A robotic arm

Abstract

The utility model discloses a mechanical arm, be applied to the semiconductor technical field. The utility model discloses wafer bearing surface both sides are provided with edge clamping module, and the first side of edge clamping module bottom is perpendicular to wafer bearing surface, because having two vertical first side in the direction parallel to wafer bearing surface to the wafer placed on wafer bearing surface is blocked, when wafer occurs deviation, can adjust wafer back to normal position, simultaneously, because edge clamping module top is provided with second side, and the second side is tilted to the upside to the side away from another edge clamping module, in the adjustment wafer deviation process, wafer can slide to wafer bearing surface along the inclined second side under the action of gravity, thereby can reduce the fragment risk.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a robotic arm. Background Technology

[0002] Traditional robotic arms, such as Figure 1 As shown, only the lower support module 1 exists, and the lower support module 1 has an edge clamping block 2 at only one end. When the wafer 3 is placed on the lower support module 1, if the wafer 3 shifts, the robotic arm cannot adjust it because the other end of the lower support module 1 lacks an edge clamping block 2. To solve this problem, the prior art has proposed another robotic arm, such as... Figure 2 As shown, in this type of robotic arm, both ends of the lower support module 1 are equipped with edge clamping blocks 2, and the sides of both edge clamping blocks 2 are perpendicular to the bearing surface of the lower support module 1. When the wafer 3 is placed on this type of lower support module 1, if the wafer 3 shifts, during the adjustment process, one end of the wafer 3 may be on the bearing surface while the other end is supported by the edge clamping blocks 2, creating a height difference between the wafer 3 and the bearing surface. Under the effect of vacuum adsorption, the wafer 3 may be at risk of breakage. Utility Model Content

[0003] In view of this, the purpose of this utility model is to provide a robotic arm to solve the wafer breakage problem existing in traditional robotic arms.

[0004] To solve the above-mentioned technical problems, this utility model provides a robotic arm, including: a lower support module; two edge clamping modules are disposed on the surface of the lower support module; the surface of the lower support module between the two edge clamping modules is a wafer bearing surface;

[0005] The edge clamping module includes at least one edge clamping stop; the side of the edge clamping stop near the other edge clamping module includes a first side and a second side; the first side and the second side are connected in sequence along the direction away from the surface of the lower support module; the first side is perpendicular to the wafer carrier surface; the second side is inclined upward toward the side away from the other edge clamping module.

[0006] Optionally, the tilt angle of the second side can be 45° to 60°, including the values ​​at both ends.

[0007] Optionally, the height of the first side is greater than the thickness of the wafer.

[0008] Optionally, the width of the wafer bearing surface is greater than the diameter of the wafer.

[0009] Optionally, the lower support module includes a main body and two support arms connected to the main body.

[0010] Optionally, a first edge clamping module is provided at the end of the main body opposite to the support arm;

[0011] A second edge clamping module is provided at the end of the support arm opposite to the main body.

[0012] Optionally, the first edge clamping module includes a first edge clamping stop; the first edge clamping stop is circumferentially arranged along one end of the main body away from the support arm.

[0013] Optionally, the second edge clamping module includes two second edge clamping blocks; each of the support arms is provided with a second edge clamping block at one end away from the main body.

[0014] Optionally, the robotic arm further includes: an upper baffle module; the upper baffle module is disposed on one side of the wafer bearing surface of the lower support module; one end of the upper baffle module is connected to the lower support module.

[0015] Optionally, the upper baffle module includes an upper baffle and a connecting portion; the upper baffle is parallel to the wafer bearing surface; one end of the connecting portion is connected to one of the edge clamping modules, and the other end is inclined upward toward another edge clamping module and connected to the upper baffle.

[0016] As can be seen, this utility model includes: a lower support module; two edge clamping modules are disposed on the surface of the lower support module; the surface of the lower support module between the two edge clamping modules is a wafer carrier surface; the edge clamping module includes at least one edge clamping block; the side of the edge clamping block near the other edge clamping module includes a first side and a second side; the first side and the second side are connected in sequence along the direction away from the surface of the lower support module; the first side is perpendicular to the wafer carrier surface; the second side is inclined upward toward the side away from the other edge clamping module. In this invention, edge clamping modules are provided on both sides of the wafer support surface, and the first side of the bottom of the edge clamping module is perpendicular to the wafer support surface. Since there are two vertical first sides that block the wafer placed on the wafer support surface in a direction parallel to the wafer support surface, the wafer can be adjusted back to its normal position when it is shifted. At the same time, since a second side is provided on the top of the edge clamping module, and the second side is tilted upwards towards the side away from the other edge clamping module, the wafer can slide along the tilted second side to the wafer support surface under the action of gravity during the adjustment of wafer shift, thereby reducing the risk of fragmentation. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0018] Figure 1 A schematic diagram of a robotic arm without an edge gripping module;

[0019] Figure 2 A schematic diagram of a robotic arm with a vertical edge gripping module;

[0020] Figure 3 A side view of a robotic arm provided for an embodiment of this utility model;

[0021] Figure 4 A partially enlarged side view of a robotic arm provided for an embodiment of this utility model;

[0022] Figure 5 A top view of a robotic arm provided for an embodiment of this utility model;

[0023] Figure 6 This is a schematic diagram of wafer sliding provided for an embodiment of the present utility model.

[0024] The annotations in the attached figures are explained as follows:

[0025] 1-Lower support module; 13-Vacuum suction hole; 2-Edge clamping block; 21-First edge clamping block; 22-Second edge clamping block; 3-Wafer; 4-Upper baffle module; 41-Upper baffle; 42-Connecting part. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0027] Please refer to Figures 3 to 6 , Figure 3 A side view of a robotic arm provided for an embodiment of this utility model; Figure 4 A partially enlarged side view of a robotic arm provided for an embodiment of this utility model; Figure 5A top view of a robotic arm provided for an embodiment of this utility model; Figure 6 This is a schematic diagram of wafer sliding provided for an embodiment of the present utility model.

[0028] The present invention provides a robotic arm that may include: a lower support module 1; two edge clamping modules are disposed on the surface of the lower support module 1; the surface of the lower support module 1 between the two edge clamping modules is a wafer bearing surface;

[0029] The edge clamping module includes at least one edge clamping stop; the side of the edge clamping stop near another edge clamping module includes a first side and a second side; the first side and the second side are connected in sequence along the direction away from the surface of the lower support module 1; the first side is perpendicular to the wafer bearing surface; the second side is inclined upward toward the side away from the other edge clamping module.

[0030] It should be noted that in this embodiment, the first side is a plane perpendicular to the wafer support surface, which can more effectively restrict the position of the wafer 3 in the direction parallel to the wafer support surface compared to an inclined plane.

[0031] It should be noted that in this embodiment, the upward tilt of the second side facing away from the other edge clamping module means that the angle between the second side and the wafer bearing surface is greater than 90°. For example... Figure 5 As shown, during the adjustment of wafer 3 offset, wafer 3 can slide along the inclined second side to the wafer bearing surface under the action of gravity, thereby reducing the risk of fragmentation.

[0032] This embodiment does not limit the specific value of the tilt angle ϴ of the second side. Preferably, the tilt angle ϴ of the second side can be 45°~60°, including the values ​​at both ends. Correspondingly, the angle between the second side and the wafer support surface can be 120°~135°, including the values ​​at both ends. It should be noted that the above-mentioned suitable numerical range for the tilt angle of the second side in this embodiment can more effectively reduce the risk of fragmentation.

[0033] This embodiment does not limit the specific value of the height of the first side. Preferably, the height of the first side is greater than the thickness of wafer 3. It should be noted that the above-mentioned appropriate value range for the height of the first side in this embodiment can more effectively block wafer 3.

[0034] It should be noted that in this embodiment, the wafer support surface is used to place the wafer 3, so the width of the wafer support surface must be no less than the diameter of the wafer 3. Preferably, in this embodiment, the width of the wafer support surface can be greater than the diameter of the wafer 3.

[0035] This embodiment does not limit the specific structure of the lower support module 1, as long as it can support the wafer 3. For example, the lower support module 1 may include a main body and two support arms connected to the main body. One end of each support arm is connected to the main body, and the other end extends in a direction away from the main body.

[0036] Furthermore, in this embodiment, the lower support module 1 may also be provided with vacuum suction holes 13. It should be noted that in this embodiment, the wafer 3 can be adsorbed onto the wafer support surface through these vacuum suction holes 13. This embodiment does not limit the specific number of vacuum suction holes 13; preferably, the support module 1 may be provided with multiple vacuum suction holes 13 to enhance the adsorption effect of the wafer 3. This embodiment does not limit the specific arrangement of the vacuum suction holes 13; preferably, both the main body and the support arm may be provided with vacuum suction holes 13 to make the adsorption force of the wafer 3 more uniform and enhance the adsorption effect of the wafer 3.

[0037] This embodiment does not limit the specific positions of the two edge clamping modules, as long as the area between the two edge clamping modules can accommodate the wafer 3. For example, a first edge clamping module can be provided at the end of the main body away from the support arm; a second edge clamping module can be provided at the end of the support arm away from the main body. That is, the two edge clamping modules are respectively provided on the main body and the support arm.

[0038] This embodiment does not limit the specific number of first edge clamping blocks 21 in the first edge clamping module. For example, the first edge clamping module may include one first edge clamping block 21 or multiple first edge clamping blocks 21. This embodiment does not limit the specific arrangement of the first edge clamping blocks 21. The specific arrangement of the first edge clamping blocks 21 can be determined according to the specific number of first edge clamping blocks 21. For example, when the first edge clamping module includes one first edge clamping block 21, the first edge clamping block 21 can be arranged circumferentially along the end of the main body away from the support arm. It should be noted that when the end of the main body away from the support arm is arc-shaped, the first edge clamping block 21 is also arc-shaped.

[0039] This embodiment does not limit the specific number of second edge clamping blocks 22 in the second edge clamping module. For example, the second edge clamping module may include two second edge clamping blocks 22, one second edge clamping block 22, or multiple second edge clamping blocks 22. This embodiment does not limit the specific arrangement of the second edge clamping blocks 22. The specific arrangement of the second edge clamping blocks 22 can be determined according to the specific number of second edge clamping blocks 22. For example, when the second edge clamping module includes two second edge clamping blocks 22, one second edge clamping block 22 can be provided at the end of each support arm away from the main body. That is, the two second edge clamping blocks 22 are respectively provided on the two support arms.

[0040] Furthermore, the robotic arm in this embodiment may also include: an upper baffle module 4; the upper baffle module 4 is disposed on one side of the wafer bearing surface of the lower support module 1; one end of the upper baffle module 4 is connected to the lower support module 1. It should be noted that traditional robotic arms only have a lower support module 1 and no upper baffle module 4, making it unable to handle anomalies caused by foreign objects falling onto the wafer 3 during the grasping and transfer process. In this embodiment, an upper baffle module 4 is added to one side of the wafer bearing surface of the lower support module 1 to cover the wafer 3 placed on the wafer bearing surface, which can prevent foreign objects from falling onto the wafer 3, thereby reducing the risk of surface anomalies during the transfer process.

[0041] This embodiment does not limit the specific structure of the upper baffle module 4, as long as it can shield the wafer support surface. For example, the upper baffle module 4 may include an upper baffle 41 and a connecting part 42; the upper baffle 41 is parallel to the wafer support surface; one end of the connecting part 42 is connected to an edge clamping module, and the other end is inclined upward toward another edge clamping module and connected to the upper baffle 41. It should be noted that the upper baffle module 4 with the above structure in this embodiment can increase the space between the upper baffle module 4 and the wafer 3.

[0042] Furthermore, the current support module 1 includes a main body and two support arms connected to the main body. A first edge clamping module is provided at one end of the main body away from the support arm, and a second edge clamping module is provided at one end of the support arm away from the main body. One end of the connecting part 42 can be connected to the first edge clamping module, and the other end is inclined upward toward the second edge clamping module and connected to the upper baffle 41.

[0043] This embodiment does not limit the specific shape of the upper baffle module 4. Preferably, the projection of the upper baffle module 4 in the direction perpendicular to the wafer support surface is circular. This embodiment does not limit the specific size of the upper baffle module 4. Preferably, the diameter of the projection of the upper baffle module 4 in the direction perpendicular to the wafer support surface can be larger than the diameter of the wafer 3.

[0044] Based on the above embodiments, the present invention provides edge clamping modules on both sides of the wafer carrier surface, and the first side of the bottom of the edge clamping module is perpendicular to the wafer carrier surface. Since there are two vertical first sides that block the wafer placed on the wafer carrier surface in a direction parallel to the wafer carrier surface, the wafer can be adjusted back to the normal position when it is offset. At the same time, since the edge clamping module has a second side on the top, and the second side is tilted upwards towards the side away from the other edge clamping module, the wafer can slide along the tilted second side to the wafer carrier surface under the action of gravity during the adjustment of wafer offset, thereby reducing the risk of fragmentation.

[0045] The above provides a detailed description of the robotic arm provided by this utility model. For those skilled in the art, based on the ideas of the embodiments of this utility model, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this utility model.

Claims

1. A robotic arm, characterized in that, include: Support modules below; The lower support module surface is provided with two edge clamping modules; The surface of the lower support module between the two edge clamping modules is the wafer bearing surface; The edge clamping module includes at least one edge clamping stop; the side of the edge clamping stop near the other edge clamping module includes a first side and a second side; the first side and the second side are connected in sequence along the direction away from the surface of the lower support module; the first side is perpendicular to the wafer bearing surface; the second side is inclined upward toward the side away from the other edge clamping module.

2. The robotic arm according to claim 1, characterized in that, The tilt angle of the second side can be 45° to 60°, including the values ​​at both ends.

3. The robotic arm according to claim 1, characterized in that, The height of the first side is greater than the thickness of the wafer.

4. The robotic arm according to claim 1, characterized in that, The width of the wafer bearing surface is greater than the diameter of the wafer.

5. The robotic arm according to claim 1, characterized in that, The lower support module includes a main body and two support arms connected to the main body.

6. The robotic arm according to claim 5, characterized in that, A first edge clamping module is provided at the end of the main body that is away from the support arm; A second edge clamping module is provided at the end of the support arm opposite to the main body.

7. The robotic arm according to claim 6, characterized in that, The first edge clamping module includes a first edge clamping stop; the first edge clamping stop is arranged circumferentially along one end of the main body away from the support arm.

8. The robotic arm according to claim 6, characterized in that, The second edge clamping module includes two second edge clamping blocks; each of the support arms is provided with a second edge clamping block at one end away from the main body.

9. The robotic arm according to any one of claims 1 to 8, characterized in that, Also includes: Upper baffle module; the upper baffle module is disposed on one side of the wafer bearing surface of the lower support module; One end of the upper baffle module is connected to the lower support module.

10. The robotic arm according to claim 9, characterized in that, The upper baffle module includes an upper baffle and a connecting part; the upper baffle is parallel to the wafer support surface; one end of the connecting part is connected to one of the edge clamping modules, and the other end is inclined upward toward another edge clamping module and connected to the upper baffle.

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