Cmp polishing pad having a pore structure

Abstract

The utility model discloses a CMP polishing pad with pore structure belongs to polishing pad technical field, including base layer, the upper surface of base layer is provided with polishing layer, is provided with the polishing block of outward bulge on the polishing layer, wherein, the pore structure is formed between adjacent polishing block, the pore structure is used for conveying and distribution polishing liquid and stores and removes polishing byproduct, be provided with the reinforcing assembly on the base layer, the reinforcing assembly is used for enhancing the hardness and mechanical strength of base layer. The utility model solves the problem that the groove structure that the present polishing pad surface sets usually will reduce the hardness and mechanical strength of polishing pad, leads to polishing pad to wear too fast, reduces the service life of polishing pad. The utility model can strengthen the hardness and mechanical strength of base layer through reinforcing assembly to enhance the hardness and mechanical strength of polishing pad, prevent polishing pad to wear too fast, can prolong the service life of polishing pad.

Description

Technical Field

[0001] This utility model relates to the field of polishing pad technology, specifically to a CMP polishing pad with a porous structure. Background Technology

[0002] Polishing pads are key auxiliary materials in chemical mechanical polishing (CMP) processes, determining the surface quality of wafers. Primarily composed of materials such as polyurethane foam, they possess a porous microstructure and high wear resistance. Their core functions include uniformly transmitting pressure, storing polishing slurry, and removing reaction residues. Adjusting the hardness can optimize both in-mold and in-wafer uniformity. The groove pattern design directly affects the polishing slurry distribution efficiency; radial grooves improve material removal rate, while annular grooves optimize surface finish.

[0003] When using existing CMP polishing pads, the groove structure on the surface of the pad usually reduces the hardness and mechanical strength of the pad, causing it to wear out too quickly and reducing its service life. Utility Model Content

[0004] The purpose of this invention is to provide a CMP polishing pad with a porous structure, which can improve the hardness and mechanical strength of the polishing pad, prevent the polishing pad from wearing out too quickly, extend the service life of the polishing pad, and solve the problems in the prior art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A CMP polishing pad with a porous structure includes a base layer, a polishing layer disposed on the upper surface of the base layer, and outwardly protruding polishing blocks disposed on the polishing layer. A porous structure is formed between adjacent polishing blocks. The porous structure is used to transport and distribute polishing fluid and to store and remove polishing byproducts. A reinforcing component is disposed on the base layer to enhance the hardness and mechanical strength of the base layer.

[0007] Preferably, the substrate layer includes an upper substrate layer and a lower substrate layer, wherein the reinforcing component is located inside the upper substrate layer and the lower substrate layer, and the upper substrate layer is located above the lower substrate layer.

[0008] Preferably, the reinforcing component includes reinforcing rings and reinforcing ribs, the reinforcing rings are concentrically distributed, and the reinforcing rings are connected by reinforcing ribs.

[0009] Preferably, the reinforcing component further includes an upper positioning ring and a lower positioning ring, wherein the upper positioning ring is disposed on the upper surface of the reinforcing ring and the lower positioning ring is disposed on the lower surface of the reinforcing ring.

[0010] Preferably, the reinforcing ring is disposed within the upper substrate layer via an upper positioning ring, and the reinforcing ring is disposed within the lower substrate layer via a lower positioning ring.

[0011] Preferably, the inner side of the upper substrate layer is provided with an upper annular groove for assembling the upper positioning ring, and the inner side of the lower substrate layer is provided with a lower annular groove for assembling the lower positioning ring.

[0012] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0013] This invention involves placing a lower positioning ring on a lower annular groove on a lower substrate layer, placing an upper substrate layer above the lower substrate layer, and placing the upper positioning ring in an upper annular groove on the upper substrate layer. After lamination, a base layer with embedded reinforcing components is formed. The reinforcing components can enhance the hardness and mechanical strength of the base layer, thereby improving the hardness and mechanical strength of the polishing pad, preventing the polishing pad from wearing out too quickly, and extending the service life of the polishing pad. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of the CMP polishing pad with a porous structure according to the present invention.

[0015] Figure 2 This is a schematic diagram of the polishing layer of this utility model;

[0016] Figure 3 This is an exploded top view of the base layer of this utility model;

[0017] Figure 4 This is an exploded top view of the base layer of this utility model;

[0018] Figure 5 This is a structural schematic diagram of the reinforcing component of this utility model;

[0019] Figure 6 A cross-sectional schematic diagram of the reinforcing component disposed within the base layer of this utility model;

[0020] Figure 7 An exploded cross-sectional view of the reinforcing component disposed within the base layer of this utility model;

[0021] Figure 8 For the present utility model Figure 6 Enlarged view of point A in the image;

[0022] Figure 9 For the present utility model Figure 7 Enlarged view of point B in the image.

[0023] In the figure: 1. Base layer; 11. Upper substrate layer; 111. Upper annular groove; 12. Lower substrate layer; 121. Lower annular groove; 2. Polishing layer; 21. Polishing block; 22. Pore structure; 3. Reinforcing component; 31. Reinforcing ring; 32. Reinforcing rib; 33. Upper positioning ring; 34. Lower positioning ring. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] To address the issue that the grooved structure on the surface of existing CMP polishing pads often reduces the pad's hardness and mechanical strength, leading to premature wear and a shortened lifespan, please refer to [reference needed]. Figures 1-9 The following technical solution is provided in this embodiment:

[0026] A CMP polishing pad with a porous structure includes a base layer 1, a polishing layer 2 disposed on the upper surface of the base layer 1, and polishing blocks 21 protruding outwardly disposed on the polishing layer 2. A porous structure 22 is formed between adjacent polishing blocks 21. The porous structure 22 is used to transport and distribute polishing fluid and to store and remove polishing byproducts.

[0027] Specifically, the porous structure 22 forms the delivery channel of the polishing pad, which can deliver the polishing liquid to the entire polishing area and distribute it evenly. Furthermore, the polishing byproducts generated during the polishing process can be carried away in time through the porous structure 22, giving it a strong ability to deliver polishing liquid and remove polishing byproducts.

[0028] A reinforcing component 3 is provided on the base layer 1, which is used to enhance the hardness and mechanical strength of the base layer 1.

[0029] In this embodiment, the substrate layer 1 includes an upper substrate layer 11 and a lower substrate layer 12, wherein the reinforcing component 3 is located inside the upper substrate layer 11 and the lower substrate layer 12, and the upper substrate layer 11 is located above the lower substrate layer 12.

[0030] In this embodiment, the reinforcing component 3 includes reinforcing rings 31 and reinforcing ribs 32. The reinforcing rings 31 are distributed concentrically and are connected to each other by the reinforcing ribs 32.

[0031] In this embodiment, the reinforcing component 3 further includes an upper positioning ring 33 and a lower positioning ring 34. The upper positioning ring 33 is disposed on the upper surface of the reinforcing ring 31, and the lower positioning ring 34 is disposed on the lower surface of the reinforcing ring 31.

[0032] In this embodiment, the reinforcing ring 31 is disposed in the upper substrate layer 11 by the upper positioning ring 33, and the reinforcing ring 31 is disposed in the lower substrate layer 12 by the lower positioning ring 34.

[0033] In this embodiment, the inner side of the upper substrate layer 11 is provided with an upper annular groove 111 for assembling the upper positioning ring 33, and the inner side of the lower substrate layer 12 is provided with a lower annular groove 121 for assembling the lower positioning ring 34.

[0034] Specifically, the lower positioning ring 34 is placed on the lower annular groove 121 of the lower substrate layer 12, and the upper substrate layer 11 is placed above the lower substrate layer 12. The upper positioning ring 33 is placed in the upper annular groove 111 on the upper substrate layer 11. After lamination, a base layer 1 with embedded reinforcing component 3 is formed. The hardness and mechanical strength of the base layer 1 can be enhanced by the reinforcing component 3, thereby improving the hardness and mechanical strength of the polishing pad, preventing the polishing pad from wearing out too quickly, and extending the service life of the polishing pad.

[0035] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0036] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A CMP polishing pad with a porous structure, comprising a substrate layer (1), characterized in that: The upper surface of the base layer (1) is provided with a polishing layer (2), and the polishing layer (2) is provided with outwardly protruding polishing blocks (21), wherein a pore structure (22) is formed between adjacent polishing blocks (21), the pore structure (22) is used to transport and distribute polishing liquid and store and remove polishing by-products, and a reinforcing component (3) is provided on the base layer (1), the reinforcing component (3) is used to enhance the hardness and mechanical strength of the base layer (1).

2. The CMP polishing pad with a porous structure according to claim 1, characterized in that: The base layer (1) includes an upper base layer (11) and a lower base layer (12), wherein the reinforcing component (3) is located inside the upper base layer (11) and the lower base layer (12), and the upper base layer (11) is located above the lower base layer (12).

3. The CMP polishing pad with a porous structure according to claim 2, characterized in that: The reinforcing component (3) includes reinforcing rings (31) and reinforcing ribs (32). The reinforcing rings (31) are distributed around the same center and are connected to each other by reinforcing ribs (32).

4. The CMP polishing pad with a porous structure according to claim 3, characterized in that: The reinforcing component (3) further includes an upper positioning ring (33) and a lower positioning ring (34). The upper positioning ring (33) is disposed on the upper surface of the reinforcing ring (31), and the lower positioning ring (34) is disposed on the lower surface of the reinforcing ring (31).

5. The CMP polishing pad with a porous structure according to claim 4, characterized in that: The reinforcing ring (31) is disposed in the upper substrate layer (11) by the upper positioning ring (33), and the reinforcing ring (31) is disposed in the lower substrate layer (12) by the lower positioning ring (34).

6. The CMP polishing pad with a porous structure according to claim 5, characterized in that: The inner side of the upper substrate layer (11) is provided with an upper annular groove (111) for assembling the upper positioning ring (33), and the inner side of the lower substrate layer (12) is provided with a lower annular groove (121) for assembling the lower positioning ring (34).

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