A patch inductor with two groups of reverse magnetic field coils

Abstract

The utility model relates to circuit board production technical field, concretely relates to a kind of integrally formed two groups of reverse magnetic field coil's patch inductor, including circuit board, terminal structure, coil structure, magnetic powder core and heat dissipation component, the coil structure includes the coil A and coil B of opposite setting of winding direction, the terminal structure includes: terminal A incoming wire pin, its one side is provided with terminal A outgoing wire pin;Terminal B incoming wire pin, its one side is provided with terminal B outgoing wire pin;The terminal A incoming wire pin and terminal A outgoing wire pin between and terminal B incoming wire pin and terminal B outgoing wire pin between are integrally formed by trapezoidal connecting bridge;The space when inductor and circuit board combination can be reduced, and due to pre-integrally formed, can prevent wrong connection, and it is good to prevent fool, and compared with the way of integrally formed and one group of coil cooperation in the past, process technology production procedure reduces, it is favorable to save production cost.

Description

Technical Field

[0001] This utility model relates to the field of circuit board manufacturing technology, specifically to a surface mount inductor with two sets of reverse magnetic field coils integrally formed. Background Technology

[0002] Surface mount inductors are mainly assembled from magnetic cores, coils, and terminals. First, the coils and terminals are spot-welded together. Then, the coils and terminals are molded together with the powder core. Finally, the finished product is delivered to the customer for connection to their circuit board.

[0003] The existing surface mount inductor method mainly consists of one set of coil terminals combined with one magnetic core. When two sets of magnetic cores and coil terminals are required on a circuit board, two such reverse inductors with different magnetic fields need to be placed. On some circuit boards with narrow spaces, two inductors of the same volume cannot be accommodated. In addition, the foolproof effect is poor when placing two reverse inductors in the past. The previous integrated magnetic core and one set of coils had many manufacturing processes, which is not conducive to saving production costs. Utility Model Content

[0004] To address the problems in the existing technology, this utility model provides a surface mount inductor with two sets of reverse magnetic field coils integrally formed, which can reduce the space when the inductor is combined with the circuit board. Since it is pre-molded, it can prevent incorrect connection and has good foolproof performance. Compared with the previous method of integral molding and matching with a set of coils, the manufacturing process is reduced, which helps to save production costs.

[0005] The technical solution adopted by this utility model to solve its technical problem is a surface mount inductor with two sets of reverse magnetic field coils integrally formed, including a circuit board, a terminal structure, a coil structure, a magnetic powder core, and a heat dissipation assembly. The coil structure includes coil A and coil B with opposite winding directions. The terminal structure includes:

[0006] Terminal A has an inlet pin, and a terminal A outlet pin is provided on one side of it;

[0007] Terminal B has an inlet pin, and a terminal B outlet pin is provided on one side of it;

[0008] The inlet and outlet pins of terminal A and the inlet and outlet pins of terminal B are integrally formed by trapezoidal connecting bridges, and the top of the two sets of trapezoidal connecting bridges is provided with an anti-mistake marking groove.

[0009] The coils A and B are welded between their respective terminals and then integrally encapsulated with the magnetic powder core.

[0010] Specifically, the circuit board has soldering positions at the top of the circuit board near the four corners, and grounding copper foil is arranged inside each soldering position.

[0011] Specifically, positioning grooves are provided on both sides of the bottom of the magnetic powder core at positions corresponding to the welding positions on the circuit board.

[0012] Specifically, the heat dissipation component includes:

[0013] An aluminum heat dissipation substrate is disposed on the top of the magnetic powder core, and heat dissipation fins are provided at the upper end;

[0014] A heat pipe runs through the magnetic powder core and the heat dissipation fins.

[0015] Specifically, the heat dissipation fins are arranged obliquely with decreasing height gradients, and the spacing between adjacent fins is 0.8 to 1.2 mm.

[0016] Specifically, the trapezoidal connecting bridge has stress relief holes in the middle.

[0017] Specifically, a thermally conductive silicone pad is provided between the bottom of the aluminum heat dissipation substrate and the top of the magnetic powder core.

[0018] Specifically, the terminal structure is plated with a 0.05mm thick nickel-tin composite layer, and its edges are rounded.

[0019] Specifically, it also includes a positioning post located at the top of the magnetic powder core, and the positioning hole is interference-fitted with the positioning hole on the circuit board.

[0020] Specifically, coil A and coil B are wound with flat copper wire, and the wire width to thickness ratio is 4:1.

[0021] The beneficial effects of this utility model are:

[0022] (1) The chip inductor with two sets of reverse magnetic field coils integrally formed according to the present invention can reduce the space when the inductor and the circuit board are combined because the inductor adopts an integrally formed magnetic core and two sets of coils, compared with the previous integrally formed magnetic core and one set of coils.

[0023] (2) The patch inductor with two sets of reverse magnetic field coils integrally formed according to the present invention, and since the two sets of coils are welded to the terminals and then integrally formed with a set of magnetic powder cores in advance, it can prevent the previous situation where a set of magnetic powder cores and a set of coils were matched and two sets of inductors were required to be installed on a circuit board. It can effectively prevent the magnetic induction direction from being the same and the connection from being incorrect, and has good foolproof performance.

[0024] (3) The chip inductor with two sets of reverse magnetic field coils integrally formed according to the present invention is formed by two sets of coils and one set of magnetic powder core. Compared with the previous method of integral forming and one set of coils, the manufacturing process is reduced, which is conducive to saving production costs. Attached Figure Description

[0025] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0026] Figure 1 This is a schematic diagram of the component structure of this utility model;

[0027] Figure 2 This is a schematic diagram of the structure of the terminal and coil after welding.

[0028] Figure 3 This is a schematic diagram of the structure of the present invention after the terminals and coil are welded together and assembled with the magnetic powder core;

[0029] Figure 4 This is a schematic diagram of the connection structure between the assembled magnetic powder core and the circuit board of this utility model;

[0030] Figure 5 This is a cross-sectional view of the heat dissipation component of this utility model;

[0031] Figure 6 This is a detailed structural diagram of the trapezoidal connecting bridge of this utility model;

[0032] Figure 7 This is a schematic diagram of the magnetic powder core, positioning groove, and positioning post structure of this utility model.

[0033] In the diagram: 1. Circuit board; 2. Circuit board soldering position; 3. Terminal A input pin; 4. Terminal A output pin; 5. Terminal B input pin; 6. Terminal B output pin; 7. Coil A; 8. Coil B; 9. Magnetic powder core; 10. Positioning groove; 11. Heat dissipation assembly; 12. Trapezoidal connecting bridge; 13. Error prevention marking groove; 14. Grounding copper foil; 15. Aluminum heat dissipation substrate; 16. Heat dissipation fins; 17. Heat pipe; 18. Stress relief hole; 19. Positioning post; 20. Positioning hole; 21. Thermal conductive silicone pad. Detailed Implementation

[0034] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0035] like Figure 1-6 As shown, the present invention discloses a surface-mount inductor with two sets of reverse magnetic field coils integrally formed, comprising a circuit board 1, a terminal structure, a coil structure, a magnetic powder core 9, and a heat dissipation assembly 11. The coil structure includes coils A7 and B8 with opposite winding directions. The terminal structure includes:

[0036] Terminal A has an inlet pin 3, and a terminal A outlet pin 4 is provided on one side of it;

[0037] Terminal B has an inlet pin 5, and a terminal B outlet pin 6 is provided on one side of it;

[0038] The terminal A inlet pin 3 and terminal A outlet pin 4, as well as the terminal B inlet pin 5 and terminal B outlet pin 6, are integrally formed by trapezoidal connecting bridges 12. The top of the two sets of trapezoidal connecting bridges 12 is provided with an error-proof marking groove 13.

[0039] The coils A7 and B8 are welded between their respective terminals and then integrally encapsulated with the magnetic powder core 9.

[0040] In use, coil A7 is first fixed in the middle position through terminal A input pin 3 and terminal A output pin 4. Then, coil B8 is soldered through terminal B input pin 5 and terminal B output pin 6. After soldering, it is integrally formed with magnetic powder core 9. The integrally formed structure is then soldered to circuit board 1 to complete the mounting of two inductors on a set of circuit boards.

[0041] For example, such as Figure 1 As shown, the present invention also includes circuit board soldering positions 2 at the top of the circuit board 1 near the four corners, and grounding copper foil 14 is arranged on the inner side of each soldering position 2.

[0042] In use, the circuit board soldering position 2 allows the top of the circuit board 1 to have soldering positions corresponding to terminal A input pin 3, terminal A output pin 4, terminal B input pin 5, and terminal B output pin 6.

[0043] For example, such as Figure 1 and 4 As shown, positioning grooves 10 are provided on both sides of the bottom of the magnetic powder core 9 at positions corresponding to the welding positions 2 on the circuit board.

[0044] During use, the groove 10 can prevent the magnetic powder core 9 from interfering with the circuit board 1 when it is attached to the circuit board 1.

[0045] For example, such as Figure 1 , Figure 3 and Figure 5 As shown, the heat dissipation assembly 11 includes:

[0046] An aluminum heat dissipation substrate 15 is disposed on the top of the magnetic powder core 9, and heat dissipation fins 16 are provided on the upper end;

[0047] Heat pipe 17 penetrates the magnetic powder core 9 and the heat dissipation fins 16.

[0048] In use, the aluminum heat dissipation substrate 15 and heat dissipation fins 16 can effectively dissipate heat from the magnetic powder core 9.

[0049] For example, such as Figure 1 , Figure 3 and Figure 5As shown, the heat dissipation fins 16 are arranged obliquely with decreasing height gradients, and the spacing between adjacent fins is 0.8 to 1.2 mm.

[0050] When in use, the heat dissipation fins 16 are arranged at an angle and their heights decrease gradually, which can effectively prevent heat accumulation between multiple sets of heat dissipation fins 16.

[0051] For example, such as Figure 5 As shown, a stress relief hole 18 is provided in the middle of the trapezoidal connecting bridge 12.

[0052] During use, the stress relief hole 18 can help the trapezoidal connecting bridge 12 to release stress, reducing the possibility of damage to the trapezoidal connecting bridge 12.

[0053] For example, such as Figure 3 and Figure 5 As shown, a thermally conductive silicone pad 21 is provided between the bottom of the aluminum heat dissipation substrate 15 and the top of the magnetic powder core 9.

[0054] During use, the heat generated by the magnetic powder core 9 can be effectively conducted to the aluminum heat dissipation substrate 15 through the thermally conductive silicone pad 21.

[0055] For example, such as Figure 2 As shown, the terminal structure has a 0.05mm thick nickel-tin composite layer plated on its surface, and its edges are rounded.

[0056] When in use, the nickel-tin composite layer can effectively improve the anti-oxidation effect of the terminal structure surface, which is conducive to extending the service life. The rounded corner structure can effectively prevent sharp corners from scratching coil A7 and coil B8.

[0057] For example, such as Figure 1 , Figure 3 and Figure 7 As shown, it also includes a positioning post 19 located at the top of the magnetic powder core 9, and the positioning hole 20 is interference-fitted with the positioning hole 20 on the circuit board 1.

[0058] In use, the positioning post 19 and the positioning hole 20 can be used to effectively pre-position the magnetic powder core 9 and the circuit board 1.

[0059] For example, such as Figure 1-2 As shown, coils A7 and B8 are wound with flat copper wire, and the wire width to thickness ratio is 4:1.

[0060] When in use, the cross-sectional area of ​​the coil is increased by using a 4:1 width-to-thickness ratio of flat copper wire, which allows it to carry a larger current in the same volume.

[0061] In use, the coil A7 is first fixed in the middle position by the input pin 3 and output pin 4 of terminal A, and then the coil B8 is soldered by the input pin 5 and output pin 6 of terminal B. After the soldering is completed, it is integrally formed with the magnetic powder core 9. The integrally formed structure is then soldered to the circuit board 1 to complete the patching of the inductor. Since the winding directions of coil A7 and coil B8 are opposite, they can cancel each other out the magnetic field force generated after energization.

[0062] By cooperating with the positioning pin 19 and the positioning hole 20, and by cooperating with the positioning groove 10 and the welding position 2, the magnetic powder core 9 and the circuit board 1 can be pre-positioned before welding connection.

[0063] When two sets of inductors need to be soldered on a circuit board, since this inductor uses an integrally molded magnetic powder core 9 and two sets of coils, compared with the previous integrally molded magnetic powder core 9 and one set of coils, the space when the inductor and the circuit board are combined can be reduced. That is, when the circuit board is slightly smaller than the magnetic powder core 9 and the two sets of coils, soldering can still be performed normally.

[0064] Furthermore, since coils A77 and B8 are pre-molded as a single unit with the magnetic powder core 9, the error-proof marking groove 13 effectively prevents incorrect connection before molding. After molding, it can be ensured that the magnetic fields generated by coil B8 and magnetic powder core 9 are in opposite directions, thus improving the error-proof performance.

[0065] Compared to the previous method of combining a single molded powder core with a set of coils, which usually requires the separate fabrication of two sets of powder cores and two sets of coils when two sets of reverse magnetic field coils are needed, this inductor simultaneously molds two sets of reverse magnetic field coils on a single powder core. This reduces the number of manufacturing steps and helps save production costs.

[0066] It is important to note that the constructions and arrangements of this application shown in several different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who consult this disclosure will readily understand that many modifications are possible (e.g., changes in the size, dimensions, structure, shape, and proportions of various elements, as well as parameter values ​​(e.g., temperature, pressure, etc.), mounting arrangements, use of materials, color, orientation, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in this application). For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of elements may be inverted or otherwise altered, and the nature or number or position of discrete elements may be changed or altered. Therefore, all such modifications are intended to be included within the scope of this utility model. The order or sequence of any process or method steps may be changed or rearranged according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure described herein that performs the function, and not only structural equivalents but also equivalent structures. Without departing from the scope of this invention, other substitutions, modifications, alterations, and omissions may be made in the design, operation, and arrangement of the exemplary embodiments. Therefore, this invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims.

[0067] Furthermore, in order to provide a concise description of exemplary embodiments, not all features of actual embodiments (i.e., those features that are not relevant to the best mode of carrying out the present invention as currently considered, or those features that are not relevant to implementing the present invention) may be omitted.

[0068] It should be understood that numerous specific implementation decisions can be made during the development of any actual implementation method, and in any engineering or design project. Such development efforts may be complex and time-consuming, but for those of ordinary skill in the art who benefit from this disclosure, the development effort will be a routine work of design, manufacturing, and production without requiring much experimentation.

[0069] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A surface-mount inductor with two sets of reverse magnetic field coils integrally formed, characterized in that, The system includes a circuit board (1), a terminal structure, a coil structure, a magnetic powder core (9), and a heat dissipation assembly (11). The coil structure includes coil A (7) and coil B (8) arranged in opposite winding directions. The terminal structure includes: Terminal A has an inlet pin (3), and a terminal A outlet pin (4) is provided on one side of it; Terminal B has an inlet pin (5), and a terminal B outlet pin (6) is provided on one side; The terminal A inlet pin (3) and terminal A outlet pin (4) and the terminal B inlet pin (5) and terminal B outlet pin (6) are integrally formed by trapezoidal connecting bridges (12), and the top of the two sets of trapezoidal connecting bridges (12) is provided with anti-mistake marking grooves (13); The coils A (7) and B (8) are welded between their respective terminals and then integrally encapsulated with the magnetic powder core (9).

2. The patch inductor with two sets of reverse magnetic field coils integrally formed according to claim 1, characterized in that, The circuit board (1) is provided with circuit board soldering positions (2) at the top near the four corners, and grounding copper foil (14) is arranged inside each soldering position (2).

3. A surface-mount inductor with two sets of reverse magnetic field coils integrally formed according to claim 1 or 2, characterized in that, The magnetic powder core (9) has positioning grooves (10) on both sides of its bottom, corresponding to the welding positions (2) on the circuit board.

4. A surface mount inductor with two sets of reverse magnetic field coils integrally formed according to claim 1, characterized in that, The heat dissipation assembly (11) includes: An aluminum heat dissipation substrate (15) is disposed on the top of the magnetic powder core (9), and heat dissipation fins (16) are provided at the upper end; A heat pipe (17) runs through the magnetic powder core (9) and the heat dissipation fins (16).

5. A surface mount inductor with two sets of reverse magnetic field coils integrally formed according to claim 4, characterized in that, The heat dissipation fins (16) are arranged obliquely with decreasing height gradients and the spacing between adjacent fins is 0.8 to 1.2 mm.

6. A surface mount inductor with two sets of reverse magnetic field coils integrally formed according to claim 1, characterized in that, The trapezoidal connecting bridge (12) is provided with a stress relief hole (18) in the middle.

7. A surface mount inductor with two sets of reverse magnetic field coils integrally formed according to claim 4, characterized in that, A thermally conductive silicone pad (21) is provided between the bottom of the aluminum heat dissipation substrate (15) and the top of the magnetic powder core (9).

8. A surface mount inductor with two sets of reverse magnetic field coils integrally formed according to claim 1, characterized in that, The terminal structure is plated with a 0.05mm thick nickel-tin composite layer, and its edges are rounded.

9. A surface mount inductor with two sets of reverse magnetic field coils integrally formed according to claim 1, characterized in that, It also includes a positioning post (19) located at the top of the magnetic powder core (9), and the positioning hole (20) is interference-fitted with the positioning hole (20) on the circuit board (1).

10. A surface mount inductor with two sets of reverse magnetic field coils integrally formed according to claim 1, characterized in that, The coils A (7) and B (8) are made of flat copper wire with a wire width to thickness ratio of 4:1.

Images