Semiconductor grinder wafer surface pressure equalization device

Abstract

The utility model relates to mechanical manufacturing technical field discloses semiconductor grinder wafer surface pressure equalization device, including the casing, the inner wall top of casing is fixedly connected with temperature sensor, the left and right sides of the inner wall top of casing are all fixedly connected with cooling heat pipe no.

Description

Technical Field

[0001] This utility model relates to the field of mechanical manufacturing technology, and in particular to a device for homogenizing the pressure on the surface of a semiconductor grinding machine wafer. Background Technology

[0002] Semiconductor polishing machines play a crucial role in the semiconductor manufacturing process by performing surface processing on wafers. Through polishing operations, the thickness, flatness, and roughness of wafers can be precisely controlled. During the polishing process, the uniformity of the pressure on the wafer surface directly affects the polishing quality and chip yield. Uneven pressure will cause inconsistent polishing thickness, scratches, or damage to the wafer surface. To address this, wafer surface pressure homogenization devices for semiconductor polishing machines have been developed.

[0003] The wafer surface pressure homogenization device of the semiconductor polishing machine improves the pressure sensing module and liquid distribution components through the polishing head and polishing disc, ensuring that the surface pressure of the wafer is evenly distributed during polishing, effectively improving polishing accuracy and product quality. It has become a key module to ensure the efficient and stable operation of the semiconductor polishing machine and realize high-precision wafer processing.

[0004] Although the wafer surface pressure homogenization device of the semiconductor polishing machine can improve the uniformity of wafer polishing and reduce surface defects, the device considers temperature control of the limiting ring, but cannot completely eliminate the problem of uneven temperature of the wafer during the polishing process. The frictional heat generated between the polishing pad and the wafer is not effectively controlled, resulting in different chemical reaction rates of the polishing fluid in different areas of the wafer, affecting the polishing rate and pressure uniformity. The existing solutions are to increase heat dissipation channels and heat dissipation fins to improve heat dissipation efficiency, use materials with good thermal conductivity to manufacture the polishing head and the support stage, and design internal circulating cooling channels to remove heat through the circulation of coolant. However, the addition of heat dissipation devices occupies a certain amount of space, increasing the size of the equipment. Utility Model Content

[0005] To overcome the above shortcomings, this utility model provides a semiconductor grinding machine wafer surface pressure homogenization device, which aims to improve the problem that adding a heat dissipation device in the prior art will occupy a certain space and increase the size of the equipment.

[0006] To achieve the above objectives, this utility model adopts the following technical solution: a semiconductor polishing machine wafer surface pressure homogenization device, comprising a housing, a temperature sensor fixedly connected to the top of the inner wall of the housing, cooling heat pipes one fixedly connected to the left and right sides of the top of the inner wall of the housing, mounting grooves opened on the left and right sides of the housing, cooling boxes slidably connected to the inner walls of the two mounting grooves, micro circulation pumps fixedly connected to the bottom of the inner walls of the two cooling boxes, cooling heat pipes two fixedly connected to the rear sides of the two micro circulation pumps, two connectors fixedly connected to the opposite sides of the two cooling heat pipes one, heat dissipation holes opened on the front and rear sides of the two cooling boxes, silent fans fixedly connected to the inner walls of multiple heat dissipation holes, two rotating shafts rotatably connected to the bottom of the inner walls of the two cooling boxes, air guide plates fixedly connected to the top of multiple rotating shafts, inspection doors rotatably connected to the opposite sides of the two cooling boxes, a polishing groove opened on the top of the housing, and a polishing fluid recovery mechanism provided on the inner wall of the housing for recovering polishing fluid.

[0007] As a further description of the above technical solution:

[0008] The grinding fluid recovery mechanism includes an electromagnetic adsorption disk, the outer wall of which is slidably connected to the inner wall of the grinding tank. Multiple guide vanes are fixedly connected to the inner wall of the electromagnetic adsorption disk, and multiple electromagnetic coils are fixedly connected to the bottom of the inner wall of the electromagnetic adsorption disk. A recovery hole is opened at the bottom of the inner wall of the electromagnetic adsorption disk, and a shape memory alloy filter screen is fixedly connected to the inner wall of the recovery hole. A recovery box is fixedly connected to the bottom of the inner wall of the housing, and a water pump is fixedly connected to the top of the recovery box. A guide pipe is connected to the right side of the water pump.

[0009] As a further description of the above technical solution:

[0010] Guide rods are fixedly connected to the front and rear sides of both cooling boxes, and sliding grooves are provided on the front and rear sides of the inner walls of both mounting slots.

[0011] As a further description of the above technical solution:

[0012] Multiple rubber pads are fixedly connected to the bottom of the housing, and multiple anti-slip strips are fixedly connected to the bottom of each rubber pad.

[0013] As a further description of the above technical solution:

[0014] Two pins are fixedly connected to the opposite sides of the two cooling boxes, and two rotating shafts are fixedly connected to the opposite sides of the two inspection doors.

[0015] As a further description of the above technical solution:

[0016] Each of the multiple heat dissipation holes has a dustproof mesh fixedly connected to its inner wall, and the multiple dustproof meshes are symmetrically distributed.

[0017] As a further description of the above technical solution:

[0018] Each of the dustproof nets has a sealing ring fixedly connected to its outer wall, and each of the sealing rings adopts a ring design.

[0019] As a further description of the above technical solution:

[0020] A control panel is fixedly connected to the front side of the housing. The control panel is electrically connected to the temperature sensor, the micro circulation pump, the silent fan, the electromagnetic coil, and the water pump.

[0021] This utility model has the following beneficial effects:

[0022] 1. In this utility model, by inserting the cooling box into the mounting slot, the corresponding micro circulation pump is started, and the coolant in the second cooling heat pipe and the first cooling heat pipe are circulated, which accelerates the heat dissipation of the device. At the same time, the silent fan can accelerate the heat dissipation speed of the second cooling heat pipe in the cooling box, and the air guide plate can make the cold air target the components in the cooling box for heat dissipation. The precise temperature control ensures uniform wafer pressure. The plug-in design of the cooling box is convenient for maintenance and storage, saves space, and improves the flexibility and practicality of the equipment.

[0023] 2. In this utility model, the used grinding fluid is collected by an electromagnetic adsorption plate, and the guide plate enables the grinding fluid to flow to the recovery hole. At the same time, the electromagnetic coil can remove iron debris from the grinding fluid, and the filter screen can intercept the remaining impurities. Then, the water pump is started to accelerate the recovery of the grinding fluid, avoid equipment blockage, improve the purity and recovery efficiency of the grinding fluid, and reduce the processing cost. Attached Figure Description

[0024] Figure 1 This is a perspective view of the semiconductor polishing machine wafer surface pressure homogenization device proposed in this utility model;

[0025] Figure 2 This is a front view of the semiconductor polishing machine wafer surface pressure homogenization device proposed in this utility model;

[0026] Figure 3 This is a cross-sectional view of the housing of the semiconductor polishing machine wafer surface pressure homogenization device proposed in this utility model;

[0027] Figure 4 This is a schematic diagram of the cooling heat pipe of the semiconductor polishing machine wafer surface pressure homogenization device proposed in this utility model;

[0028] Figure 5This is a cross-sectional view of the cooling box of the semiconductor polishing machine wafer surface pressure homogenization device proposed in this utility model;

[0029] Figure 6 This is a schematic diagram of the water pump structure of the semiconductor grinding machine wafer surface pressure homogenization device proposed in this utility model.

[0030] Legend:

[0031] 1. Housing; 2. Grinding fluid recovery mechanism; 201. Electromagnetic adsorption plate; 202. Guide plate; 203. Electromagnetic coil; 204. Recovery hole; 205. Shape memory alloy filter; 206. Guide pipe; 207. Water pump; 208. Recovery box; 3. Temperature sensor; 4. Cooling heat pipe one; 5. Connector; 6. Mounting slot; 7. Cooling box; 8. Miniature circulation pump; 9. Cooling heat pipe two; 10. Heat dissipation hole; 11. Silent fan; 12. Rotating shaft; 13. Air guide plate; 14. Inspection door; 15. Slide; 16. Guide rod; 17. Dustproof net; 18. Control panel; 19. Rubber pad; 20. Anti-slip strip; 21. Rotating shaft; 22. Pin; 23. Sealing ring; 24. Grinding tank. Detailed Implementation

[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0033] Reference Figure 2 , Figure 4 and Figure 5This utility model provides an embodiment of a semiconductor polishing machine wafer surface pressure homogenization device, comprising a housing 1. A temperature sensor 3 is fixedly connected to the top of the inner wall of the housing 1. The temperature sensor 3 can detect the heat transferred between the polishing pad and the wafer due to friction. Cooling heat pipes 4 are fixedly connected to the left and right sides of the top of the inner wall of the housing 1. The cooling heat pipes 4 are used to cool the high-heat areas inside the device. Mounting slots 6 are provided on both the left and right sides of the housing 1. The mounting slots 6 are used for quick installation of cooling boxes 7 and facilitate the retraction of cooling boxes 7 when cooling is not required. The inner walls of both mounting slots 6 are slidably connected to cooling boxes 7, which are the main components 7 used to reduce temperature. Miniature circulation pumps 8 are fixedly connected to the bottom of the inner walls of both cooling boxes 7. One side of the miniature circulation pump 8 is connected to the first cooling heat pipe 4 via a connector 5, allowing the coolant to circulate between the second cooling heat pipe 9 and the first cooling heat pipe 4. The rear sides of both miniature circulation pumps 8 are fixedly connected to the second cooling heat pipe 9, which displaces heat within the device and cools the heated coolant in the area of ​​the second cooling heat pipe 9. Two connectors 5 are fixedly connected to the opposite side of heat pipe 4. Connectors 5 are used to connect cooling heat pipe 9 and cooling heat pipe 4, and also allow the micro circulation pump 8 to be connected to cooling heat pipe 4. Heat dissipation holes 10 are provided on the front and rear sides of both cooling boxes 7. The heat dissipation holes 10 can accelerate the temperature reduction of cooling heat pipe 9 inside the cooling box 7. Silent fans 11 are fixedly connected to the inner walls of the multiple heat dissipation holes 10. The silent fans 11 create air convection inside the cooling box 7, accelerating airflow. Two rotating shafts 12 are rotatably connected to the bottom of the inner walls of both cooling boxes 7. The airflow direction guided by the air guide plate 13 is adjusted by two rotating shafts 12. The top of the multiple rotating shafts 12 is fixedly connected to the air guide plate 13. The air guide plate 13 enables the cold air to specifically dissipate heat to the components inside the cooling box 7. The two cooling boxes 7 are rotatably connected to the opposite side of each other, and the components inside the cooling box 7 are inspected through the inspection door 14. The top of the housing 1 is provided with a grinding tank 24, which serves as the place for grinding the wafer. The inner wall of the housing 1 is provided with a grinding fluid recovery mechanism 2, which is used to recover the grinding fluid.

[0034] Specifically, the semiconductor polishing machine is started, causing the polishing pad and wafer to move relative to each other for polishing. Temperature sensor 3 on the top of the inner wall of the housing 1 begins real-time monitoring of the heat generated and transferred between the polishing pad and wafer due to friction. When temperature sensor 3 detects that the temperature reaches the preset start-up value, micro-circulation pump 8 starts, drawing coolant from cooling heat pipe 9 and transferring it to cooling heat pipe 4 via connector 5. The coolant absorbs heat from the vicinity of the polishing area in cooling heat pipe 4, increasing its temperature. The heated coolant then flows back to cooling heat pipe 9 for cooling, lowering the coolant temperature. Simultaneously, silent fan 11 starts, activating the cooling fan in the cooling box 7. Air convection occurs, with air entering the cooling box 7 through the heat dissipation hole 10. As it passes through the second cooling heat pipe 9, it carries away the surface heat and then exits through the heat dissipation hole 10 on the other side, accelerating the cooling speed of the second cooling heat pipe 9. By adjusting the angle of the air guide plate 13 by rotating the shaft 12, the direction of airflow can be changed, allowing the cold air to more effectively dissipate heat to the key components inside the cooling box 7, thus improving heat dissipation efficiency. When the grinding work is completed and the components inside the cooling box 7 need to be inspected or maintained, the inspection door 14 can be opened to inspect, clean, or replace the micro circulation pump 8 and the second cooling heat pipe 9. If the cooling box 7 is no longer needed, it can be slid out of the mounting slot 6 for storage.

[0035] Reference Figure 1 , Figure 3 and Figure 6 The grinding fluid recovery mechanism 2 includes an electromagnetic adsorption plate 201 for collecting the grinding fluid. The outer wall of the electromagnetic adsorption plate 201 is slidably connected to the inner wall of the grinding tank 24. Multiple guide vanes 202 are fixedly connected to the inner wall of the electromagnetic adsorption plate 201 to guide the flow of the used grinding fluid. Multiple electromagnetic coils 203 are fixedly connected to the bottom of the inner wall of the electromagnetic adsorption plate 201 to collect iron-containing impurities in the used grinding fluid. A recovery hole 204 is provided at the bottom of the inner wall of the electromagnetic adsorption plate 201. 04 is used to recycle the used grinding fluid. A shape memory alloy filter 205 is fixedly connected to the inner wall of the recycling hole 204. The shape memory alloy filter 205 can filter impurities in the grinding fluid. A recycling box 208 is fixedly connected to the bottom of the inner wall of the housing 1. The recycling box 208 is used to store the collected grinding fluid. A water pump 207 is fixedly connected to the top of the recycling box 208. The water pump 207 accelerates the recycling speed of the grinding fluid in the electromagnetic adsorption plate 201. A guide pipe 206 is connected to the right side of the water pump 207. The guide pipe 206 is used to guide the flow direction of the grinding fluid passing through the shape memory alloy filter 205.

[0036] Specifically, during the wafer polishing process, the polishing slurry flows within the polishing tank 24. The outer wall of the electromagnetic adsorption disk 201 is slidably connected to the inner wall of the polishing tank 24, tightly adhering to the bottom and side walls of the polishing tank 24 to ensure no leakage of the polishing slurry. After the polishing slurry contacts the electromagnetic adsorption disk 201, it is collected. The guide plate 202 guides the flow of the polishing slurry within the electromagnetic adsorption disk 201, enabling the polishing slurry to be evenly distributed and flow towards the recovery hole 204. Simultaneously, the electromagnetic coil 203 generates a magnetic field when energized, adsorbing iron-containing impurities in the polishing slurry. The polishing slurry is guided by the guide plate 202 to flow towards the recovery hole 204. When it passes through the shape memory alloy filter 205 at the recovery hole 204, the impurities are intercepted and filtered. Polishing slurry that meets the requirements passes through the filter. At this time, the water pump 207 generates suction, accelerating the speed at which the polishing slurry in the electromagnetic adsorption disk 201 passes through the filter and flows towards the recovery box 208. The filtered polishing slurry flows through the guide pipe 206 and finally into the recovery box 208 for storage, so that the polishing slurry can be processed or reused later.

[0037] Reference Figure 1 , Figure 2 and Figure 3 Guide rods 16 are fixedly connected to the front and rear sides of both cooling boxes 7. Slide grooves 15 are provided on the front and rear sides of the inner walls of both mounting slots 6. The guide rods 16 and slide grooves 15 guide the insertion position of the cooling boxes 7. Multiple rubber pads 19 are fixedly connected to the bottom of the housing 1. These rubber pads 19 reduce the impact of vibration at the bottom of the device on grinding. Multiple anti-slip strips 20 are fixedly connected to the bottom of each rubber pad 19, increasing friction. Two pins 22 are fixedly connected to the opposite sides of each of the two cooling boxes 7. Two rotating shafts 21 are fixedly connected to the opposite sides of each of the two inspection doors 14. Two pins 22 and two rotating shafts 21 facilitate the opening and closing of the inspection door 14. Dustproof nets 17 are fixedly connected to the inner walls of multiple heat dissipation holes 10. The dustproof nets 17 can prevent dust from entering the cooling box 7. The multiple dustproof nets 17 are symmetrically distributed. Sealing rings 23 are fixedly connected to the outer walls of multiple dustproof nets 17. The multiple sealing rings 23 adopt an annular design. The sealing rings 23 can prevent dust from entering the cooling box 7 from the edge of the dustproof nets 17. A control panel 18 is fixedly connected to the front side of the casing 1. The control panel 18 is electrically connected to the temperature sensor 3, the micro circulation pump 8, the silent fan 11, the electromagnetic coil 203 and the water pump 207 respectively.

[0038] Specifically, align the guide rods 16 on both sides of the cooling box 7 with the sliding grooves 15 on the front and rear sides of the inner wall of the mounting slot 6, and smoothly push the cooling box 7 into place along the direction of the sliding grooves 15. Utilizing the cooperation between the guide rods 16 and the sliding grooves 15, ensure the cooling box 7 is accurately installed, achieving precise connection between the cooling box 7 and the cooling pipes and circuits inside the housing 1. Through the rubber pads 19 and anti-slip strips 20 at the bottom of the housing 1, the equipment is stably placed on the working surface. The rubber pads 19 absorb the vibrations generated during the operation of the device, reducing the impact of vibration on the grinding accuracy. The anti-slip strips 20 increase the friction with the ground, preventing the equipment from shifting due to vibration during the grinding process. To ensure the stability of the grinding operation, when it is necessary to inspect the components inside the cooling box 7, the inspection door 14 is rotated. Through the cooperation of the pin 22 and the rotating shaft 21, the inspection door 14 is opened, which makes it convenient for the staff to inspect, clean or replace the micro circulation pump 8 and cooling heat pipe inside the cooling box 7. The dustproof net 17, together with the sealing ring 23, intercepts external dust during the operation of the equipment, preventing dust from entering the interior of the cooling box 7. The sealing ring 23 fits tightly against the edge of the heat dissipation hole 10, preventing dust from entering from the gap between the dustproof net 17 and the heat dissipation hole 10, ensuring the cleanliness of the interior of the cooling box 7 and extending the service life of the components.

[0039] Working Principle: During the grinding process, the friction between the grinding pad and the wafer generates heat, which is transferred to the surroundings. The temperature sensor 3 on the top of the inner wall of the housing 1 can detect the heat generated and transferred between the grinding pad and the wafer in real time. The micro circulation pump 8 starts after the temperature reaches the preset value, drawing out the coolant from the second cooling heat pipe 9. The coolant is transported to the first cooling heat pipe 4 through the connector 5. Since the first cooling heat pipe 4 is located in the high-heat area of ​​the device, the coolant absorbs heat and its temperature rises. The heated coolant then flows back to the second cooling heat pipe 9. In the area of ​​the second cooling heat pipe 9, the coolant dissipates its own heat through heat exchange with the surrounding environment, thereby cooling down the coolant and forming a coolant circulation loop. After the fan 11 is started, air convection is formed in the cooling box 7. Air enters the cooling box 7 through the heat dissipation hole 10. When passing through the second cooling heat pipe 9, the air carries away the heat from the surface of the second cooling heat pipe 9 because the surface temperature of the second cooling heat pipe 9 is relatively high. Then it is discharged from the heat dissipation hole 10 on the other side, which accelerates the cooling speed of the second cooling heat pipe 9 and improves the heat dissipation efficiency. At the same time, by rotating the shaft 12 to adjust the angle of the air guide plate 13, the direction of air flow is changed, so that the cold air can more effectively dissipate heat to the key components in the cooling box 7, further optimizing the heat dissipation effect. When the grinding work is completed, the cooling box 7 no longer needs to be used. It can be slid out from the mounting slot 6 for storage, which facilitates the installation, disassembly and storage of the cooling box 7, improves the flexibility and maintainability of the device, and avoids the occupation of space.

[0040] Furthermore, the sliding contact structure between the electromagnetic adsorption plate 201 and the inner wall of the grinding tank 24 prevents leakage of the grinding fluid, ensuring that the grinding fluid is completely collected by the adsorption plate. When the electromagnetic coil 203 is energized, it generates a magnetic field, which exerts a magnetic force on the iron-containing impurities in the grinding fluid. The iron-containing impurities are attracted by the magnetic field, change their trajectory, and adhere to the inner wall of the adsorption plate, thus separating the iron-containing impurities from the grinding fluid and avoiding equipment blockage. The guide plate 202, through its specific shape and layout, guides the grinding fluid to flow orderly within the electromagnetic adsorption plate 201, promoting uniform distribution of the grinding fluid and its flow towards the recovery hole 204. The shape memory alloy filter 205 utilizes the temperature response characteristics of the shape memory alloy material to maintain a stable filter pore size, intercepting impurities based on the sieving principle to achieve precise filtration and ensure the purity of the recovered grinding fluid. The water pump 207 drives the grinding fluid in the electromagnetic adsorption plate 201 to overcome the resistance of the filter and the pipeline, accelerating its passage through the filter and flowing along the guide pipe 206 to the recovery box 208. The pressure difference is used to achieve rapid transmission and centralized storage of the grinding fluid, facilitating subsequent processing and reuse.

[0041] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A semiconductor polishing machine wafer surface pressure homogenization device, comprising a housing (1), characterized in that: A temperature sensor (3) is fixedly connected to the top of the inner wall of the housing (1). Cooling heat pipes (4) are fixedly connected to the left and right sides of the top of the inner wall of the housing (1). Mounting slots (6) are provided on both sides of the housing (1). Cooling boxes (7) are slidably connected to the inner walls of the two mounting slots (6). Micro circulation pumps (8) are fixedly connected to the bottom of the inner walls of the two cooling boxes (7). Cooling heat pipes (9) are fixedly connected to the rear side of the two micro circulation pumps (8). Two connectors (5) are fixedly connected to the opposite sides of the two cooling heat pipes (4). Heat dissipation holes (10) are provided on the front and rear sides of the box (7). A silent fan (11) is fixedly connected to the inner wall of the multiple heat dissipation holes (10). Two rotating shafts (12) are rotatably connected to the bottom of the inner wall of the two cooling boxes (7). A guide plate (13) is fixedly connected to the top of the multiple rotating shafts (12). An inspection door (14) is rotatably connected to the opposite side of the two cooling boxes (7). A grinding groove (24) is provided on the top of the housing (1). A grinding fluid recovery mechanism (2) is provided on the inner wall of the housing (1). The grinding fluid recovery mechanism (2) is used to recover the grinding fluid.

2. The semiconductor polishing machine wafer surface pressure homogenization device according to claim 1, characterized in that: The grinding fluid recovery mechanism (2) includes an electromagnetic adsorption disk (201). The outer wall of the electromagnetic adsorption disk (201) is slidably connected to the inner wall of the grinding tank (24). Multiple guide plates (202) are fixedly connected to the inner wall of the electromagnetic adsorption disk (201). Multiple electromagnetic coils (203) are fixedly connected to the bottom of the inner wall of the electromagnetic adsorption disk (201). A recovery hole (204) is opened at the bottom of the inner wall of the electromagnetic adsorption disk (201). A memory alloy filter screen (205) is fixedly connected to the inner wall of the recovery hole (204). A recovery box (208) is fixedly connected to the bottom of the inner wall of the housing (1). A water pump (207) is fixedly connected to the top of the recovery box (208). A guide pipe (206) is connected to the right side of the water pump (207).

3. The semiconductor polishing machine wafer surface pressure homogenization device according to claim 1, characterized in that: Guide rods (16) are fixedly connected to the front and rear sides of the two cooling boxes (7), and sliding grooves (15) are opened on the front and rear sides of the inner walls of the two mounting slots (6).

4. The semiconductor polishing machine wafer surface pressure homogenization device according to claim 1, characterized in that: The bottom of the housing (1) is fixedly connected to a plurality of rubber pads (19), and the bottom ends of the plurality of rubber pads (19) are fixedly connected to a plurality of anti-slip strips (20).

5. The semiconductor polishing machine wafer surface pressure homogenization device according to claim 1, characterized in that: Two pins (22) are fixedly connected to the opposite sides of the two cooling boxes (7), and two rotating shafts (21) are fixedly connected to the opposite sides of the two inspection doors (14).

6. The semiconductor polishing machine wafer surface pressure homogenization device according to claim 1, characterized in that: The inner walls of the plurality of heat dissipation holes (10) are fixedly connected with dustproof nets (17), and the plurality of dustproof nets (17) are symmetrically distributed.

7. The semiconductor polishing machine wafer surface pressure homogenization device according to claim 6, characterized in that: Each of the dustproof nets (17) has a sealing ring (23) fixedly connected to its outer wall, and each of the sealing rings (23) adopts a ring design.

8. The semiconductor polishing machine wafer surface pressure homogenization device according to claim 1, characterized in that: A control panel (18) is fixedly connected to the front side of the housing (1). The control panel (18) is electrically connected to the temperature sensor (3), the micro circulation pump (8), the silent fan (11), the electromagnetic coil (203), and the water pump (207).

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