Silicon backside anchor thermal expansion misregistration structure

By setting a metal base and annular compensation groove structure at the bottom of the silicon package, the misalignment of the anchors is prevented, thus solving the problem of silicon package damage caused by thermal expansion and improving the stability and safety of the equipment.

CN224543109UActive Publication Date: 2026-07-24JIAOZUO SENZE HIGH TEMPERATURE MATERIAL CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Utility models(China)
Current Assignee / Owner
JIAOZUO SENZE HIGH TEMPERATURE MATERIAL CO LTD
Filing Date
2025-08-20
Publication Date
2026-07-24

AI Technical Summary

Technical Problem

Thermal expansion at the bottom of the silicon package can cause misalignment of the anchors, which can easily lead to the silicon package being sheared by the anchors.

Method used

A metal base is set at the bottom of the silicon package, and the bottom of the outer steel shell is provided with a compensation hole and an annular compensation groove. A movable circular plate is installed inside. When the outer steel shell expands, the movable circular plate moves in the annular compensation groove to prevent the anchor bolts from being misaligned, and heat transfer is reduced through ceramic materials and heat insulation pads.

Benefits of technology

It effectively prevents misalignment of anchor bolts, reduces damage to the bottom of the silicon package, and improves equipment stability and safety.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN224543109U_ABST
    Figure CN224543109U_ABST
Patent Text Reader

Abstract

The utility model relates to the technical field of silicon package bottom anchorage piece anti -thermal expansion misplacement structure, and disclose a silicon package bottom anchorage piece anti -thermal expansion misplacement structure, including outer steel shell, a plurality of anchor bolt spare, be provided with the silicon package main part in the outer steel shell, the silicon package main part bottom is provided with the metal base, this silicon package bottom anchorage piece anti -thermal expansion misplacement structure, through being provided with the metal base in the silicon package main part bottom, be provided with a plurality of anchor bolt spare in the metal base bottom, and the outer steel shell bottom is provided with a plurality of evenly distributed compensation hole, the annular compensation groove is opened in a plurality of compensation holes, the movable round plate is movably arranged in the annular compensation groove, the sleeve hole that is sleeved with anchor bolt spare is opened on the movable round plate, when the outer steel shell expands because of high temperature, through the movement of movable round plate in the annular compensation groove, prevent the displacement transmission between the outer steel shell and anchor bolt spare, thereby prevent the anchor bolt spare misplacement.
Need to check novelty before this filing date? Find Prior Art