direction, and multiple computing modules in each set of computing modules are arranged adjacently along the first direction; the first flow channel includes multiple first sub-flow channels connected in sequence, and the second flow channel includes multiple second sub-flow channels connected in sequence, and the extension direction of the first sub-flow channel and the extension direction of the second sub-flow channel are parallel to the first direction.

[0029] Each set of computing modules corresponds to at least one first sub-channel and / or at least one second sub-channel.

[0030] In some embodiments, each group of computing modules includes three columns of computing units spaced apart along a second direction; each group of computing modules corresponds to two first sub-channels and one second sub-channel; or, each group of computing modules corresponds to one first sub-channel and two second sub-channels.

[0031] In some embodiments, the distance between two adjacent sets of computing modules is greater than the distance between adjacent computing modules within each set; the multiple sets of computing modules include two first sets of computing modules and two second sets of computing modules, the two first sets of computing modules and the two second sets of computing modules are arranged at intervals along a second direction, the first set of computing modules corresponds to one first sub-channel and two second sub-channels, and the second set of computing modules corresponds to two first sub-channels and one second sub-channel.

[0032] In some embodiments, it further includes a power connector, through which two or more liquid cooling modules are electrically connected.

[0033] In some embodiments, the power connector rigidly connects two or more liquid cooling modules.

[0034] In some embodiments, each liquid cooling module further includes at least one cover plate connected to the liquid cooling plate for fixing the computing board to the liquid cooling surface; the cooling device further includes a fastening structure for fixing the liquid cooling plate, the computing board and the cover plate together.

[0035] In some embodiments, the fastening structure is a threaded fastener.

[0036] In some embodiments, the cover plate has a plurality of first through holes, the computing board has a plurality of second through holes, and the liquid cooling plate has a plurality of positioning holes; the cooling device further includes:

[0037] Multiple fasteners correspond one-to-one with multiple first through holes and multiple second through holes, and the fasteners are sequentially inserted into the corresponding first through holes, second through holes and positioning holes.

[0038] In some embodiments, the fastener includes a connecting post and a limiting protrusion, the limiting protrusion being formed by the outward protrusion of the outer peripheral wall of the connecting post; wherein the connecting post is sequentially disposed in the corresponding first through hole, second through hole and positioning hole, the limiting protrusion is located between the liquid cooling plate and the computing plate, and the two end faces of the limiting protrusion abut against the liquid cooling surface of the liquid cooling plate and the surface of the computing plate adjacent to the liquid cooling plate, respectively.

[0039] In some embodiments, the fastener further includes a locking portion that is detachably connected to a portion of the connecting post located on the side of the cover plate away from the liquid cooling plate, and the locking portion abuts against the surface of the cover plate on the side away from the computing board.

[0040] In some embodiments, the cover plate has a recessed portion surrounding the periphery of the first through hole, the recessed portion being recessed along the side facing the computing board, and the surface of the recessed portion adjacent to the computing board abutting against the surface of the computing board.

[0041] In some embodiments, the recess defines a groove on the side opposite to the computing board, and at least a portion of the locking portion is received within the groove.

[0042] In some embodiments, each liquid cooling module further includes at least one cover plate connected to the liquid cooling plate for fixing the computing board to the liquid cooling surface. The cover plate includes a clamping structure for tightly fitting the liquid cooling plate and the computing board together.

[0043] In some embodiments, the clamping structure is an elastic clamping structure.

[0044] In some embodiments, the clamping structure includes a support portion that abuts against the surface of the computing board.

[0045] In some embodiments, the support includes a plurality of support pads disposed on the side of the cover plate facing the liquid cooling module, the surfaces of the plurality of support pads abutting against the surface of the computing board, and the material of the support pads includes an elastic material.

[0046] In some embodiments, the support portion includes a plurality of support protrusions, which are formed by a portion of the cover plate protruding in a direction toward the computing board, and the surface of the support protrusion abuts against the surface of the computing board.

[0047] In some embodiments, the support includes multiple support arms, the cover plate has multiple hollowed-out heat dissipation holes, one end of the support arm is connected to the edge of the corresponding heat dissipation hole, and the other end of the support arm is bent and abuts against the surface of the computing board.

[0048] In some embodiments, an insulating layer is provided on the outer surface of the liquid cooling plate.

[0049] As another aspect of the embodiments of this application, the embodiments of this application also provide a computing device, which specifically includes a cooling device as described in any of the above embodiments.

[0050] The embodiments of this application have the following beneficial effects:

[0051] Based on the cooling device and computing equipment provided above, the computing module is attached to the liquid cooling surface of the liquid cooling plate so that the liquid cooling surface of the liquid cooling plate can remove the heat of the computing board at that location, thereby improving the heat dissipation efficiency of the computing board. This allows the computing board to maintain a low temperature during high-load computing and avoids performance degradation or damage caused by overheating of the computing board. Attached Figure Description

[0052] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments disclosed in this application and should not be construed as limiting the scope of this application.

[0053] Figure 1 A schematic diagram of the structure of a cooling device according to an embodiment of this application is shown;

[0054] Figure 2 A cross-sectional view of a liquid cooling module according to an embodiment of this application is shown;

[0055] Figure 3 An exploded view of a liquid cooling module according to an embodiment of this application is shown;

[0056] Figure 4 A schematic diagram of the computing board according to an embodiment of this application is shown;

[0057] Figure 5 A cross-sectional view of a liquid cooling module according to an embodiment of this application is shown;

[0058] Figure 6 Show Figure 5 Enlarged diagram of A in the middle;

[0059] Figure 7 Show Figure 5 Enlarged diagram of B in the diagram;

[0060] Figure 8 This diagram shows a structural schematic of a cover plate according to a first embodiment of the present application;

[0061] Figure 9 A schematic diagram of the cover plate according to a second embodiment of this application is shown;

[0062] Figure 10A schematic diagram of the cover plate according to a third embodiment of this application is shown;

[0063] Figure 11 A schematic diagram of the cover plate according to a third embodiment of this application is shown.

[0064] Explanation of reference numerals in the attached figures:

[0065] 1. Computing equipment;

[0066] 10. Cooling device;

[0067] 100. Liquid cooling module; 110. Liquid cooling plate; 111. Cooling channel; 1111. First channel; 1111a. First sub-channel; 1112. Second channel; 1112a. Second sub-channel; 112. Liquid cooling surface; 113. Positioning hole; 114. Boss; 120. Cover plate; 121. First through hole; 122. Recess; 123. Groove; 124. Support part; 1241. Support pad; 1242. Support arm; 1243. Support protrusion; 125. Heat dissipation hole; 130. Fastener; 131. Connecting post; 132. Limiting protrusion; 133. Locking part;

[0068] 200, Computing board; 210, Computing module; 220, Second through hole;

[0069] 300. Connector;

[0070] 400. Limiting protrusion;

[0071] X, the first direction; Y, the second direction. Detailed Implementation

[0072] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this application. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0073] The following combination Figures 1 to 11 The cooling device 10 of the embodiments of this application will be described in detail.

[0074] Figure 1 This diagram shows a schematic representation of the cooling device 10 according to an embodiment of the present application. Figure 2 A cross-sectional view of a liquid cooling module 100 according to an embodiment of this application is shown. Figure 3 An exploded view of a liquid cooling module 100 according to an embodiment of this application is shown. See also: Figures 1 to 3The cooling device 10 in this application embodiment includes at least one liquid cooling module 100. Each liquid cooling module 100 includes a liquid cooling plate 110 and at least one computing board 200. The liquid cooling plate 110 in the liquid cooling module 100 is used to provide cooling for the computing board 200.

[0075] In some embodiments, a plurality of computing modules 210 are provided on one side of the computing board 200, and the computing modules 210 are in contact with the liquid cooling surface 112.

[0076] Understandably, the computing modules 210 on the computing board 200 are usually the most heat-generating parts. These computing modules 210 (such as CPU, GPU, etc.) generate a lot of heat when running under high load. If heat is not dissipated in a timely and effective manner, the computing modules 210 may overheat, thereby affecting system performance and stability, and may even damage the hardware.

[0077] According to an embodiment of this application, the computing module 210 can be attached to the liquid cooling surface 112 of the liquid cooling plate 110 so that the liquid cooling surface 112 of the liquid cooling plate 110 can carry away the heat of the computing module 210 at that location.

[0078] In some embodiments, liquid cooling surfaces 112 are formed on opposite sides of the liquid cooling plate 110, and two computing boards 200 are respectively disposed on the two liquid cooling surfaces 112 of the liquid cooling plate 110. This arrangement enables both liquid cooling surfaces 112 of the liquid cooling plate 110 to cool the computing boards 200.

[0079] In some embodiments, there are two computing boards 200, and the computing modules 210 of the two computing boards 200 are respectively opposite to different liquid cooling surfaces 112. With this arrangement, the two liquid cooling surfaces 112 can contact the computing modules 210 of the two computing boards 200 respectively, thereby achieving the cooling effect on the computing boards 200.

[0080] Figure 4 This diagram shows a structural schematic of a computing board 200 according to an embodiment of this application. Figure 5 A cross-sectional view of a liquid cooling module 100 according to an embodiment of this application is shown. See also Figures 3 to 5 The liquid-cooled module 100 includes a cooling structure and at least one clamping device. The liquid-cooled structure can be a liquid-cooled heat sink, a liquid-cooled box, a liquid-cooled plate 110, etc., but is not limited to the examples listed above. Specifically, the cooling structure is a liquid-cooled plate 110. The clamping device can be a structure for fixing the computing board 200 to the liquid-cooled surface 112, such as a bolt clamping device, a spring clamping device, a pneumatic or hydraulic clamping device, etc., but is not limited to the examples listed above.

[0081] Specifically, the clamping device is a cover plate 120. Further, the liquid cooling plate 110 has a cooling channel 111 defined inside for the flow of cooling medium. At least one side surface of the liquid cooling plate 110 has a liquid cooling surface 112. The cover plate 120 is connected to the liquid cooling plate 110 and is used to fix the computing board 200 to the liquid cooling surface 112. The computing board 200 generates heat during operation. In this embodiment, the cover plate 120 fixes the computing board 200 to the liquid cooling surface 112 of the liquid cooling plate 110. That is, by attaching the computing board 200 to the liquid cooling surface 112, the heat generated by the computing board 200 can be quickly transferred to the liquid cooling plate 110 through the liquid cooling surface 112, thereby improving the heat dissipation efficiency of the computing board 200. Secondly, the cooling medium flows through the cooling channels 111 inside the liquid cooling plate 110, which can continuously absorb and remove the heat generated by the computing board 200 during the operation, thereby continuously providing cooling for the computing board 200. This allows the computing board 200 to maintain a low temperature during high-load operation, reducing the possibility of performance degradation or damage caused by overheating of the computing board 200.

[0082] In this embodiment, the cover plate 120 is a structure that can fix the computing board 200 on the liquid cooling surface 112 of the liquid cooling plate 110. For example, it can be a strip-shaped clamping member, a clamping screw, an elastic clamping member, a clamping fixing member, etc.

[0083] In this embodiment, the cooling medium is a liquid capable of absorbing and reducing heat. Specifically, the cooling medium can be a liquid capable of continuously absorbing and carrying away the heat generated by the computing board 200 during the computing process.

[0084] In some examples, water can be used as the cooling medium.

[0085] In other examples, the cooling medium may be a fluorinated liquid.

[0086] It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. For example, the cooling medium flowing within the liquid cooling plate 110 may also be ethylene glycol solvent, glycerin, or other types of liquid coolants.

[0087] For example, the number of cover plates 120 can be one, two, three, or four, etc. It should be noted that the above is merely illustrative and does not constitute a limitation on this application. Those skilled in the art will understand that a corresponding number of liquid cooling modules 100 can be provided according to the shape of the liquid cooling plate 110, and this is not limited to this.

[0088] In some embodiments, each liquid cooling module 100 further includes at least one cover plate 120 connected to the liquid cooling plate 110. The cover plate 120 is used to fix the computing board 200 to the liquid cooling surface 112. The cover plate 120 includes a clamping structure for tightly fitting the liquid cooling plate 110 and the computing board 200 together. With this configuration, the clamping structure can fix the computing board 200 on the liquid cooling surface 112, effectively preventing the computing board 200 from loosening or shifting due to vibration or external force during operation, thereby enhancing the mechanical stability of the system.

[0089] In some embodiments, the clamping structure is an elastic clamping structure, which can provide continuous and uniform pressure to keep the liquid cooling plate 110 and the computing board 200 in close contact at all times, which is beneficial to improving heat transfer efficiency.

[0090] In some embodiments, liquid cooling surfaces 112 are formed on opposite sides of the liquid cooling plate 110, and each liquid cooling surface 112 is provided with a cover plate 120 and a computing board 200. The computing board 200 has a computing module 210 on the side opposite to the cover plate 120.

[0091] For example, liquid cooling plates 110 have liquid cooling surfaces 112 formed on opposite sides of the liquid cooling plate 110, and two cover plates 120 are connected to the two liquid cooling surfaces 112 respectively. The shape of the liquid cooling plate 110 may include the shape of the opposite two surfaces, such as plate-shaped, strip-shaped, disc-shaped, etc., but its shape is not limited to the above examples. Specifically, the liquid cooling plate 110 is cuboid in shape, and there are two cover plates 120. The two cover plates 120 are respectively disposed on opposite sides of the liquid cooling plate 110, and the two cover plates 120 respectively fix the two computing boards 200 to opposite sides of the liquid cooling plate 110, so that one liquid cooling plate 110 can cool two computing boards 200 simultaneously.

[0092] It should be noted that by placing the computing boards 200 on opposite sides of the liquid cooling plate 110, this application effectively increases the distance between the two computing boards 200. This allows the heat from the two computing boards 200 to be transferred to opposite sides of the liquid cooling plate 110, thus preventing the heat from concentrating at the same location on the liquid cooling plate 110. Consequently, the liquid cooling plate 110 can maintain a lower temperature even when the two computing boards 200 are operating under high load, which is beneficial to improving the cooling effect of the cooling device 10 of this application. Furthermore, the two computing boards 200 are located on opposite sides of the cooling channel 111, allowing the heat from the two computing boards 200 to be transferred to the cooling channel 111 through the two liquid cooling surfaces 112, further enhancing the heat dissipation effect of the liquid cooling plate 110.

[0093] It should be noted that the above is only an exemplary description and should not be construed as a limitation of this application. In other examples of this application, the number of liquid cooling surfaces 112 of the liquid cooling plate 110 can be more than two, so that more than two computing boards 200 can be cooled simultaneously by one liquid cooling plate 110.

[0094] In some examples, the liquid cooling plate 110 is cuboid in shape, and there are three liquid cooling surfaces 112 formed on the three side surfaces of the liquid cooling plate 110. There are three cover plates 120, which are respectively disposed on the three liquid cooling surfaces 112 of the liquid cooling plate 110. The three cover plates 120 fix the three computing boards 200 to the three liquid cooling surfaces 112 of the liquid cooling plate 110, so that one liquid cooling plate 110 can cool three computing boards 200 simultaneously.

[0095] In other examples, the liquid cooling plate 110 is cuboid in shape, with four liquid cooling surfaces 112 formed on the four side surfaces of the liquid cooling plate 110. Four cover plates 120 are also present, each disposed on one of the four liquid cooling surfaces 112 of the liquid cooling plate 110. These cover plates 120 fix four computing boards 200 to the four liquid cooling surfaces 112 of the liquid cooling plate 110, enabling one liquid cooling plate 110 to simultaneously cool four computing boards 200.

[0096] It should be noted that this is only an example, and the number of liquid cooling surfaces 112 on the liquid cooling plate 110 can be set according to the actual situation, and the number of corresponding cover plates 120 is not limited to the above example.

[0097] In some embodiments, the liquid cooling surface 112 is non-planar. This configuration allows the liquid cooling surface 112 to make full contact with the computing module 210 of the computing board 200, while increasing the gap between the liquid cooling surface 112 and the computing board 200, thereby increasing the airflow between the liquid cooling surface 112 and the computing board 200, and thus improving the heat dissipation effect of the computing module 210 of the computing board 200.

[0098] In some embodiments, the liquid-cooled surface has at least one protrusion 114 that contacts the computing module 210. This arrangement allows the liquid-cooled surface 112 to fully contact the computing module 210 of the computing board 200 while increasing the gap between the liquid-cooled surface 112 and the computing board 200. This allows the protrusion 114 to dissipate heat from the computing module 210, while the gap between the liquid-cooled surface 112 and the computing board 200 improves airflow and thus enhances the heat dissipation effect of the computing module 210 of the computing board 200.

[0099] In some embodiments, multiple computing modules 210 are arranged in columns, with each column of computing modules 210 corresponding to a boss 114. This arrangement allows the boss 114 to contact the computing module 210, thereby achieving heat dissipation of the computing module 210.

[0100] In some embodiments, the number of liquid cooling modules 100 is two or more, and the two or more liquid cooling modules 100 are stacked.

[0101] In this embodiment, the number of liquid cooling modules 100 can be one or more, such as one, two, three, four, etc., and each liquid cooling module 100 can cool at least one computing board 200. It should be noted that the above is only an example and does not constitute a limitation on this application. Those skilled in the art will understand that different numbers of liquid cooling modules 100 can be provided according to the width and length of the cooling device 10, and are not limited thereto.

[0102] In some embodiments, the cooling channels 111 of different liquid cooling modules 100 are connected in a manner that allows the computing device 1 to have only one cooling medium input pipe and one cooling medium output pipe, thereby reducing the number of pipes in the cooling device 10, simplifying the installation and maintenance of the cooling device 10, and improving the layout rationality of the cooling device 10.

[0103] In some embodiments, the cooling channels 111 of different liquid cooling modules 100 are arranged in parallel.

[0104] It should be noted that the cooling channels 111 of each liquid cooling module 100 are independently connected to the main liquid supply pipe and the return pipe. The cooling medium is diverted from the main liquid supply pipe to the channels of each liquid cooling module 100, and then converges into the return pipe after passing through the liquid cooling module 100. The flow of the cooling medium between each liquid cooling module 100 is parallel, and the flow rate is distributed among each liquid cooling module 100.

[0105] In some embodiments, the cooling channels 111 of different liquid cooling modules 100 are arranged in series.

[0106] For example, the cooling channels 111 of at least two adjacent liquid cooling modules 100 are connected in series. This arrangement allows the computing device 1 to have only one cooling medium input pipe and one cooling medium output pipe, thereby reducing the number of pipes in the cooling device 10, simplifying the installation and maintenance of the cooling device 10, and improving the layout rationality of the cooling device 10.

[0107] It should be noted that the cooling medium flows sequentially through the cooling channel 111 of each liquid cooling module 100, exiting from the first liquid cooling module 100 and entering the next liquid cooling module 100. The flow of the cooling medium between each liquid cooling module 100 is continuous and the flow rate remains consistent.

[0108] In some embodiments, the cooling channel 111 includes at least two channels.

[0109] In some embodiments, at least two flow channels have the same and / or opposite directions. In some examples, there are multiple flow channels, and at least two of the multiple flow channels have the same direction. In other examples, there are multiple flow channels, and at least two of the multiple flow channels have opposite directions. In still other examples, there are multiple flow channels, and at least two of the multiple flow channels have the same direction, and at least two of the multiple flow channels have opposite directions.

[0110] In some embodiments, see Figure 2 The cooling channel 111 includes a first channel 1111 and a second channel 1112. The output end of the first channel 1111 is connected to the input end of the second channel 1112. The flow direction of the first channel 1111 is opposite to that of the second channel 1112.

[0111] It should be noted that the flow direction of the first flow channel 1111 can be understood as the flow direction of the cooling medium from the input end to the output end of the first flow channel 1111. Similarly, the flow direction of the second flow channel 1112 can be understood as the flow direction of the cooling medium from the input end to the output end of the second flow channel 1112. The fact that the flow directions of the first flow channel 1111 and the second flow channel 1112 are opposite means that the general flow direction of the cooling medium within the first flow channel 1111 is generally opposite to the general flow direction within the second flow channel 1112. For example, the flow direction of the cooling medium in the adjacent portions of the first flow channel 1111 and the second flow channel 1112 is opposite.

[0112] Thus, the cooling medium forms a circulating flow path within the liquid cooling plate 110 through the first flow channel 1111 and the second flow channel 1112, which can effectively utilize the internal space of the liquid cooling plate 110, making the cooling device 10 more compact and efficient, ensuring that the cooling medium can fully cover the area that needs heat dissipation, ensuring that the heat of the computing board 200 can be quickly carried away, and improving the overall heat dissipation efficiency of the cooling device 10.

[0113] In this embodiment, the flow directions of the first flow channel 1111 and the second flow channel 1112 are opposite, and at least part of the first flow channel 1111 and the second flow channel 1112 are adjacent. Since the temperature of the cooling medium in the second flow channel 1112 is always higher than the temperature of the cooling medium in the first flow channel 1111, the first flow channel 1111 and the second flow channel 1112 can achieve heat conduction, and the heat can be uniformly transferred between the first flow channel 1111 and the second flow channel 1112, avoiding local overheating or overcooling of the first flow channel 1111 and the second flow channel 1112, and ensuring the uniformity of the temperature distribution of the first flow channel 1111 and the second flow channel 1112.

[0114] It is understood that the diameters of the first flow channel 1111 and the second flow channel 1112 can be selected according to the computing module 210 on the computing board 200. For example, to improve the heat dissipation effect of the computing board 200, the diameters of the first flow channel 1111 and the second flow channel 1112 can be adapted to the width of the computing module 210. With this configuration, when the computing module 210 is in contact with the liquid cooling surface 112 of the liquid cooling plate 110, the orthographic projection of the computing module 210 on the liquid cooling surface 112 falls within the orthographic projections of the first flow channel 1111 and the second flow channel 1112 on the liquid cooling surface 112, so that the first flow channel 1111 and the second flow channel 1112 can cover the computing module 210. It should be noted that this is merely an example and does not constitute a limitation of this application. Those skilled in the art will understand that the diameters of the first flow channel 1111 and the second flow channel 1112 can also be larger than the width of the computing module 210, and are not limited thereto.

[0115] In some embodiments, see Figure 2 The input end of the first flow channel 1111, the output end of the second flow channel 1112, the input end of the second flow channel 1112, and the output end of the first flow channel 1111 are arranged sequentially on the same side of the liquid cooling plate 110 in the first direction X, so that the liquid inlet and liquid outlet of the entire cooling device 10 are located on the same side of the liquid cooling plate 110 in the first direction X, so that the pipes connecting the liquid inlet and liquid outlet of the cooling device 10 can be integrated on the same side of the liquid cooling plate 110 in the first direction X, thereby making the pipeline layout of the cooling device 10 more concentrated and helping to simplify the installation and maintenance of the cooling device 10.

[0116] For example, see Figure 2 The second flow channel 1112 is located inside the first flow channel 1111. In other examples, the first flow channel 1111 is located inside the second flow channel 1112. It should be noted that this is only an example and does not constitute a limitation of this application. Those skilled in the art will understand that the spacing order of the first flow channel 1111 and the second flow channel 1112 can be arranged according to actual pipeline requirements and is not limited thereto.

[0117] In some embodiments, see Figure 2 The input end of the first flow channel 1111 and the output end of the second flow channel 1112 are located near one side of the liquid cooling plate 110 in the second direction Y, and the output end of the first flow channel 1111 and the input end of the second flow channel 1112 are located near the other side of the liquid cooling plate 110 in the second direction Y, and the second direction Y is perpendicular to the first direction X.

[0118] This configuration increases the distance between the input and output ends of the first flow channel 1111, as well as the distance between the input and output ends of the second flow channel 1112. This increases the flow distance of the cooling medium between the input and output ends of the first flow channel 1111 and the second flow channel 1112. On the one hand, this allows the embodiments of this application to effectively utilize the internal space of the liquid cooling plate 110, making the cooling device 10 more compact. On the other hand, the cooling medium can fully cover the areas on the computing board 200 that require heat dissipation, ensuring that the heat from the computing board 200 is quickly dissipated, thus improving the overall heat dissipation efficiency of the cooling device 10.

[0119] It is understandable that "perpendicular" refers to the state where the angle formed by two lines, a line and a surface, or a surface and a surface is 89° to 91°. Equal distances or equal angles refer to the state where the tolerance range is -1% to 1%.

[0120] For example, the output end of the first flow channel 1111 and the input end of the second flow channel 1112 can be connected by a pipe on the other side of the liquid cooling plate 110 in the second direction Y, so that the pipes connecting the liquid inlet and liquid outlet of the cooling device 10 can be integrated on one side of the liquid cooling plate 110 in the second direction Y, and the pipe between the output end of the first flow channel 1111 and the input end of the second flow channel 1112 can be integrated on the other side of the liquid cooling plate 110 in the second direction Y, thereby making the pipeline layout of the cooling device 10 more concentrated, which helps to simplify the installation and maintenance of the cooling device 10.

[0121] In some embodiments, see Figure 2 The extension path of the first flow channel 1111 is the same as the extension path of the second flow channel 1112.

[0122] This configuration increases the area covered by the first flow channel 1111 and the second flow channel 1112 on the liquid cooling plate 110, reduces the gap between the first flow channel 1111 and the second flow channel 1112, and increases the flow distance and coverage area of ​​the cooling medium in the first flow channel 1111 and the second flow channel 1112. On the one hand, this embodiment of the application can effectively utilize the internal space of the liquid cooling plate 110, thereby making the cooling device 10 more compact. On the other hand, the cooling medium can fully cover the area on the computing board 200 that needs heat dissipation, ensuring that the heat of the computing board 200 can be quickly carried away, and improving the overall heat dissipation efficiency of the cooling device 10.

[0123] For example, the extension path of the first flow channel 1111 from the input end to the output end can be as follows: extending from the input end of the first flow channel 1111 along the first direction X to the first edge of the liquid cooling plate 110, then extending a predetermined distance along the second direction Y and then extending again along the first direction X to the second edge, then extending a predetermined distance along the second direction Y and then extending again along the first direction X to the first edge, and so on, to form the first flow channel 1111. The first edge and the second edge are two opposite edges of the liquid cooling plate 110 in the first direction X. It should be noted that this is merely an example and does not constitute a limitation of this application. Those skilled in the art will understand that the extension path of the first flow channel 1111 can also be extended along multiple directions to adapt to the heat dissipation requirements of the computing board 200, and is not limited to this.

[0124] For example, the extension path of the second flow channel 1112 from the input end to the output end can be as follows: extending from the input end of the second flow channel 1112 along the first direction X to the first edge of the liquid cooling plate 110, then extending a predetermined distance along the second direction Y and then extending again along the first direction X to the second edge, then extending a predetermined distance along the second direction Y and then extending again along the first direction X to the first edge, and so on, to form the second flow channel 1112. The first edge and the second edge are two opposite edges of the liquid cooling plate 110 in the first direction X. It should be noted that this is merely an example and does not constitute a limitation of this application. Those skilled in the art will understand that the extension path of the second flow channel 1112 can also extend along multiple directions to adapt to the heat dissipation requirements of the computing board 200, and is not limited to this.

[0125] In some embodiments, see Figure 3 and Figure 4 The computing board 200 is provided with multiple sets of computing modules 210 arranged at intervals along the second direction Y, and multiple computing modules 210 in each set of computing modules 210 are arranged adjacently along the first direction X.

[0126] Understandably, the computing modules 210 on the computing board 200 are usually the most heat-generating parts. These computing modules 210 (such as CPU, GPU, etc.) generate a lot of heat when running under high load. If heat is not dissipated in a timely and effective manner, the computing modules 210 may overheat, thereby affecting system performance and stability, and may even damage the hardware.

[0127] Based on the issues mentioned above, see Figure 2 and Figure 3 In this embodiment of the application, the first flow channel 1111 includes a plurality of sequentially connected first sub-flow channels 1111a, and the second flow channel 1112 includes a plurality of sequentially connected second sub-flow channels 1112a. The extension direction of the first sub-flow channels 1111a and the extension direction of the second sub-flow channels 1112a are parallel to the first direction X. Each set of calculation modules 210 corresponds to at least one first sub-flow channel 1111a and / or at least one second sub-flow channel 1112a. It should be noted that, since the cooling medium in the first sub-channel 1111a and the second sub-channel 1112a is constantly flowing and thus carrying away the heat of the liquid cooling plate 110, the temperature is lower and the cooling rate is faster in the entire cooling device 10 the closer the position is to the first sub-channel 1111a and the second sub-channel 1112a. Therefore, in this embodiment, the computing module 210 is respectively corresponding to the first sub-channel 1111a or the second sub-channel 1112a, so that the position in the liquid cooling plate 110 with a faster cooling rate is attached to the computing module 210, thereby further improving the heat dissipation efficiency of the computing board 200.

[0128] For example, the computing module 210 can be attached to the position in the liquid cooling plate 110 corresponding to the first sub-flow channel 1111a, so that the cooling medium flowing in the first sub-flow channel 1111a can carry away the heat of the computing module 210 at that position. In some other examples, the computing module 210 can be attached to the position in the liquid cooling plate 110 corresponding to the second sub-flow channel 1112a, so that the cooling medium flowing in the second sub-flow channel 1112a can carry away the heat of the computing module 210 at that position. In still some examples, the computing module 210 can be attached to the positions in the liquid cooling plate 110 corresponding to both the first sub-flow channel 1111a and the second sub-flow channel 1112a, so that the cooling medium flowing in both the first sub-flow channel 1111a and the second sub-flow channel 1112a can carry away the heat of the computing module 210 at that position. It should be noted that these are merely examples and do not constitute a limitation of this application. Those skilled in the art will understand that the computing module 210 can be selected to correspond to the first sub-channel 1111a and / or the second sub-channel 1112a according to the heat dissipation requirements, and is not limited thereto.

[0129] In some embodiments, there are multiple liquid cooling modules 100, and the multiple liquid cooling modules 100 are stacked.

[0130] For example, multiple liquid cooling modules 111 can be stacked in a direction perpendicular to the liquid cooling plate 110.

[0131] This design makes full use of the vertical space of the computing device, making it more compact and efficient. The stacked design not only optimizes space utilization but also adapts to the needs of high-density computing environments, thereby achieving better heat dissipation within a limited space.

[0132] In other examples, multiple liquid cooling modules 100 may be stacked in the first direction X or in the second direction Y. It should be noted that these are merely examples and do not constitute a limitation of this application. Those skilled in the art will understand that the stacking method of the liquid cooling modules 100 can be selected according to the actual layout of the computing device and is not limited thereto.

[0133] In some embodiments, each group of computing modules 210 includes three columns of computing units spaced apart along a second direction Y. Each group of computing modules 210 corresponds to two first sub-channels 1111a and one second sub-channel 1112a. Alternatively, each group of computing modules 210 corresponds to one first sub-channel 1111a and two second sub-channels 1112a.

[0134] For example, when the computing board 200 is attached to the liquid cooling surface, the computing module 210 on the computing board 200 is attached to the liquid cooling surface 112 at a position corresponding to the two first sub-channels 1111a and the second sub-channel 1112a, or the computing module 210 on the computing board 200 is attached to the liquid cooling surface 112 at a position corresponding to the first sub-channel 1111a and the two second sub-channels 1112a.

[0135] This configuration allows the computing module 210, which generates the most heat on the computing board 200, to be placed in the position where the liquid cooling plate 110 provides the best cooling and heat dissipation effects. This enables the liquid cooling plate 110 to remove as much heat as possible from the computing module 210 on the computing board 200, thereby improving the heat dissipation efficiency of the cooling device 10.

[0136] In some embodiments, the distance between two adjacent sets of computing modules 210 is greater than the distance between adjacent computing modules 210 within each set. The multiple sets of computing modules 210 include two first sets of computing modules 210 and two second sets of computing modules 210, which are arranged at intervals along a second direction Y. Each first set of computing modules 210 corresponds to one first sub-channel 1111a and two second sub-channels 1112a, and each second set of computing modules 210 corresponds to two first sub-channels 1111a and one second sub-channel 1112a.

[0137] For example, each group of computing modules 210 extends along the first direction X, and the distance between two adjacent groups of computing modules 210 in the second direction is greater than the distance between adjacent computing modules 210 within each group, so that each group of computing modules 210 can correspond as closely as possible to the positions of the first sub-channel 1111a and the second sub-channel 1112a. Secondly, the cooling channels composed of the first sub-channel 1111a and the second sub-channel 1112a are coiled together, with six of each. To increase the proportion of the first and second sub-channels 1111a on the liquid cooling plate 110, the first and second sub-channels 1111a are arranged at intervals along the second direction Y within the liquid cooling plate 110. Based on this, to increase the efficiency of the four groups of computing modules 210 on the computing board 200... To improve the temperature balance among the four sets of computing modules 210, this application arranges the first sub-channels 1111a and 1112a at intervals along the second direction Y. The first set of computing modules 210 is assigned to one first sub-channel 1111a and two second sub-channels 1112a, and the second set of computing modules 210 is assigned to two first sub-channels 1111a and one second sub-channel 1112a. This results in three cooling channels corresponding to the four sets of computing modules 210, thereby making the heat dissipation effect of the four sets of computing modules 210 more balanced.

[0138] In some embodiments, in two adjacent liquid cooling modules 100, the output end of the first flow channel 1111 of the first liquid cooling module 100 is connected to the input end of the first flow channel 1111 of the second liquid cooling module 100, the output end of the first flow channel 1111 of the second liquid cooling module 100 is connected to the input end of the second flow channel 1112 of the second liquid cooling module 100, and the output end of the second flow channel 1112 of the second liquid cooling module 100 is connected to the input end of the second flow channel 1112 of the first liquid cooling module 100. This arrangement enables the computing device to have a cooling medium input pipe and a cooling medium output pipe, thereby reducing the number of pipes in the cooling device 10, simplifying the installation and maintenance of the cooling device 10, and improving the layout rationality of the cooling device 10.

[0139] For example, in an embodiment where there are two liquid cooling modules 100, the output end of the first flow channel 1111 of the first liquid cooling module 100 is connected to the input end of the first flow channel 1111 of the second liquid cooling module 100, the output end of the first flow channel 1111 of the second liquid cooling module 100 is connected to the input end of the second flow channel 1112 of the second liquid cooling module 100, and the output end of the second flow channel 1112 of the second liquid cooling module 100 is connected to the input end of the second flow channel 1112 of the first liquid cooling module 100.

[0140] For example, in an embodiment where the number of liquid cooling modules 100 is three, the output end of the first flow channel 1111 of the first liquid cooling module 100 is connected to the input end of the first flow channel 1111 of the second liquid cooling module 100, the output end of the first flow channel 1111 of the second liquid cooling module 100 is connected to the input end of the first flow channel 1111 of the third liquid cooling module 100, the output end of the first flow channel 1111 of the third liquid cooling module 100 is connected to the input end of the second flow channel 1112 of the third liquid cooling module 100, the output end of the second flow channel 1112 of the third liquid cooling module 100 is connected to the input end of the second flow channel 1112 of the second liquid cooling module 100, and the output end of the second flow channel 1112 of the second liquid cooling module 100 is connected to the input end of the second flow channel 1112 of the first liquid cooling module 100.

[0141] It should be noted that this is merely an example and does not constitute a limitation on this application. Those skilled in the art will understand that the number of liquid cooling modules 100 can be selected according to actual needs and is not limited thereto.

[0142] In some examples, in two adjacent liquid cooling modules 100, computing boards 200 are respectively arranged on both sides of the first liquid cooling module 100, and computing boards 200 are arranged on one side of the second liquid cooling module 100.

[0143] For example, there are three computing boards 200, namely a first computing board 200, a second computing board 200, and a third computing board 200. The first computing board 200 and the second computing board 200 are respectively attached to both sides of the liquid cooling plate 110 of the first liquid cooling module 100, and the third computing board 200 is attached to one side of the liquid cooling plate 110 of the second liquid cooling module 100. The coolant in the first flow channel 1111 and the second flow channel 1112 of the first liquid cooling module 100 carries away the heat of the first computing board 200 and the second computing board 200 when it flows, and the coolant in the first flow channel 1111 and the second flow channel 1112 of the second liquid cooling module 100 carries away the heat of the third computing board 200 when it flows.

[0144] In some embodiments, the input and output ends of the first flow channel 1111 and the second flow channel 1112 of the first liquid cooling module 100 are respectively provided with connectors, and the input and output ends of the first flow channel 1111 and the second flow channel 1112 of the second liquid cooling module 100 are respectively provided with connectors. These connectors are used to connect the aforementioned input or output ends to external pipes or other water system equipment. The connector can be a connecting pipe, a connecting seat, or other connecting structure, but is not limited to the examples listed above. Specifically, the connector is as follows: Figure 8 The connector 300 is shown.

[0145] For example, the output end of the first flow channel 1111 of the first liquid cooling module 100 is connected to the connector 300 of the input end of the first flow channel 1111 of the second liquid cooling module 100 through a first connecting pipe, the output end of the first flow channel 1111 of the second liquid cooling module 100 is connected to the connector 300 of the input end of the second flow channel 1112 of the second liquid cooling module 100 through a second connecting pipe, and the output end of the second flow channel 1112 of the second liquid cooling module 100 is connected to the connector 300 of the input end of the second flow channel 1112 of the first liquid cooling module 100 through a third connecting pipe.

[0146] Exemplary examples show that connector 300 can be a waterproof connector 300 or a locking connector 300. Using a waterproof connector 300 prevents moisture from entering the interior of the cooling channel 111 through the connector 300, while using a locking connector 300 improves the connection between the connector 300 and the inlet and outlet of each cooling channel 111. It should be noted that this is merely an example and does not constitute a limitation of this application. Those skilled in the art will understand that connector 300 can also be a quick connector 300, a compression connector 300, a ferrule connector 300, a threaded connector 300, a welded connector 300, or a flange connector 300, etc., and is not limited thereto.

[0147] In some embodiments, see Figure 2 The connector 300 at the input end of the first flow channel 1111 of the first liquid cooling module 100 is used to connect to the cooling medium input pipe, and the connector 300 at the output end of the second flow channel 1112 of the first liquid cooling module 100 is used to connect to the cooling medium output pipe, so that the entire cooling device 10 requires only one cooling medium input pipe and one cooling medium output pipe. At the same time, the cooling medium input pipe and the cooling medium output pipe can be integrated on one side of the entire cooling device 10, thereby making the piping layout of the cooling device 10 more concentrated and helping to simplify the installation and maintenance of the cooling device 10.

[0148] In some embodiments, the first liquid cooling module 100 includes a first computing board 200 and a second computing board 200, and the second liquid cooling module 100 includes a third computing board 200. The first computing board 200 and the second computing board 200 are respectively disposed on both sides of the first liquid cooling module 100 in the thickness direction, and the third computing board 200 is disposed on one side of the second liquid cooling module 100 in the thickness direction. The output end of the first flow channel 1111 of the first liquid cooling module 100 is connected to and communicates with the input end of the first flow channel 1111 of the second liquid cooling module 100. The output end of the first flow channel 1111 of the second liquid cooling module 100 is connected to and communicates with the input end of the second flow channel 1112 of the second liquid cooling module 100, and the output end of the second flow channel 1112 of the second liquid cooling module 100 is connected to and communicates with the input end of the second flow channel 1112 of the first liquid cooling module 100.

[0149] For example, the first computing board 200 is attached to one side of the first liquid cooling plate 110 in the thickness direction, the second computing board 200 is attached to the other side of the first liquid cooling plate 110 in the thickness direction, and the third computing board 200 is attached to one side of the second liquid cooling plate 110 in the thickness direction. With this configuration, the first flow channel 1111 and the second flow channel 1112 of the first liquid cooling module 100 can simultaneously remove the heat from the first computing board 200 and the second computing board 200, and the first flow channel 1111 and the second flow channel 1112 of the second liquid cooling module 100 can remove the heat from the third computing board 200.

[0150] According to an embodiment of this application, in two adjacent liquid cooling modules 100, coolant enters from the input end of the first flow channel 1111 of the first liquid cooling module 100, flows sequentially through the first flow channel 1111 of the first liquid cooling module 100, the first flow channel 1111 of the second liquid cooling module 100, the second flow channel 1112 of the second liquid cooling module 100, and the second flow channel 1112 of the first liquid cooling module 100, and finally exits from the output end of the second flow channel 1112 of the first liquid cooling module 100. In this embodiment, the first liquid cooling module 100 is responsible for cooling the first computing board 200 and the second computing board 200, and the second liquid cooling module 100 is responsible for cooling the third computing board 200.

[0151] In other embodiments, the first liquid cooling module 100 includes a first computing board 200 and a second computing board 200, and the second liquid cooling module 100 includes a third computing board 200 and a fourth computing board 200. The first computing board 200 and the second computing board 200 are respectively disposed on both sides of the first liquid cooling module 100 in the thickness direction, and the third computing board 200 and the fourth computing board 200 are respectively disposed on both sides of the second liquid cooling module 100 in the thickness direction. The output end of the first flow channel 1111 of the first liquid cooling module 100 is connected to and communicates with the input end of the first flow channel 1111 of the second liquid cooling module 100, the output end of the first flow channel 1111 of the second liquid cooling module 100 is connected to and communicates with the input end of the second flow channel 1112 of the second liquid cooling module 100, and the output end of the second flow channel 1112 of the second liquid cooling module 100 is connected to and communicates with the input end of the second flow channel 1112 of the first liquid cooling module 100.

[0152] For example, the first computing board 200 is attached to one side of the first liquid cooling plate 110 in the thickness direction, the second computing board 200 is attached to the other side of the first liquid cooling plate 110 in the thickness direction, the third computing board 200 is attached to one side of the second liquid cooling plate 110 in the thickness direction, and the fourth computing board 200 is attached to the other side of the second liquid cooling plate 110 in the thickness direction. With this configuration, the first flow channel 1111 and the second flow channel 1112 of the first liquid cooling module 100 can simultaneously remove the heat from the first computing board 200 and the second computing board 200, and the first flow channel 1111 and the second flow channel 1112 of the second liquid cooling module 100 can simultaneously remove the heat from the third computing board 200 and the fourth computing board 200.

[0153] According to an embodiment of this application, in two adjacent liquid cooling modules 100, coolant enters from the input end of the first flow channel 1111 of the first liquid cooling module 100, flows sequentially through the first flow channel 1111 of the first liquid cooling module 100, the first flow channel 1111 of the second liquid cooling module 100, the second flow channel 1112 of the second liquid cooling module 100, and finally exits from the output end of the second flow channel 1112 of the first liquid cooling module 100. Since the temperature of the coolant gradually increases as it flows through the cooling flow channel 111, carrying away heat from the computing board 200, the coolant temperature in the flow channel is ordered from low to high as follows: first flow channel 1111 of the first liquid cooling module 100, first flow channel 1111 of the second liquid cooling module 100, second flow channel 1112 of the second liquid cooling module 100, and second flow channel 1112 of the first liquid cooling module 100. The coolant temperature of the first flow channel 1111 of the first liquid cooling module 100 is a first temperature, the coolant temperature of the second flow channel 1112 of the first liquid cooling module 100 is a second temperature, the coolant temperature of the first flow channel 1111 of the second liquid cooling module 100 is a third temperature, and the coolant temperature of the second flow channel 1112 of the second liquid cooling module 100 is a third temperature. The sum of the first temperature and the second temperature is approximately equal to the sum of the third temperature and the fourth temperature. Based on this, the embodiments of this application are configured such that the first liquid cooling module 100 cools the first computing board 200 and the second computing board 200, and the second liquid cooling module 100 cools the third computing board 200 and the fourth computing board 200, thereby ensuring the balance of heat dissipation effect of the first computing board 200, the second computing board 200, the third computing board 200 and the fourth computing board 200, and improving the temperature balance and stability of the cooling device 10.

[0154] It should be noted that this is merely an example and does not constitute a limitation on this application. Those skilled in the art will understand that the number of computing boards 200 corresponding to each liquid cooling plate 110 is not limited to this.

[0155] In an embodiment where there are three liquid cooling modules 100, the output end of the first flow channel 1111 of the first liquid cooling module 100 is connected to the input end of the first flow channel 1111 of the second liquid cooling module 100, the output end of the first flow channel 1111 of the second liquid cooling module 100 is connected to the input end of the first flow channel 1111 of the third liquid cooling module 100, the output end of the first flow channel 1111 of the third liquid cooling module 100 is connected to the input end of the second flow channel 1112 of the third liquid cooling module 100, the output end of the second flow channel 1112 of the third liquid cooling module 100 is connected to the input end of the second flow channel 1112 of the second liquid cooling module 100, and the output end of the second flow channel 1112 of the second liquid cooling module 100 is connected to the input end of the second flow channel 1112 of the first liquid cooling module 100. That is, when there are multiple liquid cooling modules 100, the coolant medium will sequentially flow through the first flow channel 1111 of multiple liquid cooling modules 100 and then flow back to the second flow channel 1112 of the first liquid cooling module 100 through the second flow channel 1112 of multiple liquid cooling modules 100. This makes the entire cooling device 10 only require one cooling medium inlet pipe and one cooling medium outlet pipe, and the cooling medium inlet pipe and the cooling medium outlet pipe can be integrated on one side of the entire cooling device 10. This makes the piping layout of the cooling device 10 more centralized and helps to simplify the installation and maintenance of the cooling device 10.

[0156] It should be noted that this is merely an example and does not constitute a limitation on this application. Those skilled in the art will understand that the number of liquid cooling modules 100 can be four, five, or six, etc., and it is necessary to ensure that the cooling medium input pipe and cooling medium output pipe of the entire cooling device 10 are located in the first cooling module, but it is not limited to this.

[0157] In some embodiments, this application also includes a power connector, through which two or more liquid cooling modules 100 are electrically connected. This configuration enables the electrical connection of multiple liquid cooling modules 100 through the power connector, integrating the power supply and cooling functions of the liquid cooling modules 100 into one system, reducing the complexity of individual wiring, and improving the overall integration of the liquid cooling device 10.

[0158] In some embodiments, the power connector rigidly connects two or more liquid cooling modules 100. The rigid connection ensures a stable connection between the power connector and the liquid cooling module 100, preventing the power connector from detaching from the liquid cooling module 100, thereby reducing the risk of electrical interference and improving the electrical stability of the system.

[0159] In some embodiments, the cooling channels 111 of multiple liquid cooling modules 100 are arranged in parallel. The parallel arrangement of the cooling channels 111 of multiple liquid cooling modules 100 makes full use of the internal space of the liquid cooling module 100. When there are multiple liquid cooling modules 100, the coolant medium will flow through the first channel 1111 of multiple liquid cooling modules 100 in sequence and then flow back to the second channel 1112 of the first liquid cooling module 100 through the second channel 1112 of multiple liquid cooling modules 100. This makes the entire cooling device 10 only require one cooling medium inlet pipe and one cooling medium outlet pipe. At the same time, the cooling medium inlet pipe and the cooling medium outlet pipe can be integrated on one side of the entire cooling device 10, thereby making the pipeline layout of the cooling device 10 more concentrated, which helps to simplify the installation and maintenance of the cooling device 10, and makes the liquid cooling module 100 more compact and efficient.

[0160] In some embodiments, see Figure 2 The input ends of the first flow channels 1111 of different liquid cooling modules 100 are connected in parallel, and the output ends of the second flow channels 1112 of multiple liquid cooling modules 100 are connected in parallel, so that the cooling medium can pass through the first flow channels 1111 in sequence to remove the heat on the liquid cooling plate 110.

[0161] In some embodiments, each liquid cooling module 100 further includes at least one cover plate 120 connected to the liquid cooling plate 110, and the cover plate 120 is used to fix the computing board 200 to the liquid cooling surface 112. The cooling device 10 also includes a fastening structure for fixing the liquid cooling plate 110, the computing board 200 and the cover plate 120 together. This arrangement can prevent relative movement between the cover plate 120, the computing board 200 and the liquid cooling plate 110, and can fix the computing board 200, the cover plate 120 and the liquid cooling plate 110 together, thereby improving the connection stability between the cover plate 120, the computing board 200 and the liquid cooling plate 110.

[0162] In some embodiments, the fastening structure is a threaded fastener.

[0163] Figure 5 A cross-sectional view of a liquid cooling module 100 according to an embodiment of this application is shown. Figure 6 Show Figure 5 An enlarged schematic diagram of A is shown in some other embodiments. Figures 3 to 6 The cover plate 120 has multiple first through holes 121, the computing board 200 has multiple second through holes 220, and the liquid cooling plate 110 has multiple positioning holes 113. The cooling device 10 also includes multiple connecting structures for connecting and fixing the cover plate 120, the liquid cooling plate 110, and the computing board 200. These connecting structures can be bolt structures, screw structures, snap-fit ​​structures, tenon and mortise structures, etc., but are not limited to the examples listed above. Specifically, the connecting structure is... Figure 6The fastener 130 is shown. Multiple fasteners 130, multiple first through holes 121, and multiple second through holes 220 correspond one-to-one. The fasteners 130 are sequentially inserted into the corresponding first through holes 121, second through holes 220, and positioning holes 113. This arrangement prevents relative movement between the cover plate 120, the computing board 200, and the liquid cooling plate 110, and enables the fixing of the computing board 200, the cover plate 120, and the liquid cooling plate 110, thereby improving the connection stability between the cover plate 120, the computing board 200, and the liquid cooling plate 110.

[0164] For example, a first through hole 121 is provided at each of the four corners of the cover plate 120, four second through holes 220 are provided on the computing board 200, and positioning holes 113 are provided at each of the four corners of the liquid cooling plate 110. There are four fasteners 130, and the four fasteners 130 pass through the four first through holes 121, the four second through holes 220 and the four positioning holes 113 respectively, so that the corners of the computing board 200, the cover plate 120 and the liquid cooling plate 110 are limited, thereby realizing the fixation between the computing board 200, the cover plate 120 and the liquid cooling plate 110. Furthermore, in order to improve the connection stability between the cover plate 120, the computing board 200, and the liquid cooling plate 110, this embodiment of the application can also provide a plurality of first through holes 121 at intervals in the middle position of the cover plate 120, a plurality of second through holes 220 at intervals in the middle position of the computing board 200, and a plurality of positioning holes 113 at intervals in the middle position of the liquid cooling plate 110. And by using fasteners 130 to pass through the first through holes 121 in the middle position of the cover plate 120, the second through holes 220 in the middle position of the computing board 200, and the positioning holes 113 in the middle position of the liquid cooling plate 110 respectively, the connection stability between the computing board 200, the cover plate 120, and the liquid cooling plate 110 can be further improved.

[0165] Of course, the above-described interval settings are merely illustrative examples and do not constitute a limitation on this application. The positions of the first through hole 121, the first through hole 121, and the positioning hole 113 are not limited to the above examples. Provided that a stable connection is achieved between the computing board 200, the cover plate 120, and the liquid cooling plate 110, all other variations or alternatives that can be conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the protection scope of this application.

[0166] In some embodiments, see Figure 6The fastener 130 includes a connecting post 131 and a limiting protrusion 132, which is formed by protruding outward from the outer peripheral wall of the connecting post 131. The connecting post 131 is sequentially inserted through a first through hole 121, a second through hole 220, and a positioning hole 113. The limiting protrusion 132 is located between the liquid cooling plate 110 and the computing board 200. The two end faces of the limiting protrusion 132 abut against the liquid cooling surface 112 of the liquid cooling plate 110 and the surface of the computing board 200 adjacent to the liquid cooling plate 110, respectively. This prevents relative sliding between the liquid cooling plate 110 and the cover plate 120, and also provides additional support for both the liquid cooling plate 110 and the cover plate 120, ensuring their stability during long-term operation.

[0167] In some examples, the two end faces of the limiting protrusion 132 are both planes. On the one hand, making the two end faces of the limiting protrusion plane can increase the contact area between the limiting protrusion 132 and the liquid cooling plate 110 and the cover plate 120 respectively. The larger contact area can provide a more stable mechanical connection between the limiting protrusion 132 and the liquid cooling plate 110 and the cover plate 120 respectively, reducing the relative sliding and displacement between the liquid cooling plate 110 and the cover plate 120, thereby ensuring the stability and reliability of the liquid cooling module 100 during operation. On the other hand, making the end faces of the limiting protrusion 132 plane can make the supporting force applied by the limiting protrusion 132 to the liquid cooling plate 110 and the computing board 200 more uniform, reducing the occurrence of local stress concentration on the liquid cooling plate 110 and the computing board 200, and avoiding deformation or damage to the liquid cooling plate 110 and the cover plate 120 due to excessive local stress.

[0168] It should be noted that the above is merely illustrative and does not constitute a limitation on this application. Those skilled in the art will understand that the two end faces of the limiting protrusion 132 can also be curved surfaces or arc-shaped surfaces, etc., and are not limited thereto.

[0169] In some examples, the cross-section of the limiting protrusion 132 can be square or circular.

[0170] In some embodiments, see Figure 6 The fastener 130 also includes a locking part 133, which is detachably connected to the part of the connecting post 131 located on the side of the cover plate 120 away from the liquid cooling plate 110. The locking part 133 abuts against the surface of the cover plate 120 on the side away from the computing board 200.

[0171] For example, when installing the liquid cooling plate 110 and the cover plate 120, the connecting post 131 is first inserted into the positioning hole 113 of the liquid cooling plate 110. Then, the computing board 200 is placed on the liquid cooling surface 112 on one side of the liquid cooling plate 110, and the connecting post 131 is inserted into the corresponding second through hole 220. At this time, the two end faces of the limiting protrusion 132 abut against the liquid cooling surface 112 of the liquid cooling plate 110 and the surface of the computing board 200 adjacent to the liquid cooling plate 110, respectively. Then, the first through hole 121 of the cover plate 120 is aligned with the connecting post 131 to cover the computing board 200. Finally, the locking part 133 is connected to the part of the connecting post 131 that protrudes from the first through hole 121. With this configuration, the cover plate 120 can be pressed tightly onto the limiting protrusion 132 by the locking part 133.

[0172] It should be noted that the cross-sectional area of ​​the limiting protrusion 132 is larger than the cross-sectional area of ​​the first through hole 121, and the cross-sectional area of ​​the locking part 133 is larger than the cross-sectional area of ​​the first through hole 121, so that the limiting protrusion 132 and the locking part 133 can respectively abut against the two opposite end faces of the cover plate 120.

[0173] In some examples, the connecting post 131 can be a stud, and the limiting protrusion 132 is formed by the stud extending radially outward. Part of the stud is inserted into the positioning hole 113 of the liquid cooling plate 110. Then, the computing board 200 is placed on the liquid cooling surface 112 on one side of the liquid cooling plate 110, and the stud is inserted into the corresponding second through hole 220. At this time, the two end faces of the limiting protrusion 132 abut against the liquid cooling surface 112 of the liquid cooling plate 110 and the surface of the computing board 200 adjacent to the liquid cooling plate 110, respectively. Then, the first through hole 121 of the cover plate 120 is aligned with the stud to cover the computing board 200. Finally, the locking part 133 is connected to the part of the stud protruding from the first through hole 121. With this configuration, the cover plate 120 can be pressed tightly onto the limiting protrusion 132 by the locking part 133.

[0174] See in some examples Figure 6 The portion of the stud protruding from the first through hole 121 is provided with external threads, and the locking part 133 is an anti-slip nut. After the first through hole 121 of the cover plate 120 is aligned with the stud to cover the computing board 200, the anti-slip thread is threadedly connected to the external thread of the stud, so that the anti-slip nut can press the cover plate 120 tightly onto the computing board 200.

[0175] It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. Those skilled in the art will understand that the fastener 130 can also be a screw, bolt, or rivet, etc., and it should be understood that these exemplary physical connection methods should not be construed as limitations on this application.

[0176] In some embodiments, see Figure 6 The cover plate 120 has a recessed portion 122 surrounding the outer periphery of the first through hole 121. The recessed portion 122 is recessed along the side facing the computing board 200. The surface of the recessed portion 122 adjacent to the computing board 200 abuts against the surface of the computing board 200. This arrangement allows the cover plate 120 to abut against the surface of the computing board 200 through the recessed portion 122, thereby creating a gap between the cover plate 120 and the computing board 200 except at the location of the recessed portion 122, allowing air from the cooling device 10 to pass through the gap. The heat is carried away from the computing board 200 by entering between the cover plate 120 and the computing board 200. This allows the cooling device 10 to fix the computing board 200 and the cover plate 120 by the recess 122 abutting against the surface of the computing board 200. On the other hand, by forming a gap between the cover plate 120 and the computing board 200, the cooling device 10 can more efficiently use airflow to carry away heat, reduce the burden on the cooling module 100, improve heat dissipation efficiency, and improve the heat dissipation performance of the cooling device 10.

[0177] For example, the number of recesses 122 is multiple, and the multiple recesses 122 are spaced apart on the side of the cover plate 120 facing the computing board 200. The multiple recesses 122 are evenly arranged in the middle of the cover plate 120. This arrangement can improve the supporting effect of the cover plate 120 on the computing board 200.

[0178] In some embodiments, see Figure 6 The recessed portion 122 has a supporting plane defined on the side facing the computing board 200. The supporting plane abuts against the computing board 200. The provision of the supporting plane increases the contact area between the recessed portion 122 and the computing board 200, and the larger contact area improves the supporting effect between the recessed portion 122 and the computing board 200. Secondly, the provision of the supporting plane makes the supporting force applied by the recessed portion 122 to the computing board 200 more uniform, reduces the phenomenon of local stress concentration on the computing board 200, and avoids deformation or damage to the computing board 200 due to excessive local stress.

[0179] It should be noted that the above is merely illustrative and does not constitute a limitation on this application. Those skilled in the art will understand that the surface of the recessed portion 122 facing the computing board 200 can also be a curved or arc-shaped surface, and is not limited thereto.

[0180] In this embodiment, the connection between the supporting plane and the side of the recess 122 is rounded, thereby forming an arc-shaped surface at the connection between the supporting plane and the side of the recess 122, effectively preventing the recess 122 from damaging the computing board 200. It should be noted that other designs can also be used at the connection between the supporting plane and the side of the recess 122; the above are merely illustrative examples and do not constitute a limitation on this application.

[0181] In some embodiments, see Figure 6 The recessed portion 122 defines a groove 123 on the side opposite to the computing board 200, and at least a portion of the locking portion 133 is accommodated within the groove 123. By accommodating at least a portion of the locking portion 133 within the groove 123, this application reduces the radial displacement and loosening of the locking portion 133, thereby ensuring the connection stability between the cover plate 120 and the computing board 200. Furthermore, by embedding the locking portion 133 within the groove 123, the space occupied by the cooling device 10 is reduced, optimizing the layout of the cooling device 10, saving space, and making the internal structure of the cooling device 10 more organized.

[0182] Figure 7 Show Figure 5 Enlarged diagram of B in the diagram. Figure 8 This diagram shows a structural schematic of the cover plate 120 according to a first embodiment of the present application. Figure 9 This diagram shows a structural schematic of the cover plate 120 according to a second embodiment of the present application. Figure 10 This diagram shows a structural schematic of the cover plate 120 according to a third embodiment of the present application. Figure 11 This diagram illustrates the structure of the cover plate 120 according to a third embodiment of this application. In some embodiments, see [link to related documentation]. Figures 7 to 11 The cover plate 120 is provided with a support structure that abuts against the surface of the computing board 200. The support structure protrudes towards the computing board 200 relative to the cover plate 120, providing additional support points and increasing the contact area between the cover plate 120 and the computing board 200, thereby enhancing the connection stability between the cover plate 120 and the computing board 200. The support part 124 can effectively disperse the pressure between the cover plate 120 and the computing board 200, avoid stress concentration caused by a single contact point, and improve the stability and shock resistance of the entire cooling device 10.

[0183] For example, the number of support parts 124 is multiple, and the multiple support parts 124 are spaced apart on the side of the cover plate 120 facing the computing board 200. The multiple support parts 124 are evenly arranged in the middle position of the cover plate 120. This arrangement can improve the supporting effect of the cover plate 120 on the computing board 200.

[0184] In this embodiment, the recessed portion 122 and the supporting portion 124 are arranged at intervals on the side of the cover plate 120 facing the computing board 200. It should be noted that the interval arrangement of the recessed portion 122 and the supporting portion 124 can also adopt other designs. The above is only an example and does not constitute a limitation of this application.

[0185] In some embodiments, see Figure 8The support portion 124 includes multiple support pads 1241. These support pads 1241 are disposed on the side of the support portion 124 facing the liquid cooling module 100, and their surfaces abut against the surface of the computing board 200. The support pads 1241 can be rubber elastic elements, springs, sponges, etc., but are not limited to the above-mentioned examples. The material of the support pads 1241 includes elastic materials. Support pads 1241 made of elastic materials can provide additional cushioning when subjected to external pressure and impact, further enhancing the pressure resistance and impact resistance of the cooling device 10. The arrangement of multiple support pads 1241 can further disperse vibration and impact forces, reducing the impact on the computing board 200 when the cooling device 10 vibrates.

[0186] In some embodiments, see Figure 9 The support portion 124 includes multiple support arms 1242, and the cover plate 120 has multiple hollowed-out heat dissipation holes 125. External air from the cooling device 10 can enter the gap between the computing board 200 and the cover plate 120 through the heat dissipation holes 125, further improving the airflow between the computing board 200 and the cover plate 120. One end of the support arm 1242 is connected to the edge of the corresponding heat dissipation hole 125, and the other end of the support arm 1242 is bent and abuts against the surface of the computing board 200.

[0187] For example, the support arm 1242 has a certain elasticity. One end of the support arm 1242 is connected to the edge of the heat dissipation hole 125, and the other end of the support arm 1242 is bent and abuts against the surface of the computing board 200. On the one hand, the support arm 1242 can provide support for the computing board 200. On the other hand, the support arm 1242 can provide additional buffer when subjected to external pressure and impact, further enhancing the pressure resistance and impact resistance of the cooling device 10. The arrangement of multiple support arms 1242 can further disperse vibration and impact force, reducing the impact on the computing board 200 when the cooling device 10 vibrates.

[0188] In some embodiments, see Figure 10 and Figure 11 The support portion 124 includes a plurality of support protrusions 1243, which are formed by a portion of the cover plate 120 protruding in a direction toward the computing board 200, and the surface of the support protrusion 1243 abuts against the surface of the computing board 200. The shape of the support protrusion 1243 can be as follows: Figure 11 The rectangle shown can also be upright, circular, etc., but is not limited to the examples listed above. One support protrusion 1243 can correspond to at least one support portion 124, specifically, as shown in... Figure 10As shown, one support protrusion 1243 corresponds to four support parts 124. The support protrusion 1243 can provide additional buffer when subjected to external pressure and impact, further enhancing the pressure resistance and impact resistance of the cooling device 10. The arrangement of multiple support protrusions 1243 can further disperse vibration and impact force, reducing the impact on the computing board 200 when the cooling device 10 vibrates.

[0189] In some embodiments, the outer surface of the liquid cooling plate 110 is provided with an insulating structure, which includes an insulating layer, an insulating coating, an insulating film layer, etc., but is not limited to the above-mentioned examples. Specifically, the insulating structure is an insulating layer, thereby preventing electrical short circuits in the computing board 200.

[0190] For example, the liquid cooling plate 110 is generally made of aluminum plate to improve its thermal conductivity. Based on this, this application utilizes the characteristic that the liquid cooling plate 110 is made of aluminum plate to prepare an alumina insulating layer, which can effectively improve the preparation efficiency of the insulating layer. In the preparation process of the insulating layer, in the embodiments of this application, the aluminum liquid cooling plate 110 is placed as the anode in an electrolytic cell, and then a lead plate or stainless steel plate is used as the cathode. A DC power supply is connected to the anode and the cathode, and finally, an alumina insulating layer is formed on the outer surface of the liquid cooling plate 110 through an oxidation process.

[0191] In the embodiments of this application, the electrolytic cell contains an electrolyte, commonly a sulfuric acid (H2SO4), oxalic acid (H2C2O4), or phosphoric acid (H3PO4) solution. Sulfuric acid solution is the most commonly used choice, with a concentration generally between 15-20%. It should be noted that the electrolyte type described here is merely an example and does not constitute a limitation of this application.

[0192] It should be noted that this is merely an example and does not constitute a limitation on this application. Those skilled in the art will understand that the cathode can also be made of other materials according to actual needs, and is not limited to this. Furthermore, the insulating layer can also be made using other processes and materials, such as forming a glass fiber coating, polytetrafluoroethylene, silicone coating, ceramic coating, or polymer coating on the outer surface of the liquid cooling plate 110 by spraying.

[0193] It should be noted that if the liquid cooling plate is made of a light-colored metal, the insulation layer can be a dark-colored insulation layer, such as black. If the outer surface of the liquid cooling plate 110 is damaged, the dark-colored insulation layer will be damaged first. Therefore, the location of the damage on the outer surface of the liquid cooling plate 110 can be quickly found based on the damage to the insulation layer.

[0194] In some examples, when an aluminum oxide insulating layer is formed on the outer surface of the liquid cooling plate 110 through an oxidation process, the aluminum oxide layer can be made to exhibit a dark color, such as black, blue, or red, by controlling the electrolyte and current. Secondly, these dark colors can also be achieved through a dyeing process.

[0195] In some embodiments, the liquid cooling plate 110 has a mounting structure on at least one side in the second direction Y. This mounting structure is used to mount the liquid cooling plate 110 into the housing. The mounting structure can be screw-fixed, snap-fitted, guided, etc., but is not limited to the examples listed above. Specifically, the mounting structure is a guide structure, used to mount the liquid cooling plate 110 into the housing along a certain direction. The guide structure can be a limiting protrusion, a guide plate, a guide block, etc., but is not limited to the examples listed above. Further, the guide structure is a limiting protrusion 400, which forms a limiting engagement with the slide rail of the housing, thereby achieving guidance and limiting fixation between the housing and the liquid cooling device 10.

[0196] For example, the liquid cooling device 10 is disposed in the housing, and sliding fit structures are respectively provided on the two opposite side walls of the housing. These structures are used to cooperate with the guide structure to install the liquid cooling plate 110 into the housing. Specifically, the sliding fit structure can be a slide rail, a slide groove, a sliding cavity, etc., but is not limited to the above examples. Specifically, the sliding fit structure is a slide rail. Limiting protrusions 400 are respectively disposed on both sides of the liquid cooling plate 110 in the second direction Y. The limiting protrusions 400 extend along the first direction X. When assembling the housing and the liquid cooling device 10, the limiting protrusions 400 on both sides of the liquid cooling plate 110 can be respectively engaged into the two slide rails of the housing, thereby providing guidance and limiting fixation between the housing and the liquid cooling device 10.

[0197] It should be noted that the above is merely illustrative and does not constitute a limitation on this application. Those skilled in the art will understand that the limiting protrusion 400 may also be provided only on one side of the liquid cooling plate 110, and is not limited thereto.

[0198] As another aspect of this application, embodiments of this application also provide a computing device that includes a cooling device 10 as described in any of the preceding embodiments. Thus, this computing device possesses all the features and advantages of the aforementioned cooling devices, which will not be repeated here.

[0199] In the description of this specification, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0200] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0201] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0202] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0203] The foregoing disclosure provides many different implementations or examples for carrying out different structures of this application. To simplify the disclosure, specific examples of components and arrangements are described above. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.

[0204] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this application, and these should all be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A cooling device, characterized in that, include: At least one liquid cooling module, each of the liquid cooling modules including a liquid cooling plate and at least one computing board; the interior of the liquid cooling plate defines a cooling channel for the flow of cooling medium, and at least one side surface of the liquid cooling plate is formed with a liquid cooling surface; The computing board has multiple computing modules on one side, and the computing modules are in contact with the liquid-cooled surface.

2. The cooling device according to claim 1, characterized in that, The liquid cooling plate forms liquid cooling surfaces on its opposite two sides, and there are two computing boards, which are respectively disposed on the two liquid cooling surfaces of the liquid cooling plate.

3. The cooling device according to claim 2, characterized in that, The number of computing boards is two, and the computing modules of the two computing boards are respectively opposite to different liquid cooling surfaces.

4. The cooling device according to claim 1, characterized in that, Each of the liquid cooling modules also includes at least one cover plate for fixing the computing board to the liquid cooling surface.

5. The cooling device according to claim 4, characterized in that, The liquid cooling plate forms liquid cooling surfaces on opposite sides, and each liquid cooling surface is provided with a cover plate and a computing board. The computing board has a computing module on the side opposite to the cover plate.

6. The cooling device according to claim 5, characterized in that, The liquid cooling plate forms liquid cooling surfaces on opposite sides, and there are two cover plates, which are respectively connected to the two liquid cooling surfaces.

7. The cooling device according to claim 1, characterized in that, The liquid-cooled surface is non-planar.

8. The cooling device according to claim 1, characterized in that, The liquid-cooled surface has at least one boss, which contacts the computing module.

9. The cooling device according to claim 8, characterized in that, The multiple computing modules are arranged in columns, with each column of computing modules corresponding to one of the bosses.

10. The cooling device according to claim 1, characterized in that, The number of liquid cooling modules is two or more, and the two or more liquid cooling modules are stacked.

11. The cooling device according to claim 10, characterized in that, The cooling channels of the different liquid cooling modules are connected.

12. The cooling device according to claim 10, characterized in that, The cooling channels of the different liquid cooling modules are arranged in parallel.

13. The cooling device according to claim 10, characterized in that, The cooling channels of the different liquid cooling modules are connected in series.

14. The cooling device according to claim 1, characterized in that, The cooling channel includes at least two channels.

15. The cooling device according to claim 14, characterized in that, At least two of the flow channels have the same and / or opposite directions.

16. The cooling device according to claim 15, characterized in that, The cooling channel includes a first channel and a second channel. The output end of the first channel is connected to the input end of the second channel, and the flow direction of the first channel is opposite to that of the second channel.

17. The cooling device according to claim 16, characterized in that, The extension path of the first flow channel is the same as the extension path of the second flow channel.

18. The cooling device according to claim 15, characterized in that, In two adjacent liquid cooling modules, the output end of the first flow channel of the first liquid cooling module is connected to the input end of the first flow channel of the second liquid cooling module, the output end of the first flow channel of the second liquid cooling module is connected to the input end of the second flow channel of the second liquid cooling module, and the output end of the second flow channel of the second liquid cooling module is connected to the input end of the second flow channel of the first liquid cooling module.

19. The cooling device according to claim 18, characterized in that, The first liquid cooling module has connectors at the input and output ends of the first flow channel and the input and output ends of the second flow channel. The second liquid cooling module also has connectors at the input and output ends of the first flow channel and the second flow channel. The output end of the first flow channel of the first liquid cooling module and the input end of the first flow channel of the second liquid cooling module are connected by a first connecting pipe, the output end of the first flow channel of the second liquid cooling module and the input end of the second flow channel of the second liquid cooling module are connected by a second connecting pipe, and the output end of the second flow channel of the second liquid cooling module and the input end of the second flow channel of the first liquid cooling module are connected by a third connecting pipe.

20. The cooling device according to claim 19, characterized in that, The computing board is provided with multiple sets of computing modules arranged at intervals along the second direction, and multiple computing modules in each set of computing modules are arranged adjacently along the first direction; the first flow channel includes multiple first sub-flow channels connected in sequence, and the second flow channel includes multiple second sub-flow channels connected in sequence, and the extension directions of the first sub-flow channels and the extension directions of the second sub-flow channels are parallel to the first direction; Each group of computing modules corresponds to at least one first sub-channel and / or at least one second sub-channel.

21. The cooling device according to claim 20, characterized in that, Each set of computing modules includes three columns of computing units spaced apart along the second direction; each set of computing modules corresponds to two first sub-channels and one second sub-channel; or, each set of computing modules corresponds to one first sub-channel and two second sub-channels.

22. The cooling device according to claim 20, characterized in that, The distance between two adjacent sets of computing modules is greater than the distance between adjacent computing modules within each set; the multiple sets of computing modules include two first sets of computing modules and two second sets of computing modules, the two first sets of computing modules and the two second sets of computing modules are arranged at intervals along the second direction, the first set of computing modules corresponds to one first sub-channel and two second sub-channels, and the second set of computing modules corresponds to two first sub-channels and one second sub-channel.

23. The cooling device according to claim 1, characterized in that, Also includes: A power connector is provided, through which two or more of the liquid cooling modules are electrically connected.

24. The cooling device according to claim 23, characterized in that, The power connector rigidly connects two or more of the liquid cooling modules.

25. The cooling device according to claim 1, characterized in that, Each of the liquid cooling modules further includes at least one cover plate connected to the liquid cooling plate for fixing the computing board to the liquid cooling surface; the cooling device further includes a fastening structure for fixing the liquid cooling plate, the computing board and the cover plate together.

26. The cooling device according to claim 25, characterized in that, The fastening structure is a threaded fastener.

27. The cooling device according to claim 25, characterized in that, The cover plate has multiple first through holes, the computing board has multiple second through holes, and the liquid cooling plate has multiple positioning holes; the cooling device further includes: Multiple fasteners are provided, each corresponding to one of the multiple first through holes and the multiple second through holes. The fasteners are sequentially inserted into the corresponding first through hole, second through hole and positioning hole.

28. The cooling device according to claim 27, characterized in that, The fastener includes a connecting post and a limiting protrusion, the limiting protrusion being formed by the outward protrusion of the outer peripheral wall of the connecting post; wherein, the connecting post is sequentially inserted through the corresponding first through hole, second through hole and positioning hole, the limiting protrusion is located between the liquid cooling plate and the computing board, and the two end faces of the limiting protrusion abut against the liquid cooling surface of the liquid cooling plate and the surface of the computing board adjacent to the liquid cooling plate, respectively.

29. The cooling device according to claim 28, characterized in that, The fastener also includes a locking part, which is detachably connected to the portion of the connecting post located on the side of the cover plate away from the liquid cooling plate, and the locking part abuts against the surface of the cover plate on the side away from the computing board.

30. The cooling device according to claim 29, characterized in that, The cover plate has a recessed portion surrounding the outer periphery of the first through hole. The recessed portion is formed by recessing towards the side facing the computing board, and the surface of the recessed portion adjacent to the computing board abuts against the surface of the computing board.

31. The cooling device according to claim 30, characterized in that, The recessed portion defines a groove on the side opposite to the computing board, and at least a portion of the locking portion is accommodated within the groove.

32. The cooling device according to claim 1, characterized in that, Each of the liquid cooling modules further includes at least one cover plate connected to the liquid cooling plate for fixing the computing board to the liquid cooling surface. The cover plate includes a clamping structure for tightly fitting the liquid cooling plate and the computing board together.

33. The cooling device according to claim 32, characterized in that, The clamping structure is an elastic clamping structure.

34. The cooling device according to claim 32, characterized in that, The clamping structure includes a support portion that abuts against the surface of the computing board.

35. The cooling device according to claim 34, characterized in that, The support portion includes multiple support pads, which are disposed on the side of the cover plate facing the liquid cooling module. The surfaces of the multiple support pads abut against the surface of the computing board, and the material of the support pads includes an elastic material.

36. The cooling device according to claim 34, characterized in that, The support portion includes a plurality of support protrusions, which are formed by a portion of the cover plate protruding in the direction toward the computing board, and the surface of the support protrusion abuts against the surface of the computing board.

37. The cooling device according to claim 34, characterized in that, The support includes multiple support arms, the cover plate has multiple hollowed-out heat dissipation holes, one end of the support arm is connected to the edge of the corresponding heat dissipation hole, and the other end of the support arm is bent and abuts against the surface of the computing board.

38. The cooling device according to claim 1, characterized in that, An insulating layer is provided on the outer surface of the liquid cooling plate.

39. A computing device, characterized in that, Includes the cooling device as described in any one of claims 1 to 38.

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