A flattening device for processing bare copper wire
By designing a flattening device with brackets, support blocks, sliders, and cylinder-driven components, the problem of non-adjustable thickness in existing technologies has been solved, enabling precise control of bare copper wire thickness and improving production efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIANGXI JINYI NONFERROUS METALS CO LTD
- Filing Date
- 2025-08-27
- Publication Date
- 2026-07-24
AI Technical Summary
Existing technology makes it difficult to freely adjust the thickness of bare copper wire extrusion equipment, which requires changing equipment when producing copper wires of different thicknesses, thus reducing production efficiency.
A flattening device including a bracket, support block, slider, motor, cylinder and controller was designed. The slider and roller are driven by the cylinder to move, and the roller spacing is precisely adjusted to achieve free control of the thickness.
It enables precise adjustment of bare copper wire thickness without the need to replace rolls or stop the machine for adjustment, significantly improving production efficiency and meeting the need for rapid switching between different product specifications.
Smart Images

Figure CN224542983U_ABST