A circuit board copper thickness detection device

Abstract

The utility model relates to the technical field of circuit board copper thickness detection, and specifically discloses a circuit board copper thickness detection device. The circuit board copper thickness detection device comprises a sliding table, two oppositely arranged and synchronously rotatable conveying lines are arranged above the sliding table, a plurality of shifting rods are arranged between the conveying belts of the two conveying lines, the shifting rods can slide over the surface of the sliding table through the transmission of the conveying belts, a first linear movement module and a second linear movement module that are parallel to each other are arranged above the sliding table, a vortex sensing probe capable of ascending and descending is arranged at the movable end of the first linear movement module, and a suction disc assembly capable of ascending and descending is arranged at the movable end of the second linear movement module. The utility model is used for the copper thickness detection of a printed circuit board, can stabilize the basic placement position of the circuit board to be detected while ensuring the coherence of the structure action, and is beneficial to ensuring the operation efficiency and the detection precision.

Description

Technical Field

[0001] This utility model relates to the field of copper thickness detection technology for circuit boards, and in particular to a copper thickness detection device for circuit boards. Background Technology

[0002] On PCB (Printed Circuit Board) production lines, in order to ensure that the manufactured circuit products meet the requirements for high precision, eddy current sensors are used during production to detect the copper thickness of the circuit lines. This prevents copper lines that are too thick or too thin from affecting the use of the products and effectively improves the product yield.

[0003] The most common automated inspection solution currently used is to transport the product under test to a designated position using a conveyor belt, and then use an eddy current sensor (sensor probe) to detect the copper thickness. In this method, the distance between the circuit board and the probe becomes one of the key factors affecting the inspection results. For belt conveyor systems, the belt surface uses an elastic layer, and whether the material is stretched or compressed, it will cause the circuit board to fluctuate in height. This influence makes copper thickness detection prone to errors and misjudgments, leading to the classification of defective products as good and defective products as good. It is impossible to reliably guarantee the horizontal height position of the circuit board under test. If a reciprocating moving module is used for transport, the mechanical reciprocating motion results in significant vibration and noise, and the continuity and efficiency are inferior to traditional conveyor belts. Therefore, how to ensure the basic height position of the circuit board under test while maintaining the continuity of motion has become one of the urgent technical problems to be solved. Summary of the Invention

[0004] The purpose of this invention is to provide a circuit board copper thickness detection device that can stabilize the base placement of the circuit board under test while ensuring the continuity of structural operation, which is beneficial to ensuring work efficiency and detection accuracy.

[0005] To achieve this objective, the present invention adopts the following technical solution: A circuit board copper thickness testing device includes a slide table. Two oppositely arranged and synchronously rotating conveyor lines are positioned above the slide table. Multiple levers are connected between the conveyor belts of the two conveyor lines, and the levers can slide across the surface of the slide table via the transmission of the conveyor belts. Above the slide table are a first linear motion module and a second linear motion module that are parallel to each other. The movable end of the first linear motion module is equipped with a liftable eddy current sensor probe. The movable end of the second linear motion module is equipped with a liftable suction cup assembly, which can adsorb and fix the test product pushed out by the levers. A camera assembly is also positioned above the slide table.

[0006] Furthermore, it also includes a third linear motion module, the third linear motion module being arranged in a direction parallel to the transmission direction of the conveyor belt, and the first linear motion module being disposed on the movable end of the third linear motion module.

[0007] Furthermore, the number of eddy current sensing probes is not less than two, and the multiple eddy current sensing probes are arranged close to each other, with each eddy current sensing probe having a different horizontal height at its bottom.

[0008] Furthermore, the upper surface of the slide is provided with a guide component, which is used to prevent the circuit board from shifting position during the pushing process.

[0009] Furthermore, the guide assembly includes an air groove formed above the slide table, the extension direction of the air groove being parallel to the movement direction of the conveyor belt, an air gap being formed at the junction of the air groove and the surface of the slide table, and an air pump being provided below the slide table, the air pump's inlet and outlet being connected to both ends of the air groove via air inlet pipes.

[0010] Furthermore, the surface of the slide table is provided with an opening, and a lifting device is provided below the slide table. A baffle is slidably provided at the opening in the vertical direction, and the lifting device is used to drive the baffle to protrude or retract into the sliding surface of the slide table.

[0011] Furthermore, a stop bar is provided at the end position of the upper surface of the slide and below the second linear motion module.

[0012] The beneficial effects of this utility model are as follows: By setting a corresponding conveyor belt assembly above the slide table, the circuit board structure to be tested on the slide table can be pushed along the direction of the slide table by the levers connected between the conveyor belt assemblies until it is transported to the test position for testing. Then, the circuit board structure to be tested can be pushed out by the levers, and the circuit board can be sorted and transported by the corresponding adsorption assembly. As the reference surface of the slide table, the basic height of the circuit board to be tested can be well guaranteed. Moreover, the continuous conveying of the conveyor belt assembly can avoid the reciprocating action of the device, which optimizes the action efficiency of the structure and reduces the vibration and noise of the device. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of a circuit board copper thickness detection device provided by this utility model; Figure 2 yes Figure 1 Enlarged diagram of point A in the diagram; Figure 3 This is a front view of a circuit board copper thickness detection device provided by this utility model; Figure 4This is a side view of a circuit board copper thickness detection device provided by this utility model; Figure 5 yes Figure 4 BB-direction sectional view; Figure 6 yes Figure 5 Enlarged diagram of point C in the image.

[0014] Reference numerals: 1-Slide table; 2-Conveyor line; 3-Lever; 4-Third linear motion module; 5-First linear motion module; 6-Second linear motion module; 7-Camera assembly; 8-Lifting device; 9-Baffle; 10-Air groove; 11-Air inlet pipe; 12-Air pump; 13-Baffle bar; 14-Suction cup assembly. Detailed Implementation

[0015] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0016] like Figures 1 to 6 As shown in the figure, this utility model provides a circuit board copper thickness detection device for detecting the copper thickness of printed circuit boards. It can stabilize the basic placement position of the circuit board under test while ensuring the continuity of structural movements, which is beneficial to ensuring work efficiency and detection accuracy. To realize the structural function of the device, it is configured to include a slide table 1. The surface of the slide table 1 is preferably made of smooth stainless steel, serving as the sliding plane for the circuit board under test. To stably push the circuit board structure placed on the slide table 1 and avoid the low efficiency caused by reciprocating movements, two oppositely arranged and synchronously rotating conveyor lines 2 are provided above the slide table 1. (See reference...) Figure 1As shown, specifically, multiple levers 3 are connected between the conveyor belts of the two conveyor lines 2. When the conveyor belts are in motion, they can drive the levers 3 to circulate in space. At this time, the lower lever 3 can slide across the surface of the slide table 1 through the transmission of the conveyor belt, thereby providing a pushing force to move the circuit board to be tested at this position forward. In conjunction with the detection system, the corresponding detection work of the circuit board can be realized. Regarding the configuration of the detection system, a first linear motion module 5 and a second linear motion module 6 parallel to each other can be set above the slide table 1. The movable end of the first linear motion module 5 is equipped with an eddy current sensor probe that can be raised and lowered. During detection, the movement of the first linear motion module 5... Simply change the position of the eddy current sensor probe and lower it to the detection height at the detection position. Note that the probe needs to pass through the adjacent positions between multiple levers 3. Therefore, when not in operation, the eddy current sensor probe should be located above the levers 3 to avoid affecting the cyclic transmission between the levers 3. To ensure accurate movement position, a camera assembly 7 can be installed above the slide table 1 to prevent inaccurate position detection caused by the offset of the circuit board under test during the pushing process. In order to classify and transport the detected good and defective products, a lifting suction cup assembly 14 is installed at the movable end of the second linear motion module 6. The suction cup assembly 14 can be used to transport the test products pushed out by the levers 3 to the unloading station. In some other embodiments, dust or sand particles on the surface of the slide 1 may affect the handling of the circuit board under test (easily causing it to tilt) and may scratch the surface of the structure. Therefore, in actual configuration, a blowing component can be set on one side of the surface of the slide 1 to clean the dirt on the upper surface of the slide 1. The corresponding brush or a cleaning cloth can be set on the spaced levers 3 for wiping, and the other levers 3 can complete the normal pushing action. The circuit board under test component that is pushed is preferably positioned on a stable base for testing to avoid scratches or other effects on the circuit board itself.

[0017] This utility model provides a circuit board copper thickness detection device. Since the number of levers 3 can be automatically configured according to requirements, multiple groups of levers 3 can be moved simultaneously when pushing the circuit board assembly under test. In some other control methods, if a lower frequency of step-like actions is desired (because excessive step-like actions can easily lead to large action errors over time), the device can be configured to also include a third linear motion module 4, such as... Figure 1As shown, the third linear motion module 4 is positioned parallel to the transmission direction of the conveyor belt. The first linear motion module 5 is positioned at the movable end of the third linear motion module 4. In this way, the third linear motion module 4 can employ a more precise servo control system. After the device pushes the circuit board to be tested a certain distance, the third linear motion module 4, in conjunction with the first linear motion module 5, can control the eddy current sensor probe to perform sequential detection actions in planar space. This reduces the frequency of conveyor belt stepping actions and extends maintenance time.

[0018] This utility model provides a circuit board copper thickness detection device. Considering that a single detection probe is easily affected by external factors (such as the actual placement height of the circuit board under test) and may produce detection errors, in order to better distinguish the detection results, the number of eddy current sensor probes can be set to no less than two, and multiple eddy current sensor probes can be configured to be close to each other, with the bottom of each eddy current sensor probe having a different horizontal height. By using probes at different heights to detect the copper thickness on the same circuit board, a reasonable judgment basis can be provided for analyzing whether the circuit board under test is at a normal height, so as to have more data for reference, thereby ultimately improving the detection accuracy.

[0019] This utility model provides a circuit board copper thickness detection device. To prevent the circuit board assembly under test from sliding along an undesirable trajectory on the slide table 1, a guide component can be provided on the upper surface of the slide table 1, such as a guide groove in conjunction with a guide circuit board base. The guide component is configured to prevent the circuit board from shifting position during the movement process; other specific methods are not limited here. As a preferred embodiment, the guide component can include an air groove 10 formed above the slide table 1, such as... Figure 2 , Figure 5 as well as Figure 6 As shown, the extension direction of the air groove 10 is parallel to the moving direction of the conveyor belt, and an air gap is formed at the junction of the air groove 10 and the surface of the slide table 1. At the same time, an air pump 12 is also provided below the slide table 1. The air inlet and outlet of the air pump 12 are connected to the two ends of the air groove 10 through the air inlet pipe 11. With this structural configuration, high-speed airflow can pass through the air groove 10 and generate a corresponding adsorption effect at the air gap position by Bernoulli's principle. This can provide a certain adsorption force for the circuit board under test to be placed against the air gap position. It is preferred to configure two air gaps for the same circuit board under test, which can be used to stabilize the base and prevent the base from shifting excessively. This method is suitable for planar universal bases and does not require additional special design of the base that carries the circuit board to adapt to the guide structure on the slide table 1.

[0020] This utility model provides a circuit board copper thickness detection device. In order to locate the basic detection position and prevent the circuit board structure components under test from sliding to an unstable detection position due to inertial force under the action of the lever 3, an opening can be provided on the surface of the slide table 1, and a lifting device 8 is provided below the slide table 1. A baffle 9 is slidably provided in the vertical direction at the opening position. The lifting device 8 is used to drive the baffle 9 to protrude or be recessed into the sliding surface of the slide table 1. When the board is retracted (or the circuit board under test is positioned), the lifting device 8 lifts the baffle 9. The baffle 9 acts as a limiting block structure to prevent further sliding of the circuit board structure under test. In order to avoid hard conflict between structural components, some structures can adopt an elastic design (such as the lever 3 being located in the central position by the action of the elastic element, and being able to slide accordingly along the conveying direction of the conveyor belt after receiving resistance). The specific configuration means are not limited here.

[0021] The present invention provides a circuit board copper thickness detection device. In order to facilitate the suction cup assembly 14 to transport the tested circuit board located below, a baffle 13 is provided at the end of the upper surface of the slide table 1 and below the second linear motion module 6. The baffle 13 structure ensures the discharge position of the finally tested product, so that the suction cup assembly 14 can grasp and transport it.

[0022] The technical principles of this utility model have been described above with reference to specific embodiments. These descriptions are merely for explaining the principles of this utility model and should not be construed as limiting the scope of protection of this utility model in any way. Based on this explanation, those skilled in the art can readily conceive of other specific embodiments of this utility model without any inventive effort, and these embodiments will all fall within the scope of protection of this utility model.

Claims

1. A circuit board copper thickness detection device, characterized in that, The slide includes a slide table (1), above which are two oppositely arranged and synchronously rotating conveyor lines (2). Multiple levers (3) are connected between the conveyor belts of the two conveyor lines (2). The levers (3) can slide across the surface of the slide table (1) through the transmission of the conveyor belts. Above the slide table (1) are a first linear motion module (5) and a second linear motion module (6) that are parallel to each other. The movable end of the first linear motion module (5) is provided with a liftable eddy current sensor probe. The movable end of the second linear motion module (6) is provided with a liftable suction cup assembly (14). The suction cup assembly (14) can adsorb and fix the test product pushed out by the levers (3). Above the slide table (1) is also a camera assembly (7).

2. The circuit board copper thickness detection device according to claim 1, characterized in that, It also includes a third linear motion module (4), the setting direction of which is parallel to the transmission direction of the conveyor belt, and the first linear motion module (5) is set on the movable end of the third linear motion module (4).

3. The circuit board copper thickness detection device according to claim 1, characterized in that, The number of eddy current sensing probes shall be no less than two, and the multiple eddy current sensing probes shall be arranged close to each other, with each eddy current sensing probe having a different horizontal height at its bottom.

4. The circuit board copper thickness detection device according to claim 1, characterized in that, The upper surface of the slide (1) is provided with a guide component, which is used to prevent the circuit board from shifting position during the pushing process.

5. The circuit board copper thickness detection device according to claim 4, characterized in that, The guide assembly includes an air groove (10) formed above the slide (1). The extension direction of the air groove (10) is parallel to the moving direction of the conveyor belt. An air gap is formed at the position where the air groove (10) connects with the surface of the slide (1). An air pump (12) is also provided below the slide (1). The air inlet and outlet of the air pump (12) are connected to the two ends of the air groove (10) through an air inlet pipe (11).

6. The circuit board copper thickness detection device according to claim 1, characterized in that, The surface of the slide (1) is also provided with an opening, and a lifting device (8) is provided below the slide (1). A baffle (9) is slidably provided in the vertical direction at the opening position. The lifting device (8) is used to drive the baffle (9) to protrude or be recessed into the sliding surface of the slide (1).

7. The circuit board copper thickness detection device according to claim 1, characterized in that, A stop bar (13) is provided at the end of the upper surface of the slide (1) and below the second linear motion module (6).

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