Transformer lower hole circuit board with high-efficiency heat dissipation structure

Abstract

The utility model relates to circuit board technical field discloses a transformer lower hole circuit board with high -efficient heat dissipation structure, including the substrate, the upper part of substrate is provided with a plurality of mounting holes, through the mounting hole for the transformer winding of setting up on the substrate for installation, the middle part of substrate is equipped with the heat dissipation hole, the inner wall of a plurality of mounting holes all is provided with the heat conduction layer, through the substrate of setting up, set up a plurality of mounting holes in the upper part of substrate, the transformer winding of being convenient for steady installation, ensure that the transformer is not easy to loosen in the working process, guarantee the stability of circuit connection, and the heat dissipation hole of setting up in the middle part of substrate, can provide effective emission passage for the heat generated when the transformer works, accelerate heat discharge, avoid the heat accumulation around the transformer, thereby promote the work efficiency and the service life of transformer, the heat conduction layer of mounting hole inner wall can further export the heat of transformer conduction to the vicinity of mounting hole, strengthen the overall heat dissipation effect.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a circuit board with a hole below the transformer having a high-efficiency heat dissipation structure. Background Technology

[0002] Transformers generate significant heat during operation. If this heat cannot be dissipated effectively, it can lead to overheating of the circuit board, affecting equipment performance and even causing damage. Designing openings or slots under the transformer increases airflow, promoting heat conduction and diffusion, thus improving heat dissipation efficiency. Openings under the transformer also reduce electromagnetic interference (EMI) caused by distributed capacitance. Distributed capacitance is the capacitive effect between different layers of a circuit board due to the electric field, which can cause signal interference. Openings can reduce this effect, thereby improving circuit stability. In high-power power supply designs, the routing of the circuit board beneath the transformer has a significant impact on current paths and EMI. Openings help optimize current paths, reduce impedance, and thus improve power supply efficiency.

[0003] Transformers generate a lot of heat when they are working. If the heat is not dissipated in time, the heat will accumulate around it, which will lead to a decrease in the efficiency of the transformer and may even cause failure due to overheating. The heat dissipation design of the existing substrate is relatively simple, and most of them do not have a dedicated heat dissipation channel. Relying solely on the heat dissipation capacity of the substrate itself is insufficient to meet the requirements. Utility Model Content

[0004] The purpose of this invention is to solve the problems existing in the prior art by proposing a transformer bottom opening circuit board with a high-efficiency heat dissipation structure.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A transformer bottom perforated circuit board with a high-efficiency heat dissipation structure includes a substrate, and a plurality of mounting holes are provided on the upper part of the substrate for mounting transformer windings.

[0007] The substrate has a heat dissipation hole in the middle, and the inner wall of each of the mounting holes is provided with a heat-conducting layer.

[0008] Preferably, the substrate is an aluminum-based copper-clad laminate, and a metallization layer is disposed on the surface of the substrate.

[0009] Preferably, the metallization layer is integrally formed by chemical copper plating.

[0010] Preferably, the thermally conductive layer is integrally formed by chemical copper plating.

[0011] Preferably, the thermal conductive layer has a coverage thickness of 10 μm.

[0012] Preferably, the heat dissipation hole is a rectangle with a length of 6mm and a width of 5mm.

[0013] Preferably, the mounting holes are arranged in a rectangular array on the base.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] This invention features a substrate with several mounting holes on its upper surface, facilitating stable installation of the transformer windings and ensuring the transformer remains secure during operation, thus guaranteeing the stability of the circuit connection. The heat dissipation holes in the center of the substrate provide an effective channel for dissipating heat generated during transformer operation, accelerating heat removal and preventing heat accumulation around the transformer, thereby improving its efficiency and lifespan. The heat-conducting layer on the inner wall of the mounting holes further dissipates heat conducted from the transformer to the vicinity of the mounting holes, enhancing the overall heat dissipation effect. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of an open circuit board with a high-efficiency heat dissipation structure under a transformer, as proposed in this utility model.

[0017] Figure 2 This is a top view of a perforated circuit board with a high-efficiency heat dissipation structure for a transformer, as proposed in this utility model.

[0018] Figure 3 This is a schematic diagram of the heat dissipation holes on the perforated circuit board below the transformer, which has a high-efficiency heat dissipation structure, according to the present invention.

[0019] Figure 4 This is a schematic diagram of the heat dissipation path of the heat dissipation holes on the perforated circuit board below the transformer, which has a high-efficiency heat dissipation structure proposed in this utility model.

[0020] In the figure: 1. Substrate; 2. Mounting hole; 3. Transformer winding; 4. Heat dissipation hole; 5. Thermal conductive layer; 6. Metallization layer. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0022] Reference Figures 1 to 4 A transformer bottom perforated circuit board with a high-efficiency heat dissipation structure includes a substrate 1, and a plurality of mounting holes 2 are provided on the upper part of the substrate 1 for mounting transformer windings 3.

[0023] The substrate 1 has a heat dissipation hole 4 in the middle, and the inner walls of the mounting holes 2 are provided with a heat-conducting layer 5.

[0024] When in use, this device uses a base plate 1 with several mounting holes 2 on top to facilitate the stable installation of the transformer windings 3, ensuring that the transformer is not easily loosened during operation and guaranteeing the stability of the circuit connection. The heat dissipation holes 4 in the middle of the base plate 1 provide an effective heat dissipation channel for the heat generated by the transformer during operation, accelerating heat dissipation and preventing heat from accumulating around the transformer, thereby improving the transformer's working efficiency and service life. The heat-conducting layer 5 on the inner wall of the mounting holes 2 can further dissipate the heat conducted by the transformer to the vicinity of the mounting holes 2, enhancing the overall heat dissipation effect.

[0025] Furthermore, the substrate 1 is an aluminum-based copper-clad laminate, and a metallization layer 6 is disposed on the surface of the substrate 1. The substrate 1 uses an aluminum-based copper-clad laminate, and aluminum has excellent thermal conductivity, which can quickly conduct the heat generated by the transformer to the entire substrate 1, and then dissipate it through the substrate 1, significantly improving the overall heat dissipation capacity of the circuit board. The metallization layer 6 disposed on the surface of the substrate 1 not only improves the conductivity of the substrate 1, ensuring stable transmission of circuit signals, but also enhances the wear resistance and oxidation resistance of the substrate 1 surface, extending the service life of the circuit board. The substrate 1 can also be an aluminum nitride ceramic plate.

[0026] Furthermore, the metallization layer 6 is integrally formed by chemical copper plating. This process enables the metallization layer 6 to bond more tightly and firmly to the surface of the substrate 1, making it less prone to peeling and ensuring the stability of conductivity. The integral forming method ensures that the thickness of the metallization layer 6 is uniform, improving the production quality and reliability of the circuit board and reducing circuit failures caused by problems with the metallization layer 6.

[0027] Furthermore, the thermal conductive layer 5 is integrally formed by chemical copper plating, which makes the thermal conductive layer 5 tightly bonded to the inner wall of the mounting hole 2, resulting in more stable and reliable thermal conductivity. It can more efficiently dissipate the heat transferred from the transformer to the mounting hole 2. This process can also ensure the uniformity of the thermal conductive layer 5, avoiding the impact of uneven thickness of the thermal conductive layer 5 on the heat dissipation effect, and further improving the heat dissipation stability of the circuit board.

[0028] Furthermore, the thermal conductive layer 5 has a coverage thickness of 10μm, which ensures good thermal conductivity and effectively conducts heat without increasing costs or adversely affecting the size of the mounting hole 2 due to excessive thickness. This achieves a good balance between heat dissipation and economy.

[0029] Furthermore, the heat dissipation hole 4 is rectangular with a length of 6mm and a width of 5mm. Compared with other shapes, the rectangular hole can provide a larger heat dissipation channel space in the same area, which is conducive to air circulation and heat dissipation. The rectangular structure is easier to process in the middle of the substrate 1, and can better adapt to the overall structure of the substrate 1, so that the heat dissipation hole 4 corresponds to the position of the transformer, thereby improving the targeting and efficiency of heat dissipation.

[0030] Furthermore, the mounting holes 2 are arranged in a rectangular array on the base. This arrangement makes the transformer windings 3 neat and orderly after installation. The horizontal arrangement is also conducive to the uniform distribution of heat on the substrate 1, avoiding excessive local heat concentration, and facilitating heat dissipation through the substrate 1 and the heat dissipation holes 4.

[0031] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A transformer bottom-hole circuit board with a high-efficiency heat dissipation structure, comprising a substrate (1), characterized in that: The substrate (1) has several mounting holes (2) on its upper surface, which are used for mounting the transformer winding (3). The substrate (1) has a heat dissipation hole (4) in the middle, and the inner walls of the mounting holes (2) are provided with a heat-conducting layer (5).

2. The transformer bottom opening circuit board with a high-efficiency heat dissipation structure according to claim 1, characterized in that: The substrate (1) is an aluminum-based copper-clad laminate, and a metallization layer (6) is provided on the surface of the substrate (1).

3. The transformer bottom opening circuit board with a high-efficiency heat dissipation structure according to claim 2, characterized in that: The metallization layer (6) is integrally formed by chemical copper plating.

4. The transformer bottom opening circuit board with a high-efficiency heat dissipation structure according to claim 2, characterized in that: The thermal conductive layer (5) is integrally formed by chemical copper plating.

5. The transformer bottom opening circuit board with a high-efficiency heat dissipation structure according to claim 1, characterized in that: The thermal conductive layer (5) has a coverage thickness of 10 μm.

6. The transformer bottom opening circuit board with a high-efficiency heat dissipation structure according to claim 1, characterized in that: The heat dissipation hole (4) is a rectangle with a length of 6mm and a width of 5mm.

7. The transformer bottom opening circuit board with a high-efficiency heat dissipation structure according to claim 1, characterized in that: Several of the mounting holes (2) are arranged in a rectangular array on the base.

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