Energy-saving semiconductor industry oven system

Abstract

The utility model provides an energy -conserving type's semiconductor industry oven system, including AI intelligence main control center and heat source assembly, waste gas treatment jar, heat exchanger, loading and unloading conveying component, a plurality of semiconductor industry oven control connection, semiconductor industry oven is equipped with oven high temperature gas air inlet, oven normal temperature gas air inlet and oven high temperature waste gas exhaust, heat source assembly and oven high temperature gas air inlet intercommunication, heat exchanger is equipped with exchanger high temperature waste gas air inlet, exchanger normal temperature air air inlet, exchanger normal temperature waste gas exhaust and exchanger high temperature air outlet, oven high temperature waste gas exhaust and exchanger high temperature waste gas air inlet intercommunication, exchanger high temperature air outlet and oven high temperature gas air inlet intercommunication, exchanger normal temperature waste gas exhaust and waste gas treatment jar intercommunication. The utility model has the advantages of being capable of purifying and treating high temperature waste gas and recycling heat energy in high temperature waste gas, improving production efficiency and reducing energy consumption.

Description

Technical Field

[0001] This utility model relates to the field of industrial drying oven technology, specifically to an energy-saving semiconductor industrial drying oven system. Background Technology

[0002] Industrial ovens are key heat treatment equipment widely used in modern industrial production, found in electronics, chemicals, food, pharmaceuticals, automotive manufacturing, metal processing, and many other fields. In the semiconductor industry, industrial ovens are primarily used for the heat-melting and fixing of electronic components. The principle is to use high-temperature baking to melt solder and fix the electronic components to the circuit board. Advantages include precise temperature control; advanced temperature control systems accurately regulate the temperature inside the oven, ensuring fluctuations within the set temperature range to meet the temperature accuracy requirements of different processes. Through optimized airflow design and the use of high-efficiency heating elements, uniform temperature distribution within the oven is achieved, preventing quality problems caused by uneven heating of materials.

[0003] Currently, semiconductor industrial ovens are an indispensable piece of equipment in the production process of semiconductor circuit boards. However, existing semiconductor industrial ovens have the following drawbacks because each heat-melting and fixing process requires starting from room temperature:

[0004] 1. The heating rate is slow, which leads to low production efficiency;

[0005] 2. The heating time is long and the energy consumption is high, which in turn leads to higher production costs for heating.

[0006] 3. Direct discharge of high-temperature waste will pollute the atmosphere and is not environmentally friendly. Utility Model Content

[0007] To address the problems in existing technologies, this utility model provides an energy-saving semiconductor industrial oven system. This system incorporates a heat source assembly, a waste gas treatment tank, a heat exchanger, a loading / unloading conveyor assembly, an AI intelligent control center, and multiple semiconductor industrial ovens. The AI ​​intelligent control center controls the heat exchanger to recover the heat energy from the high-temperature waste gas discharged from the semiconductor industrial ovens and re-transfer it to the ovens to preheat the electronic components requiring heating. Simultaneously, the recovered waste gas undergoes harmless treatment before being discharged. This system purifies the high-temperature waste gas and recovers its heat energy, cyclically preheating the electronic components. It significantly reduces the time required for heat-melting and fixing of electronic components, improves production efficiency, reduces energy consumption, and achieves environmentally friendly emissions, preventing air pollution and protecting the environment. This solves the problems of slow heating speed, high energy consumption, and environmental unfriendliness in existing semiconductor industrial ovens.

[0008] This utility model provides an energy-saving semiconductor industrial oven system, comprising a heat source component, an exhaust gas treatment tank, a heat exchanger, a loading and unloading conveyor component, an AI intelligent control center, and multiple semiconductor industrial ovens that cooperate with each other. The AI ​​intelligent control center is connected to the heat source component, the exhaust gas treatment tank, the heat exchanger, the loading and unloading conveyor component, and the multiple semiconductor industrial ovens. Each semiconductor industrial oven is equipped with a high-temperature gas inlet, a normal-temperature gas inlet, and a high-temperature exhaust outlet. The heat source component is connected to the high-temperature gas inlet of the oven through a gas supply pipe. The heat exchanger is equipped with a high-temperature exhaust outlet. The oven includes an air inlet, a normal temperature air inlet, a normal temperature exhaust outlet, and a high temperature air outlet. The high temperature exhaust outlet is connected to the high temperature exhaust inlet via a gas pipeline. The high temperature air outlet is connected to the high temperature gas inlet. The normal temperature exhaust outlet is connected to the exhaust gas treatment tank. The AI ​​intelligent main control center can control the heat exchanger to recover the heat energy from the high temperature exhaust gas discharged from the semiconductor industrial oven and re-supply it to the semiconductor industrial oven to preheat the electronic components that need to be heated. At the same time, the exhaust gas after the heat energy is recovered is treated to render it harmless before being discharged.

[0009] In a further improvement, the semiconductor industrial oven further includes a baking inner box, a baking outer box, and a baking drawer that cooperate with each other. The bottom of the baking inner box is provided with a drawer slide rail, and the baking drawer is slidably connected to the drawer slide rail. A material placement box is provided inside the baking drawer. The baking outer box is arranged to tightly surround the baking inner box. A sealing and heat-insulating layer is provided between the inner wall of the baking outer box and the baking inner box. The sealing and heat-insulating layer is an aerogel gasket.

[0010] This invention is further improved by providing a baffle plate at the bottom of the baking chamber to accelerate the uniform mixing of high-temperature gases.

[0011] In a further improvement, the outer surface of the baking chamber is also provided with a heating gas mixing pipe, which is connected to the high-temperature gas inlet and the ambient temperature gas inlet of the oven. The AI ​​intelligent main control center controls the specific temperature in the inner baking chamber by controlling the proportion of high-temperature gas entering the high-temperature gas inlet and ambient temperature gas entering the ambient temperature gas inlet.

[0012] In a further improvement to this invention, a high-temperature sealing strip is provided at the contact point between the baking inner box and the baking drawer, and a drawer sealing and heat-insulating layer is provided on the inner wall of the baking drawer, which is an aerogel gasket.

[0013] In a further improvement of this invention, multiple semiconductor industrial oven arrays are arranged on a baking rack to form an oven group, and the oven group cooperates with the loading and unloading conveying assembly.

[0014] This utility model is further improved by providing high-temperature resistant solenoid valves at the high-temperature gas inlet, the normal-temperature gas inlet, and the high-temperature exhaust outlet of the oven, and the AI ​​intelligent main control center is connected to the high-temperature resistant solenoid valves for control.

[0015] This utility model is further improved in that the loading and unloading conveying assembly includes a ground rail, a six-axis robot and a loading and unloading conveyor belt. The six-axis robot is slidably connected to the ground rail, and the loading and unloading conveyor belt cooperates with the ground rail. The six-axis robot can grip the electronic components on the loading and unloading conveyor belt and move them into the semiconductor industrial oven for heat-melting and fixing operations.

[0016] In a further improvement of this utility model, a high-temperature exhaust gas combustion chamber is provided between the high-temperature exhaust port of the oven and the high-temperature exhaust gas inlet of the exchanger. The high-temperature exhaust gas combustion chamber is provided with a variety of catalytic catalysts for decomposing organic matter in the exhaust gas, including low-temperature catalysts, biological catalysts and photocatalysts.

[0017] This utility model is further improved by providing activated carbon for filtering waste gas inside the waste gas treatment tank.

[0018] Compared with existing technologies, the beneficial effects of this utility model are as follows: This utility model provides an energy-saving semiconductor industrial oven system. By setting up mutually cooperating heat source components, waste gas treatment tanks, heat exchangers, loading and unloading conveying components, an AI intelligent control center, and multiple semiconductor industrial ovens within the system, the AI ​​intelligent control center can control the heat exchangers to recover the heat energy from the high-temperature waste gas discharged from the semiconductor industrial ovens and re-transfer it to the ovens to preheat the electronic components that need to be heated. Simultaneously, the waste gas after heat recovery is treated to render it harmless before being discharged. This achieves the purification of high-temperature waste gas and the recovery and utilization of its heat energy, cyclically preheating the electronic components that need to be heated, significantly reducing the time required for heat-melting and fixing of electronic components, and improving production efficiency. The oven boasts high efficiency and reduced energy consumption. It utilizes catalytic catalysts for waste gas treatment, achieving environmentally friendly emissions without air pollution, thus protecting the environment. Furthermore, its small, sealed enclosure ensures no heat leakage, high thermal energy utilization, high temperature control accuracy, and energy savings, resulting in uniform internal temperature (±3℃). The oven units are arranged on shelves, utilizing upper-level space and occupying minimal floor space. The number of ovens can be configured according to production capacity, offering high flexibility. It can be used for both experimental and mass-produced products. An AI-powered intelligent control center monitors and controls the robot's operation and internal temperature in real time, demonstrating a high degree of intelligence. All machine actions, programmed heating, and multi-segment temperature control data are recorded for quality traceability and analysis, solving the problems of slow heating speed, high energy consumption, and insufficient environmental friendliness in existing semiconductor industrial ovens. Attached Figure Description

[0019] To more clearly illustrate the solutions in this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of an energy-saving semiconductor industrial drying oven system according to the present invention.

[0021] Figure 2 This is a cross-sectional view of the semiconductor industrial drying oven of this utility model;

[0022] Figure 3 This is a perspective view of the semiconductor industrial drying oven of this utility model;

[0023] Figure 4 This is a perspective view of the oven assembly of this utility model.

[0024] In the diagram, 1-heat source component, 2-exhaust gas treatment tank, 3-heat exchanger, 4-loading and unloading conveyor component, 41-ground rail, 42-six-axis robot, 43-loading and unloading conveyor belt, 5-semiconductor industrial oven, 51-high temperature gas inlet of oven, 52-normal temperature gas inlet of oven, 53-high temperature exhaust outlet of oven, 54-baking inner chamber, 55-baking outer chamber, 56-baking drawer, 57-heating gas mixing pipe, 58-baffle. Detailed Implementation

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein in the specification of the application is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having” and any variations thereof in the specification, claims and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0026] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0027] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings.

[0028] like Figure 1-4As shown, this utility model provides an energy-saving semiconductor industrial oven system, including a heat source component 1, an exhaust gas treatment tank 2, a heat exchanger 3, a loading and unloading conveying component 4, an AI intelligent control center, and multiple semiconductor industrial ovens 5. The AI ​​intelligent control center is connected to the heat source component 1, the exhaust gas treatment tank 2, the heat exchanger 3, the loading and unloading conveying component 4, and the multiple semiconductor industrial ovens 5. Each semiconductor industrial oven 5 is equipped with a high-temperature gas inlet 51 and a normal-temperature gas inlet 52. 2. The oven high-temperature exhaust port 53 is connected to the oven high-temperature gas inlet 51 through the gas transmission pipe. The heat exchanger 3 is equipped with an exchanger high-temperature exhaust gas inlet, an exchanger ambient air inlet, an exchanger ambient air exhaust port and an exchanger high-temperature air outlet. The oven high-temperature exhaust port 53 is connected to the exchanger high-temperature exhaust gas inlet through the gas transmission pipe. The exchanger high-temperature air outlet is connected to the oven high-temperature gas inlet 51. The exchanger ambient air exhaust port is connected to the exhaust gas treatment tank. In this embodiment, the AI ​​intelligent main control center can control the heat exchanger to recover the heat energy of the high-temperature waste gas discharged from the semiconductor industrial oven and re-transport it to the semiconductor industrial oven to preheat the electronic components that need to be heated. At the same time, the waste gas after the heat energy is recovered is treated to render it harmless before being discharged. This can purify the high-temperature waste gas and recover the heat energy in the high-temperature waste gas, and circulate it to preheat the electronic components that need to be heated. This significantly reduces the time required for the hot melting and fixing of electronic components, improves production efficiency, and reduces energy consumption. The use of catalytic catalysts for waste gas treatment achieves environmentally friendly emissions, does not pollute the atmosphere, and protects the environment.

[0029] like Figure 2-4As shown, the semiconductor industrial oven 5 also includes a baking inner chamber 54, a baking outer chamber 55, and a baking drawer 56 that cooperate with each other. The bottom of the baking inner chamber 54 is provided with a drawer slide rail, and the baking drawer 56 is slidably connected to the drawer slide rail. A material placement box is provided inside the baking drawer 56. The baking outer chamber 55 is tightly surrounded by the baking inner chamber 54. A sealing and heat-insulating layer, which is an aerogel gasket, is provided between the inner wall of the baking outer chamber 55 and the baking inner chamber 54. The bottom of the baking inner chamber 54 is also provided with a baffle 58 for accelerating the uniform mixing of high-temperature gases. A high-temperature sealing strip is also provided at the contact point between the baking inner chamber 54 and the baking drawer 56. The inner wall of the baking drawer 56 is provided with a drawer sealing and heat-insulating layer, which is an aerogel gasket. High-temperature resistant solenoid valves are provided at the high-temperature gas inlet 51, the room-temperature gas inlet 52, and the high-temperature exhaust outlet 53 of the oven. The intelligent main control center is connected to the high-temperature resistant solenoid valve control; a high-temperature exhaust gas combustion chamber is also provided between the high-temperature exhaust gas outlet 53 of the oven and the high-temperature exhaust gas inlet of the exchanger. The high-temperature exhaust gas combustion chamber is equipped with a variety of catalytic catalysts for decomposing organic matter in the exhaust gas, including low-temperature catalysts, biological catalysts and photocatalysts; the exhaust gas treatment tank 2 is equipped with activated carbon for filtering exhaust gas; the outer surface of the baking outer box 55 is also equipped with a heating gas mixing pipe 57, which is connected to the high-temperature gas inlet 51 and the room temperature gas inlet 52 of the oven. The AI ​​intelligent main control center controls the specific temperature in the baking inner box by controlling the proportion of high-temperature gas entering the high-temperature gas inlet and room temperature gas entering the room temperature gas inlet. Multiple semiconductor industrial oven arrays are set on a baking rack to form an oven group, and the oven group is coordinated with the loading and unloading conveying components. In this embodiment, the entire oven group shares a single heat source component, which is piped to each semiconductor industrial oven. High-temperature gas and room-temperature gas are mixed in proportion within the heating gas mixing pipe to achieve the required gas temperature. The gas temperature changes in each semiconductor industrial oven are independently controlled, so that the gas temperature in each semiconductor industrial oven will not be the same at the same time.

[0030] like Figure 1 As shown, the loading / unloading conveyor assembly 4 includes a ground rail 41, a six-axis robot 42, and a loading / unloading conveyor belt 43. The six-axis robot 42 is slidably connected to the ground rail 41, and the loading / unloading conveyor belt 43 cooperates with the ground rail 41. The six-axis robot 42 can grip the electronic components on the loading / unloading conveyor belt 43 and move them into the semiconductor industrial oven 5 for heat-melting and fixing. In this embodiment, the loading / unloading conveyor assembly is used to transport the electronic components that need to be heated to the semiconductor industrial oven, and then send the heat-melted and fixed electronic products out of the production line.

[0031] As can be seen from the above, this utility model provides an energy-saving semiconductor industrial oven system. By setting up mutually cooperating heat source components, waste gas treatment tanks, heat exchangers, loading and unloading conveying components, an AI intelligent control center, and multiple semiconductor industrial ovens within the system, the AI ​​intelligent control center can control the heat exchangers to recover the heat energy from the high-temperature waste gas discharged from the semiconductor industrial ovens and re-transfer it to the ovens to preheat the electronic components that need to be heated. Simultaneously, the waste gas after heat recovery is treated to render it harmless before being discharged. This system purifies the high-temperature waste gas and recovers the heat energy within it, cyclically preheating the electronic components that need to be heated. This significantly reduces the time required for heat-melting and fixing of electronic components, improves production efficiency, and reduces energy consumption. Using catalytic catalysts for waste gas treatment achieves environmentally friendly emissions, preventing air pollution and protecting the environment. The oven is a small, sealed chamber with no heat leakage, high thermal energy utilization, high temperature control accuracy, and energy saving, resulting in uniform internal temperature (±3℃). The oven units are arranged in a shelf configuration, utilizing upper-level space and occupying a small area. The number of ovens can be configured according to production capacity, offering high flexibility. It can be used for both experimental and mass production products. The AI ​​intelligent main control center monitors and controls the robot's operation and the internal temperature in real time, demonstrating a high degree of intelligence. All machine actions, programmed heating, and multi-segment temperature control data are recorded for quality traceability and analysis, solving the problems of slow heating speed, high energy consumption, and insufficient environmental protection in existing semiconductor industrial ovens.

[0032] The specific embodiments described above are preferred embodiments of this utility model, and are not intended to limit the specific scope of this utility model. The scope of this utility model includes but is not limited to the specific embodiments described above. All equivalent changes made in accordance with this utility model are within the protection scope of this utility model.

Claims

1. An energy-saving semiconductor industrial drying oven system, characterized in that, The system includes a heat source assembly, an exhaust gas treatment tank, a heat exchanger, a loading and unloading conveyor assembly, an AI intelligent control center, and multiple semiconductor industrial ovens that work together. The AI ​​intelligent control center is connected to the heat source assembly, the exhaust gas treatment tank, the heat exchanger, the loading and unloading conveyor assembly, and the multiple semiconductor industrial ovens. Each semiconductor industrial oven has a high-temperature gas inlet, a normal-temperature gas inlet, and a high-temperature exhaust gas outlet. The heat source assembly is connected to the high-temperature gas inlet of the oven via a gas pipeline. The heat exchanger has a high-temperature exhaust gas inlet and a normal-temperature air outlet. The oven includes an air inlet, a normal temperature exhaust port for the heat exchanger, and a high temperature air outlet for the heat exchanger. The high temperature exhaust port of the oven is connected to the high temperature exhaust port of the heat exchanger via a gas supply pipe. The high temperature air outlet of the heat exchanger is connected to the high temperature gas inlet of the oven. The normal temperature exhaust port of the heat exchanger is connected to the exhaust gas treatment tank. The AI ​​intelligent main control center can control the heat exchanger to recover the heat energy of the high temperature exhaust gas discharged from the semiconductor industrial oven and re-supply it to the semiconductor industrial oven to preheat the electronic components that need to be heated. At the same time, the exhaust gas after the heat energy is recovered is treated to be harmless before being discharged.

2. The energy-saving semiconductor industrial oven system according to claim 1, characterized in that: The semiconductor industrial oven also includes an inner baking chamber, an outer baking chamber, and a baking drawer that cooperate with each other. The bottom of the inner baking chamber is provided with a drawer slide rail, and the baking drawer is slidably connected to the drawer slide rail. The baking drawer is provided with a material placement box. The outer baking chamber is arranged to tightly surround the inner baking chamber. A sealing and heat-insulating layer is provided between the inner wall of the outer baking chamber and the inner baking chamber. The sealing and heat-insulating layer is an aerogel gasket.

3. The energy-saving semiconductor industrial oven system according to claim 2, characterized in that: The bottom of the baking chamber is also equipped with a baffle plate to accelerate the uniform mixing of high-temperature gases.

4. The energy-saving semiconductor industrial oven system according to claim 3, characterized in that: The outer surface of the baking chamber is also equipped with a heating gas mixing pipe, which is connected to the high-temperature gas inlet and the ambient temperature gas inlet of the oven. The AI ​​intelligent main control center controls the specific temperature in the inner baking chamber by controlling the proportion of high-temperature gas entering from the high-temperature gas inlet and ambient temperature gas entering from the ambient temperature gas inlet.

5. The energy-saving semiconductor industrial oven system according to claim 4, characterized in that: The baking inner box and the baking drawer are also provided with a high-temperature sealing strip, and the inner wall of the baking drawer is provided with a drawer sealing and heat preservation layer, which is an aerogel gasket.

6. The energy-saving semiconductor industrial oven system according to claim 5, characterized in that: Multiple semiconductor industrial oven arrays are arranged on a baking rack to form an oven group, and the oven group cooperates with the loading and unloading conveying assembly.

7. The energy-saving semiconductor industrial oven system according to claim 6, characterized in that: High-temperature resistant solenoid valves are installed at the high-temperature gas inlet, the normal-temperature gas inlet, and the high-temperature exhaust outlet of the oven. The AI ​​intelligent main control center is connected to the high-temperature resistant solenoid valves for control.

8. The energy-saving semiconductor industrial oven system according to claim 7, characterized in that: The loading and unloading conveyor assembly includes a ground rail, a six-axis robot, and a loading and unloading conveyor belt. The six-axis robot is slidably connected to the ground rail, and the loading and unloading conveyor belt cooperates with the ground rail. The six-axis robot can grip the electronic components on the loading and unloading conveyor belt and move them into the semiconductor industrial oven for heat-melting and fixing operations.

9. The energy-saving semiconductor industrial oven system according to claim 8, characterized in that: A high-temperature exhaust gas combustion chamber is provided between the high-temperature exhaust port of the oven and the high-temperature exhaust gas inlet of the exchanger. The high-temperature exhaust gas combustion chamber is equipped with a variety of catalytic catalysts for decomposing organic matter in the exhaust gas, including low-temperature catalysts, biological catalysts and photocatalysts.

10. The energy-saving semiconductor industrial oven system according to claim 9, characterized in that: The waste gas treatment tank is equipped with activated carbon for filtering waste gas.

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